CN217468418U - Serial diode packaging assembly - Google Patents
Serial diode packaging assembly Download PDFInfo
- Publication number
- CN217468418U CN217468418U CN202221199380.2U CN202221199380U CN217468418U CN 217468418 U CN217468418 U CN 217468418U CN 202221199380 U CN202221199380 U CN 202221199380U CN 217468418 U CN217468418 U CN 217468418U
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- Prior art keywords
- frame
- diode
- chip
- package assembly
- cross
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
- H01L2224/401—Disposition
- H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The utility model provides a serial-type diode encapsulation subassembly, it contains a plurality of bearing frame, a plurality of diode chip and a plurality of cross-over connection frame. Each bearing frame is provided with a chip setting part or a bridging part, or is provided with a chip setting part and a bridging part bent at the chip setting part. Each diode chip is arranged on each chip arrangement part. Each bridging frame is bridged between two adjacent bearing frames, and two ends of each bridging frame are respectively connected with each diode chip and each bridging part to form a series structure.
Description
Technical Field
The utility model relates to a diode encapsulation subassembly especially relates to a serial-type diode encapsulation subassembly.
Background
In electronic circuits, diode components are often used to perform rectification, voltage regulation, and loop protection. If the circuit is applied to a high voltage, a plurality of diode components can be connected in series in the circuit.
SUMMERY OF THE UTILITY MODEL
The inventor believes that the prior art method of connecting a plurality of diodes in series in a circuit increases the complexity of the circuit and is not conducive to automated manufacturing processes.
In view of the shortcomings of the prior art, the inventors of the present invention have focused on providing a serial diode package for high voltage circuits, so as to simplify the circuit and facilitate the automation process.
To achieve the above and other objects, the present invention provides a serial diode package assembly, which comprises a plurality of supporting frames, a plurality of diode chips and a plurality of bridging frames. Each bearing frame is provided with a chip setting part or a bridging part, or is provided with a chip setting part and a bridging part bent at the chip setting part. The diode chips are disposed on the chip mounting portions. Each bridging frame is bridged between two adjacent bearing frames, and two ends of each bridging frame are respectively connected with each diode chip and each bridging part to form a series structure.
In one embodiment, the carrier frames may include an inlet frame, an outlet frame, and at least one intermediate frame arranged between the inlet frame and the outlet frame.
In an embodiment, the inlet frame has only the chip disposing portion, the outlet frame has only the bridging portion, and the at least one middle frame may have the chip disposing portion and the bridging portion bent at the chip disposing portion.
In an embodiment, the at least one intermediate frame may be L-shaped and arranged complementarily to each other between the inlet frame and the outlet frame.
In an embodiment, the carrying frames arranged complementary to each other may have at least one turning point.
In an embodiment, the tandem diode package assembly may further include a package body. The packaging body covers the bearing frame, the diode chip and the bridging frame to form a packaging structure.
In an embodiment, each of the carrying frames may be provided with a lead protruding from the package body.
In an embodiment, the cross-over frames may be arranged parallel to each other.
In embodiments, the diode chip may include a silicon (Si) based schottky diode, a silicon carbide (SiC) schottky diode, a gallium nitride (GaN) diode, a gallium arsenide (GaAs) diode, a fast recovery diode, or a general PN junction diode.
Therefore, the utility model discloses a serial-type diode encapsulation subassembly, through the bearing frame reaches the cross-over connection frame establishes ties a plurality of diode chips, and can be applied to among the high-voltage circuit to the circuit that makes use is retrencied and is favorable to automatic processing procedure.
Drawings
Fig. 1 is a schematic top perspective view of a tandem diode package assembly according to an embodiment of the present invention;
FIG. 2 is a cross-sectional view of the entrance frame, the middle frame, the diode chip and the cross-over frame of FIG. 1;
FIG. 3 is a cross-sectional view of the two middle frames, the diode chip and the cross-over frame of FIG. 1;
FIG. 4 is a cross-sectional schematic view of the outlet frame, intermediate frame, diode chip and crossover frame of FIG. 1 being bridged;
FIG. 5 is a schematic top view corresponding to FIG. 1;
fig. 6 is a schematic bottom view corresponding to fig. 1.
[ notation ] to show
100 series diode packaging assembly
101 load-bearing frame
102 diode chip
103 cross-over frame
104 chip setting part
105 bridge section
106 portal frame
107 outlet frame
108 middle frame
109 package
110 pin
Detailed Description
For fully understanding the objects, features and effects of the present invention, the present invention will now be described in further detail by the following specific embodiments in conjunction with the accompanying drawings, which are set forth below:
referring to fig. 1 to 4, as shown in fig. 1, an embodiment of the invention provides a serial diode package assembly 100, which includes a plurality of conductive carrying frames 101, a plurality of diode chips 102, and a plurality of conductive bridging frames 103. Each of the carrier frames 101 has a chip mounting portion 104 or a bridging portion 105, or has a chip mounting portion 104 and a bridging portion 105 bent at the chip mounting portion 104. Each of the diode chips 102 is disposed on each of the chip disposing parts 104. Each of the cross frames 103 spans between two adjacent carrying frames 101. Both ends of each cross frame 103 are connected to each diode chip 102 and each cross portion 105, respectively, to form a series structure. The diode chip 102 includes a silicon (Si) -based schottky diode, a silicon carbide (SiC) schottky diode, a gallium nitride (GaN) diode, a gallium arsenide (GaAs) diode, a fast recovery diode, and a general PN junction diode. However, the present invention is not limited to this, and other types of diode chips may be used.
Therefore, the serial diode package assembly 100 according to the embodiment of the present invention can be applied to a high voltage circuit (not shown) by connecting a plurality of diode chips 102 in series through the supporting frame 101 and the bridging frame 103, so that the applied circuit is simplified and is beneficial to an automated process.
As shown in fig. 1 to 4, in an embodiment, the supporting frames 101 may include an inlet frame 106, an outlet frame 107, and at least one middle frame 108 arranged between the inlet frame 106 and the outlet frame 107. The inlet frame 106 has only the chip setting portion 104, and the outlet frame 107 has only the bridging portion 105. The at least one middle frame 108 may have the chip mounting portion 104 and the bridging portion 105 bent at the chip mounting portion 104. In fig. 1, the number of the middle frames 108 is plural, and the middle frames 108 may be respectively L-shaped and arranged between the entrance frame 106 and the exit frame 107 complementarily to each other, so as to integrate the formed series structure, and enable the length of the cross frame 103 to span two carrying frames 101 without being too long, and fig. 1 includes one cross frame 103 spanning between the entrance frame 106 and one middle frame 108, two cross frames 103 spanning between three middle frames 108, and one cross frame 103 spanning between one middle frame 108 and the exit frame 107. The number of middle frames 108 shown in fig. 1 is three, but is not limited thereto. Under the above configuration, the carrying frames 101 arranged complementary to each other may have at least one turn, and the cross-over frames 103 may be arranged parallel to each other. The two ends of each cross frame 103 can be respectively soldered to one diode chip 102 and one cross connection portion 105, but the invention is not limited thereto. The material of the carrying frame 101 and the cross-over frame 103 may be copper or iron-nickel alloy.
As shown in fig. 1 to 6, in an embodiment, the tandem diode package assembly 100 may further include a package body 109. The package 109 covers the carrier frame 101, the diode chip 102 and the cross-over frame 103 to form a package structure. Each of the supporting frames 101 may be provided with a lead 110 protruding from the package body 109 for electrically connecting to a circuit (not shown) on a circuit board (not shown) when the tandem diode package assembly 100 is mounted on the circuit board (not shown). As shown in fig. 5 and 6, the tandem diode package assembly 100 has a plurality of leads 110 protruding from the package body 109 on both sides. The package 109 may be an epoxy or other insulating packaging material.
The present invention has been disclosed in terms of preferred embodiments, but those skilled in the art will recognize that such embodiments are merely illustrative of the present invention and should not be construed as limiting the scope of the invention. It should be noted that all changes and substitutions equivalent to the embodiments are intended to be included within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the scope defined by the claims.
Claims (9)
1. A tandem diode package assembly, comprising:
the chip mounting device comprises a plurality of bearing frames, a plurality of connecting pieces and a plurality of connecting pieces, wherein each bearing frame is provided with a chip mounting part or a bridging part, or is provided with a chip mounting part and a bridging part bent at the chip mounting part;
a plurality of diode chips, each of which is disposed on each of the chip-disposing parts; and
and the two ends of each cross-over frame are respectively connected with each diode chip and each cross-over part to form a series structure.
2. The package assembly of claim 1, wherein the carrier frame comprises an inlet frame, an outlet frame, and at least one intermediate frame disposed between the inlet frame and the outlet frame.
3. The package assembly of claim 2, wherein the inlet frame has only the chip mounting portion, the outlet frame has only the bridge portion, and the at least one intermediate frame has the chip mounting portion and the bridge portion bent at the chip mounting portion.
4. The tandem diode package assembly of claim 3, wherein the at least one intermediate frame is L-shaped and arranged complementarily to each other between the inlet frame and the outlet frame.
5. The tandem diode package assembly of claim 4, wherein the carrier frames arranged complementary to each other have at least one turn.
6. The package assembly of claim 1, further comprising a package body covering the carrier frame, the diode chip, and the cross-over frame to form a package structure.
7. The package assembly of claim 6, wherein each of the carrier frames has leads protruding from the package body.
8. The tandem diode package assembly of claim 1, wherein the cross-over frames are disposed parallel to each other.
9. The tandem diode package assembly of claim 1, wherein the diode chip comprises a silicon (Si) -based schottky diode, a silicon carbide (SiC) schottky diode, a gallium nitride (GaN) diode, a gallium arsenide (GaAs) diode, a fast recovery diode, or a general PN junction diode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221199380.2U CN217468418U (en) | 2022-05-18 | 2022-05-18 | Serial diode packaging assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221199380.2U CN217468418U (en) | 2022-05-18 | 2022-05-18 | Serial diode packaging assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217468418U true CN217468418U (en) | 2022-09-20 |
Family
ID=83276015
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221199380.2U Active CN217468418U (en) | 2022-05-18 | 2022-05-18 | Serial diode packaging assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217468418U (en) |
-
2022
- 2022-05-18 CN CN202221199380.2U patent/CN217468418U/en active Active
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