CN217336304U

CN217336304U - Shield case and electronic device

Info

Publication number: CN217336304U
Application number: CN202220483184.1U
Authority: CN
Inventors: 荣玉杰; 刘章瑜
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2022-03-07
Filing date: 2022-03-07
Publication date: 2022-08-30
Anticipated expiration: 2032-03-07

Abstract

The embodiment of the application provides a shield cover, is applied to electronic equipment, and electronic equipment includes the mainboard, and the shield cover includes apron and brace rod, and the apron has the covering surface, and the covering surface is used for towards the mainboard. The brace rod includes supporting part and connecting portion, and connecting portion connect in the apron, and the supporting part includes relative first end and second end, and first end is connected in connecting portion, and the second end is used for with the mainboard connection, and wherein, the second end staggers at the orthographic projection of covering surface and first end at the orthographic projection of covering surface. Because the atress direction of first end and second end is not on same straight line, the supporting part can consequently have the deformation trend on mainboard place plane direction this moment for the part impact force that finally acts on the mainboard can be dispersed on mainboard place plane direction, avoids the impact force to act on the junction of second end and mainboard completely, and then realizes reducing the effect of mainboard stress. In addition, the embodiment of the application also provides the electronic equipment.

Description

Shield case and electronic device

Technical Field

The application relates to the technical field of electromagnetic shielding, in particular to a shielding case and electronic equipment.

Background

In manufacturing electronic devices, in order to protect electronic components on a motherboard from external electromagnetic waves, a shielding cover is generally used to cover the electronic components on the motherboard, so as to achieve electromagnetic isolation.

Along with the increase of the use scenes of the electronic equipment, the probability of falling or colliding of the electronic equipment is increased. When the electronic equipment falls or collides, components such as a battery cover or a middle frame of the electronic equipment risk to extrude the shielding cover. The shield cover receives probably to produce deformation and impact force after the extrusion, and the impact force will be transmitted for the mainboard through the connecting portion of shield cover and mainboard, and when mainboard local stress was great, the mainboard produced deformation, leads to the welding between this regional electronic component and the mainboard situations such as unstability or contact failure to appear, causes equipment failure.

SUMMERY OF THE UTILITY MODEL

It is an object of the present application to provide a shielding cage and an electronic device to at least partially solve the above technical problems.

In a first aspect, an embodiment of the present application provides a shielding case, which is applied to an electronic device including a motherboard, where the shielding case includes a cover plate and a support rib, and the cover plate has a covering surface, and the covering surface is used for facing the motherboard. The brace rod includes supporting part and connecting portion, and connecting portion connect in the apron, and the supporting part includes relative first end and second end, and first end is connected in connecting portion, and the second end is used for with the mainboard connection, and wherein, the second end staggers at the orthographic projection of covering surface and first end at the orthographic projection of covering surface.

In a second aspect, an embodiment of the present application further provides an electronic device, which includes a motherboard and the foregoing shielding case, where the motherboard has a pad. The second end in the shield cover is welded to the welding pad, and the apron and the mainboard of shield cover set up relatively, and the chamber is held in the injeciton between apron and the mainboard.

The embodiment of the application provides a shield cover and electronic equipment, connecting portion are connected in the apron, connecting portion are connected to the first end of supporting part, on the plane direction of covering surface, the second end sets up for first end staggers, when the apron receives external impact force like this, the impact force is conducted to the brace rod, then conduct to the mainboard, because first end and second end are staggered, the direction of force of first end and second end is not on same straight line, the supporting part can consequently have the deformation trend on mainboard place plane direction this moment, make the partial impact force that finally acts on the mainboard disperse on mainboard place plane direction, avoid the impact force to act on the junction of second end and mainboard completely, and then realize reducing the effect of mainboard stress.

These and other aspects of the present application will be more readily apparent from the following description of the embodiments.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present disclosure.

Fig. 2 is a partial structural schematic diagram of the electronic device shown in fig. 1 after the rear cover is removed.

Fig. 3 is a cross-sectional view taken along line a-a of fig. 1.

Fig. 4 is a schematic structural diagram of a shielding cover according to an embodiment of the present application.

Fig. 5 is a schematic cross-sectional view of a shielding cover according to an embodiment of the present application.

Fig. 6 is a schematic cross-sectional view of another shielding cover according to an embodiment of the present application.

Fig. 7 is a schematic cross-sectional view of another shielding cover according to an embodiment of the present application.

Fig. 8 is a schematic structural diagram of another shielding cover provided in an embodiment of the present application.

Fig. 9 is a partial sectional structural view of the shield cover provided in fig. 8.

Fig. 10 is a schematic cross-sectional view of still another shielding cover according to an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

In the related art, when a shielding case provided in an electronic device is mounted, an edge of the shielding case is bent and then welded to a main board in a vertical 90-degree manner. In order to save the space of the mainboard, the thickness of the shielding case is not too thick, so that the connecting area between the shielding case and the mainboard is smaller. With the wide application of electronic equipment, the situation that the electronic equipment falls or collides inevitably occurs. In the process, the battery cover, the middle frame and the like can be deformed by the impact force applied to the electronic equipment, and the impact can be generated on the shielding cover. Because adopt perpendicular mode welding between shield cover and the mainboard, when receiving external force and assault, the impact force direct action is in the junction of shield cover and mainboard for the stress that this region received is very big, and then leads to the mainboard to produce deformation, leads to the welding between electronic component in this region and the mainboard to appear situations such as unstability or contact failure, causes equipment failure.

As shown in fig. 1, the present embodiment provides an electronic device 10, where the electronic device 10 in the present application may be a mobile phone or a smart phone (e.g., an iPhone-based phone, an Android-based phone), a Portable game device (e.g., Nintendo DS, PlayStation Portable, game Advance, iPhone), a laptop, a PDA, a Portable internet device, a music player, and a data storage device, other handheld devices, and a Head Mounted Device (HMD) such as a watch, an earphone, a pendant, an earphone, etc., and the electronic device 10 may also be other wearable devices (e.g., an electronic glasses, an electronic garment, an electronic bracelet, an electronic necklace, an electronic tattoo, an electronic device, or a smart watch).

Referring to fig. 1 and fig. 2 together, the electronic device 10 provided in the present embodiment is described by taking a mobile phone as an example. The electronic device 10 includes a housing assembly 20, a display screen 30, a main board 50, a battery 40, and the like, wherein the main board 50 and the battery 40 are disposed in the housing assembly 20. The electronic device may also be provided with a front-facing camera disposed on the side of the electronic device 10 on which the display screen 30 is disposed.

Referring to fig. 3, the housing assembly 20 includes a middle frame 21, a front housing 25 and a rear housing 26, the middle frame 21 includes a middle plate 22 and a bezel 23, the bezel 23 surrounds an edge of the middle plate 22, the bezel 23 protrudes from the middle plate 22, and the bezel 23 protrudes from the middle plate 22 at two opposite sides of the middle plate 22. The front shell 25 and the rear shell 26 are respectively assembled on two opposite sides of the middle plate 22, and the front shell 25 and the rear shell 26 are fixedly assembled with the frame 23; the rear shell 26, the middle frame 21 and the front shell 25 together form a cavity, the main board 50 is disposed in the cavity and fixed on the middle plate 22, and the cavity may be further provided with various other components such as a rear camera, an antenna, a processor, and the like.

The Display screen 30 is mounted on the front case 25, the Display screen 30 may be a Liquid Crystal Display (LCD) screen for displaying information, and the LCD screen may be a Thin Film Transistor (TFT) screen or an In-Plane Switching (IPS) screen or a Liquid Crystal Display (SLCD) screen. In other embodiments, the display screen 30 may adopt an OLED (Organic Light-Emitting display) screen for displaying information, and the OLED screen may be an AMOLED (Active Matrix Organic Light-Emitting Diode) screen or a Super AMOLED (Super Active Matrix Organic Light-Emitting Diode) screen or a Super AMOLED Plus (Super Active Matrix Organic Light-Emitting Diode, smart screen), which will not be described herein again.

Various electronic components 60 are disposed on the main board 50, and the electronic components 60 include, but are not limited to, a processor, a memory, an antenna module, a speaker, a receiver, and the like, which are not limited herein. The main board 50 is provided with pads (not shown), and the electronic component 60 is connected to the circuit on the main board 50 by soldering to the pads.

With continued reference to fig. 2 and 3, the electronic device 10 further includes a shielding can 100, where the shielding can 100 may be one or more, and the shielding can 100 is used for covering one or more electronic components 60. It is understood that any of the above-mentioned types of electronic components 60 may be selectively covered by one or more shielding cases 100, and is not limited thereto.

Referring to fig. 3 and 4, the shielding case 100 includes a cover plate 110 and support ribs 120, the cover plate 110 may be configured in a planar configuration, and the structure of the cover plate 110 may be configured in any shape according to the number and shape of the electronic components 60 to be covered, which is not limited herein. Moreover, in some embodiments, the cover plate 110 may also have a non-planar configuration according to design requirements, for example, the cover plate 110 may be formed with a concave or convex structure by stamping or the like to accommodate electronic components 60 with different heights. Some or all of the edge of the cover plate 110 may be bent to form a bent flap 150, so that the shielding can 100 can shield the electronic component 60 in multiple directions, thereby improving the electromagnetic shielding effect.

Referring to fig. 4 and 5, the cover plate 110 has a covering surface 111 and an outer surface 112 opposite to the covering surface 111, the covering surface 111 is disposed toward the main plate 50, the outer surface 112 faces the rear case 26 when assembled, the covering surface 111 is substantially planar, and the covering surface 111 is disposed opposite to the main plate 50. The support rib 120 includes a support portion 140 and a connecting portion 130, the connecting portion 130 is connected to the cover plate 110, the support portion 140 includes a first end 141 and a second end 142 opposite to each other, the first end 141 is connected to the connecting portion 130, and the second end 142 is connected to the main plate 50. The cover plate 110 and the support ribs 120 may be made of metal material to improve the deformation resistance of the shielding case 100. The supporting portion 140 and the connecting portion 130 may be integrally formed, or may be connected by welding or the like.

The number of the supporting ribs 120 may be one or more, and when the number of the supporting ribs 120 is plural, the supporting ribs 120 may be distributed at the edge of the circumference of the cover plate 110 or at a position adjacent to the edge, and the supporting ribs 120 may also be disposed at any other position of the cover plate 110. For example, when the cover plate 110 covers a plurality of electronic components 60 at the same time, the support ribs 120 may also be disposed in the middle region of the cover plate 110. The support ribs 120 are used for supporting the cover plate 110, so that a receiving cavity 61 (shown in fig. 3) is defined between the cover plate 110 and the main board 50, and the receiving cavity is used for receiving the electronic component 60, thereby shielding the electronic component 60. In order to achieve a better shielding effect, the supporting ribs 120 and the cover plate 110 may be made of metal. It will be appreciated that the receiving chamber 61 may be completely enclosed or may be of a non-enclosed construction to facilitate heat dissipation.

When the electronic device 10 is subjected to external impact due to falling, impact, etc., and the housing assembly 20 deforms, impact may be generated on the cover plate 110 of the shielding case 100, at this time, the cover plate 110 is first subjected to impact force, and after the impact force is transmitted through the connecting portion 130 and the supporting portion 140, the impact force may act on the main board 50.

In this embodiment, the connecting portion 130 is connected to the covering surface 111 of the cover plate 110, the connecting portion 130 is configured to be substantially a plate-shaped structure and is attached to the covering surface 111, and the connecting portion 130 may be connected and fixed to the cover plate 110 by welding, bonding, or the like. The advantages of this arrangement are: the connecting portion 130 is of a plate-shaped structure, when the connecting portion is fixed to the cover plate 110, the contact area is larger, the stability is higher, when the cover plate 110 is impacted by external force, impact force is transmitted to the support rib 120, and is firstly transmitted to the connecting portion 130, because the contact area between the connecting portion 130 and the cover plate 110 is larger, the impact force is dispersed to the whole connecting portion 130, so that the impact force cannot be simultaneously and completely transmitted to the support portion 140, but is transmitted to the support portion 140 in a continuous manner within a period of time, so that the impact force transmitted to the support portion 140 can be reduced, and further, the stress on the main plate 50 is reduced.

In other embodiments, the connecting portion 130 and the cover plate 110 may be formed by being integrally formed. For example: the edge of the cover plate 110 is bent with respect to the cover plate 110 to form a connection portion 130. In other embodiments, the connecting portion 130 may also be directly connected to the covering surface 111 by welding, and the connecting portion 130 is connected to the covering surface 111 in a substantially linear contact manner.

The second end 142 may be fixedly connected to the main board 50 by welding. In this embodiment, the orthographic projection of the second end 142 on the covering surface 111 and the orthographic projection of the first end 141 on the covering surface 111 are arranged in a staggered manner, that is, the orthographic projection of the second end 142 on the covering surface 111 and the orthographic projection of the first end 141 on the covering surface 111 do not coincide with each other, by this arrangement, when the cover plate 110 receives an impact force, the stress directions of the first end 141 and the second end 142 are not on the same straight line, and at this time, the supporting portion 140 has a deformation tendency in the plane direction of the main plate 50, so that a part of the impact force finally acting on the main plate 50 is dispersed in the plane direction of the main plate 50, and the impact force is prevented from completely acting on the joint of the second end 142 and the main plate 50, thereby achieving the effect of reducing the stress of the main plate 50.

More specifically, in the present embodiment, as a possible implementation manner, the supporting portion 140 is disposed obliquely with respect to the inclined surface, and the orthogonal projection of the second end 142 on the covering surface 111 may be located outside the orthogonal projection range of the connecting portion 130 on the covering surface 111. When the impact force is transmitted to the main board 50 through the supporting portion 140, since the supporting portion 140 is disposed obliquely with respect to the covering surface 111, the direction of the force F applied by the supporting portion 140 to the main board 50 is not perpendicular to the plane of the main board 50, but along the extending direction of the supporting portion 140. At this time, as shown in FIG. 5, the force F forms a component F perpendicular to the main plate 50 ₁ And a force component F along a plane parallel to the main plate 50 ₂ And F is always greater than F ₁ And F ₂ And a component force F parallel to the plane of the main plate 50 ₂ Can be distributed to other areas of the main board 50, and the force applied to the joint of the second end 142 and the main board 50 is only F ₁ The force transmitted to the main plate 50 is reduced compared to the force F transmitted to the support rib 120 by the cover plate 110.

Wherein, F ₁ F sin α, α is the inclination angle between the supporting portion 140 and the plane of the main plate 50, and since the covering surface 111 is parallel to the plane of the main plate, α is equal to θ, F sin α is equal to θ ₁ F sin θ. Whereby F ₁ Is positively correlated with the inclination angle theta of the supporting part 140 with respect to the covering surface 111, the smaller theta, the smaller F ₁ Smaller, but correspondingly, too small θ, results in too small a gap between the cover plate 110 and the main plate 50, which is not conducive to the placement of the electronic component 60 and the structural strength of the support ribs is relatively low. Thus, the inclination angle θ of the supporting portion 140 with respect to the covering surface 111 may be, for exampleThe inclination angle θ may be other values, of course, and is not limited in any way.

The shielding case 100 provided by the embodiment can reduce the stress of the impact force on the main board 50 when being subjected to the external impact, reduce the risk of poor contact caused by damage of the main board 50, and improve the service life of the device.

In another embodiment, as shown in fig. 6, the orthographic projection of the second end 142 on the covering surface 111 can be located within the orthographic projection range of the connecting portion 130 on the covering surface 111, so that the supporting portion 140 forms a component force F perpendicular to the main board 50 ₁ The direction vector of (2) is located in the range of the connecting portion 130, so that the reaction force of the supporting portion 140 to the connecting portion 130 is on the connecting portion 130, which can improve the overall installation stability of the shielding cover 100 and prevent the supporting rib 120 from breaking under the impact force.

In other embodiments, the support portion 140 may also be disposed in a non-aligned extending manner, for example, the support portion 140 has at least one bend, and the arrangement position of the support rib 120 may be more reasonably configured by bending the support portion 140. Meanwhile, the supporting portion 140 is designed to have a bend, at the bend, the impact force transmitted from the cover plate 110 to the supporting portion 140 is also decomposed into forces in multiple directions, and these force components are consumed by friction with the air in the accommodating cavity, so that the impact force finally applied to the main plate 50 is also reduced.

For example, as shown in fig. 7, the supporting portion 140 may include a first connecting section 143 and a second connecting section 144, the first connecting section 143 and the second connecting section 144 are connected, the first connecting section 143 and the second connecting section 144 are relatively bent, and an included angle between the first connecting section 143 and the second connecting section 144 may be an acute angle. Wherein the first end 141 is formed at an end of the first connecting section 143 away from the second connecting section 144, and the second end 142 is formed at an end of the second connecting section 144 away from the first connecting section 143. The first connecting section 143 is disposed obliquely with respect to the covering surface 111 of the cover plate 110, the second connecting section 144 extends substantially in a direction perpendicular to the plane of the main plate 50, and the second end 142 is connected to the main plate 50. The advantages of this embodiment are: since the second connecting section 144 is bent relative to the first connecting section 143, the whole supporting portion 140 needs to occupy less space along the plane direction of the main board 50, which is beneficial to the reasonable arrangement of the electronic components 60 on the main board 50.

Moreover, since the first connecting section 143 is disposed obliquely with respect to the covering surface 111, when the impact is transmitted to the connection between the first connecting section 143 and the second connecting section 144, a component F perpendicular to the main plate 50 is generated to the second connecting section 144 ₁ And a force component F along a plane parallel to the main plate 50 ₂ At this time, the second connecting section 144 is subjected to a force component F ₂ The driving force generates deformation along the plane of the main plate 50, so that the component force F ₂ When the impact force is transmitted to the main board 50, the impact force is dispersed in the plane direction of the main board 50, so that the stress of the impact force on the main board 50 is reduced, and the risk of poor contact caused by damage of the main board 50 is reduced.

As another possible implementation, referring to fig. 8 and 9, the supporting portion 140 may also be configured as a reciprocating bending structure, forming a structure similar to a "spring". Specifically, the supporting portion 140 includes a first connecting section 143, a first bending section 146, a second connecting section 144, a second bending section 147 and a third connecting section 145 that are connected in sequence, the first bending section 146 is connected to one end of the first connecting section 143 that is far away from the connecting portion 130, extends in a direction substantially parallel to the cover plate 110 and is connected to the second connecting section 144, and the first bending section 146 bends relative to the first connecting section 143 and the second connecting section 144. The second bending section 147 is connected to an end of the second connecting section 144 away from the first bending section 146, extends substantially in a direction parallel to the cover plate 110, and is connected to the third connecting section 145, and the second bending section 147 is bent with respect to the second connecting section 144 and the third connecting section 145; one end of the first connecting section 143 away from the first bending section 146 forms a first end 141 connected to the connecting portion 130, and one end of the third connecting section 145 away from the second bending section 147 forms a second end 142 connected to the main board 50.

The first connecting section 143, the second connecting section 144 and the third connecting section 145 are arranged approximately oppositely to form a reciprocating bending structure. This structure has a plurality of bending points, and in the impact force transmission process, the impact force can take place the direction change many times, forms the cushioning effect to at this in-process, partial impact force and air friction do work and consume, and then make the effort that transmits to on the mainboard 50 reduce, also can realize reducing the stress of impact force to mainboard 50, reduce the effect that mainboard 50 is impaired to lead to contact failure risk. Furthermore, since the support portion 140 forms a "spring" structure, when the impact force is transmitted to the support portion 140, the support portion 140 will "accumulate" force first and then "discharge" force slowly toward the main board 50, so as to reduce the impact force transmitted to the main board 50.

In addition, the reciprocating bending structure can not only enable the impact force to be consumed after being changed for a plurality of times, but also can not increase excessive occupied space, and is beneficial to the arrangement of the electronic elements 60 on the mainboard 50. Similarly to the above embodiments, the supporting portion 140 may be configured to have other types of multi-bending structures, and is not limited herein. For example, the support 140 may also include more bends.

Further, for better achieving the purpose of reducing the impact force transmitted to the main board 50, as shown in fig. 10, the third connecting section 145 may also be disposed obliquely with respect to the covering surface 111, so that when the impact force is transmitted to the main board 50 through the third connecting section 145, since the third connecting section 145 is disposed obliquely with respect to the covering surface 111, the direction of the acting force F of the third connecting section 145 on the main board 50 is not perpendicular to the plane of the main board 50, but along the extending direction of the supporting portion 140. Therefore, a component force perpendicular to the main board 50 and a component force along a plane parallel to the main board 50 are formed, and the component force parallel to the plane of the main board 50 can be dispersed to other areas of the main board 50, thereby further reducing the force transmitted to the main board 50.

The shielding case 100 provided in this embodiment can reduce the impact force of the shielding case 100 on the motherboard 50 in the electronic device 10 when the shielding case is impacted by an external force, so as to protect the motherboard 50 more effectively, avoid the pad on the motherboard 50 from loosening due to unstable solder joint, and reduce the occurrence of poor contact.

The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A shield case applied to an electronic apparatus including a main board, the shield case comprising:

a cover plate having a cover face for facing the main plate; and

the utility model provides a cover plate, including the apron, the apron includes the relative first end of supporting part and connecting portion, connecting portion connect in the apron, the supporting part includes relative first end and second end, first end connect in connecting portion, the second end be used for with mainboard connection, wherein, the second end is in the orthographic projection of covering surface with first end is in the orthographic projection of covering surface staggers.

2. A shielding cage according to claim 1, wherein said support portion is a plate-like member disposed obliquely with respect to said covering surface.

3. The shield according to claim 1, wherein the support portion has at least one bend.

4. The shielding cage according to claim 3, wherein the supporting portion comprises a first connecting section and a second connecting section, the first connecting section and the second connecting section are bent relatively, an end of the first connecting section away from the second connecting section forms the first end, and an end of the second connecting section away from the first connecting section forms the second end.

5. The shielding cage of claim 3, wherein said support portion is configured as a reciprocating flexure structure.

6. The shielding case of claim 5, wherein the supporting portion comprises a first connecting section, a first bending section, a second connecting section, a second bending section and a third connecting section which are connected in sequence, the first bending section is bent relative to the first connecting section and the second connecting section, and the second bending section is bent relative to the second connecting section and the third connecting section;

one end of the first connecting section, which is far away from the first bending section, forms the first end, and one end of the third connecting section, which is far away from the second bending section, forms the second end.

7. The shielding cage of claim 6, wherein said third connector segment is disposed obliquely relative to said cover surface.

8. The shielding cage according to any one of claims 1 to 7, wherein the connecting portion is attached to the covering surface or integrally formed with the cover plate, and the cover plate and the support rib are made of a metal material.

9. The shielding cage according to any one of claims 1 to 7, wherein an orthographic projection of the second end on the covering surface is located within an orthographic projection range of the connecting portion on the covering surface.

10. An electronic device, comprising:

the main board is provided with a bonding pad;

the shielding cage of any of claims 1-9, the second end of the shielding cage being soldered to the solder pad, the cover plate of the shielding cage being disposed opposite the motherboard, the cover plate and the motherboard defining a receiving cavity therebetween.