CN217428453U

CN217428453U - High-yield high-quality-rate SMT (surface mount technology) chip mounting device

Info

Publication number: CN217428453U
Application number: CN202220565739.7U
Authority: CN
Inventors: 任飞
Original assignee: Zhejiang Jiachen Semiconductor Co ltd
Current assignee: Zhejiang Jiachen Semiconductor Co ltd
Priority date: 2022-03-15
Filing date: 2022-03-15
Publication date: 2022-09-13
Anticipated expiration: 2032-03-15

Abstract

The utility model discloses a high-product high-quality-rate SMT chip mounting device, which comprises a base, wherein two sliding rods are arranged on the base in parallel, sliding sleeves are arranged on the sliding rods, a mounting plate is arranged between the two sliding sleeves, a pen cap is arranged on one side of the mounting plate in a sliding manner, a vertically sliding adsorption pen is arranged on the pen cap, a limiting ring is fixedly arranged on the adsorption pen, a first spring which is respectively connected with the pen cap and the limiting ring is sleeved on the adsorption pen, an adsorption head is arranged at the lower end of the adsorption pen, the adsorption head is connected with a vacuum generator through a hose, a detection pen is also arranged on the support, a detection head is arranged at the lower end of the detection pen, the detection pen is electrically connected with a display screen, a rectangular placing frame is also arranged between the two sliding rods, a placing position for placing a chip strip is arranged on the upper surface of the base, a camera pen connected with the display screen is arranged on one side of the adsorption pen, the lower end of the adsorption pen and the mounting position on the base plate are enlarged and displayed on the display screen through the camera pen, the precision of paster is improved, the high-quality rate of product is improved.

Description

High-yield high-quality-rate SMT (surface mount technology) chip mounting device

Technical Field

The utility model relates to the field of semiconductor technology, concretely relates to high yield high quality SMT paster device.

Background

Chip mounter: the chip mounter is also called a mounter and a Surface mounting System (Surface Mount System), and is configured behind a dispenser or a screen printer in a production line, and is equipment for accurately placing Surface mounting components on a PCB (printed circuit board) pad by moving a mounting head.

Disclosure of Invention

In order to solve the weak point among the above-mentioned prior art, the utility model provides a high yield high quality rate SMT paster device.

In order to realize the technical effect, the utility model discloses a following scheme:

a high-yield high-quality SMT paster device comprises a base, wherein two sliding rods are parallelly arranged on the base, sliding sleeves are arranged on the sliding rods in a sliding mode, a mounting plate is arranged between the two sliding sleeves, connecting blocks are arranged at two ends of the mounting plate in a downward extending mode and fixedly connected with the two sliding sleeves respectively, a support sliding along the length of the mounting plate is arranged on one side of the mounting plate, a pen sleeve is fixedly arranged on the support, a sliding hole is vertically formed in the pen sleeve in a penetrating mode, an adsorption pen is arranged in the sliding hole in a sliding mode and sleeved with a first spring, the lower end of the first spring is fixedly connected with the pen sleeve, a limiting ring is fixedly arranged on the adsorption pen, the upper end of the first spring is connected with the limiting ring, an adsorption head is arranged at the lower end of the adsorption pen, air passages are arranged in the adsorption pen and in the adsorption head in a penetrating mode, and an upper end connecting hose of the adsorption pen is connected with the adsorption pen, the hose is communicated with the air passage, the other end of the hose is connected with a vacuum generator, the limit ring is provided with a switch of the vacuum generator, the vacuum generator is connected with a power supply through a switch electric connector, the support is also provided with a camera pen, the lower end of the camera pen is provided with a camera, the camera is arranged towards the lower end of the adsorption head, the camera electric connector is connected with a display screen, a rectangular placing frame is arranged between two slide bars, the placing frame is arranged above the base through four supporting columns, the four supporting columns are arranged at four included angles of the placing frame, the placing frame is arranged below the adsorption pen and the camera pen, a placing hole with a rectangle is arranged in the placing frame in a penetrating manner, two supporting bars are arranged in the placing hole in parallel, one of the supporting bars is fixedly arranged at one side edge of the placing hole, and the other supporting bar is arranged in the placing hole in a sliding manner, the draw-in groove has been seted up at the both ends of gliding support bar, it is equipped with the slide rail to place downthehole side that corresponds with two draw-in grooves, and two draw-in grooves block respectively and slide on two slide rails, and a side that fixed support bar was kept away from to gliding support bar is connected rather than the corresponding hole side of placing through a plurality of second springs, and the side that two support bars are relative all is equipped with the edge of leaning on of bearing that highly is less than the support bar upper surface, and the edge of leaning on of bearing on two support bars sets up relatively, the upper surface of base is equipped with the position of placing that is used for placing the chip strip.

According to the technical scheme, the lower end of the adsorption head is connected with the rubber head, the rubber head is arranged in a round table shape, the upper end of the rubber head is fixedly connected with the adsorption head, a through hole is vertically formed in the rubber head in a penetrating mode, and the through hole is communicated with the air passage.

According to the preferable technical scheme, the placing position comprises a plurality of raw material grooves, the length directions of the raw material grooves are parallel to the length direction of the sliding rods, the raw material grooves penetrate through the upper surface of the base horizontally, and a plurality of raw material grass are arranged between the two sliding rods in parallel.

According to the preferable technical scheme, the base is further provided with two separating rods, the two separating rods are respectively close to two ends of the raw material groove, the separating rods are located above the raw material groove, and the length direction of the separating rods is perpendicular to the length direction of the raw material groove.

According to the technical scheme, the support comprises a sliding block and a supporting plate, a sliding groove extending along the length direction of the mounting plate is formed in the lower surface of the mounting plate, the sliding block is matched with the sliding groove, the sliding block is embedded in the sliding groove to slide, one end of the sliding block fixedly connected with the supporting plate extends out of the sliding groove, the other end of the supporting plate extends out of the lower portion of the mounting plate, and the pen cap is arranged on the supporting plate.

Compared with the prior art, beneficial effect does:

the utility model discloses simple structure, convenient to use is provided with the pen of making a video recording of being connected with the display screen in one side of adsorbing the pen, and the lower extreme that will adsorb the pen through the pen of making a video recording and paste the enlarged demonstration of dress position on the base plate on the display screen, improved the precision of paster, improve the high-quality rate of product.

Drawings

FIG. 1 is a schematic structural view of the present invention;

fig. 2 is a schematic cross-sectional view of the present invention.

Reference numerals: 1. a base; 2. a slide bar; 3. a sliding sleeve; 4. connecting blocks; 5. mounting a plate; 6. a pen cap; 7. an adsorption pen; 8. an airway; 9. a limiting ring; 10. a first spring; 11. a camera pen; 12. an adsorption head; 13. a pillar; 14. placing the frame; 15. placing holes; 16. a supporting strip; 17. a bearing edge; 18. a slide rail; 19. a second spring; 20. a raw material tank; 21. and separating the rod.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

An SMT (surface mount technology) chip device with high product quality rate comprises a base, wherein two sliding rods 2 are arranged on the base in parallel, sliding sleeves 3 are arranged on the sliding rods 2 in a sliding mode, an installation plate 5 is arranged between the two sliding sleeves 3, two ends of the installation plate 5 are provided with connecting blocks 4 in a downward extending mode, the two connecting blocks 4 are respectively fixedly connected with the two sliding sleeves 3, a pushing installation plate can horizontally move along the length direction of the sliding sleeves, a support sliding along the length direction of the installation plate is arranged on one side of the installation plate 5, the pushing support slides, the sliding direction of the support is perpendicular to the moving direction of the installation plate, a pen cap 6 is fixedly arranged on the support, a sliding hole vertically penetrates through the pen cap 6, an adsorption pen 7 is arranged in the sliding hole in a sliding mode, a first spring 10 is sleeved on the adsorption pen 7, the lower end of the first spring 10 is fixedly connected with the pen cap 6, a limiting ring 9 is fixedly arranged on the adsorption pen 7, the upper end of the first spring 10 is connected with the limiting ring 9, the limiting ring is held by hand, the adsorption pen is pressed downwards, the adsorption pen moves downwards, the first spring is compressed, the adsorption pen moves downwards to adsorb a chip or mount the chip, after downward pressure is not applied, the adsorption pen is driven to ascend and reset by the aid of elasticity of the first spring, the lower end of the adsorption pen 7 is provided with an adsorption head 12, air passages 8 penetrate through the adsorption pen 7 and the adsorption head 12, the upper end of the adsorption pen 7 is connected with a hose, the hose is communicated with the air passages 8, the other end of the hose is connected with a vacuum generator, a switch of the vacuum generator is arranged on the limiting ring, the vacuum generator is arranged on the limiting ring through the switch and is electrically connected with a power supply, the switch is arranged at a position convenient for finger pressing, and the vacuum generator can be opened by pressing the manual switch at any time in the process of holding the limiting ring to move the adsorption pen, still be equipped with the pen 11 of making a video recording on the support, the lower extreme of pen 11 of making a video recording is equipped with the camera, and the camera adopts the CCD camera, the camera is towards the lower extreme of adsorption head 12 for shoot the lower extreme of adsorption head and the scene of below, pen 11 electricity of making a video recording is connected with the display screen, and the scene of shooing with the camera shows on the display screen, is convenient for observe, still is equipped with the frame 14 of placing of rectangle form between two slide bars 2, place the frame 14 and locate the top of base 1 through four pillar 13 supports, and four pillar 13 are located four contained angle departments of placing frame 14, place the frame 14 and be located the below of adsorption pen 7 and pen 11 of making a video recording, place the hole 15 of placing that runs through the rectangle in the frame 14, place the parallel and be equipped with two support bars 16 in the hole 15, one of them support bar 16 is fixed to be located a side of placing hole 15, another support bar 16 slides the setting in placing hole 15, the draw-in groove has been seted up at gliding support bar 16's both ends, place the side that corresponds with two draw-in grooves in the hole 15 and be equipped with slide rail 18, two draw-in grooves block respectively on two slide rails 18 and slide, gliding support bar 16 keeps away from a side of fixed support bar 16 and is connected rather than corresponding 15 sides of placing the hole through a plurality of second springs 19, two sides that support bar 16 is relative all are equipped with highly being less than the edge 17 of bearing of 16 upper surfaces of support bar, bear on two support bars 16 and lean on the relative setting of edge 17, the base plate or the PCB board that will paste dress the chip are placed two and are leaned on the edge to it fixes to order about two support bars through the elasticity of second spring, the upper surface of base 1 is equipped with the position of placing that is used for placing the chip strip, and the chip strip is the raw materials, the higher authority has deposited the chip of a plurality of needs.

During pasting, place base plate or PCB board after the screen printing and lean on along fixed in two, then hold the spacing ring drive adsorption pen horizontal and longitudinal movement on the adsorption pen with the hand, thereby remove the adsorption pen to the top of placing the position, push down the adsorption pen and make the adsorption head push down a chip, then press vacuum generator's switch and make the adsorption head adsorb the chip, remove pressure, the adsorption pen rises, the drive adsorption pen removes to the position top that needs to paste the chip, push down the adsorption pen and paste the chip and target in place, close the switch, with adsorption head and chip separation, in this process, the influence that the camera will shoot shows on the display screen, can be clear see the position that chip and chip need paste, can accurate paster.

The preferred technical scheme, the lower extreme of absorption head 12 is connected with the rubber head, the rubber head is round platform form setting, the upper end and the absorption head 12 fixed connection of rubber head, the vertical through hole that runs through in the rubber head, through hole and 8 intercommunications of air flue avoid the surface of hard contact damage chip through rubber head and chip contact.

Preferred technical scheme, place the position including a plurality of raw material grooves 20, the length direction of raw material groove 20 is on a parallel with the length direction setting of slide bar 2, the upper surface of base is run through to the length level in raw material groove, raw material groove sets up at the upper surface of base is sunken, a plurality of raw materials grass is located between two slide bars 2 side by side, a chip strip among the prior art is as the basement by a rubber strip, place a plurality of chips on the rubber strip along the length of rubber strip in proper order, and push down the chip at an upper surface joint epoxy strip of rubber strip, seal the chip between rubber strip and epoxy strip, open ring epoxy strip and rubber strip can expose the chip during use.

Preferably, the base is further provided with two separation rods 21, the two separation rods 21 are respectively arranged near two ends of the raw material tank 20, the separation rods 21 are located above the raw material tank 20, and the length direction of the separation rods 21 is perpendicular to the length direction of the raw material tank 20. With the chip strip from the former feed chute of the one end embedding of former feed chute, the epoxy strip and the rubber strip of chip strip tip are separated manually earlier, and the rubber strip is located former feed chute, supports epoxy strip on the release lever, promotes the chip strip and removes along former feed chute, and this in-process release lever supports epoxy strip, thereby just can separate it from the rubber strip and expose the chip.

Preferably, the support includes slider 22 and backup pad 23, the lower surface of mounting panel 5 is equipped with the spout that extends along 5 length direction of mounting panel, slider 22 and spout phase-match, slider 22 inlays in the spout and slides, the lower extreme of slider 22 stretches out the one end of spout fixed connection backup pad 23, the other end of backup pad 23 stretches out the below of mounting panel 5, pen socket 6 sets up on backup pad 23.

In the description of the present invention, it is to be understood that the terms "upper", "lower", "top", "bottom", "inner", "outer", and the like refer to the orientation or position relationship shown in the drawings, or the orientation or position relationship that the product of the present invention is usually placed when in use, or the orientation or position relationship that one skilled in the art conventionally understands, and are only for convenience of describing the present invention and simplifying the description, but do not refer to or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

Claims

1. A high-yield high-quality SMT paster device is characterized by comprising a base, wherein two sliding rods are arranged on the base in parallel, sliding sleeves are arranged on the sliding rods in a sliding mode, a mounting plate is arranged between the two sliding sleeves, connecting blocks are arranged at two ends of the mounting plate in a downward extending mode and fixedly connected with the two sliding sleeves respectively, a support sliding along the length direction of the mounting plate is arranged on one side of the mounting plate, a pen cap is fixedly arranged on the support, a sliding hole is vertically formed in the pen cap in a penetrating mode, an adsorption pen is arranged in the sliding hole in a sliding mode and sleeved with a first spring, the lower end of the first spring is fixedly connected with the pen cap, a limiting ring is fixedly arranged on the adsorption pen, the upper end of the first spring is connected with the limiting ring, an adsorption head is arranged at the lower end of the adsorption pen, air passages are formed in the adsorption pen and in the adsorption head in a penetrating mode, the upper end connecting hose of the adsorption pen, the hose is communicated with the air passage, the other end of the hose is connected with a vacuum generator, a switch of the vacuum generator is arranged on the limit ring, the vacuum generator is electrically connected with a power supply through the switch, a camera pen is further arranged on the support, the lower end of the camera pen is provided with a camera, the camera is towards the lower end of the adsorption head, the camera pen is electrically connected with a display screen, a rectangular placing frame is further arranged between the two slide bars, the placing frame is supported and arranged above the base through four support columns, the four support columns are arranged at four included angles of the placing frame, the placing frame is arranged below the adsorption pen and the camera pen, a rectangular placing hole is formed in the placing frame in a penetrating manner, two support bars are arranged in the placing hole in parallel, one support bar is fixedly arranged at one side edge of the placing hole, and the other support bar is arranged in the placing hole in a sliding manner, the draw-in groove has been seted up at the both ends of gliding support bar, it is equipped with the slide rail to place downthehole side that corresponds with two draw-in grooves, and two draw-in grooves block respectively and slide on two slide rails, and a side that fixed support bar was kept away from to gliding support bar is connected rather than the corresponding hole side of placing through a plurality of second springs, and the side that two support bars are relative all is equipped with the edge of leaning on of bearing that highly is less than the support bar upper surface, the upper surface of base is equipped with the position of placing that is used for placing the chip strip.

2. An SMT (surface mount technology) chip device with high product yield and high quality rate according to claim 1, wherein a rubber head is connected to the lower end of the adsorption head and is arranged in a circular truncated cone shape, the upper end of the rubber head is fixedly connected with the adsorption head, a through hole is vertically arranged in the rubber head in a penetrating mode, and the through hole is communicated with an air channel.

3. A high throughput high quality SMT chip attachment device according to claim 1 wherein said placement station comprises a plurality of material slots, said material slots having a length direction parallel to a length direction of said slide bars, wherein a plurality of material blades are juxtaposed between two of said slide bars.

4. A high throughput SMT chip device according to claim 3 wherein said base further comprises two spaced rods positioned adjacent to opposite ends of said feed slot, said spaced rods positioned above said feed slot, said spaced rods having a length dimension perpendicular to a length dimension of said feed slot.

5. A high product quality ratio SMT patch device according to claim 1, wherein the bracket comprises a slider and a support plate, the lower surface of the mounting plate is provided with a sliding slot extending along the length direction of the mounting plate, the slider is matched with the sliding slot, the slider is embedded in the sliding slot to slide, the lower end of the slider extends out of one end of the sliding slot fixedly connected with the support plate, the other end of the support plate extends out of the lower portion of the mounting plate, and the pen cap is disposed on the support plate.