CN217388803U

CN217388803U - Image pickup apparatus

Info

Publication number: CN217388803U
Application number: CN202220634849.4U
Authority: CN
Inventors: 卢招庆
Original assignee: Shenzhen Mercury Communication Technology Co ltd
Current assignee: Shenzhen Mercury Communication Technology Co ltd
Priority date: 2022-03-22
Filing date: 2022-03-22
Publication date: 2022-09-06
Anticipated expiration: 2032-03-22

Abstract

The utility model relates to a camera equipment technical field provides a camera device, including plastic housing, the circuit board, first heat conduction spare and second heat conduction spare, plastic housing includes first wall body and second wall body, the second wall body is connected in the first side of first wall body, the circuit board sets up on a wall of first wall body, first heat conduction spare sets up between circuit board and first wall body, first heat conduction spare is used for the heat transfer that produces the circuit board to first wall body, the second heat conduction spare sets up on another wall of first wall body, the second heat conduction spare is used for the heat transfer with first wall body to second wall body. Above-mentioned camera device is through adopting plastic housing, can effectively reduce camera device's manufacturing cost to can directly be with heat transfer to first wall body and second wall body through adopting first heat-conducting piece and second heat-conducting piece to replace the air, can effectively improve heat transfer efficiency, thereby can effectively with outside the heat discharge plastic housing, improved camera device's heat dispersion.

Description

Image pickup apparatus

Technical Field

The utility model relates to a camera equipment technical field especially provides a camera device.

Background

In consideration of manufacturing cost, more and more manufacturers change the casing of the camera device from a metal material to a plastic material, and when the camera device works, the circuit board is used as a main heating source of the camera device, and heat generated by the camera device is transferred to the plastic casing through air.

SUMMERY OF THE UTILITY MODEL

An object of the embodiment of the utility model is to provide a camera device aims at solving current camera device and leads to the technical problem that heat dispersion descends by a wide margin owing to adopted plastic housing.

In order to achieve the above object, the embodiment of the present invention adopts the following technical solutions: an image pickup apparatus comprising: a plastic housing comprising a first wall and a second wall, the second wall connected to a first side of the first wall; the circuit board is arranged on one wall surface of the first wall body; the first heat conducting piece is arranged between the circuit board and the first wall body and used for transferring heat generated by the circuit board to the first wall body; and the second heat conducting piece is arranged on the other wall surface of the first wall body and is used for transferring the heat of the first wall body to the second wall body.

The embodiment of the utility model provides a camera device has following beneficial effect at least: above-mentioned camera device is through adopting the plastic casing, can effectively reduce camera device's manufacturing cost, when above-mentioned camera device is at the during operation, the produced heat of circuit board is in proper order via first heat-conducting piece, first wall body and the transmission of second heat-conducting piece are to the second wall body, then the heat is through the outside diffusion of second wall body, can directly transmit the heat to first wall body and second wall body through adopting first heat-conducting piece and the replacement air of second heat-conducting piece, can effectively improve heat transfer efficiency, thereby can effectively be outside the plastic casing with the heat discharge, camera device's heat dispersion has been improved. Therefore, compared with the traditional image pickup device, the image pickup device has the advantages of low manufacturing cost and good heat dissipation performance.

In one embodiment, the second heat conduction member includes a first heat conduction portion and a second heat conduction portion connected to each other, and the heat of the first wall body is transferred to the second wall body via the first heat conduction portion and the second heat conduction portion in sequence.

In one embodiment, a first heat conducting glue layer is arranged between the first heat conducting part and the first wall body; and/or a second heat-conducting glue layer is arranged between the second heat-conducting part and the second wall body.

In one embodiment, the imaging device further includes a third heat conduction member, the plastic housing further includes a third wall connected to the second side of the first wall and disposed opposite to the second wall, and the third heat conduction member is configured to transfer heat of the first wall to the third wall.

In one embodiment, the third heat-conducting member includes a third heat-conducting portion and a fourth heat-conducting portion connected to each other, and the heat of the first wall is transferred to the third wall through the third heat-conducting portion and the fourth heat-conducting portion in sequence.

In one embodiment, a third thermal conductive adhesive layer is arranged between the third thermal conductive part and the first wall body; and/or a fourth heat-conducting glue layer is arranged between the fourth heat-conducting part and the third wall body.

In one embodiment, a fifth thermal conductive adhesive layer is arranged between the first thermal conductive member and the circuit board; and/or a sixth heat-conducting glue layer is arranged between the first heat-conducting piece and the first wall body.

In one embodiment, the image pickup apparatus further includes a fourth heat-conducting member disposed on a side of the circuit board facing away from the first heat-conducting member, and the fourth heat-conducting member is configured to absorb heat generated by the circuit board.

In one embodiment, a seventh thermal adhesive layer is disposed between the fourth thermal conductive member and the circuit board.

In one embodiment, the fourth heat-conducting member is a fin-shaped heat-conducting member.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

Fig. 1 is a schematic structural diagram of an image pickup apparatus provided by an embodiment of the present invention.

Wherein, in the figures, the respective reference numerals:

100. a camera device; 110. a plastic housing; 111. a first wall body; 112. a second wall body; 113. a third wall body; 120. a circuit board; 121. processing the chip; 130. a first heat-conducting member; 131. a fifth heat-conducting adhesive layer; 132. a sixth thermal adhesive layer; 140. a second heat-conducting member; 141. a first heat-conducting portion; 142. a second heat conduction portion; 143. a first heat-conducting adhesive layer; 144. a second heat-conducting adhesive layer; 150. a third heat-conducting member; 151. a third heat conduction portion; 152. a fourth heat conduction portion; 153. a third heat-conducting adhesive layer; 154. a fourth heat-conducting adhesive layer; 160. a fourth heat-conducting member; 161. and the seventh heat-conducting adhesive layer.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below by referring to the drawings are exemplary intended for explaining the present invention, and should not be construed as limiting the present invention.

In the description of the present invention, it is to be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientation or positional relationship indicated in the drawings for convenience in describing the present invention and for simplicity in description, and are not intended to indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present invention.

Furthermore, the terms "first", "second", "third", "fourth", "fifth", "sixth", "seventh" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", "third", "fourth", "fifth", "sixth", "seventh" may explicitly or implicitly include one or more of the features. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

Referring to fig. 1, the camera device 100 of the present invention includes a plastic housing 110, a circuit board 120, a first heat-conducting member 130, and a second heat-conducting member 140. The plastic housing 110 comprises a first wall 111 and a second wall 112, the second wall 112 being connected to a first side of the first wall 111. The circuit board 120 is disposed on a wall of the first wall 111. The first heat conducting member 130 is disposed between the circuit board 120 and the first wall 111, and the first heat conducting member 130 is used for transferring heat generated by the circuit board 120 to the first wall 111. The second heat conducting member 140 is disposed on the other wall surface of the first wall 111, and the second heat conducting member 140 is used for transferring heat of the first wall 111 to the second wall 112.

It can be understood that the circuit board 120 is provided with the processing chip 121, the processing chip 121 serves as a main heat source of the circuit board 120, the first heat conducting member 130 directly or indirectly contacts the processing chip 121 to absorb heat generated by the operation of the processing chip 121, and meanwhile, the first heat conducting member 130 directly or indirectly contacts the first wall 111 to transfer the heat generated by the operation of the processing chip 121 to the first wall 111. Similarly, the second heat conducting member 140 directly or indirectly contacts the first wall 111 to absorb heat on the first wall 111, and meanwhile, the second heat conducting member 140 directly or indirectly contacts the second wall 112 to transfer heat on the first wall 111 to the second wall 112.

It should be noted that the first heat conduction member 130 and the second heat conduction member 140 are both metal members, and may be specifically made of aluminum, copper, and the like, and are not limited in particular.

The camera device 100 can effectively reduce the manufacturing cost of the camera device 100 by using the plastic casing 110, when the camera device 100 works, the heat generated by the circuit board 120 is sequentially transmitted to the second wall body 112 through the first heat-conducting member 130, the first wall body 111 and the second heat-conducting member 140, and then the heat is diffused outwards through the second wall body 112, and the heat can be directly transmitted to the first wall body 111 and the second wall body 112 by using the first heat-conducting member 130 and the second heat-conducting member 140 to replace air, so that the heat transmission efficiency can be effectively improved, the heat can be effectively discharged out of the plastic casing 110, and the heat radiation performance of the camera device 100 is improved. As a result, the image pickup apparatus 100 is not only low in manufacturing cost but also has good heat dissipation performance as compared with the conventional image pickup apparatus 100.

In one embodiment, as shown in fig. 1, the second heat conducting member 140 includes a first heat conducting portion 141 and a second heat conducting portion 142 connected to each other, and the heat of the first wall 111 is transferred to the second wall 112 through the first heat conducting portion 141 and the second heat conducting portion 142 in sequence. It can be understood that the first heat conduction portion 141 is a plate-shaped structure, and the first heat conduction portion 141 is disposed opposite to the first wall 111 and directly or indirectly contacts the first wall 111 to absorb heat on the first wall 111. The second heat conducting portion 142 is also a plate-shaped structure, and the second heat conducting portion 142 is disposed opposite to the second wall 112 and directly or indirectly contacts the second wall 112 to transfer heat on the first heat conducting portion 141 to the second wall 112.

In the above embodiment, in order to further improve the heat transfer efficiency between the first heat conducting portion 141 and the first wall 111, as shown in fig. 1, a first heat conducting adhesive layer 143 is disposed between the first heat conducting portion 141 and the first wall 111, in other words, the first heat conducting portion 141 is indirectly contacted with the first wall 111 through the first heat conducting adhesive layer 143. It should be noted that the first thermal conductive adhesive layer 143 can be made of different thermal conductive materials with higher thermal conductivity according to actual needs, and the thermal conductive materials include, but are not limited to, thermal conductive silicone, epoxy resin thermal conductive adhesive, and polyurethane thermal conductive adhesive.

In the above embodiment, in order to further improve the heat transfer efficiency between the second heat conducting portion 142 and the second wall 112, as shown in fig. 1, a second heat conducting adhesive layer 144 is disposed between the second heat conducting portion 142 and the second wall 112, in other words, the second heat conducting portion 142 is indirectly contacted with the second wall 112 through the second heat conducting adhesive layer 144. It should be noted that the second thermal conductive adhesive layer 144 can be made of different thermal conductive materials with higher thermal conductivity according to actual needs, and the thermal conductive materials include, but are not limited to, thermal conductive silicone, epoxy resin thermal conductive adhesive, and polyurethane thermal conductive adhesive.

In one embodiment, as shown in fig. 1, the image capturing apparatus 100 further includes a third heat conducting member 150, the plastic housing 110 further includes a third wall 113, the third wall 113 is connected to the second side of the first wall 111 and is disposed opposite to the second wall 112, in other words, the first side and the second side are opposite sides of the first wall 111, and the third heat conducting member 150 is configured to transfer heat of the first wall 111 to the third wall 113. It is understood that the third thermal conduction member 150 is directly or indirectly in contact with the first wall 111 to absorb heat on the first wall 111, and meanwhile, the third thermal conduction member 150 is directly or indirectly in contact with the second wall 112 to transfer heat on the first wall 111 to the third wall 113.

By adopting the above technical solution, the heat of the first wall 111 is transferred to the second wall 112 and the third wall 113 through the second heat conduction member 140 and the third heat conduction member 150, respectively, so that the heat can be discharged outwards from the two opposite sides of the plastic housing 110 at the same time, and the heat dissipation performance of the image pickup apparatus 100 can be further improved.

In the above embodiment, referring to fig. 1, the third heat conduction member 150 includes a third heat conduction portion 151 and a fourth heat conduction portion 152 connected to each other, and the heat of the first wall 111 is transferred to the third wall 113 through the third heat conduction portion 151 and the fourth heat conduction portion 152 in sequence. It is understood that the third heat conduction portion 151 is in a plate structure, and the third heat conduction portion 151 is disposed opposite to the first wall 111 and directly or indirectly contacts the first wall 111 to absorb heat on the first wall 111. The fourth heat conduction portion 152 is also a plate-like structure, and the fourth heat conduction portion 152 is disposed opposite to the third wall body 113 and is in direct or indirect contact with the third wall body 113 to transfer heat on the third heat conduction portion 151 to the third wall body 113.

Alternatively, the first heat conduction part 141 and the third heat conduction part 151 may be separately provided from each other or integrally connected to each other, in other words, when the first heat conduction part 141 and the third heat conduction part 151 are integrally connected to each other, the second heat conduction member 140 and the third heat conduction member 150 are integrally formed.

The above-mentioned integral molding method includes, but is not limited to, a casting process and a die-casting process.

In the above embodiment, in order to further improve the heat transfer efficiency between the third heat conducting portion 151 and the first wall 111, please refer to fig. 1, a third heat conducting adhesive layer 153 is disposed between the third heat conducting portion 151 and the first wall 111, in other words, the third heat conducting portion 151 is indirectly contacted with the first wall 111 through the third heat conducting adhesive layer 153. It should be noted that the third thermal conductive adhesive layer 153 may be made of different thermal conductive materials with higher thermal conductivity according to actual needs, and the thermal conductive materials include, but are not limited to, thermal conductive silicone, epoxy resin thermal conductive adhesive, and polyurethane thermal conductive adhesive.

In the above embodiments, in order to further improve the heat transfer efficiency between the fourth heat conducting portion 152 and the third wall 113, please refer to fig. 1, a fourth heat conducting adhesive layer 154 is disposed between the fourth heat conducting portion 152 and the third wall 113, in other words, the fourth heat conducting portion 152 is indirectly contacted with the third wall 113 through the fourth heat conducting adhesive layer 154. It should be noted that the fourth thermal conductive adhesive layer 154 can be made of different thermal conductive materials with higher thermal conductivity according to actual needs, and the thermal conductive materials include, but are not limited to, thermal conductive silicone, epoxy resin thermal conductive adhesive, and polyurethane thermal conductive adhesive.

In one embodiment, in order to further improve the heat transfer efficiency between the first heat conducting member 130 and the processing chip 121, as shown in fig. 1, a fifth thermal conductive adhesive layer 131 is disposed between the first heat conducting member 130 and the processing chip 121, in other words, the first heat conducting member 130 is indirectly contacted with the processing chip 121 through the fifth thermal conductive adhesive layer 131. It should be noted that the fifth thermal conductive adhesive layer 131 can be made of different thermal conductive materials with higher thermal conductivity according to actual needs, and the thermal conductive materials include, but are not limited to, thermal conductive silicone, epoxy resin thermal conductive adhesive, and polyurethane thermal conductive adhesive.

In one embodiment, in order to further improve the heat transfer efficiency between the first heat conducting member 130 and the first wall 111, as shown in fig. 1, a sixth thermal conductive adhesive layer 132 is disposed between the first heat conducting member 130 and the first wall 111, in other words, the first heat conducting member 130 is indirectly contacted with the first wall 111 through the sixth thermal conductive adhesive layer 132. It should be noted that the sixth thermal conductive adhesive layer 132 may be made of different thermal conductive materials with higher thermal conductivity according to actual needs, and the thermal conductive materials include, but are not limited to, thermal conductive silicone, epoxy resin thermal conductive adhesive, and polyurethane thermal conductive adhesive.

In an embodiment, referring to fig. 1, the image capturing apparatus 100 further includes a fourth heat conducting member 160, the fourth heat conducting member 160 is disposed on a side of the circuit board 120 away from the first heat conducting member 130, and the fourth heat conducting member 160 is configured to absorb heat generated by the circuit board 120.

It is understood that the fourth thermal conduction member 160 may be in direct or indirect contact with the circuit board 120 to absorb heat generated by the operation of the circuit board 120.

By adopting the above technical solution, the image capturing apparatus 100 has at least two heat transfer paths, wherein one heat transfer path is that a part of heat generated by the operation of the processing chip 121 is transferred to the first wall 111 through the first heat conducting member 130, and then transferred to the second wall 112 and the third wall 113 through the second heat conducting member 140 and the third heat conducting member 150, respectively, so that a part of heat generated by the operation of the processing chip 121 is discharged outwards from the opposite sides of the plastic housing 110, and the other heat transfer path is that another part of heat generated by the operation of the processing chip 121 is directly diffused to the outer space of the plastic housing 110 through the fourth heat conducting member 160, which can further improve the heat dissipation performance of the image capturing apparatus 100.

Specifically, the fourth heat conducting member 160 is disposed on the circuit board 120 at a position opposite to the processing chip 121, so as to shorten a heat transfer path between the processing chip 121 and the fourth heat conducting member 160, thereby further improving the heat transfer efficiency, and further effectively improving the heat dissipation efficiency of the image capturing apparatus 100.

In the above embodiments, in order to further improve the heat transfer efficiency between the fourth heat conducting member 160 and the circuit board 120, please refer to fig. 1, a seventh heat conducting adhesive layer 161 is disposed between the fourth heat conducting member 160 and the circuit board 120, in other words, the fourth heat conducting member 160 indirectly contacts the circuit board 120 through the seventh heat conducting adhesive layer 161. It should be noted that the seventh thermal conductive adhesive layer 161 can be made of different thermal conductive materials with higher thermal conductivity according to actual needs, and the thermal conductive materials include, but are not limited to, thermal conductive silicone, epoxy resin thermal conductive adhesive, and polyurethane thermal conductive adhesive.

In the above embodiment, the fourth heat conducting member 160 is a fin-shaped heat conducting member, and since the heat dissipation area of the fin-shaped heat conducting member is large, the heat transfer efficiency between the fourth heat conducting member 160 and the circuit board 120 can be further improved, so that the heat dissipation performance of the image pickup apparatus 100 can be more effectively improved.

The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.

Claims

1. An image pickup apparatus, characterized by comprising:

a plastic housing comprising a first wall and a second wall, the second wall connected to a first side of the first wall;

the circuit board is arranged on one wall surface of the first wall body;

the first heat conducting piece is arranged between the circuit board and the first wall body and used for transferring heat generated by the circuit board to the first wall body;

the second heat conducting piece is arranged on the other wall surface of the first wall body and used for transferring the heat of the first wall body to the second wall body.

2. The image pickup apparatus according to claim 1, wherein: the second heat conducting member comprises a first heat conducting portion and a second heat conducting portion which are connected with each other, and heat of the first wall body is transmitted to the second wall body sequentially through the first heat conducting portion and the second heat conducting portion.

3. The image pickup apparatus according to claim 2, wherein:

a first heat-conducting adhesive layer is arranged between the first heat-conducting part and the first wall body; and/or the presence of a gas in the gas,

and a second heat-conducting adhesive layer is arranged between the second heat-conducting part and the second wall body.

4. The image pickup apparatus according to claim 1, wherein: the camera device further comprises a third heat-conducting piece, the plastic shell further comprises a third wall body, the third wall body is connected to the second side edge of the first wall body and is opposite to the second wall body, and the third heat-conducting piece is used for transferring heat of the first wall body to the third wall body.

5. The image pickup apparatus according to claim 4, wherein: the third heat-conducting member includes a third heat-conducting portion and a fourth heat-conducting portion that are connected to each other, and the heat of the first wall body is transmitted to the third wall body via the third heat-conducting portion and the fourth heat-conducting portion in sequence.

6. The image pickup apparatus according to claim 5, wherein:

a third heat-conducting adhesive layer is arranged between the third heat-conducting part and the first wall body; and/or the presence of a gas in the gas,

and a fourth heat-conducting adhesive layer is arranged between the fourth heat-conducting part and the third wall body.

7. The image pickup apparatus according to any one of claims 1 to 6, wherein:

a fifth heat-conducting adhesive layer is arranged between the first heat-conducting piece and the circuit board; and/or the presence of a gas in the gas,

and a sixth heat-conducting adhesive layer is arranged between the first heat-conducting piece and the first wall body.

8. The image pickup apparatus according to any one of claims 1 to 6, wherein: the camera device further comprises a fourth heat-conducting piece, the fourth heat-conducting piece is arranged on one side, away from the first heat-conducting piece, of the circuit board, and the fourth heat-conducting piece is used for absorbing heat generated by the circuit board.

9. The image pickup apparatus according to claim 8, wherein: and a seventh heat-conducting adhesive layer is arranged between the fourth heat-conducting piece and the circuit board.

10. The image pickup apparatus according to claim 8, wherein: the fourth heat conducting piece is a fin-shaped heat conducting piece.