CN217403484U

CN217403484U - Testing device of infrared proximity and ambient light brightness induction sensor

Info

Publication number: CN217403484U
Application number: CN202220982417.2U
Authority: CN
Inventors: 张汉刚; 姚玉峰
Original assignee: Lafley Technology Suzhou Co ltd
Current assignee: Lafley Technology Suzhou Co ltd
Priority date: 2022-04-26
Filing date: 2022-04-26
Publication date: 2022-09-09
Anticipated expiration: 2032-04-26

Abstract

The utility model discloses a testing arrangement of infrared proximity and ambient light brightness induction sensor, relate to the chip test field, the shading camera bellows inside of this testing arrangement is provided with the light source, place the chip to be tested on the test fixture and be located the direct light path of light source, the chip pin of the chip to be tested is connected to the test machine, when the reflecting plate is located first test position under the drive of position switching mechanism, the reflecting plate is located the top of test fixture and the perpendicular distance between the chip to be tested is less than the predetermined distance, thereby can realize the test of infrared proximity induction function; when the reflecting plate is driven by the position switching mechanism to be located at the second testing position, the reflecting plate is located outside a direct light path from the light source to the testing tool, so that the testing of the ambient light brightness sensing function can be realized by utilizing the light source, two testing tasks can be completed by using one testing device, and the testing process is simplified.

Description

Testing device of infrared proximity and ambient light brightness induction sensor

Technical Field

The utility model belongs to the technical field of the chip test and specifically relates to an infrared testing arrangement who is close and ambient light brightness induction sensor.

Background

In the smart devices of today, various sensors are often used, for example, an infrared proximity sensor is mainly used to implement a touch-proof function for answering a phone call, and when a user's head approaches the phone call, the touch-proof function of the phone call is turned off. The ambient light brightness sensor is used for sensing the change of an ambient light source, the brightness of the mobile phone panel is adjusted according to the brightness of the environment, when the ambient brightness becomes dark, the brightness of the mobile phone panel is prevented from stimulating eyes and then becomes dark, and when the ambient brightness becomes bright, the brightness of the mobile phone panel can be increased to the visibility by changing the brightness.

The infrared proximity sensor and the ambient light brightness sensor are packaged and used respectively at first, and along with the technical development, the infrared proximity sensor and the ambient light brightness sensor are integrated in a packaging structure at present to form the infrared proximity and ambient light brightness sensing sensor with the infrared proximity sensing and ambient light brightness sensing functions simultaneously, so that the purposes of saving space and energy are achieved.

Infrared is close and environment light brightness inductive transducer is when carrying out functional test, need be close sensing function and environment light brightness sensing function to infrared and all test, but because infrared is close sensing function and environment light brightness sensing function and all is used for sensing light, consequently often need build test platform respectively to these two sensing function at present, in order to avoid the interference influence of each other between two sensing function, guarantee the independence and the accuracy of test result, thereby it is higher to lead to whole testing process complexity, test speed is slower.

SUMMERY OF THE UTILITY MODEL

The inventor provides an infrared testing arrangement who is close and ambient light brightness induction sensor to above-mentioned problem and technical demand, the technical scheme of the utility model as follows:

a testing device of an infrared proximity and ambient light brightness induction sensor comprises a shading camera bellows, wherein a light source is arranged in the shading camera bellows, a testing tool is arranged on the shading camera bellows, and the testing tool is positioned on a direct light path of the light source; a chip to be tested is placed on the testing tool, the chip to be tested is an infrared approaching and ambient light brightness sensing sensor, a photosensitive surface of the chip to be tested faces the direction of the light source, a chip pin of the chip to be tested is connected to a testing machine outside the shading dark box, and the testing machine is connected with the control light source;

the interior of the shading dark box is also provided with a reflecting plate and a position switching mechanism, the reflecting plate is fixed on the position switching mechanism, and the testing machine is connected with the position switching mechanism;

the reflecting plate is driven by the position switching mechanism to switch between a first testing position and a second testing position, and when the reflecting plate is positioned at the first testing position, the reflecting plate is positioned above the testing tool and the vertical distance between the reflecting plate and the chip to be tested is smaller than a preset distance; when the reflecting plate is located at the second testing position, the reflecting plate is located outside a direct light path from the light source to the testing tool.

The further technical scheme is that at least two chips to be tested are placed on the test tool.

The further technical scheme is that a test port is formed in the wall surface of the shading dark box on a direct light path of the light source, the test tool is detachably mounted at the test port, and the outer edge of the test tool is attached to the inner edge of the test port without light leakage;

the chip to be tested is placed on the testing tool, the photosensitive surface of the chip to be tested is exposed relative to the testing tool and faces to the direction of the light source in the shading camera bellows, and the chip pins of the chip to be tested are led out of the testing tool and are connected to the testing machine.

The testing tool comprises a chip holder with an upper surface facing the interior of the shading camera bellows and a lower surface facing the exterior of the shading camera bellows, wherein a chip groove is formed in the upper surface of the chip holder, the size of the chip groove is matched with that of a chip to be tested, and a plurality of pin hole sites penetrating through the lower surface of the chip holder are formed in the bottom of the chip groove; the chip to be tested is placed in the chip groove, and the chip pins of the chip to be tested are exposed just opposite to the pin hole positions and are electrically connected to the testing machine through the pin hole positions.

The test tool further comprises an electric connection device, wherein the electric connection device comprises a spring pin connector, a test circuit board and an adapter, the spring pin connector and the adapter are respectively arranged on the test circuit board, and a probe on the spring pin connector is electrically connected with the adapter through a preset wiring of the test circuit board;

the electrical connection device is arranged on the lower surface of the chip seat, and the probes on the spring pin connector correspond to the pin hole sites of the chip seat one by one and penetrate through the pin hole sites to contact the chip pins of the chip to be tested; the adapter is connected with the tester.

The further technical scheme is that an inserting groove is formed in the lower surface of a chip seat, a chip groove in the upper surface of the chip seat is formed in the inserting groove, and the structure of the inserting groove is matched with that of the spring pin connector; when the electric connecting device is arranged on the lower surface of the chip groove, the spring pin connector is inserted into the inserting groove, and the alignment of the probe on the spring pin connector and the pin hole position of the chip seat is completed.

The test tool further comprises a cover plate, the cover plate is installed at a test port of the shading camera bellows, the upper surface of the cover plate is positioned inside the shading camera bellows, and the lower surface of the cover plate is positioned outside the shading camera bellows; the chip seat is arranged on the lower surface of the cover plate, and the cover plate is provided with a through cover plate light hole at the position opposite to the chip groove on the chip seat.

The technical scheme is that a cover plate groove is formed in the upper surface of the cover plate, a cover plate light transmission hole is formed in the cover plate groove, and a light transmission plate is arranged in the cover plate groove.

The further technical scheme is that the test tool further comprises a bottom plate, the bottom plate is installed between the cover plate and the chip holder, and the bottom plate is provided with a bottom plate light hole at a position right opposite to the cover plate light hole and the chip groove.

The further technical scheme is that the shading camera bellows, the chip holder, the cover plate and the bottom plate are respectively detachably connected.

The utility model has the beneficial technical effects that:

the application discloses infrared testing arrangement who is close and ambient light brightness inductive transducer utilizes this testing arrangement to switch through the operating mode that easily realizes just can realize infrared environment light brightness inductive transducer's that is close and ambient light brightness inductive transducer's ambient light brightness inductive function and infrared test that is close inductive function respectively, uses a testing arrangement can accomplish the test task, need not to build test platform respectively, and the implementation is simple and convenient. And the test device is beneficial to realizing batch test, and can further improve the test efficiency.

Through the structural design of the test tool, when the infrared approaching and environment light brightness induction sensor is tested, the glass panel of an electronic product in the actual application process can be simulated, the gap between the sensor and the glass panel can be further simulated, the test scene is more attached to the actual use scene of the sensor, and the test result is more accurate.

Drawings

FIG. 1 is a block diagram of a test setup in one embodiment.

FIG. 2 is a top view of the test apparatus shown in FIG. 1 along the light path angle of the light source under the test condition of the ambient light level sensing function.

FIG. 3 is a top view of the testing apparatus shown in FIG. 1 along the light path angle of the light source under the condition of performing the infrared proximity sensing function test.

Fig. 4 is a block diagram of a test apparatus based on the structure of a test fixture in one embodiment.

Fig. 5 is an exploded view of a test fixture of the structure shown in fig. 4.

FIG. 6 is a schematic diagram of an exemplary embodiment of a top surface structure of a die pad.

FIG. 7 is a schematic view of a bottom surface of a die pad in one embodiment.

Figure 8 is a schematic diagram of the configuration of the pogo pin connector in one embodiment.

Fig. 9 is a schematic diagram of the structure of the upper surface of the cover plate in one embodiment.

Fig. 10 is a schematic view of the structure of the lower surface of the cover plate in one embodiment.

FIG. 11 is a schematic diagram of the structure of the base plate in one embodiment.

Detailed Description

The following description will further explain embodiments of the present invention with reference to the accompanying drawings.

The application discloses a testing device of an infrared proximity and ambient light brightness induction sensor, please refer to fig. 1-3, the testing device comprises a shading camera 1, and a light source 2 is arranged inside the shading camera 1. A testing tool 3 is arranged on the shading camera bellows 1, the testing tool 3 is located on a direct light path of the light source 2, a chip 4 to be tested is placed on the testing tool 3, and the chip 4 to be tested is an infrared approaching and ambient light brightness induction sensor. Only one chip 4 to be tested can be placed on the testing tool 3, or at least two chips 4 to be tested can be placed on the testing tool more commonly, so that batch testing of the infrared approaching and ambient light brightness induction sensors can be realized, and the testing efficiency is improved. The photosensitive surface of the chip 4 to be tested faces the direction of the light source 2, and the illumination range of the light source 2 on the testing tool 3 at least covers all the chips 4 to be tested.

The mounting mode of the test tool 3 on the shading camera bellows 1 mainly has two types: (1) test fixture 3 installs completely in shading camera bellows 1, and shading camera bellows 1 is the structure that can open and shut under this kind of circumstances, can get when shading camera bellows 1 opens and put the chip 4 that awaits measuring on the internal test fixture 3, and shading camera bellows 1 closes the back inside and is camera bellows light-resistant environment, blocks the influence of external light. (2) The wall surface of the shading dark box 1 on the direct light path of the light source 2 is provided with a test port, the test tool 3 is detachably arranged at the test port, the outer edge of the test tool 3 is attached to the inner edge of the test port without light leakage, and the test tool 3 is not light-transmitting. Shading camera bellows 1 need not to design for the structure that can open and shut under this kind of circumstances, and the back of tearing test fixture 3 down can realize waiting getting of examining chip 4 and put, and after installing test fixture 3, shading camera bellows 1 is inside to be camera bellows light-resistant environment, blocks the influence of outside light. The mounting method shown in case (2) is exemplified as fig. 1.

No matter what installation method is adopted between the test tool 3 and the shading dark box 1, the chip pins of the chip 4 to be tested are electrically connected to the test machine 5 outside the shading dark box 1. The testing machine 5 is connected with the control light source 2, so that the light source 2 can be controlled to be turned on and off according to the testing requirement.

The shading camera bellows 1 is also internally provided with a reflecting plate 6 and a position switching mechanism 7, the reflecting plate 6 is fixed on the position switching mechanism 7, and the testing machine 5 is connected with the position switching mechanism 7. As shown in fig. 2 and 3, one implementation of the position switching mechanism 7 is a common structure that can switch positions, such as an electric slide rail or a small-sized robot arm, and the present application is not limited to this.

The reflecting plate 6 is switched between a first test position and a second test position by the driving of the position switching mechanism 7. As shown in fig. 2 and 3, taking the position switching mechanism 7 as an electric slide rail as an example of a top view along the light path angle of the light source 2, when the reflector 6 slides along the electric slide rail to be located at the second testing position, the reflector 6 is located outside the direct light path from the light source 2 to the testing fixture 3, as shown in fig. 2, the testing fixture 3 and the chip 4 to be tested thereon are exposed relative to the direct light path of the light source 2, and a person skilled in the art can determine, without doubt, that the light source 2 can be controlled to be turned on at this time according to the actual need of the ambient light brightness sensing testing process, so that the ambient light brightness sensing function of the chip 4 to be tested can be tested by using the light source 2. When the reflective plate 6 slides along the electric slide rail to be located at the first testing position, the reflective plate 6 is located above the testing fixture 3, and the vertical distance between the reflective plate 6 and the chip 4 to be tested is smaller than the predetermined distance, as shown in fig. 3, in comparison with fig. 2, the reflective plate 6 is located above the testing fixture 3 and the chip 4 to be tested thereon, so that the light emitted by the light source 2 is blocked by the reflective plate 6 and does not act on the chip 4 to be tested, a person skilled in the art can undoubtedly determine that the light source 2 can be controlled to be turned off by using the testing machine 5 according to the actual needs of the infrared proximity sensing testing process, and the infrared proximity sensing function of the chip 4 to be tested can be tested by using the reflective plate 6.

Therefore, the testing device can be used for testing the infrared approaching sensing function and the ambient light brightness sensing function of the infrared approaching and ambient light brightness sensing sensor without respectively building a testing platform. And the batch test of a plurality of infrared approaching and ambient light brightness induction sensors can be realized, the test difficulty is low, and the test efficiency is high.

In one embodiment, when the testing tool 3 is detachably installed at the testing opening of the light-shielding dark box 1, the chip 4 to be tested is placed on the testing tool 3, the light-sensitive surface of the chip 4 to be tested is exposed relative to the testing tool 3 and faces the direction of the light source 2 inside the light-shielding dark box 1, and the chip pin of the chip 4 to be tested is led out from the testing tool 3 and connected to the testing machine 5.

Referring to fig. 4-11, the testing tool 3 includes a chip holder 31 having an upper surface facing the interior of the light-shielding dark box 1 and a lower surface facing the exterior of the light-shielding dark box 1, wherein the chip holder 31 is completely shielded from light. Referring to fig. 6, a chip slot 31a is formed on the upper surface of the chip holder 31. In one embodiment, as shown in fig. 6, the chip holder 31 has a plurality of chip slots 31a formed in an upper surface thereof and arranged according to a predetermined rule. The size of the chip groove 31a is matched with that of the chip 4 to be tested, and a plurality of pin hole positions penetrating through the lower surface of the chip seat 31 are formed at the bottom of the chip groove 31 a. The chip 4 to be tested is placed in the chip slot 31a, and the chip pins of the chip 4 to be tested are exposed to the pin hole sites, so that the chip pins of the chip 4 to be tested can pass through the pin hole sites to be electrically connected to the testing machine 5.

The chip pins of the chip 4 to be tested may be connected to the tester 5 by wires, or as shown in fig. 4 and 5, the test fixture 3 further includes an electrical connection device 32, and the electrical connection device 32 includes a pogo pin connector 32a, a test circuit board 32b, and an adapter 32 c. The pogo pin connector 32a and the adapter 32c are respectively disposed on the test circuit board 32b, and the probes on the pogo pin connector 32a and the adapter 32c are electrically connected through preset wiring in the test circuit board 32 b. The electrical connection device 32 is mounted on the lower surface of the die pad 31, and the probes on the pogo pin connector 32a correspond to the pin holes of the die pad 31 one by one and pass through the pin holes to contact the chip pins of the chip 4 to be tested. The adapter 32c is connected to the tester 5. The chip pins of the chip 4 to be tested can be easily connected to the tester 5 via the electrical connection devices 32.

In order to avoid the alignment connection between the electrical connection device 32 and the chip holder 31, as shown in fig. 7, the lower surface of the chip holder 31 is provided with a socket groove 31b, and the chip slot 31a on the upper surface of the chip holder 31 is provided at the socket groove 31 b. The structure of the plug recess 31b matches the structure of the pogo pin connector 32a, and as shown in fig. 7 and 8, the plug recess 31b matches the projection structure of the pogo pin connector 32 a. When the electrical connection device 32 is mounted on the lower surface of the chip slot 31a, the pogo pin connector 32a is inserted into the insertion groove 31b, so that the alignment between the probes on the pogo pin connector 32a and the pin hole sites of the chip holder 31 can be completed, the connection is facilitated, and the connection reliability is ensured.

The chip holder 31 can be directly detachably attached to the test port of the light-shielding dark box 1. Or the test fixture 3 further comprises a light-tight cover plate 33, the cover plate 33 is detachably mounted at the test port of the light-shielding dark box 1, specifically, as shown in fig. 9 and 10, the size of the end surface of the upper surface of the cover plate 33 is larger than the size of the opening of the test port of the light-shielding dark box 1, so that a boss structure is formed, and the upper surface of the cover plate 33 covers the test port, so that the mounting with the light-shielding dark box 1 can be realized. The upper surface of the cover plate 33 is located inside the light-shielding dark box 1, and the lower surface of the cover plate 33 is located outside the light-shielding dark box 1. The chip holder 31 is mounted on the lower surface of the cover plate 33, and optionally, the chip holder 31 is detachably mounted on the lower surface of the cover plate 33. The cover plate 33 is provided with a through cover plate light-transmitting hole 33a at a position opposite to the chip groove 31a on the chip holder 31, so that the light path of the light-sensing surface of the chip 4 to be tested is ensured to be smooth.

Optionally, a cover plate groove 33b is formed in the upper surface of the cover plate 33, the cover plate light-transmitting hole 33a is formed in the cover plate groove 33b, and a light-transmitting plate is arranged in the cover plate groove 33b and can be used for simulating a glass panel in an electronic product to be used as an additional filter to eliminate defective products.

In another embodiment, the test fixture 3 further comprises a light-tight bottom plate 34, the bottom plate 34 is mounted between the cover plate 33 and the chip holder 31, and optionally, the bottom plate 34 is detachably connected to the cover plate 33 and the chip holder 31, respectively. Referring to fig. 11, the bottom plate 34 is provided with bottom plate light holes 34a at positions opposite to the cover plate light holes 33a and the chip slots 31a, so as to ensure that the light path of the light-sensing surface of the chip 4 to be tested is smooth. The base plate 34 has a predetermined thickness that simulates the gap between the glass panel of an actual electronic product and the infrared proximity and ambient light level sensing sensors.

As shown in fig. 6-11, the chip holder 31, the pogo pin connector 32a, the cover plate 33 and the bottom plate 34 are provided with a plurality of mounting holes, so that the light-shielding camera bellows 1, the chip holder 31, the electrical connection device 32, the cover plate 33 and the bottom plate 34 can be detachably connected.

What has been described above is only a preferred embodiment of the present application, and the present invention is not limited to the above embodiment. It is to be understood that other modifications and variations directly derivable or suggested by those skilled in the art without departing from the spirit and scope of the present invention are to be considered as included within the scope of the present invention.

Claims

1. The testing device of the infrared proximity and ambient light brightness induction sensor is characterized by comprising a shading camera bellows (1), wherein a light source (2) is arranged in the shading camera bellows (1), a testing tool (3) is arranged on the shading camera bellows (1), and the testing tool (3) is positioned on a direct light path of the light source (2); a chip (4) to be tested is placed on the testing tool (3), the chip (4) to be tested is an infrared approaching and ambient light brightness induction sensor, a light sensing surface of the chip (4) to be tested faces the direction of the light source (2), a chip pin of the chip (4) to be tested is connected to a testing machine (5) outside the shading dark box (1), and the testing machine (5) is connected with and controls the light source (2);

a reflecting plate (6) and a position switching mechanism (7) are further arranged in the shading dark box (1), the reflecting plate (6) is fixed on the position switching mechanism (7), and the testing machine (5) is connected with and controls the position switching mechanism (7);

the reflecting plate (6) is driven by the position switching mechanism (7) to be switched between a first test position and a second test position, when the reflecting plate (6) is located at the first test position, the reflecting plate (6) is located above the test tool (3) and the vertical distance between the reflecting plate (6) and the chip (4) to be tested is smaller than a preset distance; when the reflecting plate (6) is located at the second testing position, the reflecting plate (6) is located outside a direct light path from the light source (2) to the testing tool (3).

2. The testing device according to claim 1, characterized in that at least two chips (4) to be tested are placed on the testing tool (3).

3. The testing device according to claim 1 or 2, characterized in that the wall surface of the shading dark box (1) on the direct light path of the light source (2) is provided with a testing port, the testing tool (3) is detachably mounted at the testing port, and the outer edge of the testing tool (3) is attached to the inner edge of the testing port without light leakage;

the to-be-tested chip (4) is placed on the testing tool (3), a photosurface of the to-be-tested chip (4) is exposed relative to the testing tool (3) and faces the direction of the light source (2) in the shading dark box (1), and chip pins of the to-be-tested chip (4) are led out of the testing tool (3) and are connected to the testing machine (5).

4. The testing device according to claim 3, wherein the testing tool (3) comprises a chip holder (31) with an upper surface facing the inside of the shading camera bellows (1) and a lower surface facing the outside of the shading camera bellows (1), a chip groove (31a) is formed in the upper surface of the chip holder (31), the size of the chip groove (31a) is matched with that of a chip (4) to be tested, and a plurality of pin hole positions penetrating through the lower surface of the chip holder (31) are formed in the bottom of the chip groove (31 a); the chip (4) to be tested is placed in the chip groove (31a), and the chip pins of the chip (4) to be tested are exposed to the pin hole positions and are electrically connected to the testing machine (5) through the pin hole positions.

5. The testing device according to claim 4, characterized in that the testing tool (3) further comprises an electrical connection device (32), the electrical connection device (32) comprises a pogo pin connector (32a), a testing circuit board (32b) and an adapter (32c), the pogo pin connector (32a) and the adapter (32c) are respectively arranged on the testing circuit board (32b), and a probe on the pogo pin connector (32a) and the adapter (32c) are electrically connected through a preset wiring of the testing circuit board (32 b);

the electrical connection device (32) is arranged on the lower surface of the chip seat (31), probes on the spring pin connector (32a) correspond to pin hole sites of the chip seat (31) one by one and penetrate through the pin hole sites to contact chip pins of a chip (4) to be tested; the adapter (32c) is connected with the testing machine (5).

6. The testing device according to claim 5, wherein a lower surface of the chip holder (31) is provided with a plug-in groove (31b), a chip groove (31a) on an upper surface of the chip holder (31) is provided at the plug-in groove (31b), and the structure of the plug-in groove (31b) is matched with that of the pogo pin connector (32 a); when the electric connecting device (32) is installed on the lower surface of the chip groove (31a), the spring pin connector (32a) is inserted into the insertion groove (31b), and alignment of a probe on the spring pin connector (32a) and a pin hole position of the chip seat (31) is completed.

7. The testing device according to claim 4, wherein the testing tool (3) further comprises a cover plate (33), the cover plate (33) is installed at the testing opening of the shading camera bellows (1), the upper surface of the cover plate (33) is located inside the shading camera bellows (1), and the lower surface of the cover plate (33) is located outside the shading camera bellows (1); the chip holder (31) is arranged on the lower surface of the cover plate (33), and the cover plate (33) is provided with a through cover plate light-transmitting hole (33a) at a position opposite to the chip groove (31a) on the chip holder (31).

8. The testing device as claimed in claim 7, wherein a cover plate recess (33b) is formed on the upper surface of the cover plate (33), the cover plate light-transmitting hole (33a) is formed in the cover plate recess (33b), and a light-transmitting plate is disposed in the cover plate recess (33 b).

9. The testing device according to claim 7, wherein the testing tool (3) further comprises a bottom plate (34), the bottom plate (34) is installed between the cover plate (33) and the chip holder (31), and the bottom plate (34) is provided with a bottom plate light transmission hole (34a) at a position opposite to the cover plate light transmission hole (33a) and the chip groove (31 a).

10. The testing device according to claim 9, wherein the light-shielding camera chamber (1), the chip holder (31), the cover plate (33) and the bottom plate (34) are detachably connected with each other.