CN217452630U

CN217452630U - Intra-hole femtosecond laser beam deflection device

Info

Publication number: CN217452630U
Application number: CN202222221723.7U
Authority: CN
Inventors: 唐杰; 龙冈; 邓明旭; 沈乾坤
Original assignee: Mianyang Xinneng Zhizao Technology Co ltd
Current assignee: Mianyang Xinneng Zhizao Technology Co ltd
Priority date: 2022-08-23
Filing date: 2022-08-23
Publication date: 2022-09-20
Anticipated expiration: 2032-08-23

Abstract

The utility model discloses an intra-hole femtosecond laser beam deflection device, which comprises a rod body with a diameter smaller than the aperture, wherein the top of the rod body is provided with a laser beam reflection surface which can extend into the hole, and the laser beam reflection line of the reflection surface is vertical to the hole wall; the rod body is arranged on the linkage table. The utility model discloses PCB diaphragm orifice inner wall smooth after downthehole femto second laser beam deflection device handles has avoidd PCB board product inner hole wall surface quality and has had the defect of inclination, and the high-pressure discharge that does not appear because the not high production of inner hole wall quality punctures the scheduling problem after the circular telegram, satisfies the life requirement of PCB board simultaneously, uses this device can satisfy the qualification rate of PCB product completely, and PCB product uniformity is high, and product quality is controllable.

Description

Intra-hole femtosecond laser beam deflection device

Technical Field

The utility model belongs to PCB board manufacture equipment field relates to PCB inboard wall of through hole processing auxiliary device.

Background

In earlier technology development work, the applicant prepared a PCB laminate as shown in fig. 1, where the PCB laminate was obtained by precisely aligning and pressing a plurality of PCB composite boards, and a through hole was formed in the middle of the PCB.

In the field of micromachining, femtosecond laser has little influence on the periphery of a material, so that the material can be safely cut, punched and carved, and can even be applied to the photoetching process of integrated circuits in the electronic industry. Femtosecond laser processing can also be used in the electronics industry to fabricate through holes in PCB boards.

Femtosecond laser is a technical means for obtaining the shortest pulse under the laboratory condition, and the power emitted instantly is huge.

With the technical upgrade of the application field of the PCB, the use condition is higher and higher, and when the multilayer PCB is manufactured, the quality requirement on the inner surface of the through hole of the multilayer PCB is higher and higher, and the discharge phenomenon between the conducting layers of the inner wall of the through hole of the PCB is not allowed. This requires that the surface quality between the hole conductive layers in the PCB be improved without loss.

The conventional machining mode is machining, but the machining method is destructive machining, the surface of a high-quality product cannot be met, the surface quality of the inner wall of a through hole of a PCB cannot be checked and accepted by a user, and high-voltage discharge breakdown phenomena can occur when a plurality of laminated PCBs or multi-layer PCBs are drilled in the machining mode.

In implementing the present invention, the inventor finds that there is at least one of the following technical problems in the prior art:

A. in the prior art, a technical means of using a laser beam including a femtosecond laser to punch holes on the surface of a workpiece appears, in the prior art, the laser beam is perpendicular to the surface of the PCB to drill holes on the PCB, and the drilling mode includes a punching method and a non-punching method, wherein the non-punching method includes a circular cutting method, a spiral method, a concentric circle processing method and the like. However, this technique is only used for punching a hole in a workpiece, and cannot achieve a state where the inner wall surface of the hole is not damaged.

B. The femtosecond processing cannot directly and completely puncture the workpiece once, circular cutting or spiral cutting is needed, the workpiece is processed into punched parts layer by layer like a boring cutter, and a groove is formed on the hole wall of each layer when each layer is processed, so that the inner wall of the through hole is finally serrated, referring to fig. 2, the secondary hole 401' is serrated, and the tip of the sawtooth can become a high-voltage tip discharge part, so that a user product is punctured.

C. The inner wall of the hole can not be processed by the existing femtosecond laser equipment.

SUMMERY OF THE UTILITY MODEL

In view of this, the utility model aims to provide an downthehole femto second laser beam deflection device, the device with femto second laser beam perpendicular to PCB board through-hole inner wall, make full use of femto second laser characteristic, make the through-hole inner wall level and smooth.

In order to solve the technical problem, the utility model provides a technical scheme is that, an intra-hole femtosecond laser beam deflection device is provided, which comprises a rod body with a diameter smaller than the aperture, a laser beam reflection surface capable of extending into the hole is arranged at the top of the rod body, and the laser beam reflection line of the reflection surface is perpendicular to the hole wall; the rod body is arranged on the linkage table.

According to the utility model discloses downthehole femto second laser beam deflection device's an embodiment, the linkage platform includes slewing mechanism, slewing mechanism's rotation portion with the body of rod is with axis line fixed connection.

According to the utility model discloses an embodiment of downthehole femto second laser beam deflection device, the linkage platform includes the plane mechanism that slightly slides.

According to the utility model discloses an embodiment of downthehole femto second laser beam deflection device, the linkage platform includes vertical little smooth mechanism.

According to the utility model discloses an embodiment of downthehole femto second laser beam deflection device, the plane is smooth mechanism a little and is passed through first connector fixed connection with slewing mechanism.

According to the utility model discloses an embodiment of downthehole femto second laser beam deflection device, first connector is the ring flange.

According to the utility model discloses an embodiment of downthehole femto second laser beam deflection device, the plane slide a little the mechanism with vertical slide a little the mechanism passes through the second connector and connects, the second connector is the L type, and the second connector includes mutually perpendicular's first link and second link, and slide a little the mechanism and first link fixed connection, vertical slide a little the mechanism and second link fixed connection.

According to the utility model discloses an embodiment of downthehole femto second laser beam deflection device, vertical little smooth mechanism includes fixed module and slip module, slip module and second connecting end fixed connection, fixed module fixedly connected with third connector.

According to the utility model discloses an embodiment of downthehole femto second laser beam deflection device, slewing mechanism is the miniature servo motor of disk.

According to the utility model discloses an embodiment of downthehole femto second laser beam deflection device, the plane is slided the mechanism a little and is finely tuned the slip table, vertical little smooth mechanism is sharp slip table.

Compared with the prior art, one of the technical solutions has the following advantages:

a) the utility model discloses downthehole femto second laser beam deflection device makes femto second laser beam in downthehole back that deflects, beats perpendicularly on the downthehole wall to under the cooperation of linkage platform, make the light beam strike point cover all regions of downthehole wall, solve the unsmooth problem in downthehole wall surface that current matter accuse technology preparation obtained.

b) The utility model discloses PCB diaphragm orifice inner wall smooth after downthehole femto second laser beam deflection device handles has avoidd the defect of PCB board product inner hole wall surface quality loss and inclination, and the high-pressure discharge breakdown scheduling problem because the not high production of inner hole wall quality does not appear after the circular telegram satisfies the life requirement of PCB board simultaneously.

Drawings

In order to more clearly illustrate the technical solution of the embodiments of the present invention, the drawings which are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and that for those skilled in the art, other related drawings can be obtained according to these drawings without inventive efforts.

Fig. 1 is a perspective view of a prior art PCB laminate.

Fig. 2 is a schematic cross-sectional structural diagram of a through hole of a PCB board formed by femtosecond processing in the prior art.

Fig. 3 is a schematic perspective view of an intra-hole femtosecond laser beam deflection device.

Fig. 4 is a schematic view of a sectional structure of a through hole of a PCB board formed by auxiliary processing of the device of the present invention.

The labels in the figure are respectively:

100 of the rod bodies are arranged in the horizontal direction,

101 of the light-reflecting surface of the light-reflecting plate,

210 of the rotating mechanism, and a rotating mechanism,

220 of the micro-sliding mechanism on the plane,

230 of the vertical micro-sliding mechanism are arranged,

310 a first connector for a first electrical device,

320 the second connector of the second set of connectors,

321 a first connection end of the first connector,

322 of the second end of the first connector,

330 a third connector for the at least one of the first and second connectors,

400 of the stacked PCB boards are stacked,

the holes of the plate 401 are arranged,

401' sub well.

Detailed Description

The following description is made with reference to the accompanying drawings and a specific embodiment.

To make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the drawings of the embodiments of the present invention are combined to clearly and completely describe the technical solutions of the embodiments of the present invention, and obviously, the described embodiments are some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention. Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it may not be further defined and explained in subsequent figures.

The femtosecond laser beam deflection device in the hole described in the embodiment refers to the hole, generally a through hole, on the workpiece to be processed. For example, the board holes 401 on the stacked PCB 400 shown in fig. 1 require smooth inner wall surfaces of the board holes 401 and complete attachment between the inner walls of the board holes 401 and the connecting members in some application fields of the stacked PCB 400 with higher requirements, so that the conductive area is maximized.

When the existing femtosecond laser equipment is used for machining holes, a workpiece cannot be directly and completely punctured at one time, circular cutting or spiral cutting is needed, the holes are processed layer by layer like boring cutters for processing the punched parts, each layer is processed, a layer of grooves are formed on the hole wall, and finally the holes become sawtooth-shaped secondary holes 401' as shown in figure 2, and the tips of the sawteeth are in line contact with the rod-shaped conductors and can become high-voltage tip discharge parts, so that the rod-shaped conductors are punctured. Downthehole femto second laser beam deflection device just can solve the problem of inferior hole 401', makes downthehole wall surface level and smooth, makes conductive area reach the maximize.

See fig. 3. The femtosecond laser beam deflection apparatus in the hole includes a rod body 100 having a diameter smaller than the aperture, and the rod body 100 can be inserted into the hole. The top of the rod body 100 is provided with a laser beam reflecting surface 101 capable of extending into the hole, the reflecting surface 101 is a reflecting surface capable of reflecting laser beams, and the reflecting surface 101 can be a fixed reflecting surface directly constructed on the rod body 100 or a reflecting surface of a reflector arranged on the top of the rod body 100.

The installation angle of the reflecting surface has strict requirements, and it is necessary to ensure that the reflection line of the laser beam L emitted to the reflecting surface 101 is perpendicular to the hole wall, so as to machine the plate hole 401 in and out of fig. 4. Once the included angle between the femtosecond laser beam L and the hole wall is a non-right angle, an inclined plane can appear on the hole wall.

The reflecting surface 101 rotates in the plate hole 401 and slides back and forth along the axial line of the hole until the inner wall of the plate hole 401 is completely processed to be smooth. To control the movement of the reflecting surface 101, the stick 100 is mounted on a linkage table.

Specifically, the linkage table in this embodiment includes a rotation mechanism 210, a planar microslide mechanism 220, and a vertical microslide mechanism 230. The rotating mechanism 210 is a disk-type micro servo motor, such as a RMD-L-7010 disk-type dc brushless servo motor. The disc type micro servo motor comprises a stator and a rotor, wherein the rotor is a rotating part, the rotor is fixedly connected with the rod body 100 coaxially, and drives the rod body 100 to rotate, and in the figure 3, R represents that the rod body 100 rotates anticlockwise; the stator of the motor is fixedly connected to the first connector 310.

In this embodiment, the first connector 310 is a flange, and includes an upper connection plate and a lower connection plate, the stator is connected to the upper connection plate, and the planar micro-sliding mechanism 220 is connected to the lower connection plate.

The planar microslip mechanism 220 is a fine adjustment sliding table, and the horizontal position of the rod body 100 is finely adjusted in the directions of the X axis and the Y axis.

The planar micro-sliding mechanism 220 is connected with the vertical micro-sliding mechanism 230 through a second connector 320, the second connector 320 is L-shaped, the second connector 320 includes a first connecting end 321 and a second connecting end 322 which are perpendicular to each other, the planar micro-sliding mechanism 220 is fixedly connected with the first connecting end 321, and the vertical micro-sliding mechanism 230 is fixedly connected with the second connecting end 322.

The vertical microslip mechanism 230 is a linear sliding table, and the vertical positions of the second connector 320, the planar microslip mechanism 220, the first connector 310, the rotating mechanism 210 and the rod body 100 are integrally fine-tuned in the Z-axis direction.

The vertical micro-sliding mechanism 230 includes a fixed module and a sliding module, the sliding module is fixedly connected to the second connecting end 322, and the fixed module is fixedly connected to the third connector 330. The third connector 330 is a component for connecting the femtosecond laser beam deflection apparatus in the hole with other apparatuses or a submount, and realizes the installation of the femtosecond laser beam deflection apparatus in the hole.

In the prior art, a large number of high-precision disc-type micro servo motors, fine adjustment sliding tables and linear sliding tables can be selected.

In a specific application mode, referring to fig. 4, when a board hole 401 of a PCB board is processed, an in-hole femtosecond laser beam deflection device is installed right below a femtosecond laser device, a rod body 100 extends into the board hole 401 from a lower orifice of the board hole 401, a laser beam L is projected from an upper orifice of the board hole 401 to a beam of the laser beam L coinciding with an axis line of the hole, the laser beam L is projected onto a reflection surface 101, an incident angle is 45 °, a reflection angle is 45 °, and a reflection line perpendicularly acts on an inner wall of the board hole 401. By controlling the linkage table, the femtosecond laser is processed to the whole surface area of the inner wall of the plate hole 401.

The utility model discloses downthehole femto second laser beam deflection device can guarantee that femto second laser device jets out laser beam and beats perpendicularly on product PCB diaphragm orifice 401 is surperficial, laser beam focuses on the superfine micro space region that still much less than the diameter of hair silk, lets product hole surface form thin one deck plasma in the twinkling of an eye, thereby processing out do not have the thermal effect and shock wave, can not have the diaphragm orifice 401 surface of tissue damage, the machining accuracy of femto second laser can reach 5 mu m, the last product that processes out high quality surface.

Of course, when using the utility model discloses a supplementary processing diaphragm orifice 401 surface, at first need use prior art means to process out the through-hole on the PCB board.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and to simplify the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or may be connected through the use of two elements or the interaction of two elements. The specific meaning of the above terms in the present invention can be understood according to specific situations by those of ordinary skill in the art.

In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

The above is only a preferred embodiment of the present invention, and it should be noted that the above preferred embodiment should not be considered as limiting the present invention, and the protection scope of the present invention should be subject to the scope defined by the claims. It will be apparent to those skilled in the art that various modifications and enhancements can be made without departing from the spirit and scope of the invention, and such modifications and enhancements are intended to be within the scope of the invention.

Claims

1. An intra-hole femtosecond laser beam deflection device is characterized by comprising a rod body with the diameter smaller than the hole diameter, wherein the top of the rod body is provided with a laser beam reflection surface capable of extending into a hole, and the laser beam reflection line of the reflection surface is vertical to the hole wall; the rod body is arranged on the linkage table.

2. The femtosecond laser beam deflection device in hole according to claim 1, wherein the linkage table comprises a rotating mechanism, and a rotating part of the rotating mechanism is fixedly connected with the coaxial line of the rod body.

3. The intra-aperture femtosecond laser beam deflection device according to claim 2, wherein the linkage table comprises a planar microslip mechanism.

4. The intra-aperture femtosecond laser beam deflection device according to claim 3, wherein the linkage table comprises a vertical microslip mechanism.

5. The femtosecond laser beam deflection device inside a hole according to claim 3, wherein the plane microslip mechanism is fixedly connected with the rotation mechanism through a first connector.

6. The femtosecond laser beam deflection device according to claim 5, wherein the first connector is a flange.

7. The femtosecond laser beam deflection device in hole according to claim 4, wherein the planar microslide mechanism is connected with the vertical microslide mechanism through a second connector, the second connector is L-shaped, the second connector comprises a first connecting end and a second connecting end which are perpendicular to each other, the planar microslide mechanism is fixedly connected with the first connecting end, and the vertical microslide mechanism is fixedly connected with the second connecting end.

8. The intra-aperture femtosecond laser beam deflection device according to claim 7, wherein the vertical microslip mechanism comprises a fixed module and a sliding module, the sliding module is fixedly connected with the second connecting end, and the fixed module is fixedly connected with a third connector.

9. The femtosecond laser beam deflection device inside a hole according to claim 2, wherein the rotation mechanism is a disc-type micro servo motor.

10. The intra-aperture femtosecond laser beam deflection device according to claim 4, wherein the planar microslip mechanism is a fine adjustment slide table, and the vertical microslip mechanism is a linear slide table.