CN217470608U - Electromagnetic shielding heat dissipation mechanism and electronic equipment - Google Patents
Electromagnetic shielding heat dissipation mechanism and electronic equipment Download PDFInfo
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- CN217470608U CN217470608U CN202220780804.8U CN202220780804U CN217470608U CN 217470608 U CN217470608 U CN 217470608U CN 202220780804 U CN202220780804 U CN 202220780804U CN 217470608 U CN217470608 U CN 217470608U
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Abstract
The utility model discloses an electromagnetic shield heat dissipation mechanism, including circuit board assembly, still including set up in radiator unit, cover on the circuit board assembly are established metal casing on the circuit board assembly, set up in a plurality of net holes on the metal casing, radiator unit is located inside the metal casing, a plurality of net holes with radiator unit sets up relatively, and each the circumscribed circle diameter of the cross section in net hole is less than or equal to half of the minimum wavelength of the produced electromagnetic wave of circuit board assembly. Therefore, the utility model discloses an electromagnetic shield heat dissipation mechanism is through seting up the net hole on metal casing for the net hole can play ventilation cooling's effect, can play electromagnetic shield's effect again, compares in prior art, can compromise the heat dissipation demand and the electromagnetic shield demand of electronic product, optimizes the EMC design of electronic product. The utility model discloses still disclose an electronic equipment, its beneficial effect as above.
Description
Technical Field
The utility model relates to an electronic product technical field, in particular to electromagnetic shield heat dissipation mechanism. The utility model discloses still relate to an electronic equipment.
Background
At present, a Printed Circuit Board Assembly (PCBA) is generally installed in an electronic product, that is, the PCB (Printed Circuit Board) is used to realize the integrated installation of various electronic components, so that the installation density of the electronic product can be improved, and the volume can be reduced.
During operation, each electronic component on the PCBA can continuously generate electromagnetic radiation to the outside. If the level of Electromagnetic radiation is severe, it will cause significant Electromagnetic Interference (EMI) to other electronic products. To minimize the effect of electromagnetic radiation, the production quality requirements for electronic products usually include EMC (Electro Magnetic Compatibility) design. The electromagnetic compatibility refers to the ability of the device or system to operate in compliance with requirements in an electromagnetic environment and not generate intolerable electromagnetic interference to other electronic devices in the environment, and on one hand, the ability refers to the ability that the electromagnetic interference generated by the device to the environment cannot exceed a certain limit value in the normal operation process, and on the other hand, the ability refers to the ability that the device has a certain degree of immunity to the electromagnetic interference existing in the environment, that is, electromagnetic sensitivity.
In the prior art, in order to achieve a good EMC design, a metal housing is usually mounted outside the PCBA, and the PCBA is wrapped or sealed by the closed or semi-closed metal housing to shield electromagnetic interference. Also, because the PCBA generates a large amount of heat during operation, the heat dissipation requirements of the PCBA must be maintained, and for this reason, it is common in the art to mount a fan on the PCBA and then provide a vent opening in the metal housing to allow heat to be dissipated through the vent opening. However, this results in a large gap in the metal shell of the sealing structure, which easily results in that the metal shell cannot provide sufficient electromagnetic shielding effect. On the whole, the technical solutions in the prior art are difficult to achieve both the heat dissipation requirement and the electromagnetic shielding requirement of the electronic product.
Therefore, how to optimize the EMC design of the electronic product while taking into account the heat dissipation requirement and the electromagnetic shielding requirement of the electronic product is a technical problem faced by those skilled in the art.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing an electromagnetic shield heat dissipation mechanism can compromise the heat dissipation demand and the electromagnetic shield demand of electronic product, optimizes the EMC design of electronic product. Another object of the present invention is to provide an electronic device.
In order to solve the technical problem, the utility model provides an electromagnetic shield heat dissipation mechanism, including circuit board assembly, still including set up in radiator unit, cover on the circuit board assembly are established metal casing on the circuit board assembly, set up in a plurality of net holes on the metal casing, radiator unit is located inside the metal casing, a plurality of net holes with radiator unit sets up relatively, and each the circumscribed circle diameter of the cross section in net hole is less than or equal to half of the minimum wavelength of the electromagnetic wave that circuit board assembly produced.
In an embodiment, the electromagnetic radiation shielding module further includes a plurality of heat dissipation holes opened on the metal housing, and each of the heat dissipation holes is used for enhancing the heat dissipation and electromagnetic radiation shielding effects of each of the grid holes.
In one embodiment, each of the grid holes is a circular hole, and the diameter of each of the grid holes is smaller than or equal to half of the minimum wavelength of the electromagnetic wave generated by the circuit board assembly.
In one embodiment, each of the grid holes is a square hole, and each side length of the square hole is less than or equal to half of the minimum wavelength of the electromagnetic wave generated by the circuit board assembly.
In one embodiment, a coverage area of each of the grid holes on the metal shell is greater than or equal to an air outlet area of the heat dissipation assembly.
In one embodiment, the heat dissipation assembly includes a heat dissipation fan disposed on the circuit board assembly, and the heat dissipation fan faces each of the grid holes.
In an embodiment, the heat dissipation assembly further includes a heat dissipation base disposed on the surface of the circuit board assembly and used for absorbing heat therefrom and dissipating the heat, and the heat dissipation fan is mounted on a surface of the heat dissipation base away from the circuit board assembly.
In one embodiment, the heat dissipation assembly further comprises a plurality of metal fins standing on the heat dissipation base.
In one embodiment, each of the metal heat dissipation fins and the ribs between the grid holes are arranged at intervals.
The utility model also provides an electronic equipment, including the mount pad with set up in electromagnetic shield heat dissipation mechanism on the mount pad, wherein, electromagnetic shield heat dissipation mechanism specifically is above-mentioned arbitrary electromagnetic shield heat dissipation mechanism.
The utility model provides an electromagnetic shield heat dissipation mechanism mainly includes circuit board subassembly, radiator unit, metal casing and net hole. The circuit board assembly is a main body component of the mechanism and mainly comprises a PCB and a plurality of electronic components integrally mounted on the PCB. The heat dissipation assembly is arranged on the circuit board assembly and is mainly used for dissipating heat of each electronic component. The metal shell covers the circuit board assembly and is mainly used for forming a closed environment for the circuit board assembly, so that the electromagnetic shielding cover is realized. The grid holes are formed in the metal shell, a plurality of grid holes are formed in the metal shell, the diameter of the circumscribed circle of the cross section of each grid hole is smaller than or equal to half of the minimum wavelength of the electromagnetic wave generated by the circuit board assembly, so that a waveguide environment with a specific shape is formed for the electromagnetic wave, when the electromagnetic wave is transmitted into the grid holes, the electromagnetic wave is repeatedly reflected between the hole walls of the grid holes through a waveguide reflection effect, the electromagnetic wave is limited from being transmitted outwards, and the effect of shielding electromagnetic radiation is achieved. Simultaneously, radiator unit and each net hole set up relatively to the produced heat of electronic components on with circuit board assembly disperses the external world through each net hole through the heat dissipation air current, prevents that the heat from accumulating in metal casing, realizes quick radiating effect. Therefore, the utility model provides an electromagnetic shield heat dissipation mechanism is through seting up the net hole on metal casing for the net hole can play ventilation cooling's effect, can play electromagnetic shield's effect again, compares in prior art, can compromise the heat dissipation demand and the electromagnetic shield demand of electronic product, optimizes the EMC design of electronic product.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
Fig. 1 is a schematic overall structure diagram of a specific embodiment of the present invention.
Fig. 2 is a schematic diagram of a specific structure of the grid holes.
FIG. 3 is another detailed structure diagram of the grid holes.
Fig. 4 is a schematic structural diagram of the heat dissipation assembly.
Wherein, in fig. 1-4:
the circuit board assembly-1, the heat dissipation assembly-2, the metal shell-3, the grid holes-4, the mounting seat-5 and the heat dissipation holes-6;
a heat radiation fan-21, a heat radiation base-22 and a metal heat radiation fin-23.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts all belong to the protection scope of the present invention.
Referring to fig. 1, fig. 1 is a schematic diagram of an overall structure of an embodiment of the present invention.
The utility model provides an among the specific implementation, electromagnetic shield heat dissipation mechanism mainly includes circuit board assembly 1, radiator unit 2, metal casing 3 and net hole 4.
The circuit board assembly 1 is a main component of the mechanism, and mainly includes a PCB and a plurality of electronic components integrally mounted on the PCB, such as a PCBA.
The heat dissipation assembly 2 is arranged on the circuit board assembly 1 and is mainly used for dissipating heat of each electronic component.
The metal shell 3 covers the circuit board assembly 1 and is mainly used for forming a closed environment for the circuit board assembly 1, so that an electromagnetic shielding cover is realized.
Simultaneously, radiator unit 2 and each net hole 4 set up relatively to the produced heat of electronic components on with circuit board assembly 1 through each net hole 4 disperse to the external world through the heat dissipation air current, prevent that the heat from accumulating in metal casing 3, realize quick radiating effect.
So, the electromagnetic shield heat dissipation mechanism that this embodiment provided is through seting up latticed hole 4 on metal casing 3 for latticed hole 4 can play ventilation cooling's effect, can play electromagnetic shield's effect again, compares in prior art, can compromise electronic product's heat dissipation demand and electromagnetic shield demand, optimizes electronic product's EMC design.
In an alternative embodiment with respect to the metal housing 3, it is considered that the circuit board assembly 1 is generally substantially rectangular, and in order to facilitate the cage covering of the circuit board assembly 1, the metal housing 3 is also particularly rectangular. Of course, the metal case 3 may have a spherical shape or the like.
In an alternative embodiment regarding the positional relationship of the mesh holes 4 with the metal shell 3, each mesh hole 4 is particularly opened on the top surface of the metal shell 3. So set up, because circuit board assembly 1 is established in metal casing 3 by the cover, the produced heat of each electronic components of installation when the operation on circuit board assembly 1 will rise fast under the convection action of cold and hot air, and simultaneously, heat-radiating component 2's air outlet is towards each net hole 4, forms vertical heat dissipation air flue promptly, and hot-blast can smoothly disperse to the external world through each net hole 4 that is located 1 top of circuit board assembly, helps improving radiating efficiency and air flow rate.
In another alternative embodiment regarding the positional relationship of the mesh holes 4 with the metal shell 3, the respective mesh holes 4 are specifically opened on the side wall surfaces of the metal shell 3, such as the left and right side walls or the front and rear side walls. At this moment, the air outlet of the heat dissipation assembly 2 faces each grid hole 4, i.e. a horizontal heat dissipation air passage is formed, so that the lateral heat dissipation channel is conveniently erected.
Of course, if the heat dissipation assembly 2 has a plurality of air outlets with different orientations, the grid holes 4 can be formed on each surface of the metal housing 3 at the same time.
In addition, in order to enhance the ventilation and heat dissipation effect and the electromagnetic shielding effect of each grid hole 4, a plurality of heat dissipation holes 6 are additionally formed in the metal shell 3 in the embodiment. Specifically, the opening positions of the heat dissipation holes 6 may be located in the peripheral area or the corner area of the metal housing 3, which is different from the central area where the grid holes 4 are located. Meanwhile, the heat dissipation holes 6 are distributed in an array manner like the grid holes 4, and have the same function as the grid holes 4, so that the function of the grid holes 4 is assisted to be enhanced.
As shown in fig. 2, fig. 2 is a schematic diagram of a specific structure of the grid holes 4.
In an alternative embodiment regarding the shape of the grid holes 4, the grid holes 4 are embodied as square holes, such as square holes, and the like, and the side length of each grid hole 4 is less than or equal to half of the minimum wavelength of the electromagnetic waves of various frequencies generated by the circuit board assembly 1.
Fig. 3 is another specific structure diagram of the grid holes 4, as shown in fig. 3.
In another alternative embodiment regarding the shape of the grid holes 4, the grid holes 4 are embodied as circular holes. Meanwhile, the diameter of each of the mesh holes 4 is less than or equal to half of the minimum wavelength of the electromagnetic waves of various frequencies generated by the circuit board assembly 1.
Of course, the shape of the mesh holes 4 is not limited to the above circular or rectangular shape, and may also be a polygon, an ellipse, or the like.
Taking the grid holes 4 as rectangular holes as an example, the principle of shielding electromagnetic radiation is explained: each mesh hole 4 of the metal mesh corresponds to a rectangular waveguide with respect to the electromagnetic wave, and each mesh hole 4 corresponds to an overlapping combination of a large number of rectangular waveguides due to the wall thickness (axial length) of the mesh hole 4. Because light has the wave-particle duality, when electromagnetic waves enter the rectangular waveguide, the electromagnetic waves bounce back and forth on each metal wall and go forward in a zigzag mode. According to Maxwell's equation, for a rectangular waveguide of the same specification, the lower the frequency of the electromagnetic wave (the larger the wavelength), the larger the reflection angle of the electromagnetic wave on the metal wall of the rectangular waveguide, and when the wavelength of the electromagnetic wave is greater than or equal to the cutoff wavelength, the reflection angle reaches 90 °, which is equivalent to that the electromagnetic wave vertically reciprocates only on the side walls on both sides of the rectangular waveguide and does not continue to advance along the propagation direction. Therefore, when each side length of the mesh holes 4 is less than or equal to half of the minimum wavelength of the electromagnetic waves of various frequencies generated by the circuit board assembly 1, the wavelength of the electromagnetic waves generated by the circuit board assembly 1 is always greater than or equal to the cutoff wavelength, thereby achieving a stable electromagnetic shielding effect.
For the grid holes 4 with a circular shape, the electromagnetic shielding principle is the same, and the description is omitted here.
Of course, in engineering practice, the diameter or side length of the grid holes 4 may be somewhat floating on the basis of one and a half wavelengths mentioned above.
In addition, consider that radiator unit 2 and each grid hole 4 set up relatively, in order to guarantee that the radiating air current can reach the external world through each grid hole 4 high-efficiently, in this embodiment, each grid hole 4 is greater than or equal to radiator unit 2's air-out area in the surperficial coverage area of metal casing 3. So set up, the flow path of heat dissipation air current has been covered completely to the coverage area of net hole 4 promptly to guarantee that the heat dissipation air current can pass through net hole 4 completely, avoid being sheltered from by metal casing 3's inner wall.
As shown in fig. 4, fig. 4 is a schematic structural diagram of the heat dissipation assembly 2.
In an alternative embodiment of the heat dissipation assembly 2, the heat dissipation assembly 2 mainly comprises a heat dissipation fan 21, and the heat dissipation fan 21 is disposed opposite to each of the mesh holes 4. Specifically, the heat dissipation fan 21 is disposed on the surface of the circuit board assembly 1, and when the heat dissipation fan 21 is operated, a directional airflow carrying heat generated by the circuit board assembly 1 is generated to be discharged to the outside through each of the mesh holes 4.
Generally, the heat dissipation fan 21 may be an axial fan. Of course, the radial fan may be used as the radiator fan 21. Further, the radiator fan 21 may be replaced with a fan or the like.
Further, in order to improve the efficiency of absorbing heat generated by the circuit board assembly 1, the heat sink assembly 2 of the present embodiment is additionally provided with a heat sink base 22. Specifically, the heat radiation base 22 is disposed on the surface of the circuit board assembly 1, and the heat radiation fan 21 is mounted on the surface of the heat radiation base 22. The heat dissipation base 22 has good thermal conductivity, can efficiently absorb heat generated by the circuit board assembly 1, and dissipates the heat by using a large surface area thereof, thereby improving the heat dissipation efficiency of the circuit board assembly 1.
Moreover, in order to further improve the heat dissipation efficiency of the circuit board assembly 1 and assist in strengthening the electromagnetic shielding effect of the grid holes 4, the heat dissipation assembly 2 of the present embodiment is further provided with a metal heat dissipation plate 23. Specifically, the plurality of metal fins 23 are erected on the surface of the heat dissipation base 22, and are generally arranged at the same time to form an array distribution, and each metal fin 23 is substantially rectangular. With the arrangement, on one hand, the heat transferred to the heat dissipation base 22 is absorbed through the metal heat dissipation fins 23, and the heat dissipation area is increased by utilizing the surface area of the metal heat dissipation fins, so that the heat dissipation efficiency is improved; on the other hand, when the electromagnetic wave passes through each metal heat sink 23 in the propagation path, the electromagnetic wave is absorbed by the surface of the metal heat sink 23 by the skin effect, and thus the electromagnetic wave cooperates with the mesh holes 4 to enhance the shielding effect of the electromagnetic radiation. Generally, when electromagnetic waves are transmitted in the metal heat sink 23 for a skin depth distance, the amplitude is attenuated to 36.8% of the original amplitude, and the energy is attenuated to 13.5%.
In addition, considering that the heat dissipation base 22 is provided with the heat dissipation fan 21 and the metal heat dissipation fins 23 at the same time, for the purpose of optimizing the layout, in the present embodiment, the heat dissipation fan 21 is specifically disposed in the central region of the heat dissipation base 22, and the metal heat dissipation fins 23 are specifically scattered in the peripheral region of the heat dissipation base 22. With such arrangement, when the heat dissipation fan 21 operates, the suction force of the air inlet thereof will attract the air flow in the metal casing 3 to gather from the peripheral direction to the central area, and in the process, the air flow will firstly pass through the peripheral metal heat dissipation fins 23, thereby ensuring that the air flow can fully exchange heat with the metal heat dissipation fins 23 in the flowing process.
The embodiment further provides an electronic device, which mainly includes a mounting base 5 and an electromagnetic shielding heat dissipation mechanism disposed on the mounting base 5, wherein the specific content of the electromagnetic shielding heat dissipation mechanism is the same as the related content, and is not described herein again.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. The utility model provides an electromagnetic shield heat dissipation mechanism, includes circuit board subassembly, its characterized in that still including set up in radiator unit on the circuit board subassembly, cover and establish metal casing on the circuit board subassembly, set up in a plurality of net holes on the metal casing, radiator unit is located inside the metal casing, each net hole with radiator unit sets up relatively, and each the circumscribed circle diameter of the cross section of net hole is less than or equal to half of the minimum wavelength of the electromagnetic wave that circuit board subassembly produced.
2. The electromagnetic shielding and heat dissipating mechanism of claim 1, further comprising a plurality of heat dissipating holes disposed on the metal housing, wherein each heat dissipating hole is used to enhance the heat dissipating and electromagnetic radiation shielding effects of each mesh hole.
3. The electromagnetic shielding and heat dissipating mechanism of claim 1, wherein each of the grid holes is a circular hole and has a diameter less than or equal to half of a minimum wavelength of the electromagnetic waves generated by the circuit board assembly.
4. The electromagnetic shielding and heat dissipating mechanism of claim 1, wherein each of the grid holes is a square hole, and each of the side lengths thereof is less than or equal to half of the minimum wavelength of the electromagnetic wave generated by the circuit board assembly.
5. The electromagnetic shielding and heat dissipating mechanism of claim 1, wherein the coverage area of each grid hole on the metal housing is greater than or equal to the air outlet area of the heat dissipating assembly.
6. The electromagnetic shielding and heat dissipating mechanism of any one of claims 1 to 5, wherein the heat dissipating assembly comprises a heat dissipating fan disposed on the circuit board assembly, and the heat dissipating fan faces each of the grid holes.
7. The electromagnetic shielding and heat dissipating mechanism of claim 6, wherein the heat dissipating assembly further comprises a heat dissipating base disposed on the surface of the circuit board assembly for absorbing and dissipating heat therefrom, and the heat dissipating fan is mounted on a surface of the heat dissipating base facing away from the circuit board assembly.
8. The electromagnetic shielding and heat dissipating mechanism of claim 7, wherein the heat dissipating assembly further comprises a plurality of metal fins standing on the heat dissipating base.
9. The electromagnetic shielding and heat dissipating mechanism of claim 8, wherein each of the metal heat dissipating fins is spaced apart from the ribs between the grid holes.
10. An electronic device comprising a mounting base and an electromagnetic shielding heat dissipation mechanism disposed on the mounting base, wherein the electromagnetic shielding heat dissipation mechanism is the electromagnetic shielding heat dissipation mechanism according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220780804.8U CN217470608U (en) | 2022-04-06 | 2022-04-06 | Electromagnetic shielding heat dissipation mechanism and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220780804.8U CN217470608U (en) | 2022-04-06 | 2022-04-06 | Electromagnetic shielding heat dissipation mechanism and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217470608U true CN217470608U (en) | 2022-09-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220780804.8U Active CN217470608U (en) | 2022-04-06 | 2022-04-06 | Electromagnetic shielding heat dissipation mechanism and electronic equipment |
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| Country | Link |
|---|---|
| CN (1) | CN217470608U (en) |
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- 2022-04-06 CN CN202220780804.8U patent/CN217470608U/en active Active
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