CN217433983U

CN217433983U - Cleaning mechanism and conductive device for electroplating PCB

Info

Publication number: CN217433983U
Application number: CN202220562867.6U
Authority: CN
Inventors: 陈德和
Original assignee: Jiangxi Universe Intelligent Equipment Co ltd
Current assignee: Jiangxi Universe Intelligent Equipment Co ltd
Priority date: 2022-03-15
Filing date: 2022-03-15
Publication date: 2022-09-16
Anticipated expiration: 2032-03-15

Abstract

The utility model discloses a clearance mechanism and electroplating PCB board's electrically conductive device, include: a mounting member and a cleaning assembly; the cleaning assembly comprises a power piece and a cleaning brush, the power piece is fixed to the mounting piece, the output end of the power piece penetrates through the mounting piece and is connected with the cleaning brush, and the cleaning brush is in contact with the surface of the conductive block, so that the cleaning brush rotates to clean impurities on the surface of the conductive block. The utility model discloses a power part drive cleaning brush is rotatory, will pile up the dust on conducting block surface or the oxide layer that forms and clear up, ensures conductive device's electric conductivity, improves the production quality of PCB board.

Description

Cleaning mechanism and conductive device for electroplating PCB

Technical Field

The utility model relates to a PCB board processing technology field, in particular to clearance mechanism and electroplate PCB board electrically conductive device.

Background

A PCB (printed circuit board) is a basic component widely used in various electronic related products, and is a substrate for carrying electronic components and connecting components. Since the PCB is exposed to air for a long time, it is liable to lose gloss due to oxidation and at the same time lose solderability due to corrosion. Therefore, it is necessary to protect the copper tracks, vias and plated through holes using electroplating techniques.

Need use conductive device at the in-process of electroplating, but conductive device can pile up the dust that is difficult to clear away on conductive block of conductive device after long-term use, can also unavoidably appear the oxide layer on conductive block's the surface simultaneously for conductive block's electric conductive property reduces, causes the production quality reduction of PCB board.

SUMMERY OF THE UTILITY MODEL

The utility model mainly aims at providing a clearance mechanism and electroplate PCB board electrically conductive device aims at solving the problem that the dust is piled up easily and lead to electric conductive property to reduce to the conducting block in the current electrically conductive device.

In order to achieve the above object, the first aspect of the present invention provides a cleaning mechanism, comprising: a mounting member and a cleaning assembly;

the cleaning assembly comprises a power piece and a cleaning brush, the power piece is fixed to the mounting piece, the output end of the power piece penetrates through the mounting piece and is connected with the cleaning brush, and the cleaning brush is in contact with the surface of the conductive block, so that the cleaning brush rotates to clean impurities on the surface of the conductive block.

Preferably, the width of the cleaning brush is greater than or equal to the width of the conductive block.

Preferably, the installed part includes fixing base and mount pad, be equipped with the installation cavity on the fixing base, the one end of mount pad stretches into the installation cavity with fixing base swing joint, the power spare is fixed the other end of mount pad, just the output of power spare passes the mount pad.

Preferably, one end of the mounting seat, which is far away from the mounting cavity, is provided with a through hole through which the output end of the power part passes.

Preferably, the cleaning mechanism further comprises an elastic piece, the elastic piece is arranged in the installation cavity, one end of the elastic piece is connected with the fixed seat, and the other end of the elastic piece is connected with the upper surface of the installation seat.

Preferably, the cleaning assembly further comprises a coupler, one end of the coupler is connected with the output end of the power part, and the other end of the coupler is connected with the cleaning brush.

In a second aspect of the present application, a conductive device for electroplating a PCB is provided, comprising: fixed frame, electroplating jig, drive assembly, conducting block and clearance mechanism, be connected with the mounting bracket in the fixed frame, locate drive assembly slidable in the mounting bracket, electroplating jig is located the outside of mounting bracket, just electroplating jig with drive assembly connects, in order to drive electroplating jig for the mounting bracket slides, the conducting block is fixed electroplating jig's top, the installed part with fixed frame fixed connection, and be located the top of mounting bracket, the clearance brush with the surface of conducting block contacts.

Preferably, the surface of the conductive block is provided with a groove, and the peripheral surface of the cleaning brush is in contact with the groove.

Preferably, the conductive device of the electroplated PCB board further comprises a dust cover, the dust cover is fixedly connected with the fixed frame and the mounting frame, and the dust cover is located at a side of the mounting part and used for covering the cleaning brush.

Preferably, an opening is formed in one side, close to the mounting piece, of the dust cover, and the output end of the power piece extends into the opening to be connected with the cleaning brush.

In addition, the power member used in the above embodiments may be a motor or an electric motor, or may be other components that can drive the cleaning brush, which is not limited herein.

The technical scheme of the utility model is that the power piece is fixed on the mounting piece, and the output end of the power piece passes through the mounting piece and extends to the direction of the conductive block to be connected with the cleaning brush, so that the cleaning brush is contacted with the surface of the conductive block; when the PCB board was electroplated, power component drive cleaning brush rotated to the removal of cooperation conducting block self makes the cleaning brush constantly polish the surface of conducting block, thereby will pile up the dust on conducting block surface or the oxide layer that forms clears up, ensures conductive device's electric conductivity, improves the production quality of PCB board.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

FIG. 1 is a schematic structural view of an embodiment of a conductive device for electroplating a PCB according to the present invention;

FIG. 2 is a schematic structural view of an embodiment of the cleaning mechanism of the present invention;

FIG. 3 is a schematic view of an embodiment of a mounting member of the cleaning mechanism of the present invention;

FIG. 4 is a schematic structural view of another embodiment of the conductive device for electroplating a PCB according to the present invention;

the reference numbers illustrate:

reference numerals	Name (R)	Reference numerals	Name (R)
				1	Fixed frame	222	Cleaning brush
2	Cleaning mechanism	23	Elastic piece
				21	Mounting member	24	Coupling device
211	Fixed seat	3	Mounting rack
				212	Mounting seat	4	Transmission assembly
213	Mounting cavity	5	Electroplating clamp
				214	Through hole	6	Conductive block
22	Cleaning assembly	7	Dust cover
				221	Power part

The objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

It should be noted that if directional indications (such as up, down, left, right, front, and back … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture, and if the specific posture is changed, the directional indications are changed accordingly.

In addition, if there is a description relating to "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature. In addition, if the meaning of "and/or" and/or "appears throughout, the meaning includes three parallel schemes, for example," A and/or B "includes scheme A, or scheme B, or a scheme satisfying both schemes A and B. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.

After the conductive device is used for a long time, dust which is difficult to remove is accumulated on the conductive block of the conductive device or an oxide layer is formed on the conductive block, so that the conductive performance of the conductive device is reduced, and the production quality of the PCB is influenced. Therefore, the utility model provides a clearance mechanism.

Referring to fig. 1 and 2, in an embodiment of the present invention, the cleaning mechanism 2 includes: a mounting 21 and a cleaning assembly 22;

the cleaning assembly 22 comprises a power part 221 and a cleaning brush 222, the power part 221 is fixed on the mounting part 21, the output end of the power part 221 penetrates through the mounting part 21 to be connected with the cleaning brush 222, the cleaning brush 222 is in contact with the surface of the conductive block 6, so that the cleaning brush 222 rotates to clean impurities on the surface of the conductive block 6, and the width of the cleaning brush 222 is larger than or equal to that of the conductive block 6.

According to the technical scheme of the utility model, the power piece 221 is fixed on the mounting piece 21, and the output end of the power piece 221 passes through the mounting piece 21 and extends to the direction of the conductive block 6 to be connected with the cleaning brush 222, so that the cleaning brush 222 is contacted with the surface of the conductive block 6; when the PCB is electroplated, the power part 221 drives the cleaning brush 222 to rotate, and the cleaning brush 222 is matched with the self movement of the conductive block 6 to continuously polish the surface of the conductive block 6, so that dust accumulated on the surface of the conductive block 6 or an oxide layer formed on the surface of the conductive block is cleaned, the conductivity of the conductive device is ensured, and the production quality of the PCB is improved. In addition, it is necessary to ensure that the width of the cleaning brush 222 is greater than or equal to the width of the conductive block 6, so that the surfaces of the conductive block 6 are all contacted by the cleaning brush 222, and the conductive block 6 is cleaned.

Referring to fig. 3, in an embodiment, the mounting member 21 includes a fixing base 211 and a mounting base 212, a mounting cavity 213 is provided on the fixing base 211, one end of the mounting base 212 extends into the mounting cavity 213 to be movably connected with the fixing base 211, a power element 221 is fixed at the other end of the mounting base 212, and an output end of the power element 221 passes through the mounting base 212.

Specifically, a through hole 214 through which the output end of the power member 221 passes is formed at an end of the mounting base 212 remote from the mounting cavity 213.

It should be noted that, the mounting member 21 is composed of a fixing seat 211 and a mounting seat 212, the fixing seat 211 is fixed on a bracket or other supporting member, and then one end of the mounting seat 212 is inserted into the mounting cavity 213 and movably connected with the fixing seat 211 through a pin shaft, so that the mounting seat 212 can be adjusted in a rotating manner, and then the power member 221 is fixed to the other end of the mounting seat 212, and a through hole 214 for the output end of the power member 221 to pass through is formed in the mounting seat 212, so that the output end of the power member 221 is connected with the cleaning brush 222, and thus the whole cleaning mechanism 2 is mounted, and the mounting structure is simple and the mounting or dismounting is convenient; because the mounting base 212 can rotate for the fixing base 211 for the cleaning brush 222 can be adjusted according to the different heights of the conductive block 6, and the application range is wide.

Referring to fig. 2 and 3, in an embodiment, the cleaning mechanism 2 further includes an elastic member 23, the elastic member 23 is disposed in the mounting cavity 213, one end of the elastic member 23 is connected to the fixing seat 211, and the other end of the elastic member 23 is connected to the upper surface of the mounting seat 212. It should be noted that, by arranging the elastic element 23 in the mounting cavity 213 and connecting two ends of the elastic element 23 with the fixing seat 211 and the mounting seat 212 respectively, under the elastic force of the elastic element 23, the mounting seat 212 is forced to be pressed downward toward the conductive direction, so that the cleaning brush 222 is in contact with the surface of the conductive block 6 more, and the cleaning quality of the conductive block 6 is improved.

Referring to FIG. 2, in one embodiment, the cleaning assembly 22 further includes a coupling 24, one end of the coupling 24 being connected to the output of the power member 221, and the other end of the coupling 24 being connected to the cleaning brush 222.

With reference to fig. 1 to 4, according to a second aspect of the present application, there is provided a conductive device for plating a PCB, including: fixed frame 1, plating jig 5, drive assembly 4, the clearance mechanism 2 of conducting block 6 and the first aspect, be connected with mounting bracket 3 on the fixed frame 1, drive assembly 4 slidable locates in mounting bracket 3, plating jig 5 is located the outside of mounting bracket 3, and plating jig 5 is connected with drive assembly 4, slide for mounting bracket 3 in order to drive plating jig 5, the top at plating jig 5 is fixed to conducting block 6, installed part 21 and fixed frame 1 fixed connection, and be located mounting bracket 3's top, clearance brush 222 contacts with the surface of conducting block 6.

Install part 21 and mounting bracket 3 are connected with fixed frame 1 respectively, and slide on mounting bracket 3 and set up drive assembly 4, later be connected electroplating anchor clamps 5 with drive assembly 4 again, cleaning brush 222 is located electroplating anchor clamps 5's top this moment, and contact with the conducting block 6 on electroplating anchor clamps 5 top, when beginning to electroplate the PCB board, drive assembly 4 slides in mounting bracket 3, slide in order to drive electroplating anchor clamps 5, make conducting block 6 follow electroplating anchor clamps 5 and slide, power 221 drives cleaning brush 222 simultaneously and rotates, so that cleaning brush 222 constantly polishes the surface of conducting block 6, thereby will pile up the dust on conducting block 6 surface or the oxide layer that forms and clear up, ensure the conductivity of conductive device, improve the production quality of PCB board.

In one embodiment, the surface of the conductive block 6 is formed with a groove, and the outer circumferential surface of the cleaning brush 222 is in contact with the groove. The cleaning brush 222 is better contacted with the surface by arranging the groove on the surface of the conductive block 6, so that the dust or the oxide layer accumulated on the surface of the conductive block 6 is ensured to be cleaned.

In one embodiment, the conductive device of the electroplated PCB further comprises a dust cover 7, the dust cover 7 is fixedly connected with the fixed frame 1 and the mounting rack 3, the dust cover 7 is located at a side of the mounting member 21 and is used for covering the cleaning brush 222, an opening is arranged at a side of the dust cover 7 close to the mounting member 21, and an output end of the power member 221 extends into the opening and is connected with the cleaning brush 222. It should be noted that, the cleaning brush 222 is covered by the dust cover 7, so that the influence of the falling of external impurities on the cleaning quality of the cleaning brush 222 is effectively avoided.

The above only is the preferred embodiment of the present invention, not limiting the scope of the present invention, all the equivalent structure changes made by the contents of the specification and the drawings under the inventive concept of the present invention, or the direct/indirect application in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A cleaning mechanism, comprising: a mounting member and a cleaning assembly;

2. The cleaning mechanism of claim 1, wherein the width of the cleaning brush is greater than or equal to the width of the conductive block.

3. The cleaning mechanism of claim 1, wherein the mounting member comprises a fixing seat and a mounting seat, the fixing seat is provided with a mounting cavity, one end of the mounting seat extends into the mounting cavity to be movably connected with the fixing seat, the power member is fixed at the other end of the mounting seat, and the output end of the power member penetrates through the mounting seat.

4. The cleaning mechanism of claim 3, wherein an end of the mounting base away from the mounting cavity is provided with a through hole for the output end of the power member to pass through.

5. A cleaning mechanism as claimed in claim 3, further comprising a resilient member, the resilient member being disposed in the mounting cavity, and one end of the resilient member being connected to the mounting base, and the other end of the resilient member being connected to the upper surface of the mounting base.

6. The cleaning mechanism of claim 1, wherein the cleaning assembly further comprises a coupling, one end of the coupling being connected to the output of the power member and the other end of the coupling being connected to the cleaning brush.

7. An electrically conductive device for electroplating a PCB, comprising: fixed frame, electroplating jig, drive assembly, conducting block and any one of claims 1 to 6 clearance mechanism, be connected with the mounting bracket in the fixed frame, drive assembly locates slidable in the mounting bracket, electroplating jig is located the outside of mounting bracket, just electroplating jig with drive assembly connects, in order to drive electroplating jig for the mounting bracket slides, the conducting block is fixed electroplating jig's top, the installed part with fixed frame fixed connection, and be located the top of mounting bracket, the clearance brush with the surface of conducting block contacts.

8. The conductive device of an electroplated PCB of claim 7, wherein the conductive block has a groove on a surface thereof, and an outer circumferential surface of the cleaning brush contacts with the groove.

9. The conductive means of an electroplated PCB of claim 7, further comprising a dust cover fixedly connected to the fixed frame and the mounting bracket, the dust cover being located at a side of the mounting member for covering the cleaning brush.

10. The conductive assembly of an electroplated PCB of claim 9, wherein the dust shield has an opening on a side thereof adjacent to the mounting member, and the output end of the power member extends from the opening to connect with the cleaning brush.