CN217360658U - Frequency conversion mainboard with heat dissipation structure - Google Patents
Frequency conversion mainboard with heat dissipation structure Download PDFInfo
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- CN217360658U CN217360658U CN202220362798.4U CN202220362798U CN217360658U CN 217360658 U CN217360658 U CN 217360658U CN 202220362798 U CN202220362798 U CN 202220362798U CN 217360658 U CN217360658 U CN 217360658U
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- heat dissipation
- mainboard
- fixedly connected
- frequency conversion
- casing
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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Abstract
The utility model discloses a take heat radiation structure's frequency conversion mainboard, including casing and mainboard body, the inner wall symmetry fixedly connected with mounting panel of casing, be equipped with shock attenuation coupling mechanism between mainboard body and the mounting panel, the circular slot has been seted up to the upper surface symmetry of casing, the bottom of circular slot is run through and has been seted up the louvre, install heat dissipation mechanism between the inside of circular slot and the inside of louvre. The utility model discloses in, through the shock attenuation coupling mechanism who sets up, when taking place vibrations, shock attenuation is carried out to the mainboard body when the damping spring through setting up can take place vibrations to avoid damaging, through the heat dissipation mechanism who sets up, can dispel the heat to the top and the below of mainboard body simultaneously, thereby improved the radiating effect greatly, avoid the mainboard overheated, thereby increase of service life.
Description
Technical Field
The utility model relates to a frequency conversion mainboard technical field especially relates to a take heat radiation structure's frequency conversion mainboard.
Background
A motherboard, also called a main board, a system board or a mother board, is one of the most important components of a computer. The main board is generally a rectangular circuit board, on which a main circuit system forming a computer is installed, and generally comprises elements such as a BIOS chip, an I/O control chip, a keyboard and panel control switch interface, an indicator light plug-in connector, an expansion slot, a main board, a direct current power supply plug-in connector of a plug-in card and the like;
now relate to a take heat radiation structure's frequency conversion mainboard, current frequency conversion mainboard does not have self-contained heat-radiating equipment usually, mainly dispel the heat through the fan, and current radiator fan generally can only dispel the heat to one side of mainboard, heat radiating area is little, the heat dissipation is not comprehensive, consequently, the heat dissipation help to whole mainboard is less, thereby seriously influence the use of mainboard, and greatly reduced the life of mainboard, in addition, the mainboard is mostly rigid mounting at quick-witted incasement, the effect of shock attenuation buffering does not possess, thereby can not play good protection effect to the mainboard.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the shortcomings existing in the prior art and providing a frequency conversion mainboard with a heat dissipation structure.
In order to achieve the above purpose, the utility model adopts the following technical scheme: the utility model provides a take heat radiation structure's frequency conversion mainboard, includes casing and mainboard body, the inner wall symmetry fixedly connected with mounting panel of casing, be equipped with shock attenuation coupling mechanism between mainboard body and the mounting panel, the circular slot has been seted up to the upper surface symmetry of casing, the louvre has been seted up in the bottom of circular slot running through, install heat radiation mechanism between the inside of circular slot and the inside of louvre.
Further, shock attenuation coupling mechanism includes the screw, the one end of screw run through the mainboard body and with the inside threaded connection of mounting panel, be equipped with damping spring between the other end of screw and the mainboard body.
Further, heat dissipation mechanism includes the bracing piece, bracing piece fixed mounting is at the inner wall of louvre, just the fixed surface of bracing piece installs the motor, the output shaft fixedly connected with dwang of motor, fixedly connected with heat dissipation flabellum is established to the surface cover of dwang.
Further, heat dissipation mechanism still includes the bearing, bearing embedding fixed mounting is in the interior bottom of circular slot, the inner circle fixedly connected with ring of bearing, the outer fixed surface of ring is connected with turbine blade, the wind channel has been seted up to the inside symmetry of casing, the one end and the circular slot in wind channel are linked together, the other end in wind channel is linked together with the inside of casing and is located the below of mainboard body.
Further, the inner wall fixedly connected with connecting rod of ring, the surface of connecting rod and the top fixed connection of dwang.
Furthermore, the inner wall of the shell and the position below the main board body are fixedly connected with a plurality of radiating fins in sequence, and an opening is formed in one side of the outer surface of the shell and the position between two adjacent radiating fins.
Furthermore, the outer surface of the shell and the position close to the bottom are fixedly connected with a connecting plate, and a mounting hole is formed in the outer surface of the connecting plate.
The utility model has the advantages that:
1. the utility model discloses when using, this take heat radiation structure's frequency conversion mainboard, through the shock attenuation coupling mechanism who sets up, when taking place vibrations, carry out the shock attenuation to the mainboard body when the damping spring through setting up can take place vibrations to avoid damaging.
2. The utility model discloses when using, this take heat radiation structure's frequency conversion mainboard, through the heat dissipation mechanism that sets up, can dispel the heat to the top and the below of mainboard body simultaneously to improve the radiating effect greatly, avoided the mainboard overheated, thereby increase of service life.
Drawings
Fig. 1 is a perspective view of the present invention;
fig. 2 is a side view of the present invention;
fig. 3 is an enlarged view of a portion a in fig. 2 according to the present invention.
Illustration of the drawings:
1. a housing; 2. a main board body; 3. mounting a plate; 4. a circular groove; 5. heat dissipation holes; 6. a screw; 7. a damping spring; 8. a support bar; 9. a motor; 10. rotating the rod; 11. a heat dissipation fan blade; 12. a bearing; 13. a circular ring; 14. a turbine blade; 15. a connecting rod; 16. an air duct; 17. heat dissipation fins; 18. an opening; 19. a connecting plate; 20. and (7) installing holes.
Detailed Description
Fig. 1 to 3 show, relate to a take heat radiation structure's frequency conversion mainboard, including casing 1 and mainboard body 2, casing 1's inner wall symmetry fixedly connected with mounting panel 3 is equipped with shock attenuation coupling mechanism between mainboard body 2 and the mounting panel 3, and circular slot 4 has been seted up to casing 1's upper surface symmetry, and the louvre 5 has been seted up in the bottom of circular slot 4 through, installs heat radiation mechanism between the inside of circular slot 4 and the inside of louvre 5.
Shock attenuation coupling mechanism includes screw 6, and the one end of screw 6 run through mainboard body 2 and with the inside threaded connection of mounting panel 3, be equipped with damping spring 7 between the other end of screw 6 and the mainboard body 2, carry out the shock attenuation to mainboard body 2 when can take place vibrations through damping spring 7 that sets up to avoid damaging.
The heat dissipation mechanism comprises a support rod 8, the support rod 8 is fixedly installed on the inner wall of the heat dissipation hole 5, a motor 9 is installed on the outer surface of the support rod 8, a rotating rod 10 is fixedly connected with an output shaft of the motor 9, a heat dissipation fan blade 11 is fixedly connected with the outer surface of the rotating rod 10 in a sleeved mode, the motor 9 rotates to drive the rotating rod 10 to rotate, and therefore the heat dissipation fan blade 11 is driven to rotate, and heat is dissipated above the main board body 2.
Heat dissipation mechanism still includes bearing 12, bearing 12 embedding fixed mounting is at the interior bottom of circular slot 4, bearing 12's inner circle fixedly connected with circular ring 13, circular ring 13's outer fixed surface is connected with turbine blade 14, wind channel 16 has been seted up to casing 1's inside symmetry, wind channel 16's one end is linked together with circular slot 4, wind channel 16's the other end is linked together and is located mainboard body 2's below with casing 1's inside, circular ring 13 rotates and drives turbine blade 14 and rotate, thereby take out the air of mainboard body 2 below through wind channel 16, thereby dispel the heat to the below of mainboard body 2.
The inner wall fixedly connected with connecting rod 15 of ring 13, the top fixed connection of the surface of connecting rod 15 and dwang 10, it rotates to drive connecting rod 15 through dwang 10 when motor 9 of being convenient for rotates, and then drives ring 13 and rotate.
The inner wall of the shell 1 is sequentially fixedly connected with a plurality of radiating fins 17 at positions below the main board body 2, an opening 18 is formed in one side of the outer surface of the shell 1 and at a position between two adjacent radiating fins 17, the radiating speed can be increased through the arranged radiating fins 17, and the opening 18 is convenient for ventilation.
The outer surface of the shell 1 and the position close to the bottom are fixedly connected with a connecting plate 19, and a mounting hole 20 is formed in the outer surface of the connecting plate 19, so that the mounting is facilitated.
When using the frequency conversion mainboard of taking heat radiation structure, at first install through connecting plate 19 and mounting hole 20, when taking place vibrations, damping spring 7 through setting up when can taking place vibrations is to mainboard body 2 shock attenuation, thereby avoid damaging, motor 9 rotates and drives dwang 10 and connecting rod 15 rotation, thereby drive heat dissipation flabellum 11 and turbine blade 14 rotation, heat dissipation flabellum 11 rotates and to dispel the heat to mainboard body 2 top, turbine blade 14 rotates and takes out the air of mainboard body 2 below through wind channel 16, thereby dispel the heat to the below of mainboard body 2, heat radiating rate can be accelerated through the heat radiation fin 17 that sets up, thereby the radiating effect has been improved greatly.
The above description is only for the preferred embodiment of the present invention, and is not intended to limit the present invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included within the protection scope of the present invention.
Claims (7)
1. The utility model provides a take heat radiation structure's frequency conversion mainboard, includes casing (1) and mainboard body (2), its characterized in that: the inner wall symmetry fixedly connected with mounting panel (3) of casing (1), be equipped with shock attenuation coupling mechanism between mainboard body (2) and mounting panel (3), circular slot (4) have been seted up to the upper surface symmetry of casing (1), louvre (5) have been seted up in the bottom of circular slot (4) run through, install heat dissipation mechanism between the inside of circular slot (4) and the inside of louvre (5).
2. The frequency conversion mainboard with the heat dissipation structure of claim 1, characterized in that: the shock attenuation coupling mechanism includes screw (6), the one end of screw (6) run through mainboard body (2) and with the inside threaded connection of mounting panel (3), be equipped with damping spring (7) between the other end of screw (6) and mainboard body (2).
3. The frequency conversion mainboard with the heat dissipation structure of claim 1, characterized in that: the heat dissipation mechanism comprises a support rod (8), the support rod (8) is fixedly installed on the inner wall of the heat dissipation hole (5), a motor (9) is installed on the outer surface of the support rod (8), an output shaft of the motor (9) is fixedly connected with a rotating rod (10), and fixedly connected with heat dissipation fan blades (11) are arranged on the outer surface of the rotating rod (10).
4. The frequency conversion mainboard with the heat dissipation structure of claim 3, characterized in that: the heat dissipation mechanism further comprises a bearing (12), the bearing (12) is embedded into the inner bottom of the circular groove (4) and fixedly installed on the inner bottom of the circular groove (4), the inner ring of the bearing (12) is fixedly connected with the circular ring (13), the outer surface of the circular ring (13) is fixedly connected with the turbine blades (14), an air duct (16) is symmetrically formed in the casing (1), one end of the air duct (16) is communicated with the circular groove (4), and the other end of the air duct (16) is communicated with the inside of the casing (1) and is located below the main board body (2).
5. The frequency conversion mainboard with the heat dissipation structure of claim 4, characterized in that: the inner wall fixedly connected with connecting rod (15) of ring (13), the top fixed connection of the surface of connecting rod (15) and dwang (10).
6. The frequency conversion mainboard with the heat dissipation structure of claim 1, characterized in that: the inner wall of the shell (1) is sequentially fixedly connected with a plurality of radiating fins (17) at positions below the main board body (2), and an opening (18) is formed in one side of the outer surface of the shell (1) and at a position between two adjacent radiating fins (17).
7. The frequency conversion mainboard with the heat dissipation structure of claim 1, characterized in that: the outer surface of the shell (1) is fixedly connected with a connecting plate (19) at a position close to the bottom, and a mounting hole (20) is formed in the outer surface of the connecting plate (19).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202220362798.4U CN217360658U (en) | 2022-02-23 | 2022-02-23 | Frequency conversion mainboard with heat dissipation structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN202220362798.4U CN217360658U (en) | 2022-02-23 | 2022-02-23 | Frequency conversion mainboard with heat dissipation structure |
Publications (1)
Publication Number | Publication Date |
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CN217360658U true CN217360658U (en) | 2022-09-02 |
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Family Applications (1)
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CN202220362798.4U Active CN217360658U (en) | 2022-02-23 | 2022-02-23 | Frequency conversion mainboard with heat dissipation structure |
Country Status (1)
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CN (1) | CN217360658U (en) |
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2022
- 2022-02-23 CN CN202220362798.4U patent/CN217360658U/en active Active
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