CN216057944U - Board card device and electronic equipment - Google Patents

Abstract

The present disclosure relates to a board device and an electronic apparatus, the board device may include a cover member, a heat dissipation device, a printed circuit board, and a support member, and the cover member, the heat dissipation device, the printed circuit board, and the support member are sequentially arranged in a thickness direction. More specifically, both side walls of the cover in the width direction and both side walls of the heat sink in the width direction are joined; the printed circuit board is arranged between the supporting piece and the heat dissipation device, wherein the supporting piece can be used for supporting the printed circuit board, and the heat dissipation device can be used for dissipating heat of components on the printed circuit board.

Description

Board card device and electronic equipment

Technical Field

The present disclosure relates generally to the field of electronic products, and more particularly, to the field of card devices.

Background

In the cloud computing era, a plurality of acceleration board cards are often installed in a server to improve data processing and computing capacity. In the transportation or carrying process of the server, the Board card installed therein is subjected to vibration and impact, which may cause the Board card to generate problems such as Printed Circuit Board (PCB) deformation, stress cracking of the solder balls of the chip, and the like. Therefore, the structural strength of the board card needs to be enhanced, so that the deformation of the board card in the impact process is reduced, and the reliability is improved.

The existing board card structure is limited by the size requirement in PCIe specification, so that the structural strength of the board card backboard is difficult to improve. Therefore, a new board structure is needed to solve the problem.

Disclosure of Invention

In order to at least partially solve the technical problem, the present disclosure provides a board device and an electronic apparatus.

According to an aspect of the present disclosure, there is provided a board device including: a printed circuit board including a main body portion and a connection portion at a first side of the main body portion in a width direction; a support member including a back plate portion for supporting the printed circuit board and one side wall for restricting movement of the printed circuit board in a width direction on one side of the back plate portion; and a cover member engaged with one side wall of the support member at one side in a width direction and engaged with the support member or the printed circuit board at the other side in the width direction, thereby forming a receiving structure to receive a main portion of the printed circuit board.

According to an aspect of the present disclosure, there is provided an electronic apparatus including the board card device as described above.

According to the technical scheme, the structural strength and the reliability of the whole board card device can be improved by improving the structural strength and the reliability of the supporting piece.

Drawings

The above and other objects, features and advantages of exemplary embodiments of the present disclosure will become readily apparent from the following detailed description read in conjunction with the accompanying drawings. Several embodiments of the present disclosure are illustrated by way of example, and not by way of limitation, in the figures of the accompanying drawings and in which like reference numerals refer to similar or corresponding parts and in which:

fig. 1 shows a perspective view of a card device 100 according to an embodiment of the present disclosure;

FIG. 2 illustrates a side view of the card device 100 according to one embodiment of the present disclosure;

fig. 3 shows a perspective view of the card device 100 according to an embodiment of the disclosure;

FIG. 4 illustrates an exploded view of the card device 100 according to one embodiment of the present disclosure;

FIG. 5 illustrates a front view of the support 140 in the card device 100 according to one embodiment of the present disclosure;

fig. 6 shows a perspective view of the card device 100 according to an embodiment of the present disclosure;

FIG. 7 illustrates a side view of the card device 100 according to one embodiment of the present disclosure;

FIG. 8 illustrates a side view of the card device 100 according to one embodiment of the present disclosure.

Detailed Description

The technical solutions in the embodiments of the present disclosure will be clearly and completely described below with reference to the drawings in the embodiments of the present disclosure, and it is obvious that the described embodiments are some, but not all embodiments of the present disclosure. All other embodiments, which can be derived by a person skilled in the art from the embodiments disclosed herein without making any creative effort, shall fall within the protection scope of the present disclosure.

It should be understood that the terms "first," "second," "third," and "fourth," etc. in the claims, description, and drawings of the present disclosure are used to distinguish between different objects and are not used to describe a particular order. The terms "comprises" and "comprising," when used in the specification and claims of this disclosure, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.

Various embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings.

Fig. 1 shows a perspective view of a card device 100 according to an embodiment of the present disclosure. Fig. 2 illustrates a side view of the card device 100 according to one embodiment of the present disclosure.

For convenience of description, the longitudinal direction herein refers to the Y direction in fig. 1, the width direction refers to the X direction in fig. 1, and the thickness direction refers to the Z direction in fig. 2. It should be understood that the length, width and thickness directions described herein are for convenience of description only and are not meant to be limiting in any dimension, for example, the length may be shorter than the width.

As shown in fig. 1 and 2, the card device 100 may include a cover 110, a heat sink 120, a printed circuit board 130, and a support 140, and the cover 110, the heat sink 120, the printed circuit board 130, and the support 140 are sequentially disposed in a thickness direction. More specifically, both side walls of the cover 110 in the width direction and both side walls of the heat sink 120 in the width direction are joined; the printed circuit board 130 is disposed between the supporting member 140 and the heat dissipation device 120, wherein the supporting member 140 can be used for supporting the printed circuit board 130, and the heat dissipation device 120 can be used for dissipating heat of components on the printed circuit board 130.

As shown in the card apparatus 100 of fig. 1 and 2, the supporting member 140 of the card apparatus 100 does not exceed the bottom surface of the printed circuit board 130 in the thickness direction, i.e., the supporting member 140 has a shorter sidewall or the supporting member 140 is a flat plate structure as a whole, thereby resulting in a weak structural strength and poor reliability of the supporting member 140 of the card apparatus 100. When the board card device 100 is subjected to vibration impact, problems such as deformation of the printed circuit board 130 and stress cracking of the solder balls of the chip may occur.

In addition, as shown in fig. 1 and 2, the main air intake area of the card device 100 is the portion above the pcb 130, and the portion of the pcb 130 to the bottom surface of the support member 140 (the "unused" portion shown in fig. 2) is not used or is poorly used due to air leakage or blocking by structural members. As the thermal power consumption of the chip is higher and higher, the heat dissipation capability of the conventional board card device 100 tends to be limited, and particularly, the passive heat dissipation board card is more and more difficult to meet the heat dissipation requirement.

In view of the above, the present disclosure provides a better solution to solve at least one of the above technical problems.

Fig. 3 shows a perspective view of the card device 100 according to an embodiment of the disclosure. Fig. 4 shows an exploded view of the card device 100 according to an embodiment of the disclosure.

As shown in fig. 3 and 4, the present disclosure provides a board device 100, which may include a printed circuit board 130, a support 140, and a cover 110. The printed circuit board 130 includes a main body portion 1310 and a connection portion 1320 at a first side of the main body portion in a width direction; the support 140 includes a back plate portion 1410 and one sidewall at one side of the back plate portion 1410, the back plate portion 1410 supporting the printed circuit board 130, the one sidewall limiting movement of the printed circuit board 130 in a width direction; and the cover 110 is coupled to one side wall of the support 140 at one side in the width direction, and the cover 110 is coupled to the support 140 or the printed circuit board 130 at the other side in the width direction, thereby forming a receiving structure to receive the main portion 1310 of the printed circuit board 130.

The printed circuit board 130 includes a main body portion 1310 and a connection portion 1320 at a first side of the main body portion 1310 in a width direction. The main body portion 1310 may carry integrated circuit components such as computing chips (CPU, GPU, ASIC chips, etc.), memory granules, power management chips, etc., and provide circuit connections between the integrated circuit components; the connecting portion 1320 is a structure extending from the main body portion 1310 in the width direction, and is mainly used for connecting or fixing the printed circuit board 130 or the card device 100 to an external device such as a server. The connection portion 1320 may include a gold finger structure. In addition, the main body portion 1310 and the connection portion 1320 may be integrally formed.

The support 140 includes a back plate portion 1410 and one sidewall at one side of the back plate portion 1410. The back plate portion 1410 may be a flat plate structure that supports the printed circuit board 130 and may be connected to the main portion 1310 of the printed circuit board 130, for example, by screws. The supporting member 140 may include a side wall which may be located at any one side of the back plate portion 1410 in the width direction so as to limit the movement of the printed circuit board 130 in the width direction, for example, at a side where the connection portion 1320 is located, or at a side away from the connection portion 1320 (a side opposite to the connection portion 1320). In other embodiments, the supporting member 140 may also include two side walls respectively located at two sides of the back plate portion 1410 in the width direction, wherein at least one side wall may be used to limit the movement of the printed circuit board 130 in the width direction. The support 140 may be approximately L-shaped or U-shaped in cross-section.

The back plate portion 1410 and a side wall on one side of the back plate portion 1410 may be integrally formed, or may be connected by splicing, snap-fitting, screwing, welding, or the like.

The cover 110 is engaged with one sidewall of the support 140 at one side in the width direction, and the cover 110 is engaged with the support 140 or the printed circuit board 130 at the other side in the width direction. More specifically, when the support 140 includes only one sidewall, one side of the cover 110 in the width direction may be engaged with one sidewall of the support 140, and the other side of the cover 110 in the width direction may be engaged with the back plate portion 1410 of the support 140 or the printed circuit board 130; when the support 140 includes two sidewalls, one side of the cover 110 in the width direction may be engaged with one sidewall of the support 140, and the other side of the cover 110 in the width direction may be engaged with the other sidewall of the support 140 or the printed circuit board 130. A receiving structure is formed by the cooperation of the cover 110 and the support 140 to receive the main portion 1310 of the printed circuit board 130.

It should be understood that, like the description of "one side of the covering part 110 in the width direction" or "the other side of the covering part 110 in the width direction", there is no limitation that the covering part 110 has a side wall on one side or the other side in the width direction, the covering part 110 may be a flat plate structure, and the covering part 110 may also include one side wall or two side walls in the width direction, which is not limited herein. Further, the "joint" described herein may be a detachable connection such as a splice, a screw connection, a snap connection, and a hinge connection.

As described above, in the card device 100 provided by the present disclosure, the support member 140 may include the back plate portion 1410 and one side wall located at one side of the back plate portion 1410, and the one side wall may limit the movement of the printed circuit board 130 in the width direction. That is, one sidewall of the supporting member 140 exceeds the bottom surface of the pcb 130 in the thickness direction, and the supporting member 140 has a higher sidewall compared to the prior art, so that the structural strength and reliability of the supporting member 140 of the card device 100 can be enhanced. Furthermore, when the supporting member 140 has two side walls in the width direction, and both the side walls can be used to limit the movement of the pcb 130 in the width direction, that is, the thickness direction exceeds the bottom surface of the pcb 130, compared with the prior art, both sides of the supporting member 140 have higher side walls, so that the structural strength and reliability of the supporting member 140 of the board card device 100 can be enhanced more effectively.

In addition, a receiving structure is formed by the cooperation of the cover 110 and the support 140 to receive the main portion 1310 of the printed circuit board 130. Compared with the prior art, the air leakage quantity of the accommodating structure on the two sides of the width direction is greatly reduced, so that the heat dissipation capacity of the board card device 100 is improved.

According to an embodiment of the present disclosure, as shown in fig. 3 and 4, the present disclosure provides a board device 100, which may include a printed circuit board 130, a support member 140, and a cover member 110. The printed circuit board 130 includes a main body portion 1310 and a connection portion 1320 at a first side of the main body portion 1310 in a width direction; the support 140 includes a back plate portion 1410 and a first side wall 1420 at a first side of the back plate portion 1410, the back plate portion 1410 for supporting the printed circuit board 130, the connection portion 1320 passing through the first side wall 1420; and the cover 110 includes a third side and a fourth side, the third side of the cover 110 is coupled to the first sidewall 1420 of the supporter 140, and the fourth side is coupled to the supporter 140 or the printed circuit board 130, thereby forming a receiving structure to receive the main portion 1310 of the printed circuit board 130.

The detailed descriptions of the functions of the main portion 1310 and the connecting portion 1320 of the pcb 130, the connection relationship between the main portion 1310 and the connecting portion 1320, and the like are the same as or similar to the descriptions above, and are not repeated herein.

The support 140 may include a back plate portion 1410 and a first sidewall 1420 on a first side of the back plate portion 1410. The back plate portion 1410 may be used to support the printed circuit board 130 and may be connected to the main body portion 1310 of the printed circuit board 130, for example, by screws. The first side wall 1420 is disposed at a side where the connection portion 1320 is located, and the connection portion 1320 may pass through the first side wall 1420. More specifically, the height of the first side wall 1420 may be set to exceed the bottom surface of the printed circuit board 130 but not to exceed the upper surface of the printed circuit board 130, and may also be set to exceed the upper surface of the printed circuit board 130 but not to exceed the cover 110. Compared with the prior art, the supporting member 140 has a higher side wall on the side where the connecting portion 1320 is located, so that the structural strength and reliability of the supporting member 140 of the board card device 100 can be enhanced. In addition, since the side where the connection portion 1320 is located may be used to plug in an external device, such as a server, the strength of the first side wall 1420 disposed on the side where the connection portion 1320 is located is improved, and a more significant effect is achieved in terms of ensuring the structural strength and reliability of the board card device 100 and preventing the board card from being deformed.

The cover 110 may include a third side and a fourth side, the third side of the cover 110 may be coupled with the first sidewall 1420 of the support 140, and the fourth side may be coupled with the support 140 or the printed circuit board 130. More specifically, when the supporter 140 has only one side wall in the width direction, i.e., the first side wall 1420, the fourth side of the cover 110 may be engaged with the back plate portion 1410 of the supporter 140 or the printed circuit board 130; when the support 140 has two sidewalls in the width direction, the fourth side of the cover 110 may be engaged with the other sidewall of the support 140 or the printed circuit board 130. A receiving structure is formed by the cooperation of the cover 110 and the support 140 to receive the main portion 1310 of the printed circuit board 130.

According to an embodiment of the present disclosure, as shown in fig. 3 and 4, the first side wall 1420 may be provided with a through hole 14201, and the connection portion 1320 may pass through the through hole 14201.

In this embodiment, the through hole 14201 is formed in the first side wall 1420, which can be used for the printed circuit board 130 to be smoothly assembled in the board card device 100, and the through hole design on the first side wall 1420 can ensure that the first side wall 1420 of the board card device 100 is a continuous structure, thereby further improving the structural strength and reliability of the supporting member 140.

The size, shape and location of the through hole 14201 may be adapted according to the connection portion 1320. The cross-sectional size of the through hole 14201 needs to be greater than or equal to the connecting portion 1320 to accommodate the connecting portion 1320. Preferably, the cross-sectional size of the through hole 14201 may be equal to or approximately equal to the size of the connection portion 1320, so that the connection portion 1320 may be prevented from shaking in the through hole 14201, which affects the structural stability of the board card device 100, and the heat dissipation effect is affected because the through hole 14201 is too large to cause air leakage. More preferably, a sealing structure may be formed at the connection position of the through hole 14201 and the connection portion 1320 by a sealing material such as rubber, so as to reduce the abrasion caused by direct contact between the connection portion 1320 and the through hole 14201, and prevent the heat dissipation effect from being affected by air leakage. The through hole 14201 is formed at the first side wall 1420, mainly according to the position of the connection portion 1320 of the printed circuit board 130 at the time of assembly, to achieve smooth assembly of the printed circuit board 130 with the support member 140.

Fig. 5 illustrates a front view of the support 140 in the card device 100 according to one embodiment of the present disclosure.

As shown in fig. 5, the through hole 14201 may have a substantially rectangular or rectangular shape on the first side wall 1420 to facilitate the connection portion 1320 to pass through.

In other embodiments, the first side wall 1420 may be provided with a first recess gap through which the connection portion 1320 may pass.

More specifically, the first recess notch may have a depth smaller than the thickness of the connection portion 1320, a third side of the cover 110 may have a third sidewall, the third sidewall may be provided with a second recess notch, and the first and second recess notches may be coupled to form a through hole through which the connection portion 1320 passes. In this embodiment, a portion of the connection portion 1320 in the thickness direction may pass through the first recess notch of the first side wall 1420, and another portion of the connection portion 1320 in the thickness direction may pass through the second recess notch of the third side wall, and by the cooperation of the support member 140 and the cover member 110, the connection portion 1320 may be sandwiched between the support member 140 and the cover member 110, so that the printed circuit board 130 may be smoothly assembled in the card device 100. In this embodiment, when manufacturing the card device 100, the printed circuit board 130 may be simply placed in the first recess notch and then the second recess notch is fittingly aligned with the first recess notch, thereby mounting the printed circuit board between the support member 140 and the cover member 110. Such an embodiment simplifies manufacturing and facilitates subsequent circuit board replacement and maintenance.

In other embodiments, the depth of the first recess notch may be not less than the thickness of the connection portion 1320. In this embodiment, the connecting portion 1320 may pass entirely through the first indentation. Preferably, the depth of the first recess gap may be approximately equal to the thickness of the connection portion 1320, so as to enhance the structural strength and the heat dissipation capability of the board card device 100 on the basis of realizing the smooth assembly of the printed circuit board 130.

As further shown in fig. 3 and 4, a third side of the cover 110 may have a third sidewall 1120, the third sidewall 1120 being joined with the first sidewall 1420.

Fig. 6 shows a perspective view of the card device 100 according to an embodiment of the present disclosure.

As shown in fig. 6, the third side of the cover 110 may be a flat plate structure, and an end of the first sidewall 1420 is coupled to the third side. In this embodiment, the height of the first side wall 1420 is maximized, which can effectively enhance the structural strength and reliability of the support 140.

According to an embodiment of the present disclosure, as shown in fig. 6, the supporting member 140 may include a second side wall 1430 on a second side of the back plate part 1410, the second side wall 1430 being disposed on a side away from the connection part 1320, and a fourth side of the cover member 110 may be a flat plate structure, an end of the second side wall 1430 being coupled to the fourth side. In this embodiment, the height of the second side wall 1430 is maximized, which can effectively enhance the structural strength and reliability of the supporter 140.

Further, when the heights of the first and second side walls 1420 and 1430 are maximized, the structural strength and reliability of the support 140 of the card device 100 can be maximally enhanced.

FIG. 7 illustrates a side view of the card device 100 according to one embodiment of the present disclosure.

As shown in fig. 7, the fourth side of the cover 110 may have a fourth sidewall 1130, and a main portion of the printed circuit board 130 is clamped between an end of the fourth sidewall 1130 and the support 140.

In this embodiment, the edge of the printed circuit board 130 may be clamped by the fourth sidewall 1130 and the support member 140, so that the air loss of the card device 100 may be reduced. Preferably, the fourth side wall 1130, the printed circuit board 130 and the support 140 may be hermetically connected by a sealing material such as rubber or the like, maximally reducing the loss of air volume.

As further shown in fig. 7, the supporting member 140 may include a second side wall 1430 located at a second side of the back plate portion 1410, the second side wall 1430 is located at a side away from the connecting portion 1320, the second side wall 1430 may be a shorter side wall, and the second side wall 1430 and the fourth side wall 1130 of the cover member 110 clamp an edge of the printed circuit board 130. In other embodiments, the second side of the support 140 may be a flat plate structure, i.e., the edge of the printed circuit board 130 may be clamped by the fourth side wall 1130 and the back plate portion 1410 of the support 140.

According to an embodiment of the present disclosure, an end of the fourth sidewall 1130 may be engaged with the support 140. In this embodiment, an end of the fourth side wall 1130 may be engaged with one side wall of the support 140, and may also be engaged with the back plate portion 1410 of the support 140.

FIG. 8 illustrates a side view of the card device 100 according to one embodiment of the present disclosure.

As shown in fig. 8, the present disclosure provides a board device 100, which may include a printed circuit board 130, a support 140, and a cover 110. The printed circuit board 130 includes a main body portion 1310 and a connection portion 1320 at a first side of the main body portion 1310 in a width direction; the supporting member 140 includes a back plate portion 1410 and a second side wall 1430 at a second side of the back plate portion 1410, the second side wall 1430 limiting the movement of the printed circuit board 130 in the width direction, and the second side wall 1430 being disposed at a side away from the connecting portion 1320; the cover 110 includes a third side and a fourth side, the third side of the cover 110 is coupled to the support 140 or the printed circuit board 130, and the fourth side is coupled to the second side wall 1430 of the support 140, thereby forming a receiving structure to receive the main portion 1310 of the printed circuit board 130.

The detailed description of the main portion 1310 and the connecting portion 1320 of the pcb 130, the connection relationship between the main portion 1310 and the connecting portion 1320, the function of the back plate portion 1410, and the like, is the same as or similar to the corresponding description, and will not be repeated herein.

The height of the second side wall 1430 may be set to exceed the bottom surface of the printed circuit board 130 but not to exceed the upper surface of the printed circuit board 130, and may also be set to exceed the upper surface of the printed circuit board 130 but not to exceed the cover 110. Compared with the prior art, the side of the support member 140 far away from the connecting portion 1320 has a higher side wall, so that the structural strength and reliability of the support member 140 of the board card device 100 can be enhanced.

The third side of the cover 110 is coupled to the support 140 or the printed circuit board 130, and the fourth side is coupled to the second sidewall 1430 of the support 140. More specifically, when the support member 140 has only one side wall in the width direction, i.e., the second side wall 1430, the third side of the cover member 110 may be engaged with the back plate portion 1410 of the support member 140 or the printed circuit board 130; when the support 140 has two sidewalls in the width direction, the third side of the cover 110 may be engaged with the other sidewall of the support 140 or the printed circuit board 130. A receiving structure is formed by the cooperation of the cover 110 and the support 140 to receive the main portion 1310 of the printed circuit board 130.

As further shown in fig. 8, a fourth side of the cover 110 may have a fourth sidewall 1130, and an end of the second sidewall 1430 is joined to an end of the fourth sidewall 1130.

In other embodiments, a fourth side of the cover 110 may be a flat plate structure, and an end of the second sidewall 1430 is joined to the fourth side. The specific implementation can refer to the corresponding description in fig. 6.

According to an embodiment of the present disclosure, the third side of the cover 110 may have a third sidewall 1120, and an end of the third sidewall 1120 may sandwich a main portion of the printed circuit board 130 with the support 140. For the specific implementation, reference may be made to the related description of "the main portion of the printed circuit board 130 is clamped between the fourth sidewall 1130 and the supporting member 140", and the description thereof is omitted here.

According to an embodiment of the present disclosure, the third side of the cover 110 may have a third sidewall 1120, and an end of the third sidewall 1120 is coupled with the supporter 140. In this embodiment, an end of the third sidewall 1120 may be coupled to one sidewall of the supporter 140 and may also be coupled to the back plate portion 1410 of the supporter 140. Further, a through hole or a concave notch may be disposed according to a position relationship between the third sidewall 1120 and the printed circuit board 130 in the thickness direction for passing through the connection portion 1320, which may be referred to the related description of the through hole and the concave notch, and will not be described herein again.

According to one embodiment of the present disclosure, as shown in fig. 7 or 8, the board device 100 may further include a heat sink 120, the heat sink 120 being disposed within the receiving structure of the board device 100, and more specifically, the heat sink 120 being disposed between the cover 100 and the printed circuit board 130. The heat dissipation device 120 may be used to dissipate heat from components on the printed circuit board 130.

According to an embodiment of the present disclosure, as shown in fig. 3 or 6, a size of the support 140 in a length direction may be larger than a size of the printed circuit board 130.

More specifically, the card device 100 may be provided with an air inlet on one side in the length direction, and the printed circuit board 130 is provided in the length direction in a direction away from the air inlet. That is, the distance between the pcb 130 and the air inlet may be a certain distance, so that the area of the air inlet region can be effectively increased, and the increased air inlet region becomes the region from the bottom surface of the supporting member 140 to the upper surface of the covering member 110, thereby improving the heat dissipation capability of the board card device 100.

According to an embodiment of the present disclosure, a dimension of the support 140 in a length direction may be greater than a dimension of the printed circuit board 130 and the heat sink 120.

According to an embodiment of the present disclosure, the board card device 100 conforms to the PCIE specification. More specifically, the local size of the board device 100 may not comply with the PCIE specification, but the overall size of the board device 100 complies with the requirements of the PCIE specification. For example, the size of the printed circuit board 130 of the card device 100 may not comply with PCIe specification, but the size of the supporting member 140 of the card device 100 complies with PCIe specification, so the overall size of the card device 100 still complies with PCIe specification, thereby not affecting the structural adaptation of the card device 100. At this time, the sizes of the printed circuit board 130 in the width direction and the length direction may be smaller than the supporting member 140, that is, the height of one side wall of the supporting member 140 in one side of the width direction may exceed the bottom surface of the printed circuit board 130, so that the strength and reliability of the supporting member 140 may be enhanced, and simultaneously, the air leakage amount or the air intake amount loss of the board card device 100 in the width direction may be reduced, and the printed circuit board 130 may be away from the air inlet by a certain distance in the length direction, thereby increasing the area of the air inlet region and improving the heat dissipation capability of the board card device 100.

In some embodiments, the present disclosure also discloses an electronic device, which includes the board card apparatus 100.

According to different application scenarios, the electronic device or apparatus of the present disclosure may include a server, a cloud server, a server cluster, a data processing apparatus, a robot, a computer, a printer, a scanner, a tablet computer, a smart terminal, a PC device, a terminal of the internet of things, a mobile terminal, a mobile phone, a vehicle recorder, a navigator, a sensor, a camera, a video camera, a projector, a watch, an earphone, a mobile storage, a wearable device, a visual terminal, an autopilot terminal, a vehicle, a household appliance, and/or a medical device. The vehicle comprises an airplane, a ship and/or a vehicle; the household appliances comprise a television, an air conditioner, a microwave oven, a refrigerator, an electric cooker, a humidifier, a washing machine, an electric lamp, a gas stove and a range hood; the medical equipment comprises a nuclear magnetic resonance apparatus, a B-ultrasonic apparatus and/or an electrocardiograph. The electronic device or apparatus of the present disclosure may also be applied to the fields of the internet, the internet of things, data centers, energy, transportation, public management, manufacturing, education, power grid, telecommunications, finance, retail, construction site, medical, and the like. Further, the electronic device or apparatus disclosed herein may also be used in application scenarios related to artificial intelligence, big data, and/or cloud computing, such as a cloud end, an edge end, and a terminal. In one or more embodiments, a computationally powerful electronic device or apparatus according to the present disclosure may be applied to a cloud device (e.g., a cloud server), while a less power-consuming electronic device or apparatus may be applied to a terminal device and/or an edge-end device (e.g., a smartphone or a camera). In one or more embodiments, the hardware information of the cloud device and the hardware information of the terminal device and/or the edge device are compatible with each other, so that appropriate hardware resources can be matched from the hardware resources of the cloud device to simulate the hardware resources of the terminal device and/or the edge device according to the hardware information of the terminal device and/or the edge device, and uniform management, scheduling and cooperative work of end-cloud integration or cloud-edge-end integration can be completed.

The foregoing detailed description of the embodiments of the present disclosure has been presented for purposes of illustration and description and is not intended to be exhaustive or to limit the invention to the precise forms disclosed. Meanwhile, a person skilled in the art should, according to the idea of the present disclosure, change or modify the embodiments and applications of the present disclosure. In view of the above, this description should not be taken as limiting the present disclosure.

It should also be noted that those skilled in the art will appreciate that the embodiments described in this disclosure are capable of being practiced in other than the specifically disclosed embodiments, and that the acts or modules illustrated therein are not necessarily required to practice one or more aspects of the disclosure. In addition, the present disclosure may focus on the description of some embodiments, depending on the solution. In view of the above, those skilled in the art will understand that portions of the disclosure that are not described in detail in one embodiment may also be referred to in the description of other embodiments.

Claims (20)

1. A board card device, comprising:

a printed circuit board including a main body portion and a connection portion at a first side of the main body portion in a width direction;

a support member including a back plate portion for supporting the printed circuit board and one side wall for restricting movement of the printed circuit board in a width direction on one side of the back plate portion; and

a cover member engaged with one side wall of the support member at one side in a width direction and engaged with the support member or the printed circuit board at the other side in the width direction to form a receiving structure to receive a main portion of the printed circuit board.

2. The card device of claim 1,

the support member includes a first sidewall on a first side of the back plate portion, the connection portion passing through the first sidewall;

the cover includes a third side engaged with the first sidewall of the support and a fourth side engaged with the support or the printed circuit board.

3. The card apparatus of claim 2, wherein the first side wall is provided with a first recessed notch through which the connecting portion passes.

4. A card device according to claim 3, characterized in that the depth of the first indentation is smaller than the thickness of the connection portion, the third side of the cover has a third side wall provided with a second indentation, the first and second indentations engaging to form a through hole through which the connection portion passes.

5. The card apparatus of claim 3, wherein the depth of the first indentation is not less than the thickness of the connecting portion.

6. The card device of claim 2, wherein the first side wall is provided with a through hole through which the connecting portion passes.

7. The card device of any of claims 2-6, wherein the third side of the cover has a third sidewall, the third sidewall being engaged with the first sidewall.

8. The card apparatus of claim 2 or 6, wherein a third side of the cover is a flat plate structure, an end of the first sidewall being engaged with the third side.

9. A card device according to any of claims 2-8, characterized in that the fourth side of the cover has a fourth side wall, between the end of which and the support the main part of the printed circuit board is clamped.

10. A card device according to any of claims 2-8, characterized in that the fourth side of the cover has a fourth side wall, the end of which engages with the support.

11. Card device according to claim 1 or 2,

the support member includes a second side wall located on a second side of the back plate portion, the second side wall being for restricting movement of the printed circuit board in a width direction, and the second side wall being provided on a side away from the connection portion;

the cover includes a third side and a fourth side, the third side of the cover being engaged with the support or the printed circuit board, the fourth side being engaged with the second sidewall of the support.

12. The card device of claim 11, wherein the fourth side of the cover has a fourth sidewall, an end of the second sidewall engaging an end of the fourth sidewall.

13. The card apparatus of claim 11, wherein the fourth side of the cover is a flat plate structure with an end of the second side engaging the fourth side.

14. The card device of any of claims 11-13, wherein the third side of the cover has a third sidewall, an end of the third sidewall engaging the support.

15. A card device according to any of claims 11-13, characterized in that the third side of the cover has a third side wall, between the end of which and the support the main part of the printed circuit board is clamped.

16. A card device according to any of claims 1-15, characterized in that the card device further comprises a heat sink, which is arranged in the receiving structure of the card device, more particularly between the cover and the printed circuit board.

17. A card device according to any of claims 1-16, characterized in that the support member has a dimension in the length direction which is larger than the dimension of the printed circuit board.

18. The card device of claim 17, wherein the card device is provided with an air inlet on one side in the length direction, and the printed circuit board is provided in the length direction in a direction away from the air inlet.

19. The board device according to any of claims 1-18, wherein the board device complies with PCIE specifications.

20. An electronic device, characterized by comprising a card device according to any one of claims 1-19.

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