CN217423779U

CN217423779U - Silicon wafer drier

Info

Publication number: CN217423779U
Application number: CN202221120931.1U
Authority: CN
Inventors: 秦有贵; 辛奇; 胡凯; 徐峰; 杨军; 闫乐成; 秦宝宏
Original assignee: Shanghai Xinli Electronic Technology Co ltd
Current assignee: Shanghai Xinli Electronic Technology Co ltd
Priority date: 2022-05-11
Filing date: 2022-05-11
Publication date: 2022-09-13
Anticipated expiration: 2032-05-11

Abstract

The utility model discloses a silicon wafer drier, including bottom headstock, bottom headstock upper surface central point puts fixedly connected with top spin dryer, is provided with the fixed stay in the spin dryer of top, and fixed stay inner wall fixedly connected with sponge that absorbs water, fixed stay outer wall position runs through the wash port of seting up a plurality of evenly distributed, and the top spin dryer realizes supporting the fixed stay, and the sponge that absorbs water is effectual when the frame is placed to the silicon wafer and is thrown away water, absorbs water, and the water that avoids the frame to be placed to the silicon wafer to throw away splashes and adheres on the silicon wafer again, causes the water of throwing away not thorough, and the wash port makes the water of spin-drying pour into in the top spin dryer and discharge, the sponge inboard that absorbs water is provided with silicon wafer placer. The utility model discloses make silicon wafer convenient appropriate place to wash through the squirt, wash the back and pass through the utility model discloses spin-dry, it is efficient when spin-drying, and water stain when spin-drying is stained by abundant absorption, avoids water to stain splashing and causes the silicon wafer not thorough that spin-dries.

Description

Silicon wafer drier

Technical Field

The utility model relates to a silicon wafer production technical field especially relates to a silicon wafer drier.

Background

Elemental silicon is a grey, brittle, tetravalent, nonmetallic chemical element. The earth crust composition is composed of 27.8% elemental silicon, second only to the oxygen content, which is a relatively rich element in nature. The silicon element is found in quartz, agate, flint, and ordinary beach stones. Silicon wafers, also known as wafers, are processed from silicon ingots, and millions of transistors can be etched on the silicon wafers by a special process, and are widely used in the manufacture of integrated circuits.

In the prior art, silicon wafers need to be cleaned after being produced, and in the prior art, cleaning and brushing are mostly manually cleaned and wiped, so that the silicon wafer drying efficiency is low, and the silicon wafers are easily damaged due to uneven force caused by manual cleaning.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the technical problem that the silicon wafer washs to spin-dry inefficiency, and damages the silicon wafer easily when wasing and cleaning.

In order to solve the technical problem, the utility model discloses a technical scheme be: the utility model provides a silicon wafer drier, includes the bottom headstock, bottom headstock upper surface central point puts fixedly connected with top spin dryer tube, be provided with the fixed stay in the top spin dryer tube, the fixed stay inner wall fixedly connected with sponge that absorbs water, the fixed stay outer wall position runs through the wash port of seting up a plurality of evenly distributed.

Through above-mentioned technical scheme, the top spin dryer tube realizes supporting fixed support frame, and the sponge that absorbs water is effectual places the frame at the silicon wafer and gets rid of when water, absorbs water, avoids the silicon wafer to place the water splash that the frame got rid of and adhere again on the silicon wafer, causes to get rid of water incompletely, and the wash port makes the log raft that spin-dries pour into in the top spin dryer tube and discharge.

The sponge inboard of absorbing water is provided with silicon wafer placer, silicon wafer placer includes the silicon wafer placement frame of cylindrical setting, silicon wafer placement frame outer wall position sets up a plurality of evenly distributed's silicon wafer standing groove, bottom wall position fixedly connected with a plurality of evenly distributed's fixed stay pad in the fixed stay frame.

Through above-mentioned technical scheme, the frame is placed to the silicon wafer to fixed supporting pad supports, avoids causing the silicon wafer to place the frame and emptys.

The utility model discloses further set up to, silicon wafer places the spacing spout that the semi-cylindrical shape setting of a plurality of evenly distributed was seted up to frame upper surface position, silicon wafer places the frame outside and is located spacing spout position and set up limited steric hindrance and keep off the frame.

Through above-mentioned technical scheme, spacing block the frame and can effectually protect the silicon wafer standing groove, avoid the silicon wafer to drop.

The utility model discloses further set up to, spacing stop the frame and include a plurality of evenly distributed's spacing barrier ring, it is a plurality of spacing barrier ring top-down cover is established and is placed frame outside position, a plurality of the inboard fixed position of fixedly connected with of spacing barrier ring fixes the gag lever post of a plurality of evenly distributed.

Through above-mentioned technical scheme, fixed gag lever post can effectually block the frame to the spacing and carry out spacing support for the spacing is hindered and is kept off the frame protection effectively.

The utility model discloses further set up to, a plurality of fixed gag lever post and the spacing spout inner wall sliding connection who corresponds the position.

The utility model discloses further set up to, the silicon wafer is placed frame upper surface central point and is put fixedly connected with top and carry and draw the piece, the silicon wafer is placed frame lower surface central point and is put the spacing lug that fixedly connected with cross set up.

The utility model discloses further set up to, bottom power box inner bottom wall central point puts fixedly connected with driving motor, and the driving motor drive end puts through the rotation with bottom power box top and top spin dryer inner bottom wall central point and is connected, and driving motor drive end fixedly connected with rotates the connecting block, and rotates the connecting block upper surface position and seted up the cross recess, spacing lug is unanimous with the big or small shape of cross recess, and spacing lug and cross recess inner wall sliding connection.

Through the technical scheme, the power of the driving motor is transmitted to the limiting lug through the rotating connecting block, so that the silicon wafer placing frame rotates at a high speed, and the silicon wafer is dried by centrifugal force.

The utility model discloses further set up to, silicon wafer standing groove inner wall fixedly connected with protection is filled up, and the protection is filled up can effectual protection silicon wafer.

The utility model has the advantages as follows:

the utility model discloses a set up the silicon wafer and place frame and fixed bolster, through putting the silicon wafer in the silicon wafer standing groove, and the steric hindrance that sets up limits keeps off the frame, wash the silicon wafer through the squirt, put the silicon wafer in fixed bolster after washing, make spacing lug and the cooperation of rotatable connecting block, start driving motor, make the silicon wafer place frame and the high-speed rotation of fixed bolster, make the water stain of silicon wafer position fall through centrifugal force on the sponge that absorbs water, avoid the water stain to splash, and the water that absorbs water the sponge gets rid of in the top spin dryer, make the silicon wafer wash simple and convenient, and realize quick spin-drying, make the silicon wafer wash spin-dry efficiently, and avoid the silicon wafer to damage when wasing the spin-dry.

Drawings

FIG. 1 is a schematic perspective view of a spin dryer for silicon wafers according to the present invention;

FIG. 2 is a schematic view of a silicon wafer placing frame of the silicon wafer spin dryer of the present invention;

fig. 3 is a bottom view of the silicon wafer placing frame of the silicon wafer spin dryer of the present invention.

In the figure: 1. a bottom power box; 2. a top spin dryer tube; 3. fixing the support frame; 4. a water-absorbing sponge; 5. fixing a supporting pad; 6. rotating the connecting block; 7. a limiting stop ring; 8. a silicon wafer placing groove; 9. a top pulling block; 10. fixing a limiting rod; 11. a limiting chute; 12. a silicon wafer placing frame; 13. and a limiting bump.

Detailed Description

The following detailed description of the preferred embodiments of the present invention will be provided in conjunction with the accompanying drawings, so as to enable those skilled in the art to more easily understand the advantages and features of the present invention, and thereby define the scope of the invention more clearly and clearly.

Referring to fig. 1 and 2, a silicon wafer spin dryer comprises a bottom power box 1, a top spin dryer tube 2 is fixedly connected to the center position of the upper surface of the bottom power box 1, a fixed support frame 3 is arranged in the top spin dryer tube 2, a water absorption sponge 4 is fixedly connected to the inner wall of the fixed support frame 3, a plurality of uniformly distributed drain holes are formed in the outer wall of the fixed support frame 3 in a penetrating manner, and a driving motor is fixedly connected to the center position of the inner bottom wall of the bottom power box 1.

The driving motor drive end is connected with bottom power box 1 top and 2 bottom wall central point of top spin dryer tube through rotating, and driving motor drive end fixedly connected with rotates connecting block 6, and rotates connecting block 6 upper surface position and has seted up the cross recess, and the sponge 4 inboard that absorbs water is provided with silicon wafer placer, and silicon wafer placer includes the silicon wafer place frame 12 of cylindrical setting.

The silicon wafer placing frame 12 is provided with a plurality of uniformly distributed semi-cylindrical limiting sliding grooves 11 in the upper surface position, the silicon wafer placing frame 12 is provided with a limiting blocking frame in the position where the limiting sliding grooves 11 are located on the outer side, the limiting blocking frame comprises a plurality of uniformly distributed limiting blocking rings 7, and the silicon wafer placing frame 12 is sleeved with the limiting blocking rings 7 from top to bottom.

The inboard fixed gag lever post 10 that fixedly connected with a plurality of evenly distributed of side position in a plurality of spacing barrier rings 7, a plurality of fixed gag lever posts 10 and the 11 inner wall sliding connections of spacing spout that correspond the position, silicon wafer place the frame 12 outer wall position and set up a plurality of evenly distributed's silicon

wafer standing groove

8, 8 inner wall fixedly connected with protection pads in the silicon wafer standing groove, 3 inner wall fixedly connected with a plurality of evenly distributed's of fixed stay pads 5 in the fixed stay frame.

As shown in figure 3, the top pulling block 9 is fixedly connected to the center position of the upper surface of the silicon wafer placing frame 12, the limiting convex block 13 which is arranged in a cross shape is fixedly connected to the center position of the lower surface of the silicon wafer placing frame 12, the size and the shape of the limiting convex block 13 are consistent with those of the cross groove, and the limiting convex block 13 is connected with the inner wall of the cross groove in a sliding mode.

The utility model discloses when using, through putting the silicon wafer in silicon wafer standing groove 8, and set up limit steric hindrance and keep off frame 7, wash the silicon wafer through the squirt, put the silicon wafer in fixed stay frame 3 after washing, make spacing lug 13 and the cooperation of rotation connecting block 6, start driving motor, make the silicon wafer place frame 12 and the high-speed rotation of fixed stay frame 3, make the water stain of silicon wafer position fall on water absorption sponge 4 through centrifugal force, avoid the water stain to splash, and the water of water absorption sponge 4 gets rid of and accomplishes spin-drying work in top spin dryer tube 2.

The above only is the embodiment of the present invention, not limiting the patent scope of the present invention, all the equivalent structures or equivalent processes that are used in the specification and the attached drawings or directly or indirectly applied to other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A silicon wafer drier comprises a bottom power box (1), and is characterized in that: the center of the upper surface of the bottom power box (1) is fixedly connected with a top spin dryer tube (2), a fixed support frame (3) is arranged in the top spin dryer tube (2), the inner wall of the fixed support frame (3) is fixedly connected with a water absorption sponge (4), and a plurality of uniformly distributed drain holes are formed in the outer wall of the fixed support frame (3) in a penetrating manner;

silicon wafer placer is provided with to sponge (4) inboard absorbs water, silicon wafer placer includes silicon wafer placing frame (12) of cylindrical setting, silicon wafer placing frame (12) outer wall position is seted up a plurality of evenly distributed's silicon wafer standing groove (8), bottom wall position fixedly connected with a plurality of evenly distributed's fixed stay (5) in fixed stay frame (3).

2. The silicon wafer drier as claimed in claim 1, wherein: the silicon wafer placing frame is characterized in that a plurality of semi-cylindrical limiting sliding grooves (11) which are uniformly distributed are formed in the upper surface of the silicon wafer placing frame (12), and a limiting blocking frame is arranged on the outer side of the silicon wafer placing frame (12) and located in the limiting sliding grooves (11).

3. The silicon wafer spin dryer of claim 2, wherein: the limiting blocking frame comprises a plurality of uniformly distributed limiting blocking rings (7), the limiting blocking rings (7) are sleeved at the outer side position of the silicon wafer placing frame (12) from top to bottom, and a plurality of uniformly distributed fixed limiting rods (10) are fixedly connected to the inner side position of the limiting blocking rings (7).

4. A silicon wafer spin dryer as claimed in claim 3, wherein: the fixed limiting rods (10) are connected with the inner walls of the limiting sliding grooves (11) at corresponding positions in a sliding mode.

5. The silicon wafer drier as claimed in claim 1, wherein: the silicon wafer placing frame is characterized in that the center of the upper surface of the silicon wafer placing frame (12) is fixedly connected with a top pulling block (9), and the center of the lower surface of the silicon wafer placing frame (12) is fixedly connected with a limiting bump (13) which is arranged in a cross shape.

6. The silicon wafer spin dryer of claim 1, wherein: bottom wall central point puts fixedly connected with driving motor in bottom headstock (1), and the driving motor drive end puts through the rotation with bottom headstock (1) top and bottom wall central point in top spin dryer tube (2) and is connected, and driving motor drive end fixedly connected with rotates connecting block (6), and rotates connecting block (6) upper surface position and has seted up the cross recess.

7. The silicon wafer drier as claimed in claim 5, wherein: the limiting convex block (13) is consistent with the cross groove in size and shape, and the limiting convex block (13) is connected with the inner wall of the cross groove in a sliding mode.

8. The silicon wafer drier as claimed in claim 1, wherein: the inner wall of the silicon wafer placing groove (8) is fixedly connected with a protective pad.