CN217464357U - LED lamp low-attenuation aluminum substrate - Google Patents
LED lamp low-attenuation aluminum substrate Download PDFInfo
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- CN217464357U CN217464357U CN202220710412.4U CN202220710412U CN217464357U CN 217464357 U CN217464357 U CN 217464357U CN 202220710412 U CN202220710412 U CN 202220710412U CN 217464357 U CN217464357 U CN 217464357U
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Abstract
The application provides a LED lamp aluminium base board that declines belongs to aluminium base board technical field. The LED lamp low-attenuation aluminum substrate comprises a substrate assembly and a heat dissipation assembly. The heat dissipation assembly comprises a heat dissipation plate and fins, the fins are evenly distributed on one surface of the heat dissipation plate in parallel, the other surface of the heat dissipation plate is fixedly attached to the heat absorption plate, and the outer ends of the heat dissipation nails are fixedly connected with the heat absorption plate. In this application, the effectual heat that absorbs LED lamp pearl of base plate subassembly and high-efficient transmission give radiating component and dispel the heat, have effectively improved the radiating effect of whole aluminium base board, have reduced the decay that LED lamp pearl produced because of the temperature is high.
Description
Technical Field
The application relates to the technical field of aluminum substrates, in particular to a low-attenuation aluminum substrate for an LED lamp.
Background
The aluminum substrate is a metal-based copper-clad plate with good heat dissipation function, and a single-sided board generally comprises a three-layer structure, namely a circuit layer (copper foil), an insulating layer and a metal base layer. Commonly found in LED lighting products. The LED lamp has a front surface and a back surface, wherein the white surface is welded with the LED pins, and the other surface presents the natural color of aluminum.
The base plate not only need undertake the heat dissipation function and still need undertake support function, so although copper heat conductivility is better, but copper is soft and heavy, so generally choose the base plate of aluminium system for use, but the ability of aluminium product heat dispersion is good but heat absorption heat conduction is relatively poor, can not effectual heat absorption with LED lamp pearl guide out usually, leads to LED lamp pearl to be in work under the higher temperature for a long time for LED lamp pearl subsides and loses, and life-span and luminance all receive the influence.
SUMMERY OF THE UTILITY MODEL
In order to make up for the above deficiencies, the present application provides a low-attenuation aluminum substrate for LED lamps, which aims to improve the problems mentioned in the background art.
The application provides an LED lamp low-attenuation aluminum substrate, which comprises a substrate assembly and a heat dissipation assembly.
The heat dissipation assembly comprises a heat dissipation plate and fins, the fins are evenly distributed on one surface of the heat dissipation plate in parallel, the other surface of the heat dissipation plate is fixedly attached to the heat absorption plate, and the outer ends of the heat dissipation nails are fixedly connected with the heat absorption plate.
In the above scheme, the absorber plate absorbs the heat from external LED lamp pearl, accelerates to guide to the heating panel through the heat dissipation nail of embedding, and the rethread fin distributes away, and the absorber plate mainly adopts the copper product, and thermal conductivity is good, and heat dissipation nail and heating panel all with the aluminium material, and heat dispersion is good, and copper is responsible for the heat absorption and aluminium is responsible for the heat dissipation, has effectively improved the radiating effect of whole aluminium base board, has reduced the decay that LED lamp pearl produced because of the temperature height.
Furthermore, the heat absorbing plate comprises a bottom plate A and a heat dissipation layer, the heat dissipation layer is fixedly attached to the bottom plate A, and the inner ends of all the heat dissipation nails are fixedly connected with the heat dissipation layer.
Furthermore, the heat absorbing plate also comprises a bottom plate B, and the bottom plate B is fixedly attached to the other surface of the heat dissipation layer.
Furthermore, the heat absorbing plate further comprises heat conducting columns, the heat conducting columns are evenly distributed in the heat radiating layer, and two ends of each heat conducting column are fixedly connected with the bottom plate A and the bottom plate B respectively.
In the above scheme, bottom plate A, bottom plate B and heat conduction post are integrated into one piece, and be the copper product, the heat absorption and the conduction of mainly used LED lamp pearl, heat dissipation layer and heat dissipation nail are integrated into one piece, and be the aluminium material, in this embodiment, at bottom plate A, bottom plate B and heat conduction post shaping back, the hole of heat dissipation nail is reserved on bottom plate B, then pour the shaping with the aluminium water through this reservation hole can, copper hardness is low and the heat conductivity is good but the price is more expensive and heavier, and the high heat dissipation of aluminium hardness is good and cheap and lighter, the heat dissipation layer of aluminium provides the intensity support for bottom plate A and bottom plate B of copper on the one hand, the weight has also been alleviateed, on the other hand also accelerates bottom plate A and bottom plate B's heat to distribute away through the heat dissipation nail.
Further, the substrate assembly further comprises an insulating layer, and the insulating layer is fixedly attached to the bottom plate A.
Further, the base plate subassembly is still including circuit layer and anticorrosive coating, the circuit layer with the fixed laminating of insulating layer, the anticorrosive coating with the fixed laminating of circuit layer.
In the scheme, the insulating layer is generally made of epoxy resin, the thickness is about 100 microns, heat dissipation is affected when the insulating layer is too thick, the circuit layer is usually printed on the insulating layer through copper foil to form an external circuit network for the LED lamp beads when the insulating layer is too thin, and finally the circuit layer is coated with a layer of corrosion inhibitor to protect the copper foil and play roles in oxidation resistance and corrosion resistance.
Furthermore, the heat dissipation assembly further comprises a supporting piece, the supporting piece comprises an edge strip and two baffle strips, and the edge strip and the two baffle strips are both provided with two.
Furthermore, the two edge strips and the two stop strips are fixedly connected with the edge of the heat dissipation plate.
In the scheme, the fins are protected by the frame surrounded by the edge strips and the barrier strips, and the fins are prevented from being deformed by external force and damaged.
Furthermore, the two edge strips are parallel to the fins, the two barrier strips are perpendicular to the fins, and air holes corresponding to the fins are formed in the two barrier strips.
Furthermore, the heat dissipation assembly further comprises a guard plate, and the guard plate is fixedly attached to the two edge strips, the two barrier strips and all the fins.
In the above scheme, the guard plate, the two edge strips and the two barrier strips form a complete shield to protect all the fins, and through the air holes formed in the barrier strips, external air flow can pass through the air holes to flow through all the fins and then flow out from the air holes in the other barrier strip, so that heat dissipation is facilitated.
Drawings
In order to more clearly explain the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and that for those skilled in the art, other related drawings can be obtained from these drawings without inventive effort.
FIG. 1 is a schematic structural diagram of an LED lamp low-attenuation aluminum substrate provided in the embodiment of the present application;
fig. 2 is a schematic view of a connection relationship between a heat absorbing plate and a heat dissipating plate according to an embodiment of the present disclosure;
fig. 3 is a schematic view of a connection relationship between fins and a heat dissipation plate according to an embodiment of the present disclosure;
fig. 4 is a schematic view of a partially enlarged structure at a in fig. 1 according to an embodiment of the present disclosure.
In the figure: 100-a substrate assembly; 110-a heat sink plate; 111-base plate a; 112-a heat dissipation layer; 113-base plate B; 114-a thermally conductive post; 120-heat dissipation nail; 130-an insulating layer; 140-a circuit layer; 150-an anticorrosive layer; 200-a heat dissipation assembly; 210-a heat sink; 220-fins; 230-a support; 231-edge strips; 232-barrier strip; 233-guard plate.
Detailed Description
The technical solutions in the present application will be described below with reference to the drawings in the present application.
To make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments obtained by a person of ordinary skill in the art without any inventive work based on the embodiments in the present application are within the scope of protection of the present application.
Referring to fig. 1, the present application provides a low-attenuation aluminum substrate for an LED lamp, which includes a substrate assembly 100 and a heat dissipation assembly 200.
The effective heat of absorbing LED lamp pearl of base plate subassembly 100 and high-efficient transmission give radiator unit 200 and dispel the heat, have effectively improved the radiating effect of whole aluminium base board, have reduced the decay that LED lamp pearl produced because of the temperature is high.
Referring to fig. 1 to 4, the substrate assembly 100 includes a heat absorbing plate 110 and heat dissipation pins 120, the heat dissipation pins 120 are uniformly distributed on the heat absorbing plate 110, one end of each heat dissipation pin 120 is embedded in the heat absorbing plate 110, the heat dissipation assembly 200 includes a heat dissipation plate 210 and fins 220, the fins 220 are uniformly distributed on one surface of the heat dissipation plate 210 in parallel, the other surface of the heat dissipation plate 210 is fixedly attached to the heat absorbing plate 110, and the outer ends of all the heat dissipation pins 120 are fixedly connected to the heat absorbing plate 110. The heat absorbing plate 110 absorbs heat from the external LED lamp beads, the heat is accelerated to be guided to the heat dissipation plate 210 through the embedded heat dissipation nails 120, and then the heat is dissipated through the fins 220, the heat absorbing plate 110 is mainly made of copper and is good in heat conduction performance, the heat dissipation nails 120 and the heat dissipation plate 210 are made of aluminum, the heat dissipation performance is good, the copper is responsible for heat absorption, and the aluminum is responsible for heat dissipation, so that the heat dissipation effect of the whole aluminum substrate is effectively improved, and the attenuation of the LED lamp beads due to high temperature is reduced.
Referring to fig. 1 to 4, the heat absorbing plate 110 includes a bottom plate a111 and a heat dissipating layer 112, the heat dissipating layer 112 is fixedly attached to the bottom plate a111, and inner ends of all the heat dissipating nails 120 are fixedly connected to the heat dissipating layer 112. The heat absorbing plate 110 further includes a bottom plate B113, and the bottom plate B113 is fixedly attached to the other surface of the heat dissipating layer 112. The heat absorbing plate 110 further includes heat conducting pillars 114, the heat conducting pillars 114 are uniformly distributed in the heat dissipating layer 112, and two ends of all the heat conducting pillars 114 are respectively fixedly connected to the bottom plate a111 and the bottom plate B113. The bottom plate A111, the bottom plate B113 and the heat conduction column 114 are integrally formed, and are made of copper materials, and are mainly used for heat absorption and conduction of LED lamp beads, the heat dissipation layer 112 and the heat dissipation nails 120 are integrally formed, and are made of aluminum materials, in the embodiment, after the bottom plate A111, the bottom plate B113 and the heat conduction column 114 are formed, holes of the heat dissipation nails 120 are reserved on the bottom plate B113, and then molten aluminum is poured and formed through the reserved holes, the copper is low in hardness and good in heat conductivity, but expensive and heavy in price, the aluminum is high in hardness and good in heat dissipation, cheap and light, the aluminum heat dissipation layer 112 provides strength support for the copper bottom plate A111 and the copper bottom plate B113 on one hand, the weight is also reduced, and on the other hand, the heat dissipation of the bottom plate A111 and the bottom plate B113 is accelerated to be dissipated out through the heat dissipation nails 120.
Referring to fig. 1 to 4, the substrate assembly 100 further includes an insulating layer 130, and the insulating layer 130 is fixedly attached to the bottom plate a 111. The substrate assembly 100 further includes a circuit layer 140 and an anti-corrosion layer 150, wherein the circuit layer 140 is fixedly attached to the insulating layer 130, and the anti-corrosion layer 150 is fixedly attached to the circuit layer 140. The insulating layer 130 is generally made of epoxy resin, the thickness is about 100 micrometers, heat dissipation is affected when the insulating layer is too thick, the circuit layer 140 is usually made of copper foil printed on the insulating layer 130 to form an external circuit network for the LED lamp beads, and finally the circuit layer 140 is coated with a layer of resist to protect the copper foil and play roles of oxidation resistance and corrosion resistance.
Referring to fig. 1 to 4, the heat dissipation assembly 200 further includes a supporting member 230, the supporting member 230 includes an edge strip 231 and a blocking strip 232, and two edge strips 231 and two blocking strips 232 are disposed. Both the edge strips 231 and the barrier strips 232 are fixedly connected to the edge of the heat dissipation plate 210. The edge strips 231 and the blocking strips 232 surround a frame to protect the fins 220, so that the fins 220 are prevented from being deformed and damaged by external force.
The two edge strips 231 are parallel to the fins 220, the two barrier strips 232 are perpendicular to the fins 220, and the two barrier strips 232 are provided with air holes corresponding to the fins 220. The heat dissipation assembly 200 further includes a protective plate 233, and the protective plate 233 is fixedly attached to the two edge strips 231, the two barrier strips 232, and all the fins 220. The guard plate 233 forms a complete shield with the two side bars 231 and the two barrier bars 232 to protect all the fins 220 therein, and through the air holes formed in the barrier bars 232, external air flow can pass through the air holes and flow through all the fins 220 and then flow out from the air holes in the other barrier bar 232, so as to facilitate heat dissipation, and the protection fins 220 with the support members 230 can be thinner and denser, so that a larger heat dissipation surface area is provided, which is beneficial to improving the heat dissipation effect.
The working principle of the LED lamp low-attenuation aluminum substrate is as follows: the base plate a111, the base plate B113 and the heat conducting column 114 are integrally formed and made of copper materials, and are mainly used for heat absorption and conduction of the LED lamp beads, the heat dissipation layer 112 and the heat dissipation nail 120 are integrally formed and made of aluminum materials, in this embodiment, after the base plate a111, the base plate B113 and the heat conducting column 114 are formed, a hole for the heat dissipation nail 120 is reserved on the base plate B113, and then molten aluminum is poured and formed through the reserved hole, so that the heat conduction and the heat dissipation are combined together in a crossed manner, the heat conduction and the heat dissipation effects are improved, on one hand, the aluminum heat dissipation layer 112 provides strength support for the copper base plate a111 and the copper base plate B113, the weight is also reduced, on the other hand, the heat of the base plate a111 and the base plate B113 is accelerated to be transmitted to the heat dissipation plate 210 and the fins 220 through the heat dissipation nail 120, the heat dissipation of the base plate a is accelerated to be dissipated out, and in conclusion, the base plate assembly 100 effectively absorbs the heat of the LED lamp beads and efficiently transmits the heat dissipation assembly 200 to dissipate the heat, the radiating effect of the whole aluminum substrate is effectively improved, and the attenuation of the LED lamp beads caused by high temperature is reduced.
The above embodiments are merely examples of the present application and are not intended to limit the scope of the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application. It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (10)
1. A low-attenuation aluminum substrate of an LED lamp is characterized by comprising
The heat dissipation device comprises a substrate assembly (100), wherein the substrate assembly (100) comprises a heat absorption plate (110) and heat dissipation nails (120), the heat dissipation nails (120) are uniformly distributed on the heat absorption plate (110), and one ends of all the heat dissipation nails (120) are embedded into the heat absorption plate (110);
the radiating assembly (200) comprises a radiating plate (210) and fins (220), the fins (220) are uniformly distributed on one surface of the radiating plate (210) in parallel, the other surface of the radiating plate (210) is fixedly attached to the heat absorbing plate (110), and the outer ends of all the radiating nails (120) are fixedly connected with the heat absorbing plate (110).
2. The LED lamp low-attenuation aluminum substrate as claimed in claim 1, wherein the heat absorbing plate (110) comprises a bottom plate A (111) and a heat dissipating layer (112), the heat dissipating layer (112) is fixedly attached to the bottom plate A (111), and inner ends of all the heat dissipating nails (120) are fixedly connected to the heat dissipating layer (112).
3. The LED lamp aluminum substrate with low attenuation as set forth in claim 2, wherein the heat absorbing plate (110) further comprises a bottom plate B (113), and the bottom plate B (113) is fixedly attached to the other surface of the heat dissipating layer (112).
4. The LED lamp low-attenuation aluminum substrate as claimed in claim 3, wherein the heat absorbing plate (110) further comprises heat conducting pillars (114), the heat conducting pillars (114) are uniformly distributed in the heat dissipating layer (112), and both ends of all the heat conducting pillars (114) are respectively and fixedly connected to the bottom plate A (111) and the bottom plate B (113).
5. The LED lamp aluminum substrate with low attenuation as set forth in claim 4, wherein the substrate assembly (100) further comprises an insulating layer (130), and the insulating layer (130) is fixedly attached to the bottom plate A (111).
6. The LED lamp low-attenuation aluminum substrate according to claim 5, wherein the substrate assembly (100) further comprises a circuit layer (140) and an anti-corrosion layer (150), the circuit layer (140) is fixedly attached to the insulating layer (130), and the anti-corrosion layer (150) is fixedly attached to the circuit layer (140).
7. The LED lamp low-attenuation aluminum substrate as claimed in claim 1, wherein the heat dissipation assembly (200) further comprises a support member (230), the support member (230) comprises a side bar (231) and a blocking bar (232), and two side bars (231) and two blocking bars (232) are arranged.
8. The LED lamp low-attenuation aluminum substrate as claimed in claim 7, wherein the two edge strips (231) and the two stop strips (232) are fixedly connected with the edge of the heat dissipation plate (210).
9. The LED lamp low-attenuation aluminum substrate as claimed in claim 8, wherein the two edge strips (231) are parallel to the fins (220), the two barrier strips (232) are perpendicular to the fins (220), and each of the two barrier strips (232) has an air hole corresponding to the fin (220).
10. The LED lamp low-attenuation aluminum substrate according to claim 9, wherein the heat dissipation assembly (200) further comprises a protective plate (233), and the protective plate (233) is fixedly attached to the two edge strips (231), the two barrier strips (232) and all the fins (220).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220710412.4U CN217464357U (en) | 2022-03-28 | 2022-03-28 | LED lamp low-attenuation aluminum substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220710412.4U CN217464357U (en) | 2022-03-28 | 2022-03-28 | LED lamp low-attenuation aluminum substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217464357U true CN217464357U (en) | 2022-09-20 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220710412.4U Active CN217464357U (en) | 2022-03-28 | 2022-03-28 | LED lamp low-attenuation aluminum substrate |
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| CN (1) | CN217464357U (en) |
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- 2022-03-28 CN CN202220710412.4U patent/CN217464357U/en active Active
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