CN217389277U

CN217389277U - Heat management structure

Info

Publication number: CN217389277U
Application number: CN202123106381.6U
Authority: CN
Inventors: 毛毅斌; 魏华锋; 穆成刚; 王强
Original assignee: Zhejiang Yige Enterprise Management Group Co ltd
Current assignee: Zhejiang Yige Enterprise Management Group Co ltd
Priority date: 2021-12-09
Filing date: 2021-12-09
Publication date: 2022-09-06
Anticipated expiration: 2031-12-09

Abstract

A heat management structure comprises a heat transfer unit, a heat dissipation structure, a phase change heat storage unit and a heat insulation shell; the heat transfer unit is connected with the heat dissipation structure, and the phase change heat storage unit is arranged on the heat dissipation structure; the heat dissipation structure and the heat insulation shell form a sealed cavity, and the phase change heat storage unit is positioned in the sealed cavity; the heat transfer unit is connected to a heat source. The utility model discloses a graphite alkene phase change material, inside aluminium system conducting strip, the embedded application of paraffin phase change material above aluminium system conducting strip form one set of complete heat-conduction, heat storage system, transfer the heat energy in semiconductor refrigeration piece back hot junction fast to the utility model discloses on other parts in the heat management system built to guarantee the good nature of cosmetic product cold compress function and the product heat management demand that the form of the same kind extended.

Description

Heat management structure

Technical Field

The utility model belongs to the technical field of the beauty instrument heat management, in particular to heat management structure.

Background

The heat management mode of the existing beauty instrument products is basically an active heat dissipation mode of a fan and a shell exposed hole or an exposed metal heat dissipation mode of an enlarged volume. With the upgrade of global consumption level, the convenience of product carrying and the requirement of appearance design are increasingly improved by consumers, so that the traditional heat management form is an obstacle to the appearance refinement and volume miniaturization design of the product.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a heat management structure to solve above-mentioned problem.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

a heat management structure comprises a heat transfer unit, a heat dissipation structure, a phase change heat storage unit and a heat insulation shell; the heat transfer unit is connected with the heat dissipation structure, and the phase change heat storage unit is arranged on the heat dissipation structure; the heat dissipation structure and the heat insulation shell form a sealed cavity, and the phase change heat storage unit is positioned in the sealed cavity; the heat transfer unit is connected to a heat source.

Furthermore, the heat transfer unit is a graphene phase change material, one end of the graphene phase change material is attached to the heat source, and the other end of the graphene phase change material is attached to the heat dissipation structure.

Further, the heat transfer unit has a rectangular plate-like structure.

Furthermore, the heat dissipation structure is a die-casting aluminum heat dissipation sheet, and the phase change heat storage unit is embedded and attached to the die-casting aluminum heat dissipation sheet.

Furthermore, the die-casting aluminum radiating fins are of a tooth-shaped structure or a groove structure.

Furthermore, the phase change heat storage unit is a paraffin phase change heat storage material.

Further, a heat insulation layer is arranged on the inner side of the heat insulation shell.

Further, the heat insulation layer comprises a plastic heat insulation paint spraying layer and a plastic heat conduction paint spraying layer; the plastic heat-conducting paint layer is positioned on the inner side.

Compared with the prior art, the utility model discloses there is following technological effect:

the utility model discloses a graphite alkene phase change material, inside aluminium system conducting strip, the embedded application of paraffin phase change material above aluminium system conducting strip form one set of complete heat-conduction, heat storage system, transfer the heat energy in semiconductor refrigeration piece back hot junction fast to the utility model discloses on other parts in the heat management system built to guarantee the good nature of cosmetic product cold compress function and the product heat management demand that the form of the same kind extended.

The utility model discloses the graphite alkene phase change material that adopts has good heat-conduction characteristic and to the packing connectivity in clearance between the different parts, and aluminium system conducting strip has structural strength, the radiating good nature of heat conduction, and the paraffin phase change material of embedding in the aluminum sheet clearance has the characteristic at certain temperature point phase transition heat absorption energy storage.

The utility model discloses satisfy the waterproof design requirement that the product is miniaturized, do not have the hole that exposes and bring and better product refinement design requirement.

Drawings

Fig. 1 is a heat energy transfer diagram of the present invention.

FIG. 2 is a diagram showing the property of the sprayed layer inside the plastic casing of the present invention;

FIG. 3 is a first combination of aluminum heat sink and paraffin phase change material;

FIG. 4 is a second combination of aluminum heat sink and paraffin phase change material;

wherein: the heat-insulation heat-preservation structure comprises 1-a semiconductor refrigeration sheet, 2-graphene phase-change materials, 3-die-cast aluminum cooling fins, 4-phase-change heat storage units and 5-a heat-insulation shell.

Detailed Description

The following embodiments of the present invention are given, and it should be noted that the present invention is not limited to the following embodiments, and the equivalent transformations made on the basis of the technical solution of the present invention all fall into the protection scope of the present invention.

Following the above technical solution, as shown in fig. 1 below, this embodiment provides a thermal management system solution with a cosmetic instrument design with refinement, volume miniaturization and no exposed hole.

The semiconductor refrigerating sheet 1 in the lower drawing has the functions of a refrigerating surface and a heating surface, when the product starts the refrigerating function, the corresponding back end can generate a large amount of heat energy, and if the heat energy at the hot end cannot be effectively diffused and transferred, the function of the refrigerating end can be seriously influenced.

The utility model firstly transfers the heat energy generated by the hot end of a semiconductor 1 to a die-casting aluminum radiating fin 3 through a graphene phase-change material 2 with high heat conductivity, the well-known die-casting aluminum radiating fin 3 has quick heat radiation, at this time, the paraffin phase-change heat storage material embedded in the gap of the die-casting aluminum radiating fin 3 has the property of phase change, the absorbed heat energy ensures that the temperature thereof rises steadily, once the temperature rises to the phase change value of the material, a large amount of heat energy can be absorbed in the phase change process from the solid state to the semi-softening latex state, and simultaneously, the paraffin phase-change heat storage material is closely connected with a plastic shell 5, wherein, a spraying layer inside the plastic shell 5 can be shown in detail in figure 2, the heat stored inside the paraffin phase-change material can be evenly transferred to the product surface covered by the whole heat-conducting spraying layer of the plastic shell 5, and the heat conductivity of the plastic is lower, in addition, the inner side is also covered with a heat insulation spraying layer, so that the external surface of a product touched by a consumer can be ensured not to have obvious hair burning feeling, and the surface heat dissipation can be realized slowly.

The arrow in fig. 1 is a design diagram of the whole process of transferring the hot end energy of the semiconductor chilling plate 1 to the plastic shell 5, which realizes the effect of diluting heat energy from a single heat source to a plurality of parts in a shared manner, and realizes the function of the product and the experience of consumers.

FIG. 2 shows a specific spray coating configuration for a thermally insulated enclosure, the thermally insulated layer comprising a plastic thermal insulating spray paint layer 52 and a plastic thermally conductive spray paint layer 53; the plastic heat-conducting paint layer 53 is located on the inner side.

FIG. 3 shows die-cast aluminum fins with a tooth-shaped structure, and paraffin phase-change heat storage materials embedded in the tooth gaps.

FIG. 4 shows a die-cast aluminum heat sink with a groove structure, and a paraffin phase-change heat storage material is embedded in the groove.

The utility model discloses an use and implement the logic and form one set of complete heat-conduction, heat storage system through graphite alkene phase change material, inside aluminium system conducting strip, the embedded application of paraffin phase change material on aluminium system conducting strip, with the heat energy in semiconductor refrigeration piece back hot junction transfer fast the utility model discloses on other parts in the thermal management system built to guarantee that the good nature of cosmetic product cold compress function and the product heat management demand that the form of the same kind extended.

Wherein the utility model discloses the graphite alkene phase change material that adopts has good heat-conduction characteristic and to the filling connectivity in clearance between the different parts, and aluminium system conducting strip has structural strength, heat conduction radiating good nature, and the paraffin phase change material of embedding in the aluminum sheet clearance has the characteristic at the heat energy storage of certain temperature point phase transition heat absorption.

Example 1:

a beauty instrument with a heat management structure comprises a heat management structure arranged in the beauty instrument, and a heating surface of a semiconductor refrigeration sheet of the beauty instrument is connected with a heat transfer unit 2 of the heat management structure;

the heat management structure comprises a heat transfer unit 2, a heat dissipation structure 3, a phase change heat storage unit 4 and a heat insulation shell 5; the heat transfer unit is connected with the heat dissipation structure, and the phase change heat storage unit is arranged on the heat dissipation structure; the heat dissipation structure and the heat insulation shell 5 form a sealed cavity, and the phase change heat storage unit is positioned in the sealed cavity; the heat transfer unit is connected with a heat source.

A beauty instrument comprises a heat management structure arranged in the beauty instrument, and a heating surface of a semiconductor refrigeration sheet of the beauty instrument is connected with a heat transfer unit of the heat management structure.

Claims

1. The heat management structure is characterized by comprising a heat transfer unit (2), a heat dissipation structure (3), a phase change heat storage unit (4) and a heat insulation shell (5); the heat transfer unit is connected with the heat dissipation structure, and the phase change heat storage unit is arranged on the heat dissipation structure; the heat dissipation structure and the heat insulation shell (5) form a sealed cavity, and the phase change heat storage unit is positioned in the sealed cavity; the heat transfer unit is connected with a heat source;

the heat transfer unit (2) is made of graphene phase change materials, one end of each graphene phase change material is attached to the heat source, and the other end of each graphene phase change material is attached to the heat dissipation structure (3).

2. A heat management structure according to claim 1, characterized in that the heat transfer unit (2) is a rectangular plate-like structure.

3. A heat management structure according to claim 1, wherein the heat dissipation structure (3) is a die-cast aluminum heat sink, and the phase change heat storage unit (4) is embedded in and attached to the die-cast aluminum heat sink.

4. A thermal management structure according to claim 3, wherein the die-cast aluminum fins are of a tooth-like or groove-like configuration.

5. A heat management structure according to claim 1, characterized in that the phase change heat storage unit (4) is a paraffin phase change heat storage material.

6. A heat management structure according to claim 1, characterized in that the inside of the heat insulating shell (5) is provided with a heat insulating layer.

7. A heat management structure according to claim 6, characterized in that the thermal insulation layer comprises a layer of plastic thermal insulation lacquer (52) and a layer of plastic thermal conductive lacquer (53); the plastic heat-conducting paint spraying layer (53) is positioned on the inner side.