CN217368445U

CN217368445U - Micro-fluidic chip's encapsulation platform

Info

Publication number: CN217368445U
Application number: CN202220424466.4U
Authority: CN
Inventors: 黄继德
Original assignee: Shenzhen Gangzhu Medical Technology Co ltd
Current assignee: Shenzhen Chenghui Medical Technology Co ltd
Priority date: 2022-03-01
Filing date: 2022-03-01
Publication date: 2022-09-06
Anticipated expiration: 2032-03-01

Abstract

The utility model discloses a micro-fluidic chip's packaging platform, including a decomposable seal chamber to and one can be by the pressure disk of accomplishing down-pressing action in the cavity under the drive of external force, and one with seal chamber intercommunication, be used for making vacuum environment's governing valve in seal chamber with the vacuum apparatus cooperation. Based on the utility model discloses a pressure sensitive adhesive for micro-fluidic chip substrate and cover plate can carry out the packaging mode that the evacuation was exerted pressure after the sealing-in, solve in micro-fluidic chip's encapsulation pressure sensitive adhesive bond jail, bond the back bonding face have the problem of a large amount of bubbles.

Description

Micro-fluidic chip's packaging platform

Technical Field

The utility model relates to a micro-fluidic system field especially relates to a micro-fluidic chip's encapsulation platform.

Background

Microfluidics (Microfluidics) refers to the manipulation of liquids on a sub-millimeter scale. It integrates the basic operation units related to the biological and chemical fields, even the functions of the whole laboratory, including sampling, diluting, reacting, separating, detecting, etc. on a small Chip, so it is also called Lab-on-a-Chip. The chip generally comprises various liquid storage tanks and a micro-channel network which is connected with each other, can greatly shorten the sample processing time, and realizes the maximum utilization efficiency of reagent consumables by precisely controlling the liquid flow. The micro-fluidic provides a very wide prospect for the application in numerous fields such as biomedical research, drug synthesis screening, environmental monitoring and protection, health quarantine, judicial identification, biological reagent detection and the like. Particularly, microfluidics is widely used in point of care (POCT) because it can well meet the demand for miniaturized instruments for POCT. In the industry, microfluidics is generally classified into the following types: pressure (pneumatic or hydraulic) driven microfluidics, centrifugal microfluidics, droplet microfluidics, digital microfluidics, paper microfluidics, and the like.

A large field of application scenario for the whole microfluidic technology is microfluidic molecular diagnostics. The core purpose is to integrate the whole sample of molecular diagnosis, enrichment, cracking, nucleic acid extraction and purification, and PCR amplification on a microfluidic chip. At present, the encapsulation of the microfluidic chip generally adopts methods such as glue bonding, hot-press bonding, surface modification bonding, ultrasonic welding, laser welding and the like, however, the encapsulation processes have defects, and the glue bonding and the hot-press bonding processes can damage or block a micro channel; long-term reliability of surface modification bonding is not feasible; the requirement of ultrasonic welding on equipment is high, and the chip substrate is easily damaged; laser welding can only be used for welding materials with different laser absorption coefficients, otherwise, laser absorption materials are added at the welding position, and laser welding equipment is expensive; therefore, these packaging methods have drawbacks and limited applicability.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a micro-fluidic chip's encapsulation platform to the packaging technology who solves micro-fluidic chip among the prior art has not enough problem.

In order to realize the purpose, the following technical scheme is adopted:

the packaging platform of the microfluidic chip comprises a decomposable sealing cavity, a pressure plate which can be driven by external force to complete pressing action in the cavity, and an adjusting valve which is communicated with the sealing cavity and used for being matched with a vacuum device to manufacture a vacuum environment in the sealing cavity.

Furthermore, the sealed cavity is surrounded by a sealed cover and a base and constitutes.

Furthermore, a limit groove matched with the edge of the sealing cover is arranged on the base.

Furthermore, a first silica gel sealing ring is arranged in the limiting groove.

Furthermore, a sealing guide seat communicated to the inside of the sealing cover is arranged on the sealing cover, and a guide pressure rod capable of driving the pressure plate to complete pressing-down action in the cavity under the driving of external force penetrates through the sealing guide seat.

Furthermore, sealed guide holder includes one and is used for filling the direction depression bar the end cover of the junction of sealed guide holder, one set up in sealed guide holder inner wall with sealing ring between the direction depression bar, and set up respectively in the sealing ring with between the sealed guide holder the sealing ring with second silica gel sealing washer between the direction depression bar, sealed guide holder with be provided with the silica gel gasket between the sealed cowling.

Furthermore, one end of the guide pressure lever is connected with the pressure plate, and the other end of the guide pressure lever is connected with a pressure device.

Furthermore, the pressure device is fixed below a supporting plate, and the supporting plate is fixed above the base through a supporting rod.

Furthermore, a carrier plate for carrying one or more microfluidic chips is arranged in the sealing cover and on the base.

Furthermore, the vacuum meter is used for measuring the air pressure in the sealed cavity.

The technical scheme of the utility model following beneficial effect has:

based on the utility model discloses a pressure sensitive adhesive can carry out the encapsulation mode that the evacuation was exerted pressure after the sealing-in for micro-fluidic chip substrate and cover plate, the problem of pressure sensitive adhesive bonding insecure in micro-fluidic chip's encapsulation, bonding face has a large amount of bubbles after bonding, also can avoid micro-fluidic chip to have the problem that the microchannel warp and block up in the packaging process, the high fidelity of micro-fluidic chip microchannel and the high packaging strength of the chip after the encapsulation have been guaranteed, this packaging platform's operation process is simple effective, specially adapted micro-fluidic chip's mass production.

Drawings

Fig. 1 is a schematic overall structure diagram of a package platform in an embodiment of the present disclosure;

FIG. 2 is a cross-sectional view of a package platform in an embodiment of the present disclosure;

FIG. 3 is a cross-sectional view of a seal guide in an embodiment of the present disclosure;

fig. 4 is an exploded view of a microfluidic chip in an embodiment of the present disclosure.

Reference numerals:

1. a support plate; 2. a pressure device; 3. a support bar; 4. adjusting a valve; 5. A sealing cover; 6. a base; 7. a vacuum gauge; 8. a guide pressure lever; 9. sealing the guide seat; 10. a first silica gel sealing ring; 11. a carrier plate; 12. a microfluidic chip; 13. a platen; 14. an end cap; 15. a seal ring; 16. a second silica gel sealing ring; 17. a silica gel gasket; 18. a cover sheet; 19. double-sided adhesive tape; 20. a microfluidic substrate.

Detailed Description

The technical solution of the present invention will be described clearly and completely with reference to the accompanying drawings, and obviously, the described embodiments are some, but not all embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts all belong to the protection scope of the present invention.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the term "connected" is to be interpreted broadly, e.g., as a fixed connection, a detachable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

As shown in fig. 1 to fig. 3, an embodiment of the present disclosure provides a micro-fluidic chip packaging platform, which includes a decomposable sealed cavity, a pressure plate 13 driven by an external force to perform a pressing action in the cavity, and a regulating valve 4 communicated with the sealed cavity and used for cooperating with a vacuum device to create a vacuum environment in the sealed cavity.

In one embodiment, the sealed chamber is enclosed by a sealing cover 5 and a base 6.

Wherein, the connection mode of sealed cowling 5 and base 6 can be contact connection, and sealed cowling 5 directly places on base 6 promptly, owing to need carry out the evacuation to the space between sealed cowling 5 and the base 6 in the work, can make the connection between sealed cowling 5 and the base 6 tighter and tighter more at the in-process of evacuation.

Additionally, a limit groove matched with the edge of the sealing cover 5 is arranged on the base 6. In order to further improve the connection sealing performance of the base 6 and the sealing cover 5, a limiting groove is arranged to prevent the sealing cover 5 from loosening in the vacuumizing process.

As a supplement, a first silica gel sealing ring 10 is arranged in the limiting groove. The sealing property is further improved.

In one embodiment, the sealing cover 5 is provided with a sealing guide seat 9 communicated to the interior thereof, and a guide pressure rod 8 which can drive the pressure plate 13 to perform a pressing action in the cavity under the driving of an external force penetrates through the sealing guide seat 9.

The sealing guide seat 9 and the guide pressure rod 8 are arranged, so that the pressure plate 13 in the sealing cavity can move according to a set path, and the consistency of the packaging effect of the microfluidic chip every time is further ensured.

In one embodiment, the sealing guide seat 9 includes an end cap 14 for filling the joint of the sealing guide seat 9 with the guiding pressure rod 8, a sealing ring 15 disposed between the inner wall of the sealing guide seat 9 and the guiding pressure rod 8, and second silicone sealing rings 16 disposed between the sealing ring 15 and the sealing guide seat 9 and between the sealing ring 15 and the guiding pressure rod 8, respectively, and a silicone gasket 17 is disposed between the sealing guide seat 9 and the sealing cover 5.

The sealing ring 15 and the second silica gel sealing ring 16 are used for improving the sealing performance between the sealing guide seat 9 and the guide pressure rod 8, and the silica gel gasket 17 is used for improving the sealing performance between the sealing guide seat 9 and the sealing cover 5.

In addition, one end of the guide strut 8 is connected to the pressure plate 13, and the other end is connected to a pressure device 2.

Wherein the pressure device 2 is used to drive the pressure plate 13, as an example, the pressure device 2 may be one of a push rod, a jack, a press or others, and the pressure may be adjusted.

Additionally, the pressure device 2 is fixed below a supporting plate 1, and the supporting plate 1 is fixed above a base 6 through a supporting rod 3.

It should be understood that all the components of the package platform in the present embodiment are integrated, so that the package platform is mobile and easy to manage.

In one embodiment, a carrier plate 11 for carrying one or more microfluidic chips 12 is disposed in the sealing cap 5 and on the base 6.

As a supplement, the microfluidic chip 12 may be fan-shaped, circular, square, or other regular or irregular, the packaging platform in the embodiment may process at least one chip at a time, and may also process a plurality of chips, the purpose of the carrier plate 11 is to place the irregular microfluidic chip 12, so that the bonding plane is parallel to the pressure applying plane, so that the bonding plane is uniformly stressed and does not crush the chip, the carrier plate 11 is separable from the fixing base, so that different numbers of microfluidic chips 12 with different shapes can be replaced, and the carrier plate 11 is matched with the microfluidic chip 12, so as to better package the chip.

In one embodiment, a vacuum gauge 7 is included for measuring the pressure within the sealed chamber. So that the pressure in the sealed cavity can be observed in real time.

Description of the principle: referring to fig. 4, fig. 4 is an exploded view of the microfluidic chip 12, which includes a cover plate 18, a double-sided adhesive tape 19, and a microfluidic substrate 20, and the objective of the present invention is to attach the cover plate 18 to the microfluidic substrate 20 through the double-sided adhesive tape 19, and reduce bubbles at the connection points, so that the attachment is firmer.

When packaging, firstly, preliminarily attaching a cover plate 18 to a microfluidic substrate 20 through a double-sided adhesive 19 to form a preliminary microfluidic chip 12, then placing one or more regular or irregular microfluidic chips 12 on a carrier plate 11, then covering a sealing cover 5 on a limiting groove, connecting an adjusting valve 4 with a vacuum device, vacuumizing a sealing cavity formed by the sealing cover 5 and a base 6 in an enclosing manner, wherein the air in the sealing cavity is reduced, the connection between the sealing cover 5 and the base 6 is tighter, the air between the cover plate 18 and the microfluidic substrate 20 is also pumped away, meanwhile, a pressure device 2 applies pressure to a guide pressure rod 8, so that the guide pressure rod 8 drives a pressure plate 13 to press the microfluidic chip 12 on the carrier plate 11, and further presses the air between the cover plate 18 and the microfluidic substrate 20, so that the connection between the cover plate 18 and the microfluidic substrate 20 becomes tight, when the sealing cover 5 needs to be opened, the air environment in the sealing cavity is restored, then the pressure device 2 contracts to drive the sealing cover 5 to ascend, and the micro-fluidic chip 12 can be taken out.

The technical scheme of the utility model following beneficial effect has:

based on the utility model discloses, the encapsulation mode that the evacuation was exerted pressure can be carried out to pressure-sensitive adhesive (double faced adhesive tape) for micro-fluidic chip 12 substrate and cover plate 18 after the sealing-in, the problem of pressure-sensitive adhesive bonding insecure in micro-fluidic chip 12's encapsulation, bonding face has a large amount of bubbles after the bonding, also can avoid micro-fluidic chip 12 to have the problem that the miniflow channel warp and block up in the packaging process, the high fidelity of micro-fluidic chip 12 miniflow channel and the high packaging strength of encapsulation back chip have been guaranteed, the operation process of this encapsulation platform is simple effective, the mass production of specially adapted micro-fluidic chip 12.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention. Furthermore, those skilled in the art will appreciate that while some embodiments described herein include some features included in other embodiments, rather than other features, combinations of features of different embodiments are meant to be within the scope of the invention and form different embodiments. For example, in the claims above, any of the claimed embodiments may be used in any combination. The information disclosed in this background section is only for enhancement of understanding of the general background of the invention and should not be taken as an acknowledgement or any form of suggestion that this information constitutes prior art already known to a person skilled in the art.

Claims

1. The packaging platform of the microfluidic chip is characterized by comprising a decomposable sealing cavity, a pressure plate which can be driven by external force to complete pressing action in the cavity, and an adjusting valve which is communicated with the sealing cavity and used for being matched with a vacuum device to manufacture a vacuum environment in the sealing cavity.

2. The microfluidic chip packaging platform according to claim 1, wherein the sealed cavity is defined by a sealing cover and a base.

3. The microfluidic chip packaging platform according to claim 2, wherein the base is provided with a limiting groove matched with the edge of the sealing cover.

4. The microfluidic chip packaging platform according to claim 3, wherein a first silicone sealing ring is disposed in the limiting groove.

5. The microfluidic chip packaging platform according to claim 2, wherein the sealing cover is provided with a sealing guide seat communicated with the sealing cover, and a guide pressure rod capable of driving the pressure plate to perform a pressing action in the cavity under the driving of an external force penetrates through the sealing guide seat.

6. The packaging platform of a microfluidic chip according to claim 5, wherein the sealing guide seat comprises an end cap for filling the joint of the sealing guide seat with the guiding pressure rod, a sealing ring disposed between the inner wall of the sealing guide seat and the guiding pressure rod, and second silica gel sealing rings respectively disposed between the sealing ring and the sealing guide seat and between the sealing ring and the guiding pressure rod, and silica gel gaskets are disposed between the sealing guide seat and the sealing cover.

7. The microfluidic chip packaging platform according to claim 5, wherein one end of the guiding pressure bar is connected to the pressure plate, and the other end of the guiding pressure bar is connected to a pressure device.

8. The microfluidic chip packaging platform according to claim 7, wherein the pressure device is fixed below a supporting plate, and the supporting plate is fixed above the base through a supporting rod.

9. The packaging platform for microfluidic chips according to claim 2, wherein a carrier plate for carrying one or more microfluidic chips is disposed in the sealing cap and on the base.

10. The packaging platform of a microfluidic chip according to claim 1, further comprising a vacuum gauge for measuring the air pressure in the sealed chamber.