CN217481444U - Air inlet processor of engine and engine - Google Patents
Air inlet processor of engine and engine Download PDFInfo
- Publication number
- CN217481444U CN217481444U CN202221292953.6U CN202221292953U CN217481444U CN 217481444 U CN217481444 U CN 217481444U CN 202221292953 U CN202221292953 U CN 202221292953U CN 217481444 U CN217481444 U CN 217481444U
- Authority
- CN
- China
- Prior art keywords
- type semiconductor
- engine
- frame
- air inlet
- processor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses an air inlet processor and engine of engine relates to engine technical field. The air inlet processor of the engine comprises a frame, a binding post and an H bridge, wherein the frame comprises a thermocouple, the thermocouple comprises a P-type semiconductor and an N-type semiconductor which are oppositely arranged, and the P-type semiconductor and the N-type semiconductor are electrically connected; the wiring terminals are arranged on the outer side of the frame, two wiring terminals are arranged, one wiring terminal is used for connecting the P-type semiconductor and one electrode column of the power supply, and the other wiring terminal is used for connecting the N-type semiconductor and the other electrode column of the power supply; the H-bridge is used to switch the current direction of the power supply to change the polarity of the two electrode columns. When electrons move from the N-type semiconductor to the P-type semiconductor, the temperature of the junction is increased, and redundant energy is released to realize a heating effect. When electrons move from the P-type semiconductor to the N-type semiconductor, energy is absorbed from the outside, and a cooling effect is achieved.
Description
Technical Field
The utility model relates to the technical field of engines, especially, relate to an air inlet processor of engine.
Background
In order to ensure the cold starting capability of the engine at low temperature, the air entering the cylinder needs to be heated at the temperature below-10 ℃, and the method which is usually adopted at present is to use an air inlet heater for heating.
The air inlet heater only has a heating function, and can only heat the air inlet of the engine when the ambient temperature is low so as to assist the engine to start. But has no cooling function, and when the air inlet temperature of the engine is too high to exceed the air inlet temperature requirement of the engine, only measures for reducing the torque of the engine can be taken, and no other more preferable measures exist. Moreover, after the resistance wire of the grille resistance type air inlet heater is heated for a long time, the resistance wire is easy to generate abrasion and fracture under the vibration of the engine, so that the cylinder of the engine is pulled.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an air inlet processor and engine of engine, the air inlet processor of this engine can realize the heating or the cooling that the engine admits air.
To achieve the purpose, the utility model adopts the following technical proposal:
an intake air processor for an engine, comprising:
the thermocouple comprises a P-type semiconductor and an N-type semiconductor which are oppositely arranged, and the P-type semiconductor and the N-type semiconductor are electrically connected;
the binding posts are arranged on the outer side of the frame, and two binding posts are arranged, wherein one binding post is used for connecting the P-type semiconductor and one electrode column of a power supply, and the other binding post is used for connecting the N-type semiconductor and the other electrode column of the power supply;
and the H bridge is used for switching the current direction of the power supply so as to change the polarity of the two electrode columns.
As an alternative of the intake air processor of the engine, a heat conduction device is arranged in the frame, and the heat conduction device is used for transferring heat of the frame to an intake pipeline.
As an alternative of the intake air processor of the engine, the heat conducting device includes a plurality of heat conducting fins, the plurality of heat conducting fins are arranged crosswise, and both ends of each heat conducting fin are connected to the inner side of the frame.
As an alternative of the intake air processor of the engine, the heat conducting device includes a plurality of heat conducting fins, two of which are arranged to intersect, and the remaining heat conducting fins extend from the intersection of the two heat conducting fins arranged to intersect toward the frame and are connected to the inside of the frame.
As an alternative to the intake air processor of the engine, the heat conduction sheet is made of copper or aluminum.
As an alternative to the engine's intake air processor, the frame is circular or square in cross-section.
As an alternative to the intake air processor of the engine, the P-type semiconductor and the N-type semiconductor are both made of bismuth antimonide.
The engine comprises a control unit, an air inlet connecting pipe and an air inlet pipe, wherein an air inlet processor of the engine is arranged between the air inlet connecting pipe and the air inlet pipe, the control unit is electrically connected with the air inlet processor and used for controlling the air inlet processor to heat or refrigerate.
As an alternative of the engine, two opposite end surfaces of the air inlet connecting pipe and the air inlet pipe are provided with flanges, the two flanges are connected through a bolt, and the frame is connected through the two flanges.
As an alternative of the engine, a sealing gasket is arranged between each of the two flanges and the frame.
The utility model has the advantages that:
the utility model provides an air inlet processor of engine, this air inlet processor's frame include the P type semiconductor and the N type semiconductor of relative setting, and P type semiconductor and N type semiconductor electricity are connected, and constitute the thermocouple with two electrode post connections of power respectively, and N type semiconductor has unnecessary electron, and the electron is not enough in the P type semiconductor, and when the electron moved to P type semiconductor from N type semiconductor, the temperature of node will rise, releases unnecessary energy, realizes the heating effect. When electrons move from the P-type semiconductor to the N-type semiconductor, energy is absorbed from the outside, and a cooling effect is achieved. Energy is absorbed or discharged in the form of heat at the interface (junction) of the two semiconductors, and the effect of heating at one end and cooling at the other end is achieved, namely the peltier effect. The thermocouple is arranged in the frame, so that when the inner side of the frame is heated, the outer side is refrigerated; or when the outside is heated, the inside is cooled. The peltier effect is reversible and when the direction of the current is changed, the heating and cooling effects of the two semiconductors are changed accordingly. The heating side and the cooling side of the frame are correspondingly changed by changing the current direction through the H bridge, so that the air inlet processor of the engine realizes the heating or cooling function.
The utility model provides an engine adopts the treater that admits air of foretell engine, when the engine inlet air temperature was too high to surpass the inlet air temperature requirement of engine, need not to reduce engine moment of torsion and realizes the cooling, also can avoid the engine to draw the jar simultaneously.
Drawings
Fig. 1 is a schematic structural diagram of an intake air processor of an engine according to an embodiment of the present invention.
In the figure:
1. a frame; 2. a binding post; 3. a heat conducting device.
Detailed Description
In order to make the technical problem solved by the present invention, the technical solution adopted by the present invention and the technical effect achieved by the present invention clearer, the technical solution of the present invention will be further explained by combining the drawings and by means of the specific implementation manner.
In the description of the present invention, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, detachably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In the present application, unless expressly stated or limited otherwise, the recitation of a first feature "on" or "under" a second feature may include the recitation of the first and second features being in direct contact, and may also include the recitation of the first and second features not being in direct contact, but being in contact with another feature between them. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
In the description of the present embodiment, the terms "upper", "lower", "right", and the like are used in the orientation or positional relationship shown in the drawings only for convenience of description and simplicity of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used only for descriptive purposes and are not intended to have a special meaning.
The embodiment provides an engine, which comprises a control unit, an air inlet connecting pipe and an air inlet pipe, wherein an air inlet processor of the engine is arranged between the air inlet connecting pipe and the air inlet pipe, and the control unit is electrically connected with the air inlet processor and used for controlling the air inlet processor to heat or refrigerate.
The air inlet pipe of the engine is provided with a temperature sensor, the temperature sensor is used for detecting the air inlet temperature in the air inlet pipe and sending the detected air inlet temperature to the control unit, and the control unit controls the air inlet processor to heat or refrigerate according to the received air inlet temperature.
The control unit is internally stored with a minimum limit value and a maximum limit value of the intake air temperature and a judgment program for comparing the received intake air temperature with the minimum limit value and the maximum limit value, and when the intake air temperature is lower than the minimum limit value, the control unit controls the intake air processor to heat according to the judgment program. When the inlet air temperature is higher than the maximum limit value, the control unit controls the inlet air processor to refrigerate. And controlling the air inlet processor not to work when the air inlet temperature is between the lowest limit value and the highest limit value.
Illustratively, the minimum value is-20 ℃ and the maximum value is 70 ℃.
The air inlet pipe is connected with the engine through the air inlet connecting pipe to provide air inlet for the engine, and the air inlet is processed through the air inlet processor connected between the air inlet pipe and the air inlet connecting pipe, so that the air inlet temperature meets the air inlet requirement of the engine.
As shown in fig. 1, the present embodiment provides an intake air processor of an engine, which can be applied to the engine described above. The air inlet processor of the engine comprises a frame 1, a binding post 2 and an H bridge, wherein the frame 1 comprises a thermocouple, the thermocouple comprises a P-type semiconductor and an N-type semiconductor which are oppositely arranged, and the P-type semiconductor and the N-type semiconductor are electrically connected; the binding posts 2 are arranged on the outer side of the frame 1, two binding posts 2 are arranged, one binding post 2 is used for connecting the P-type semiconductor and one electrode column of a power supply, and the other binding post 2 is used for connecting the N-type semiconductor and the other electrode column of the power supply; the H-bridge is used to switch the current direction of the power supply to change the polarity of the two electrode columns.
The P-type semiconductor and the N-type semiconductor are both made into a plate-shaped structure, the P-type semiconductor and the N-type semiconductor in the plate-shaped structure are oppositely arranged and are electrically connected through welding, then insulating heat conduction plates are packaged on two boundary end faces of the P-type semiconductor and the N-type semiconductor, and the two insulating heat conduction plates respectively form the inner side and the outer side of the frame 1. One of the two posts 2 is electrically connected to the P-type semiconductor, and the other post 2 is electrically connected to the N-type semiconductor. The two binding posts 2 are correspondingly connected with two electrode posts of a power supply one by one. When the power supply is powered on, one side of the inner side and the outer side of the frame 1 is a heating side, and the other side is a cooling side.
An H-bridge is an electronic circuit for switching the polarity of a voltage applied to a load. In this embodiment, the H-bridge is used to switch the polarity of the two electrode columns of the power supply. The control unit is electrically connected to an H-bridge, which consists of four switches (solid state or mechanical). When the switch S1 and the switch S4 are closed and the switch S2 and the switch S3 are open, a positive voltage will be applied across the power supply, corresponding to a forward current. When the switch S1 and the switch S4 are opened and the switch S2 and the switch S3 are closed, the voltage direction becomes reverse and the current also becomes reverse. The control unit controls the heating or cooling of the air inlet processor by controlling the closing of the switch S1 and the switch S4, opening the switch S2 and the switch S3, or controlling the opening of the switch S1 and the switch S4, and closing the switch S2 and the switch S3.
And when the control unit controls the pulse width of the H bridge to be 0, the air inlet processor does not work.
The frame 1 of the air inlet processor comprises a P-type semiconductor and an N-type semiconductor which are oppositely arranged, the P-type semiconductor and the N-type semiconductor are electrically connected and are respectively connected with two electrode columns of a power supply to form a thermocouple, the N-type semiconductor has redundant electrons, the electrons in the P-type semiconductor are insufficient, when the electrons move from the N-type semiconductor to the P-type semiconductor, the temperature of a node is increased, the redundant energy is released, and the heating effect is realized. When electrons move from the P-type semiconductor to the N-type semiconductor, energy is absorbed from the outside, and a cooling effect is achieved. Energy is absorbed or discharged in the form of heat at the interface (junction) of the two semiconductors, and the effect of heating at one end and cooling at the other end is achieved, namely the peltier effect. A thermocouple is arranged in the frame 1, so that when the inner side of the frame 1 is heated, the outer side is refrigerated; or when the outside is heated, the inside is cooled. The peltier effect is reversible, and when the direction of the current is changed, the heating side and the cooling side of the frame 1 are correspondingly changed, so that the intake air processor of the engine performs the heating or cooling function.
As an alternative to the intake air processor of the engine, both the P-type semiconductor and the N-type semiconductor are made of bismuth antimonide.
As an alternative to the intake air processor of the engine, the frame 1 has a circular or square cross-section. In the present embodiment, the cross section of the frame 1 is provided in a square shape.
Of course, in other embodiments, the cross-section of the frame 1 may be provided in a circular shape.
Optionally, two opposite end faces of the air inlet connecting pipe and the air inlet pipe are provided with flanges, the two flanges are connected through bolts, and the frame 1 is connected through the two flanges.
The relative one end of two flanges all is provided with the mounting groove, mounting groove and frame 1's cross-section looks adaptation to be located frame 1 in the mounting groove, then through the bolt with two flange fixed connection.
Optionally, a gasket is provided between both flanges and the frame 1. Set up sealed the pad between the inner wall of mounting groove and frame 1 to guarantee the leakproofness between flange and the frame 1, prevent gas leakage.
As an alternative to the intake air treatment device of the engine, a heat transfer device 3 is arranged in the frame 1, the heat transfer device 3 being used to transfer heat from the frame 1 into the intake air line. By arranging the heat conduction device 3 in the frame 1, heat generated by the thermocouple is transferred into the air inlet pipeline through the heat conduction device 3, so that the heat transfer efficiency is higher.
As an alternative of the intake air processor of the engine, the heat conducting device 3 includes a plurality of heat conducting fins arranged crosswise, and both ends of each heat conducting fin are connected to the P-type semiconductor or the N-type semiconductor inside the frame 1. The heat conducting device 3 is arranged into a criss-cross grid shape, so that heat is effectively transferred, and the transfer efficiency is increased.
In another optional embodiment of the present invention, the heat conducting device 3 comprises a plurality of heat conducting fins, wherein two heat conducting fins are disposed in a crossed manner, and the rest of the heat conducting fins extend from the crossing point of the two heat conducting fins disposed in the crossed manner to the frame 1 and are connected with the inner side of the frame 1. The heat-conducting fins are arranged in a central radiation mode, so that heat generated by the thermocouple can be effectively transferred to the center of the air inlet pipe and the center of the air inlet connecting pipe, and the transfer efficiency is better.
As an alternative to the intake air processor of the engine, the heat conductive sheet is made of copper or aluminum. The heat conductive sheet is exemplarily made of a copper plate, which is better in heat conductivity but higher in cost. Of course, in other embodiments, a heat conductive sheet made of an aluminum plate may also be used.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention, and it is to be understood that the present invention is not limited to the above embodiments, but may be modified within the scope of the present invention.
Claims (10)
1. An air intake processor for an engine, comprising:
the frame (1), the frame (1) includes the thermocouple, the thermocouple includes P type semiconductor and N type semiconductor that relative setting, the P type semiconductor and the N type semiconductor are connected electrically;
the binding posts (2) are arranged on the outer side of the frame (1), two binding posts (2) are arranged, one binding post (2) is used for connecting the P-type semiconductor and one electrode column of a power supply, and the other binding post (2) is used for connecting the N-type semiconductor and the other electrode column of the power supply;
and the H bridge is used for switching the current direction of the power supply so as to change the polarity of the two electrode columns.
2. The engine intake processor of claim 1, characterized in that a heat-conducting device (3) is arranged in the frame (1), the heat-conducting device (3) being configured to transfer heat from the frame (1) into the intake air line.
3. The engine intake air processor according to claim 2, wherein the heat conducting device (3) includes a plurality of heat conducting fins arranged crosswise, both ends of each of which are connected to the inside of the frame (1).
4. The engine intake air processor according to claim 2, wherein the heat conducting device (3) includes a plurality of heat conducting fins, two of which are arranged to intersect, and the remaining heat conducting fins extend from the intersection of the two heat conducting fins arranged to intersect toward the frame (1) and are connected to the inside of the frame (1).
5. The engine air intake processor of claim 3 or 4, wherein the heat conduction sheet is made of copper or aluminum.
6. The engine intake processor of claim 1, characterized in that the cross-section of the frame (1) is circular or square.
7. The engine air intake processor of claim 1, wherein the P-type semiconductor and the N-type semiconductor are both made of bismuth antimonide.
8. An engine, comprising a control unit, an air inlet connecting pipe and an air inlet pipe, wherein an air inlet processor of the engine as claimed in any one of claims 1-7 is arranged between the air inlet connecting pipe and the air inlet pipe, and the control unit is electrically connected with the air inlet processor and used for controlling the air inlet processor to heat or refrigerate.
9. An engine according to claim 8, characterized in that the opposite end faces of the inlet connection pipe and the inlet pipe are each provided with a flange, the two flanges being connected by means of bolts, the frame (1) being connected by means of the two flanges.
10. An engine according to claim 9, characterized in that a sealing gasket is arranged between both flanges and the frame (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221292953.6U CN217481444U (en) | 2022-05-26 | 2022-05-26 | Air inlet processor of engine and engine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221292953.6U CN217481444U (en) | 2022-05-26 | 2022-05-26 | Air inlet processor of engine and engine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217481444U true CN217481444U (en) | 2022-09-23 |
Family
ID=83312731
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221292953.6U Active CN217481444U (en) | 2022-05-26 | 2022-05-26 | Air inlet processor of engine and engine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217481444U (en) |
-
2022
- 2022-05-26 CN CN202221292953.6U patent/CN217481444U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7687901B2 (en) | Heat dissipating fins opposite semiconductor elements | |
| KR102034337B1 (en) | Thermoelectric-based thermal management of electrical devices | |
| CN108091803B (en) | Integrated cooling heat-preserving battery system and control method thereof | |
| EP1641067A1 (en) | System for controlling temperature of a secondary battery module | |
| CN107732359A (en) | Electric automobile power battery heat management device based on semiconductor refrigerating technology | |
| CN207217714U (en) | Electric automobile power battery heat management device based on semiconductor refrigerating technology | |
| CN107305888A (en) | Semiconductor module | |
| CN111336727A (en) | Air conditioner | |
| CN217481444U (en) | Air inlet processor of engine and engine | |
| CN111697288A (en) | Power battery thermal management system with cold and hot working condition temperature regulation function | |
| CN201859928U (en) | Novel cooling system for battery packs | |
| CN212412130U (en) | Power battery thermal management system with cold and hot working condition temperature regulation function | |
| US20170005249A1 (en) | Insulator and connector for thermoelectric devices in a thermoelectric assembly | |
| EP4299886A1 (en) | Control method and system for charge air intercooler of engine | |
| CN217655913U (en) | Heating and cooling system of fuel cell | |
| CN216528872U (en) | Power device, frequency conversion system and air conditioning equipment | |
| KR20210016128A (en) | A Coolong/Heating Structure composed of cylindrical battery Cells | |
| CN217481360U (en) | Machine oil temperature controller | |
| CN209880590U (en) | Double-sided heat dissipation semiconductor IGBT pipe | |
| CN114171473A (en) | Power device, control method thereof, frequency conversion system and air conditioning equipment | |
| JP2022118474A (en) | Battery unit and method for controlling the same | |
| CN103178201B (en) | Cold and hot bidirectional chip of semiconductor | |
| JPH09260585A (en) | Flat-type semiconductor device | |
| CN201269667Y (en) | Semiconductor refrigeration device | |
| CN209804741U (en) | Battery pack and battery pack thermal management device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |