CN217389101U - Embedded copper-based circuit plastic board - Google Patents
Embedded copper-based circuit plastic board Download PDFInfo
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- CN217389101U CN217389101U CN202221198141.5U CN202221198141U CN217389101U CN 217389101 U CN217389101 U CN 217389101U CN 202221198141 U CN202221198141 U CN 202221198141U CN 217389101 U CN217389101 U CN 217389101U
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Abstract
The utility model relates to a circuit board technical field, concretely relates to embedded copper base circuit plastic board, including plastic injection moulding board, at least two all inlay the conductive metal plate who locates plastic injection moulding board, the interval sets up between two adjacent conductive metal plates, the surface extension of conductive metal plate has the convex ridge that exposes in plastic injection moulding board surface, plastic injection moulding board's surface attachment has the circuit layer, each conductive metal plate all with circuit layer electric connection, each conductive metal plate and plastic injection moulding board formula injection moulding structure as an organic whole. Each conductive metal plate and plastic injection molding plate formula injection moulding structure as an organic whole, and each conductive metal plate inlays and locates the plastic injection molding plate, has replaced the circuit board that traditional FR-4 epoxy board multilayer was thoughtlessly pressed and CNC processing formed, connects more firmly, and the quality is more stable, and the processing mode is more simple and efficient, also is favorable to reducing the processing cost.
Description
Technical Field
The utility model relates to a circuit board technical field, concretely relates to embedded copper base circuit plastic board.
Background
The existing high-voltage circuit board is mainly used in the field of new energy equipment, and mostly takes a plurality of copper blocks with the thickness of more than 3mm as a basis, and adopts FR-4 epoxy resin board multi-layer mixed pressing and CNC processing to fix the copper blocks in the FR-4 epoxy resin board, however, the processing technology of the scheme is complex, the processing efficiency is directly influenced, and the processing cost is high; and after FR-4 epoxy resin boards are subjected to multi-layer mixed compression, the connection stability between the copper block and the epoxy resin board and between the epoxy resin board and the epoxy resin board is poor, and the quality is unstable.
Disclosure of Invention
In order to overcome the defects and shortcomings in the prior art, the utility model aims to provide an embedded copper-based circuit plastic board.
The purpose of the utility model is realized through the following technical scheme: the utility model provides an embedded copper base circuit plastic board, includes plastic injection molding board, at least two electrically conductive metal plate blocks that all inlay and locate plastic injection molding board, the interval sets up between two adjacent electrically conductive metal plate blocks, the surface extension of electrically conductive metal plate block has the convex ridge that exposes in plastic injection molding board surface, the surface attachment of plastic injection molding board has the circuit layer, each electrically conductive metal plate block all with circuit layer electric connection, each electrically conductive metal plate block and plastic injection molding board formula injection moulding structure as an organic whole.
Preferably, at least two first through holes are formed in the edge of the plastic injection molding plate.
Preferably, the conductive metal plates on the two sides of the plastic injection molding plate extend to form connecting parts protruding out of the plastic injection molding plate.
Preferably, the connecting part is provided with at least two second through holes.
Preferably, the plastic injection molding plate is a polyetheretherketone plate, a polyphenylene sulfide plate or a polyetherimide plate.
Preferably, the conductive metal plate is a copper block.
Preferably, the embedded copper-based circuit plastic board further comprises a protective layer attached to the plastic injection molding board, the circuit layer is clamped between the plastic injection molding board and the protective layer, and the raised ridge is exposed on the surface of the protective layer.
Preferably, the protective layer is a solder resist layer, a PET film layer or a PI film layer.
Preferably, the circuit layer is a conductive metal plating layer.
The beneficial effects of the utility model reside in that: the utility model discloses an embedded copper base circuit plastic board, each conductive metal plate and plastic injection moulding board formula injection moulding structure as an organic whole, and each conductive metal plate inlays and locates the plastic injection moulding board, has replaced traditional FR-4 epoxy board multilayer to thoughtlessly press and the circuit board that CNC processing formed, connects more firmly, and the quality is more stable, and the processing mode is more simple and convenient swift, also is favorable to reducing the processing cost.
Drawings
Fig. 1 is a schematic structural diagram of the present invention;
fig. 2 is a schematic structural view of the conductive metal plate of the present invention;
fig. 3 is a schematic cross-sectional view of the present invention;
the reference signs are: 1. plastic injection molding the plate; 2. a conductive metal plate; 3. a raised ridge; 4. a circuit layer; 5. a first through hole; 6. a connecting portion; 7. a second through hole; 8. and a protective layer.
Detailed Description
In order to facilitate understanding of those skilled in the art, the present invention will be further described with reference to the following examples and accompanying drawings, which are not intended to limit the present invention.
As shown in fig. 1-3, an embedded copper-based circuit plastic board comprises a plastic injection molding plate 1, at least two conductive metal plates 2 embedded in the plastic injection molding plate 1, wherein the two adjacent conductive metal plates 2 are arranged at intervals, the surface of each conductive metal plate 2 extends to form a protruding ridge 3 exposed on the surface of the plastic injection molding plate 1, a circuit layer 4 is attached to the surface of the plastic injection molding plate 1, each conductive metal plate 2 is electrically connected with the circuit layer 4, and each conductive metal plate 2 and the plastic injection molding plate 1 are of an integrated injection molding structure.
This embedded copper base circuit plastic board, each conductive metal plate 2 and plastic injection moulding board 1 formula injection moulding structure as an organic whole, and each conductive metal plate 2 inlays locates plastic injection moulding board 1, has replaced the circuit board that traditional FR-4 epoxy board multilayer was thoughtlessly pressed and CNC processing formed, connects more firmly, and the quality is more stable, and the processing mode is more simple and convenient swift, also is favorable to reducing the processing cost. In this embodiment, the number of the conductive metal plates 2 is four, the four conductive metal plates 2 are distributed side by side, and two adjacent conductive metal plates 2 are arranged at intervals; the convex ridge 3 extends to two side surfaces of the conductive metal plate 2 and is exposed out of two side surfaces of the plastic injection molding plate 1.
In this embodiment, at least two first through holes 5 are disposed on the edge of the plastic injection molding plate 1.
By adopting the technical scheme, the embedded copper-based circuit plastic board can conveniently pass through the first through hole 5 through a screw and be installed in new energy equipment for fixing.
In this embodiment, the conductive metal plates 2 on both sides of the plastic injection molding plate 1 extend with connecting portions 6 protruding out of the plastic injection molding plate 1.
By adopting the technical scheme, the follow-up element electric connection with the new energy equipment is facilitated.
In this embodiment, the connecting portion 6 has at least two second through holes 7.
By adopting the technical scheme, the connecting part 6 can be conveniently and fixedly connected with elements of the new energy equipment by penetrating the second through hole 7 through fixing parts such as screws and the like in the follow-up process, and the connection stability is improved.
In this embodiment, the plastic injection molding plate 1 is a polyetheretherketone plate, a polyphenylene sulfide plate, or a polyetherimide plate.
By adopting the technical scheme, the polyether-ether-ketone plate, the polyphenylene sulfide plate or the polyetherimide plate has the characteristic of resisting high-temperature reflow soldering at 300 ℃ and the characteristic of melting and injection molding, and is only used for application. Preferably, the plastic injection molding plate 1 is a polyetheretherketone plate.
In this embodiment, the conductive metal plate 2 is a copper block.
In this embodiment, the embedded copper-based circuit plastic board further includes a protective layer 8 attached to the plastic injection molding board 1, the circuit layer 4 is sandwiched between the plastic injection molding board 1 and the protective layer 8, and the protruding ridge 3 is exposed on the surface of the protective layer 8.
By adopting the technical scheme, the circuit layer 4 is protected, and the circuit layer 4 is prevented from being damaged.
In the present embodiment, the protective layer 8 is a solder resist layer, a PET film layer or a PI film layer; preferably, the protective layer 8 is a solder resist layer.
In this embodiment, the circuit layer 4 is a conductive metal plating layer.
By adopting the technical scheme, the basic electrical connection function of the embedded copper-based circuit plastic board is realized.
The above-mentioned embodiment is the utility model discloses the implementation of preferred, in addition, the utility model discloses can also realize by other modes, not deviating from the utility model discloses any obvious replacement is all within the protection scope under the prerequisite of design.
Claims (9)
1. An embedded copper base circuit plastic board which characterized in that: including plastic injection molding board, at least two electrically conductive metal plate blocks that all inlay and locate plastic injection molding board, the interval sets up between two adjacent electrically conductive metal plate blocks, the surface extension of electrically conductive metal plate block has the convex ridge that exposes in plastic injection molding board surface, the surface attachment of plastic injection molding board has the circuit layer, each electrically conductive metal plate block all with circuit layer electric connection, each electrically conductive metal plate block and plastic injection molding board formula injection moulding structure as an organic whole.
2. The plastic board of claim 1, wherein: at least two first through holes are formed in the edge of the plastic injection molding plate.
3. The plastic board of claim 1, wherein: the conductive metal plates on the two sides of the plastic injection molding plate extend to form connecting parts protruding out of the plastic injection molding plate.
4. The plastic board of claim 3, wherein: the connecting part is provided with at least two second through holes.
5. The plastic board of claim 1, wherein: the plastic injection molding plate is a polyether-ether-ketone plate, a polyphenylene sulfide plate or a polyetherimide plate.
6. The plastic board of claim 1, wherein: the conductive metal plate is a copper block.
7. The plastic board of claim 1, wherein: the embedded copper-based circuit plastic board further comprises a protective layer attached to the plastic injection molding board, the circuit layer is clamped between the plastic injection molding board and the protective layer, and the raised ridge is exposed on the surface of the protective layer.
8. The embedded copper-based circuit plastic board of claim 7, wherein: the protective layer is a solder resist layer, a PET film layer or a PI film layer.
9. The plastic board of claim 1, wherein: the circuit layer is a conductive metal coating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221198141.5U CN217389101U (en) | 2022-05-17 | 2022-05-17 | Embedded copper-based circuit plastic board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221198141.5U CN217389101U (en) | 2022-05-17 | 2022-05-17 | Embedded copper-based circuit plastic board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217389101U true CN217389101U (en) | 2022-09-06 |
Family
ID=83086960
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221198141.5U Active CN217389101U (en) | 2022-05-17 | 2022-05-17 | Embedded copper-based circuit plastic board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217389101U (en) |
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2022
- 2022-05-17 CN CN202221198141.5U patent/CN217389101U/en active Active
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