CN217389312U

CN217389312U - Computer server rack convenient to heat dissipation

Info

Publication number: CN217389312U
Application number: CN202220858841.6U
Authority: CN
Inventors: 赵秀琴
Original assignee: Shandong Dongding Xinde Intelligent Electronics Co ltd
Current assignee: Shandong Dongding Xinde Intelligent Electronics Co ltd
Priority date: 2022-04-14
Filing date: 2022-04-14
Publication date: 2022-09-06
Anticipated expiration: 2032-04-14

Abstract

The utility model relates to the technical field of computer server cabinets, in particular to a computer server cabinet convenient for heat dissipation, which comprises a cabinet body, wherein the left side of the cabinet body is provided with a processing box, the left side of the cabinet body is provided with a fan above the processing box, the top inner wall of the processing box is provided with a semiconductor refrigerating sheet close to the front side, the middle position of the processing box is provided with a layered plate, a plurality of absorbent cotton distributed at equal intervals are arranged between the bottom of the layered plate and the inner wall of the bottom of the processing box, the rear side of the processing box is provided with an air collecting hopper, a conveying pipe is arranged between the air collecting hopper and the cabinet body, the utility model conveys the gas in the cabinet body to the inside of the processing box through the fan and then mixes with the cold air made by the semiconductor refrigerating sheet, then the gas in temperature enters the inside of the cabinet body again through the conveying pipe, and the circulation is carried out, thereby realizing the cooling of the inside of the cabinet body, thereby avoiding the damage of the internal elements caused by the overhigh temperature inside the cabinet body.

Description

Computer server rack convenient to heat dissipation

Technical Field

The utility model relates to a computer server rack technical field specifically is a computer server rack convenient to heat dissipation.

Background

The server cabinet is used for combining and installing a panel, a plug-in box, an electronic element, a device, a mechanical part and a component to form an integral installation box, the computer server cabinet is easy to generate heat in the using process, the heat cannot be processed, the damage of the internal element of the computer server cabinet is easily caused, and the service life of the computer server cabinet is further influenced.

SUMMERY OF THE UTILITY MODEL

In order to make up for the above deficiency, the utility model provides a computer server rack convenient to heat dissipation.

The technical scheme of the utility model is that:

the utility model provides a computer server rack convenient to heat dissipation, includes the rack body, the left side of rack body is equipped with handles the case, the left side of rack body just is located the top of handling the case is equipped with the fan, the fan air outlet pass through the tuber pipe with it connects to handle the case, the top inner wall of handling the case just is equipped with the semiconductor refrigeration piece near the front side, the intermediate position of handling the case is equipped with the layering board, the surface of layering board just has seted up the rectangle near the front side and has led to the groove, the bottom of layering board with it just is equipped with a plurality of equidistant distribution's absorbent cotton to be located the front side that the rectangle led to the groove between the inner wall of bottom of the case portion to handle, the rear side of handling the case and with absorbent cotton corresponding position is equipped with an album wind fill, album wind fill with be equipped with the conveyer pipe between the rack body.

According to the preferable technical scheme, a cavity is formed between the inner wall and the outer wall of the bottom of the cabinet body, and an air exhaust hole communicated with the interior of the cavity is formed in the inner wall of the bottom of the cabinet body.

According to the preferable technical scheme, an air expanding hopper is arranged on the left side of the cabinet body and corresponds to the cavity, and one end, far away from the air collecting hopper, of the conveying pipe is fixedly connected with the air expanding hopper.

Preferably, a fan is disposed on the left inner wall of the treatment tank above the laminate.

As an optimized technical scheme, a heat dissipation aluminum plate is embedded at the top of the processing box and in a position corresponding to the semiconductor refrigeration piece, and a plurality of heat dissipation fins distributed at equal intervals are arranged at the top of the heat dissipation aluminum plate.

As the preferred technical scheme, two adjacent moisture absorption cotton are provided with a partition board, and the surface of the partition board is provided with a through groove.

Preferably, the inner walls of the left side and the right side of the treatment box are provided with symmetrically distributed U-shaped plates corresponding to the moisture absorption cotton, and the moisture absorption cotton is connected with the corresponding U-shaped plates in a sliding manner.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the utility model uses the fan to convey the gas in the cabinet body to the inside of the processing box and then mix the gas with the cold air made by the refrigerating surface of the semiconductor refrigerating sheet, and then the gas with neutralized temperature enters the inside of the cabinet body again through the conveying pipe, and the circulation is carried out, thereby realizing the cooling of the inside of the cabinet body and further avoiding the damage of the internal elements of the cabinet body caused by overhigh temperature in the cabinet body;

2. the utility model discloses a moisture absorption is cotton absorbs the moisture in handling incasement portion gas, avoids the moisture in the gas to get into the inside of rack body and leads to its internal member to wet and influence the use.

Drawings

Fig. 1 is one of the overall structural diagrams of the present invention;

fig. 2 is a second schematic view of the overall structure of the present invention;

fig. 3 is a schematic view of the overall structure of the cabinet body after being cut;

FIG. 4 is a schematic view of a part of the structure of the present invention;

FIG. 5 is one of the schematic structural diagrams of the middle treatment tank after being cut;

FIG. 6 is a second schematic view of a cut-away part of the structure of the middle processing box of the present invention;

fig. 7 is a schematic diagram of the partial structure split according to the present invention.

The meaning of the individual reference symbols in the figures is:

a cabinet body 1; a cavity 11; an air exhaust hole 12; an air expanding hopper 13; a fan 2; an air duct 21; a treatment tank 3; a laminate 31; a fan 32; a heat dissipating aluminum plate 33; heat radiation fins 331; a U-shaped plate 34; a partition plate 35; a through groove 351; a wind-collecting scoop 36; a delivery pipe 361; a bottom plate 37; a rotating shaft 38; a stopper 381; a semiconductor refrigerating sheet 4; and (5) absorbent cotton.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and to simplify the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.

Referring to fig. 1-7, the present invention provides a technical solution:

a computer server cabinet convenient for heat dissipation comprises a cabinet body 1, a processing box 3 is arranged on the left side of the cabinet body 1, a fan 2 is arranged on the left side of the cabinet body 1 and above the processing box 3, an air outlet of the fan 2 is connected with the processing box 3 through an air pipe 21, one end of the air pipe 21 far away from the air outlet of the fan 2 penetrates through the top of the processing box 3 and is close to the outer wall of the rear side and is communicated with the inside of the processing box, a semiconductor refrigerating sheet 4 is arranged on the inner wall of the top of the processing box 3 and is close to the front side, the refrigerating surface of the semiconductor refrigerating sheet 4 faces to the lower side, a layering plate 31 is arranged in the middle position of the processing box 3, a rectangular through groove is formed on the surface of the layering plate 31 and is close to the front side, a plurality of moisture absorption cotton 5 distributed at equal intervals are arranged between the bottom of the layering plate 31 and the inner wall of the bottom of the processing box 3 and on the front side of the rectangular through groove, a wind collecting hopper 36 is arranged on the rear side of the processing box 3 and corresponds to the moisture absorption cotton 5, the inner wall interval of wind-collecting bucket 36 reduces gradually from the past to the back, is equipped with conveyer pipe 361 between wind-collecting bucket 36 and the rack body 1.

Preferably, as this embodiment, a cavity 11 has been seted up between the inner wall of cabinet body 1 bottom and the outer wall, cabinet body 1's bottom inner wall has seted up with the inside communicating hole for airing exhaust 12 of cavity 11, cabinet body 1's left side and the corresponding position of cavity 11 are equipped with and expand wind fill 13, the conveyer pipe 361 is kept away from the one end of wind collecting fill 36 and is expanded wind fill 13 fixed connection, specifically, the inside gas after handling of processing case 3 passes through wind collecting fill 36's guide and gets into to expand inside wind fill 13 through the transport of conveyer pipe 361, then guide to inside cavity 11 through expanding wind fill 13, then discharge to cabinet body 1's inside through hole for airing exhaust 12.

Preferably, a fan 32 is disposed on the left inner wall of the processing box 3 above the layered plate 31 for accelerating the flow speed of the gas inside the processing box 3, so that the gas entering the processing box 3 and the cold air generated by the cooling surface of the semiconductor cooling sheet 4 are sufficiently contacted to cool the gas.

As the optimization of this embodiment, a heat dissipating aluminum plate 33 is embedded in the top of the processing box 3 and at a position corresponding to the semiconductor chilling plate 4, the bottom of the heat dissipating aluminum plate 33 contacts with the heat dissipating surface of the semiconductor chilling plate 4, the top of the heat dissipating aluminum plate 33 and the top of the processing box 3 are located on the same horizontal line, and a plurality of heat dissipating fins 331 are arranged on the top of the heat dissipating aluminum plate 33 and are distributed at equal intervals, so that the heat dissipating surface of the semiconductor chilling plate 4 is heat-dissipated through the heat dissipating aluminum plate 33 and the heat dissipating fins 331, thereby improving the working efficiency of the chilling surface of the semiconductor chilling plate 4.

Preferably, as this embodiment, all be equipped with baffle 35 between two adjacent moisture absorption cotton 5, logical groove 351 has all been seted up to the surface of baffle 35, the position that logical groove 351 was seted up on two adjacent baffles 35 is not corresponding, so that the long time of gaseous flow inside processing case 3, thereby make gaseous and a plurality of moisture absorption cotton 5 fully contact, so as to absorb the moisture in the gas, the both sides inner wall of processing case 3 and the position that corresponds with moisture absorption cotton 5 are equipped with the U-shaped board 34 of symmetric distribution, moisture absorption cotton 5 and its U-shaped board 34 sliding connection that corresponds, further, the lower extreme of moisture absorption cotton 5 passes the bottom inner wall of processing case 3 and to the outside, the bottom of processing case 3 articulates there is bottom plate 37, so that take out moisture absorption cotton 5 from processing case 3 is inside.

It is worth noting that the bottom of the bottom plate 37 and the side far away from the hinge point are provided with a limit block 381 for limiting the bottom of the bottom plate 37 and the position far away from the hinge point, and the top end of the limit block 381 and the side far away from the bottom plate 37 are rotatably connected with the outer wall of the bottom of the processing box 3 through a rotating shaft 38, so as to adjust the angle of the limit block 381.

When the computer server cabinet convenient for heat dissipation of the utility model is used, the fan 2 conveys the gas inside the cabinet body 1 to the inside of the processing box 3 through the air pipe 21, meanwhile, the refrigerating surface of the semiconductor refrigerating sheet 4 refrigerates towards the inside of the processing box 3, thereby leading the cold air to be contacted and mixed with the gas entering the treatment box 3, realizing the cooling of the gas, leading the cooled gas to enter the space below the layered plate 31 through the rectangular through groove and to be filtered and adsorbed by the multi-layer moisture absorption cotton 5, so that the moisture in the gas can be absorbed, the treated gas is guided into the conveying pipe 361 through the wind collecting hopper 36, and then is conveyed into the cavity 11 through the wind spreading hopper 13, then the inside gas of cavity 11 is discharged to the inside of rack body 1 through exhaust hole 12, so relapse to the realization is to the inside cooling of rack body 1.

The foregoing shows and describes the general principles, essential features, and advantages of the invention. It should be understood by those skilled in the art that the present invention is not limited by the above embodiments, and the description in the above embodiments and the description is only preferred examples of the present invention, and is not intended to limit the present invention, and that the present invention can have various changes and modifications without departing from the spirit and scope of the present invention, and these changes and modifications all fall into the scope of the claimed invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. The utility model provides a computer server rack convenient to heat dissipation, includes rack body (1), its characterized in that: a processing box (3) is arranged on the left side of the cabinet body (1), a fan (2) is arranged on the left side of the cabinet body (1) and above the processing box (3), the air outlet of the fan (2) is connected with the treatment box (3) through an air pipe (21), a semiconductor refrigerating sheet (4) is arranged on the inner wall of the top of the processing box (3) and close to the front side, a layering plate (31) is arranged in the middle of the treatment box (3), a rectangular through groove is formed on the surface of the layering plate (31) and close to the front side, a plurality of absorbent cotton (5) which are distributed at equal intervals are arranged between the bottom of the layered plate (31) and the inner wall of the bottom of the treatment box (3) and positioned at the front side of the rectangular through groove, a wind collecting hopper (36) is arranged at the rear side of the treatment box (3) and at the position corresponding to the moisture absorption cotton (5), a conveying pipe (361) is arranged between the air collecting hopper (36) and the cabinet body (1).

2. The computer server cabinet facilitating heat dissipation of claim 1, wherein: a cavity (11) is formed between the inner wall and the outer wall of the bottom of the cabinet body (1), and an air exhaust hole (12) communicated with the inside of the cavity (11) is formed in the inner wall of the bottom of the cabinet body (1).

3. The computer server cabinet facilitating heat dissipation of claim 2, wherein: the cabinet is characterized in that an air expansion hopper (13) is arranged on the left side of the cabinet body (1) and corresponds to the cavity (11), and one end, far away from the air collection hopper (36), of the conveying pipe (361) is fixedly connected with the air expansion hopper (13).

4. The computer server cabinet facilitating heat dissipation of claim 1, wherein: and a fan (32) is arranged on the inner wall of the left side of the treatment box (3) and above the layered plate (31).

5. The computer server cabinet facilitating heat dissipation of claim 1, wherein: the top of processing case (3) and with semiconductor refrigeration piece (4) corresponding position inlays and is equipped with heat dissipation aluminum plate (33), the top of heat dissipation aluminum plate (33) is equipped with a plurality of equidistant distribution's heat radiation fins (331).

6. The computer server cabinet facilitating heat dissipation of claim 1, wherein: every two adjacent all be equipped with baffle (35) between moisture absorption cotton (5), logical groove (351) have all been seted up on the surface of baffle (35).

7. The computer server cabinet facilitating heat dissipation of claim 1, wherein: the treatment box is characterized in that symmetrically distributed U-shaped plates (34) are arranged on the inner walls of the left side and the right side of the treatment box (3) and correspond to the moisture absorption cotton (5), and the moisture absorption cotton (5) is connected with the corresponding U-shaped plates (34) in a sliding mode.