CN217445675U - Power component, electronic equipment and battery module - Google Patents

Abstract

The application provides a power component and electronic equipment, and relates to the technical field of heat dissipation. The power assembly comprises a protective shell and at least two radiating base plates, at least two sealing areas and at least one ventilation area are formed in the protective shell in a mode that the two or more radiating base plates are fixed inside the protective shell in the power assembly and are connected with each other, the size of each sealing area is reduced, the radiating area is increased, and therefore the radiating capacity of the power assembly is improved.

Description

Power component, electronic equipment and battery module

Technical Field

The invention relates to the technical field of heat dissipation, in particular to a power assembly, electronic equipment and a battery module.

Background

A power module refers to a module comprising a large number of electronic components such as capacitors, resistors, chips, etc. With the development of electronic equipment towards miniaturization trend, the reserved volume for installing the power module in the electronic equipment is smaller and smaller, so that the integration degree of electronic components in the power module is higher and higher. The higher the integration level of the power assembly is, the worse the internal heat dissipation effect is, if the heat inside the power assembly cannot be dissipated in time, the temperature inside the power assembly is higher and higher, electronic components inside the power assembly can be burnt out, and the danger of explosion can exist. Therefore, how to improve the heat dissipation performance of the power module is a problem that needs to be solved urgently.

Disclosure of Invention

In order to solve the above problems, embodiments of the present application provide a power module, an electronic device, and a battery module, in which a plurality of heat dissipation substrates are disposed inside a protective case of the power module, and a plurality of sealing regions and a plurality of ventilation regions are formed, so that heat dissipation efficiency of the power module can be improved.

Therefore, the following technical scheme is adopted in the embodiment of the application:

in a first aspect, the present application provides a power assembly comprising: the protective shell is provided with at least two first heat dissipation substrates, each first heat dissipation substrate is fixed on the surface inside the protective shell respectively to form at least two sealing areas and at least one ventilation area, the sealing areas are areas for containing electronic components inside the protective shell, and the ventilation areas are areas for forming ventilation channels inside the protective shell.

In this embodiment, at least two sealing regions and at least one ventilation region are formed in the protective case by fixing two or more heat dissipation substrates inside the protective case in the power module, connecting the heat dissipation substrates to each other, and the like, so that the volume of each sealing region is reduced, the heat dissipation area is increased, and the heat dissipation capability of the power module is improved.

In one embodiment, the method further comprises: and one end or two ends of each second heat dissipation substrate are fixed on the first heat dissipation substrate and are used for forming at least one sealing area with the first heat dissipation substrate and/or forming at least one sealing area by the first heat dissipation substrate and the protective shell.

In this embodiment, in the power module, a part of the heat dissipation substrate is fixed on the surface inside the protective case, and another part of the heat dissipation substrate is fixed on the heat dissipation substrate, so that the ventilation area is constructed without using the protective case, and the shape of the ventilation area is not limited by the shape of the protective case, and can be a shape required by the layout.

In one embodiment, each ventilation area is formed by at least two heat dissipation substrates.

In the embodiment, each ventilation area is formed by two or more than two heat dissipation substrates, so that the heat dissipation area of each ventilation area is increased, and the heat dissipation teeth on each heat dissipation substrate are favorably shortened, thereby reducing the processing difficulty and the manufacturing cost of the heat dissipation teeth.

In one embodiment, at least one heat dissipation tooth is disposed on a first surface of a heat dissipation substrate for transferring heat on the heat dissipation substrate to the gas in the ventilation area, and the first surface is a surface of the heat dissipation substrate constituting the ventilation area.

In this embodiment, by providing at least one heat dissipation tooth on the surface of the heat dissipation substrate constituting the ventilation region, the heat dissipation area of the heat dissipation substrate can be increased, thereby further improving the heat dissipation capability of the power module.

In one embodiment, the depth of the heat dissipation teeth is not more than half of the distance between two opposite heat dissipation substrates, and the depth of the heat dissipation teeth refers to the distance between the tip of the heat dissipation teeth and the root connected with the heat dissipation substrates.

In this embodiment, if the positions of the two heat dissipation substrates forming the ventilation area are located at opposite positions, the lengths of the heat dissipation teeth on the two heat dissipation substrates can be shortened to less than half of the previous lengths, so that the heat dissipation effect of the whole ventilation area is not affected, and the processing difficulty and the manufacturing cost of the heat dissipation teeth can be reduced.

In one embodiment, the method further comprises: at least one fan for blowing ambient air into the at least one ventilation area or sucking air out of the at least one ventilation area to the outside.

In this embodiment, by arranging at least one fan at the ventilation area port, when the fan is operated, the air circulation in the ventilation area can be accelerated, so that the heat in the ventilation area is quickly taken out of the outside, thereby further improving the heat dissipation capability of the power module.

In one embodiment, the area at the port of the ventilation zone must not be greater than the total area of the at least one fan.

In this embodiment, at least one fan is attached to the port of each ventilation area, so that the fan covers the port of each ventilation area as completely as possible, and the fan can better take away heat in the ventilation area, thereby improving the heat dissipation capability of the power module.

In one embodiment, when the cross-sectional shape at the port of the ventilation area is a rectangle, the width of the rectangle is not greater than the width of the fan, the width of the rectangle is the length of the short side of the rectangle, and the width of the fan is the length of the short side of the fan.

In this embodiment, generally speaking, the temperature of the end of the heat dissipation tooth close to the heat dissipation substrate is higher than the temperature of the end far from the heat dissipation substrate, and if the width of the rectangle is longer than the width of the fan, the fan cannot cover the end of the heat dissipation tooth close to the heat dissipation substrate, so that the heat dissipation effect of the power module is reduced.

In one embodiment, when the cross-sectional shape at the port of the ventilation area is a rectangle, the length of the rectangle is an integral multiple of the length of the fan, the length of the rectangle is the length of the long side of the rectangle, and the length of the fan is the length of the long side of the fan.

In this embodiment, the ventilation area is designed to be rectangular, and the length of the rectangle is just an integral multiple of the length of the fan, so that the heat dissipation area of the fan can be fully utilized.

In one embodiment, further comprising: and the at least one wind shield is respectively arranged between the at least one fan and the port of the at least one ventilation area and used for converging air flow.

In this embodiment, if the fan is not attached to the port of the ventilation area, a wind shield may be disposed in a gap between the fan and the port of the ventilation area, so as to collect the airflow, thereby improving the heat dissipation effect of the fan.

In one embodiment, the at least one ventilation area is located in a central position of the protective casing.

In the embodiment, in the designed power assembly, each ventilation area is located at the center of the protective shell as much as possible, each ventilation area is formed by the heat dissipation substrate, the heat dissipation area is not increased, and the problem that the protective shell limits the shape of the port of the ventilation area, which is unfavorable for the subsequent installation of a fan, is avoided.

In one embodiment, the second surface of the heat dissipation substrate is used for fixing a heat-generating electronic component in the power module, and the second surface is a surface of the heat dissipation substrate which forms the sealing area.

In this embodiment, the heat-generating electronic components are arranged on the surface of the heat-dissipating substrate constituting the sealing region, so that the heat generated in each heat-generating electronic component is better transferred into the ventilation region, thereby improving the heat-dissipating capability of the power module.

In a second aspect, the present application provides an electronic device comprising: at least one power module as in each possible implementation of the first aspect. Wherein, electronic equipment can be basic station, battery module, fills electric pile, outdoor power cabinet etc..

In a third aspect, the present application provides a battery module, comprising: the battery management module is fixed at a port of the battery shell, wherein the battery management module adopts the structure of each possible realized power assembly in the first aspect.

In this embodiment, by designing the battery management module in the battery module to be the structure of each possible power module in the first aspect, at least two sealing regions and at least one ventilation region are formed in the protective case, so that the volume of each sealing region is reduced, the heat dissipation area is increased, and the heat dissipation capability of the power module is improved.

Drawings

The drawings that accompany the detailed description can be briefly described as follows.

Fig. 1 is a schematic cross-sectional view of a port of a power module provided in the prior art;

fig. 2 is a schematic cross-sectional view of a port of a power assembly provided in an embodiment of the present application;

fig. 3 is a schematic cross-sectional view of another power module port provided in an embodiment of the present application;

fig. 4 is a schematic cross-sectional view of a port of a plurality of power components provided in an embodiment of the present application after splicing;

FIG. 5 is a schematic cross-sectional side view of a power assembly provided in an embodiment of the present application;

fig. 6 is a side cross-sectional schematic view of another power assembly provided in an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application.

In the description of the present application, the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on orientations or positional relationships shown in the drawings, merely for convenience of description and simplicity of description, and do not indicate or imply that the devices or elements referred to must have particular orientations, be constructed in particular orientations, and be operated, and thus, are not to be construed as limiting the present application.

In the description of the present application, it should be noted that, unless explicitly stated or limited otherwise, the terms "mounted," "connected" and "connected" should be interpreted broadly, such as may be a fixed connection, a removable connection, an interference connection or an integral connection; the specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

In the description herein, particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.

In the prior art, in order to solve the heat dissipation problem of the power assembly, a power assembly based on an independent air duct is designed, as shown in fig. 1, the power assembly can be divided into a sealing area and a ventilation area. The sealing area and the ventilation area are isolated through the heat dissipation substrate, electronic components which are easily affected by the external environment are arranged in the sealing area, the electronic components which generate heat seriously are arranged on the heat dissipation substrate, and heat on the electronic components which generate heat seriously is transferred to the air in the ventilation area through the heat dissipation teeth on the heat dissipation substrate, so that the heat dissipation capacity of the power assembly is improved.

However, in the power assembly in the scheme, because the area of the cross section of the ventilation area is large and only one heat dissipation substrate is used, the length of the heat dissipation teeth arranged on the heat dissipation substrate is long, the processing difficulty is large, and the cost is high; because the sealing area is arranged on one side of the protective shell of the power assembly and the ventilation area is arranged on the other side of the protective shell of the power assembly in the prior art, the whole sealing area is large in size, the heat dissipation area is small, the heat dissipation effect of the sealing area is poor, the cross section shape of the port of the ventilation area is fixed, and if the fan is arranged at the port, the fan cannot completely cover the port, and the heat dissipation effect of the sealing area is poor.

In order to solve the above problem, the present application designs a power module including a protective case and at least two heat dissipation substrates. Wherein, splice between at least two heat dissipation base plates and the protective housing, constitute two at least sealed regions and at least one ventilation zone. In this application, every sealed region is obtained by the concatenation of protective housing and at least one heat dissipation base plate, and every ventilation zone is obtained by the concatenation of protective housing and at least two heat dissipation base plates, or at least three heat dissipation base plates. Because each ventilation area is spliced by at least three heat dissipation substrates, the cross section shape of the fracture of each ventilation area can be designed according to the set requirement, so that the fan can completely cover the port of the ventilation area, and the heat dissipation capacity of the power assembly is further improved. Moreover, at least two surfaces of the ventilation area are composed of the heat dissipation substrates, so that in order to avoid the intersection between the heat dissipation teeth on the heat dissipation substrates, the heat dissipation teeth on each heat dissipation substrate can be designed to be shorter, namely, the heat dissipation performance of the ventilation area is not influenced, and the problem that the assembly difficulty is increased because the heat dissipation teeth on one heat dissipation substrate are intersected with the heat dissipation teeth on the other heat dissipation substrate is avoided.

The sealing area is an area forming a sealing space in the power module, and is used for accommodating electronic components in the power module, wherein the electronic components which are easily affected by an external environment are generally attached to the inner surface of the protective shell in the sealing area or directly placed on the sealing area, and the heating electronic components are generally attached to the surface of the heat dissipation substrate in the sealing area; the ventilation area is a cavity structure forming an independent channel in the power assembly, is generally communicated with the outside, and can transfer heat on the heat dissipation substrate to the air and exchange heat with the outside air to reduce the temperature of the power assembly.

The following describes specific implementation processes of the technical solution protected by the present application through several embodiments.

Fig. 2 is a schematic cross-sectional view of a port of a power module provided in an embodiment of the present application. As shown in FIG. 2, the power module 200 includes a protective casing 210 and two heat dissipation substrates (220-1, 220-2). Wherein, two heat dissipation substrates (220-1,220-2) are arranged inside the protection shell 210, and the heat dissipation substrate 220-1 is fixed on the inner surface of the protection shell 210 to form a sealing area 230-1, the heat dissipation substrate 220-2 is fixed on the inner surface of the protection shell 210 to form a sealing area 230-2, and a ventilation area 240 is formed among the heat dissipation substrate 220-1, the heat dissipation substrate 220-2 and the protection shell 210.

The protective casing 210 is an outermost casing structure of the power module 200, and is used for protecting the electronic components of the power module 200 and providing a fixing support for the electronic components. In this application, the shape of the protection casing 210 is not limited to the rectangle shown in fig. 2, and may be a shape corresponding to a space reserved for the power module 200 in the electronic device, and may be any other shape, which is not limited herein.

The heat dissipation substrate 220 is generally made of a material with good heat dissipation performance, such as a metal, an alloy, a carbon fiber, etc., and is used for dividing the internal space of the protective casing 210 to obtain the sealing area 230 and the ventilation area 240, and providing a supporting function for the heat generating electronic components. In the present application, the shape of the heat dissipation substrate 220 is not limited to the rectangular structure shown in fig. 2, and may be a shape of a top cross section of the protection casing 210 at a position separated from the top, or may be any other shape, and the present application is not limited thereto.

Generally speaking, the thicker the thickness of the heat dissipation substrate 220 is, the less deformation of the heat dissipation substrate 220 is likely to occur, and although the deformation of the heat dissipation substrate 220 due to external force action can be avoided, the electronic components in the sealing area can be extruded, and the problems that the electronic components in the sealing area are broken down and damaged due to position change can be avoided, the defects that the heat dissipation performance is reduced, the size of the power assembly is increased, and the cost is increased can be overcome. On the contrary, if the thickness of the heat dissipation substrate 220 is thinner, although the advantages of heat dissipation performance improvement, volume reduction of the power module, cost reduction, etc. may be achieved, the problems of failure of the electronic components due to position change, damage of the electronic components in the sealing region, etc. may occur under the action of external force. In the present application, when the material for manufacturing the heat dissipation substrate 220 is selected, the thickness of the heat dissipation substrate 220 can be generally determined according to the strength, the heat conduction performance, the cost and other factors of the selected material. Preferably, the thickness of the heat dissipation substrate 220 is generally between several millimeters and several tens of millimeters.

A side surface (hereinafter, referred to as a "first surface") of the heat dissipation substrate 220, which forms a sealing region with the protective case 210, may be provided with a fixing groove, a connecting member, and the like having a function of fixing an electronic component, so that the heat-generating electronic component may be fixed on the first surface of the heat dissipation substrate 220. Optionally, a trace may be further disposed on the first surface of the heat dissipation substrate 220, so that when the heat generating electronic component is fixed on the first surface of the heat dissipation substrate 220, the heat generating electronic components may be electrically connected to each other through the trace. Accordingly, the heat dissipation substrate 220 may be extended to a Printed Circuit Board (PCB).

A side surface (hereinafter, referred to as a "second surface") of the heat dissipation substrate 220, which constitutes a ventilation area with the protective case 210 and/or the other heat dissipation substrate 220, may be provided with a plurality of heat dissipation teeth. Exemplarily, as shown in fig. 2, a plurality of heat dissipation teeth are arranged on the second surface of the heat dissipation substrate 220, and the heat dissipation teeth are parallel to each other and are distributed at equal intervals, so that heat generated by the heat-generating electronic component can be transferred to each heat dissipation tooth through the heat dissipation substrate 220, and the heat dissipation effect of the heat dissipation substrate 220 is improved by increasing the contact area with the outside air.

Generally, the heat dissipation teeth and the heat dissipation substrate 220 are of an integral structure. In the manufacturing process of the heat dissipation substrate 220, a material for manufacturing the heat dissipation substrate 220 with a set shape is subjected to processes such as punching, side cutting, and cutting, a groove penetrating through two sides is cut on a side surface of one side of the material, and protrusions located on two sides of the groove are heat dissipation teeth. Wherein, the deeper the depth of cutting out the recess, the higher the degree of difficulty of processing, and the cost of manufacture is also higher. Therefore, the ventilation area in the power module 200 designed in the present application is generally formed by two or more heat dissipation substrates 220, so that the depth of the heat dissipation teeth on each heat dissipation substrate 220, that is, the length of the heat dissipation teeth along the normal direction on the surface of the heat dissipation substrate 220, may not need to fully occupy the space of the ventilation area. The depth of the heat dissipation teeth on the heat dissipation substrate 220 in the present application can be shortened to less than half compared with the heat dissipation teeth on the heat dissipation substrate in the power assembly shown in fig. 1, which greatly reduces the processing difficulty and the manufacturing cost. Alternatively, each heat dissipation tooth can be a separate component and then fixed on the heat dissipation substrate 220, resulting in the heat dissipation component (220-.

The side of the heat dissipation substrate 220 contacting the protective case 210 may be provided with a fixing member. When the heat dissipation substrate 220 is placed inside the protection casing 210, the heat dissipation substrate 220 may be coupled to a corresponding fixing component at a set position inside the protection casing 210 through the fixing component, so as to fix the heat dissipation substrate 220 at the set position inside the protection casing 210, and prevent the heat dissipation substrate 220 from moving inside the protection casing 210, which may cause instability to the overall structure of the power assembly 200. Of course, the heat dissipating substrate 220 may be fixed to a set position inside the protective casing 210 by an adhesive, and a fixing component is not required to be disposed on the heat dissipating substrate 220, which is not limited herein.

Referring to fig. 2, in the present application, the ventilation area 240 formed by the protective case 210, the heat dissipating substrate 220-1 and the heat dissipating substrate 220-2 is generally located at an intermediate position inside the protective case 210. Since it is necessary to stick the fans 250 at the ports of the ventilation area 240, in order to make the ventilation area 240 more effective in heat dissipation, a plurality of fans 250 are generally stuck at the ports of the ventilation area 240 and occupy the entire ports of the ventilation area 240. If the ventilation area 240 is located at the edge of the protective case 210, the sectional shape thereof is easily restricted by the shape of the protective case 210, so that the sectional shape at the port of the ventilation area 240 is formed such that the fan 250 cannot occupy the entire port of the ventilation area 240. Preferably, the fewer the portions of the protective shell 210 that constitute the ventilation zone 240, the less restrictions are placed on the shape of the cross-section at the ports of the ventilation zone 240, so that as little of the protective shell 210 as possible is utilized in constructing the ventilation zone 240.

Of course, the position of the ventilation area 240 in the protective casing 210 in the present application is not limited to the middle position, but may also be limited by the volume of the electronic components in the power module 200, and if the volume of one electronic component in the sealing area 230-1 is particularly large, so that the heat dissipation substrate 220-1 cannot move below the position shown in fig. 2, the ventilation area 240 may be formed at a position lower than the middle inside the protective casing 210. The position of the ventilation area 240 in the protective shell 210 is determined according to practical situations, and the application is not limited herein.

In this application, the width of the cross section at the port of the ventilation area 240, that is, the length of the cross section at the port of the ventilation area 240 along the connection line between the sealing area 230-1 and the sealing area 230-2, should not be greater than the width of the selected fan 250; the length of the cross-section at the port of the venting section 240, i.e., the length of the cross-section at the port of the venting section 240 in a direction perpendicular to the line connecting the sealing section 230-1 and the sealing section 230-2, is an integer multiple of the length of the selected fan 250 (or slightly less than, or slightly more than, the total length of several fans). Alternatively, the width of the cross-section at the port of the ventilation zone 240 may be greater than the width of the selected fan 250, but an integer multiple of the width of the selected fan 250, such that the plurality of fans 250 completely cover the cross-section at the port of the ventilation zone 240.

In the process of transferring heat, the bottom of the heat dissipating teeth close to the heat dissipating substrate 220 must have a higher temperature than the top of the heat dissipating teeth, and if the cross-sectional shape at the port of the designed ventilation area 240 is not the above-mentioned shape, the fan 250 is generally attached to the top of the heat dissipating teeth on the heat dissipating substrate 220-1 and the heat dissipating substrate 220-2, and the heat dissipating effect is not obvious. The present application designs the above-mentioned shape of the ventilation area 240, so that the plurality of fans 250 can completely cover the cross section at the port of the ventilation area 240, thereby further improving the heat dissipation capability of the power module.

If the length of the protective case 210, i.e., the length in the length direction of the heat dissipation substrate 220, is not equal to a multiple of the length of the selected fan 250, the sealing region may be disposed in the length direction of the heat dissipation substrate 220, and the length of the heat dissipation substrate 220 may be shortened such that the length of the heat dissipation substrate 220 is an integral multiple of the length of the selected fan 250 (or slightly less than, or slightly more than the total length of several fans). Illustratively, as shown in fig. 3, the power module 300 includes a protective casing 310 and four heat dissipation substrates (320-. Wherein, the four heat dissipation substrates (320-1,320-2,320-3,320-4) are disposed inside the protection shell 310, and the heat dissipation substrate 320-1 is fixed on the inner surface of the protection shell 310 to form a sealing region 330-1; the heat dissipating substrate 320-2 is fixed on the inner surface of the protective case 310 to form a sealing region 330-2; the two ends of the heat dissipation substrate 320-3 are fixed on the heat dissipation substrate 320-1 and the heat dissipation substrate 320-2, and form a sealing area 330-3 together with the heat dissipation substrate 320-1 and the heat dissipation substrate 320-2; the two ends of the heat dissipation substrate 320-4 are fixed on the heat dissipation substrate 320-1 and the heat dissipation substrate 320-2, and form a sealing area 330-4 together with the heat dissipation substrate 320-1 and the heat dissipation substrate 320-2; heat sink substrate 320-1, heat sink substrate 320-2, heat sink substrate 320-3, and heat sink substrate 320-4 together form ventilation area 340.

In this embodiment, the ventilation area 340 is located at the center of the protective shell 310, and compared with the ventilation area 240 in the power module 200 shown in fig. 2, the length direction of the ventilation area 340 in this embodiment is not limited by the shape of the protective shell 310, so that the length of the ventilation area 340 may be designed to be an integral multiple of the length of the selected fan 350, so that the plurality of fans 350 completely cover the cross section at the port of the ventilation area 340, thereby further improving the heat dissipation capability of the power module.

When the power module 200 needs to be spliced with other power modules along the length direction, the length of the power module 200 may not be equal to a multiple of the length of the selected fan 250, so that the fan 250 on the power module 200 can be shared with other power modules. For example, as shown in fig. 4, the width of the ventilation area 440 inside the power module 400 spliced with the power module 200 along the length direction should not generally exceed the width of the fan 250, or the length of the plurality of fans 250 overlapped along the width direction of the ventilation area 440, so as to avoid that the fans 250 cannot completely cover the cross section at the port of the ventilation area 440 on the power module 400.

The sum of the length of the ventilation area 440 in the power module 400 and the length of the ventilation area 240 in the power module 200 is an integral multiple of the length of the selected fan, so that after the plurality of fans are connected in parallel along the length direction of the ventilation area, the cross section of the port of the ventilation area 240 in the power module 200 and the cross section of the port of the ventilation area 440 in the power module 400 can be completely covered, and the heat dissipation capacity of the power module is further improved.

Alternatively, the shape of the ventilation area 440 in the power module 400 is not limited to that shown in fig. 4, and may be the same as the shape of the ventilation area 240 in the power module 200, or may be different from the shape of the ventilation area 240 in the power module 200. If the shape of the ventilation area 440 in the power assembly 400 is not the same as the shape of the ventilation area 240 in the power assembly 200, the width of the ventilation area 440 needs to be such that the width of the fan 250 is not exceeded or the length of the plurality of fans 250 stacked in the width direction of the ventilation area 440 is not exceeded; the length of the ventilation zone 440 is such that the sum of the lengths of the two ventilation zones is an integer multiple of the length of the selected fan (or slightly less than, or slightly more than, the total length of several fans).

It is conceivable that two power assemblies are spliced along the length direction in fig. 4, and three, four or more power assemblies may be spliced, which is not limited herein. However, no matter how many power assemblies are spliced along the length direction, the sum of the lengths of the spliced whole power assemblies is integral multiple of the length of the selected fan, so that after the fans are connected in parallel along the length direction of the ventilation area, the cross section of the port of the ventilation area on each power assembly can be completely covered, and the heat dissipation capacity of the power assemblies is further improved.

In describing the solutions of fig. 2-4, the fans (250,350,450) are attached to the cross-section at the ports of the ventilation areas (240,340, 440). Taking the power module 200 as an example, and referring to fig. 5, the fan 250 can be directly attached to the port of the ventilation area 240, so that the fan 250 and the power module 200 are of an integral structure, which provides great convenience for the installation of the subsequent modules and the transportation of the product.

If limited by the installation space of the power module, and other factors, the fan (250,350,450) may not be attached to the cross-section at the port of the plenum (240,340, 440). Illustratively, still taking the power module 200 as an example, and referring to fig. 6, the fan 250 may be a separate component, which is disposed at a port close to the ventilation area 240 in the power module 200, and when the fan 250 is energized with an electric signal, the temperature in the ventilation area 240 is lowered by pumping the outside air into the ventilation area 240 or absorbing the air in the ventilation area 240 by allowing the air in the ventilation area 240 to exchange heat with the outside air; the fan 250 may also be fixed on the housing of the electronic device and is close to the port of the ventilation area 240 in the power module 200, so that when the fan 250 is fed with an electrical signal, the air in the ventilation area 240 can still exchange heat with the outside air, thereby reducing the temperature in the ventilation area 240; and other fastening means, the present application is not limited thereto.

Optionally, if the fan 250 is not attached to the port of the vented area 240, the power module 200 further includes a wind deflector 260. Wherein a wind screen 260 is provided between the fan 250 and the port of the ventilation area 240 for guiding the outside air pumped by the fan 250 into the ventilation area 240 and guiding the air in the ventilation area 240 into the fan 250 and blowing out into the outside environment. Because there is a gap between the fan 250 and the port of the ventilation area 240, the gap is provided with at least one wind shield 260, which plays a role of gathering air flow, and can improve the heat dissipation effect of the fan 250.

In this application, the electrical signal that lets in fan 250 generally is through external circuit, and the power among the electronic equipment carries out the electricity to be connected, also can carry out the electricity through external circuit and external power source and connect, realizes providing the electrical signal by external power source, and its power supply mode is not in this application scope, can be for arbitrary power supply mode, and this application does not limit here.

Alternatively, the power module 200 or the electronic device in which the power module 200 is disposed may have a Microprocessor (MCU), a system-on-a-chip (SoC), or other control unit disposed therein, which may control whether the external circuit provides an electrical signal to each fan 250. In general, the control unit does not allow the fans to operate, and only when a user inputs a start instruction or a trigger instruction sent by another electronic component, the control unit can control the external circuit to provide an electrical signal to each fan 250, so that each fan 250 cools the power assembly 200.

The other electronic components that trigger the control unit to turn on the function of providing the electric signal to each fan 250 may be a temperature sensor, an infrared sensor, or the like. Taking a temperature sensor as an example, the temperature sensor is generally disposed in the sealed area 230 or the ventilation area 240 inside the power module 200 for detecting the temperature inside the power module 200. If the temperature sensor detects that the temperature inside the power assembly 200 exceeds the set threshold, the temperature sensor may trigger the control unit to start the function of providing the electric signal to each fan 250, or directly trigger the function of starting the function of providing the electric signal to each fan 250, so as to realize that the fans 250 automatically cool the power assembly 200, and the temperature inside the power assembly 200 is always within the set threshold.

In the embodiment of the application, a plurality of heat dissipation substrates are fixed inside the protective shell of the power assembly to form a plurality of sealing areas and a plurality of ventilation areas, so that the volume of each sealing area is reduced, the heat dissipation area is increased, and the heat dissipation capacity of the power assembly is improved. And the cross section shape of the port of the ventilation area is associated with the shape of the external fan, so that the plurality of fans are attached to the cross section of the port of the ventilation area and can completely cover the cross section of the port of the ventilation area 340, thereby improving the heat dissipation capacity of the power assembly. In addition, each ventilation area is composed of at least two radiating substrates, so the depth of the radiating teeth on each radiating substrate can be reduced by at least half, and the processing difficulty and the manufacturing cost are greatly reduced.

The embodiment of the present application further provides an electronic device, where the electronic device includes at least one power component as described in fig. 2 to fig. 6 and the corresponding protection schemes, and each power component may be connected with another power component in a manner as shown in fig. 4. Since the electronic device includes the power component, the electronic device has all or at least some of the advantages of the power component. Wherein, electronic equipment can be basic station, battery module, fills electric pile, outdoor power cabinet etc..

Take the battery module as an example, under the ordinary circumstances, the battery module includes battery shell, at least one electricity core and battery management module. The battery shell is of a groove structure, the battery core is placed in the battery shell, and the battery management module is fixed at the port of the battery shell, so that the battery core is in a sealing structure formed by the battery shell and the battery management module. Because components such as a transformer, an inverter and the like which are easy to generate heat exist in the battery management module, the battery management module can be designed into the structure of the power assembly as shown in fig. 2-6 and the corresponding protection scheme, and at least two sealing areas and at least one ventilation area are formed in the protective shell of the battery management module, so that the volume of each sealing area is reduced, the heat dissipation area is increased, and the heat dissipation capacity of the power assembly is improved.

In the description herein, particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.

Finally, the description is as follows: the above embodiments are only used to illustrate the technical solutions of the present application, but not to limit the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions in the embodiments of the present application.

Claims (14)

1. A power assembly, comprising:

a protective casing (210,310,410),

at least two first heat dissipation substrates (220,320,420), each of which is fixed on the surface inside the protective shell, form at least two sealing areas (230,330,430) and at least one ventilation area (240,340,440), wherein the sealing areas are areas for accommodating electronic components inside the protective shell, and the ventilation areas are areas for forming ventilation channels inside the protective shell.

2. The power assembly of claim 1, further comprising:

at least one second heat dissipating substrate (220,320,420), one or both ends of each second heat dissipating substrate being fixed to the first heat dissipating substrate, for constituting at least one sealing region with the first heat dissipating substrate, and/or constituting at least one sealing region with the protective case.

3. The power module according to claim 1 or 2, wherein each ventilation area is constituted by at least two heat dissipating substrates.

4. The power module according to any one of claims 1-3, wherein at least one heat-dissipating tooth is disposed on a first surface of a heat-dissipating substrate for transferring heat from the heat-dissipating substrate to the air in the ventilation area, the first surface being a surface of the heat-dissipating substrate constituting the ventilation area.

5. The power assembly of claim 4, wherein the depth of the heat dissipation teeth is not greater than half of the distance between two opposite heat dissipation substrates, and the depth of the heat dissipation teeth is the distance between the tip of the heat dissipation teeth and the root connected with the heat dissipation substrates.

6. The power assembly of any of claims 1-5, further comprising:

at least one fan (250,350,450) for blowing ambient air into the at least one ventilation area or sucking air out of the at least one ventilation area to the outside.

7. The power assembly of claim 6, wherein an area at a port of the plenum area is no greater than a total area of the at least one fan.

8. The power assembly of claim 6 or 7, wherein when the cross-sectional shape at the port of the ventilation zone is a rectangle, the width of the rectangle is no greater than the width of the fan, the width of the rectangle is the length of the short side of the rectangle, and the width of the fan is the length of the short side of the fan.

9. The power assembly according to any one of claims 6 to 8, wherein when the cross-sectional shape at the port of the ventilation zone is a rectangle, the length of the rectangle is an integer multiple of the length of the fan, the length of the rectangle is the length of the long side of the rectangle, and the length of the fan is the length of the long side of the fan.

10. The power assembly of any of claims 6-9, further comprising:

at least one wind deflector (260) respectively arranged between the at least one fan and a port of the at least one ventilation area for converging the air flow.

11. The power assembly according to any one of claims 1-10, wherein the at least one ventilation area is in a central position of the protective case.

12. The power module according to any one of claims 1 to 11, wherein the second surface of the heat dissipation substrate is used for fixing a heat-generating electronic component in the power module, and the second surface is a surface of the heat dissipation substrate which forms the sealing area.

13. An electronic device, comprising: at least one power module according to claims 1-12.

14. A battery module, comprising:

the outer shell of the battery is provided with a battery shell,

at least one cell disposed within the battery housing,

a battery management module secured at a port of the battery housing, wherein the battery management module is configured as a power assembly of claims 1-12.

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