CN217331449U - Inductance type pressure detection chip with positioning function - Google Patents
Inductance type pressure detection chip with positioning function Download PDFInfo
- Publication number
- CN217331449U CN217331449U CN202220104351.7U CN202220104351U CN217331449U CN 217331449 U CN217331449 U CN 217331449U CN 202220104351 U CN202220104351 U CN 202220104351U CN 217331449 U CN217331449 U CN 217331449U
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- Prior art keywords
- chip package
- chip
- fly leaf
- fixedly connected
- reference column
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- 238000001514 detection method Methods 0.000 title claims abstract description 5
- 230000000694 effects Effects 0.000 claims abstract description 32
- 230000007246 mechanism Effects 0.000 claims abstract description 15
- 230000001939 inductive effect Effects 0.000 claims description 7
- 238000009434 installation Methods 0.000 abstract description 11
- 238000009530 blood pressure measurement Methods 0.000 abstract description 7
- 230000008859 change Effects 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Abstract
The utility model relates to a chip technology field just discloses an inductance type pressure measurement chip with locate function, including the chip package, the side surface fixedly connected with pin of chip package, the side surface of chip package is provided with positioning mechanism, positioning mechanism includes the fly leaf, the right side fixedly connected with reference column of chip package is kept away from to the fly leaf. This inductance type pressure detection chip with locate function, through the fly leaf, the reference column, T type spout, T type slider, spacing jack, the activity groove, the activity hole, mutually support between the gag lever post, thereby can fix the fly leaf on chip package's side surface, and make the reference column be located chip package's rear side, peg graft through the rear end with the reference column and the inside via hole of circuit board, thereby realize fixing a position chip package, prevent the offset condition when fixed chip package installation, improve the installation effect.
Description
Technical Field
The utility model relates to a chip technical field specifically is an inductance type pressure measurement chip with locate function.
Background
In the inductance type pressure sensing technology, an off-chip inductor and an off-chip capacitor can be used for assisting in judging distance change, when pressing occurs, a module generates micro deformation so as to cause the change of an off-chip inductor value, and a chip judges whether a pressing behavior occurs or not by sensing the change of the off-chip inductor and the resonance point of the off-chip capacitor; when the chip is required to be installed and fixed on the circuit board, the chip is not convenient to locate, and then the chip is fixed, so that the situation of position deviation is easy to occur when the chip is installed, and the installation position of the chip cannot be accurately determined, and therefore the inductive pressure detection chip with the locating function is required to be provided to solve the problems.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
The utility model provides a not enough to prior art, the utility model provides an inductance type pressure measurement chip with locate function possesses and has positioning mechanism to can fix a position the installation to the chip, prevent advantages such as the skew condition from appearing in the chip installation, solve when fixing the chip installation on the circuit board, be not convenient for fix a position the chip, and then fixed make the chip when the installation, the skew condition appears easily, and can not the accurate problem of confirming the mounted position of chip.
(II) technical scheme
In order to achieve the above purpose, the utility model provides a following technical scheme: the utility model provides an inductance type pressure measurement chip with locate function, includes the chip package, the side surface fixedly connected with pin of chip package, the side surface of chip package is provided with positioning mechanism, positioning mechanism includes the fly leaf, the right side fixedly connected with reference column of chip package is kept away from to the fly leaf, T type spout has been seted up in the front of chip package, the fly leaf is close to one side fixedly connected with T type slider of chip package, the rear side of chip package is provided with the circuit board.
Preferably, the corner of fly leaf and chip package overlap joint each other, T type spout and chip package's side surface intercommunication, the inside sliding connection of T type slider and T type spout to can put into the inside of T type spout with T type slider from chip package's front, realize spacing the fly leaf.
Preferably, the inside of circuit board is seted up the via hole that runs through from top to bottom, the rear end of reference column is located the rear side of fly leaf, the rear end of reference column is pegged graft with the inside activity of via hole to fix a position the chip package, prevent that it from appearing the skew condition on the circuit board.
Preferably, the rear side of the movable plate and the rear sides of the pins are located at the same horizontal height, and the rear sides of the movable plate and the pins are in lap joint with the front side of the circuit board, so that the chip package can be supported and fixed.
Preferably, a limiting jack is formed in the side surface of the chip package, a movable groove is formed in one side, away from the chip package, of the movable plate, a movable hole is formed in one side, close to the chip package, of the movable plate, the position of the movable hole corresponds to that of the limiting jack, a limiting rod is movably connected inside the movable hole, one end, close to the chip package, of the limiting rod is movably connected with the inside of the limiting jack in an inserted mode, and therefore the movable plate can be limited, and the movable plate is prevented from moving back and forth on the side surface of the chip package.
Preferably, the one end fixedly connected with pull ring of chip package is kept away from to the gag lever post, the inside fixedly connected with spring in activity groove, activity groove and activity hole intercommunication, the inside swing joint in gag lever post and activity groove, the one end and the pull ring fixed connection in activity groove are kept away from to the spring, and under the effect of spring, can carry out spacing fixed to pull ring and gag lever post, prevent that the gag lever post from taking place to remove, and then can avoid the one end that the pull ring was kept away from to the gag lever post to remove from the inside of spacing jack.
Compared with the prior art, the utility model provides an inductance type pressure measurement chip with locate function possesses following beneficial effect:
1. this inductance type pressure measurement chip with locate function, through the fly leaf, the reference column, T type spout, T type slider, spacing jack, the activity groove, the activity hole, mutually support between the gag lever post, thereby can fix the fly leaf on chip package's side surface, and make the reference column be located chip package's rear side, peg graft through the rear end with the reference column and the inside via hole of circuit board, thereby realize fixing a position chip package, prevent the offset condition from appearing when fixed chip package installation, improve the installation effect.
2. This inductance type pressure measurement chip with locate function, through T type spout, T type slider, spacing jack, the activity groove, the activity hole, the gag lever post, the pull ring, mutually support between the spring, thereby with chip package installation fixed back, alright with demolish positioning mechanism, through outwards spuring the pull ring, it removes to drive the gag lever post, make the inside that spacing jack can be followed to the gag lever post remove, thereby can be with fly leaf rebound, make T type slider at the inside rebound of T type spout, and remove from the inside of T type spout, and then realize dismantling positioning mechanism, thereby carry out repetitious usage operation to all the other chip packages.
Drawings
FIG. 1 is a sectional view of the top view of the present invention;
FIG. 2 is an enlarged view of the structure A of FIG. 1 according to the present invention;
fig. 3 is a schematic structural diagram of the positioning mechanism of the present invention.
Wherein: 1. packaging a chip; 2. a pin; 3. a movable plate; 4. a positioning column; 5. a T-shaped chute; 6. a T-shaped slider; 7. limiting the jacks; 8. a movable groove; 9. a movable hole; 10. a limiting rod; 11. a pull ring; 12. a spring.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-3, an inductive pressure detecting chip with a positioning function includes a chip package 1, a plurality of pins 2 are fixedly connected to a side surface of the chip package 1, and a rear end of each pin 2 is soldered to a front surface of a circuit board, so that the chip package 1 can be fixed, a positioning mechanism is disposed on the side surface of the chip package 1, the number of the positioning mechanisms is four, the four positioning mechanisms are uniformly distributed at four corners of the chip package 1, the positioning mechanism includes a movable plate 3, a rear side of the movable plate 3 and a rear side of each pin 2 are at the same horizontal height, the movable plate 3 and the rear side of each pin 2 are overlapped with the front surface of the circuit board, and the movable plate 3 and the front surface of the circuit board are overlapped to support and fix the chip package 1, and when the chip package 1 is mounted on the circuit board, the pin 2 can be protected, the right side of the movable plate 3 far away from the chip package 1 is fixedly connected with a positioning column 4, the positioning column 4 can be driven to move together by the movement of the movable plate 3, the front side of the chip package 1 is provided with T-shaped chutes 5, the number of the T-shaped chutes 5 is eight, the eight T-shaped chutes 5 are respectively arranged at four corners of the chip package 1, two T-shaped chutes 5 are arranged at the same corner, one side of the movable plate 3 near the chip package 1 is fixedly connected with a T-shaped sliding block 6, each movable plate 3 is fixedly connected with two T-shaped sliding blocks 6, the corners of the movable plate 3 and the chip package 1 are mutually overlapped, the T-shaped chutes 5 are communicated with the side surface of the chip package 1, the T-shaped sliding blocks 6 are connected with the T-shaped chutes 5 in a sliding manner, and the T-shaped sliding blocks 6 are processed to move from the front side of the chip package 1 to the inside of the T-shaped chutes 5, the movable plate 3 can be moved on the side surface of the chip package 1, and the movable plate 3 is limited to move only forward and backward.
The rear side of the chip package 1 is provided with a circuit board, the interior of the circuit board is provided with a plurality of through holes which penetrate through the circuit board from top to bottom, components mounted on the circuit board can be positioned through the through holes, the rear sides of the positioning columns 4 are positioned on the rear sides of the movable plates 3, the rear ends of the positioning columns 4 are movably inserted into the through holes, when the four positioning columns 4 are inserted into the corresponding four through holes, the chip package 1 can be positioned, the position deviation of the chip package 1 during mounting is prevented, the mounting effect is improved, the side surface of the chip package 1 is provided with limiting jacks 7, one side of the movable plate 3 far away from the chip package 1 is provided with movable grooves 8, one side of the movable plate 3 close to the chip package 1 is provided with movable holes 9, the movable holes 9 correspond to the positions of the limiting jacks 7, the inner parts of the movable holes 9 are movably connected with limiting rods 10, and the movable plates 3 can be further limited, prevent that fly leaf 3 from carrying out the back-and-forth movement, the one end that gag lever post 10 is close to chip package 1 is pegged graft with the inside activity of spacing jack 7, chip package 1's one end fixedly connected with pull ring 11 is kept away from to gag lever post 10, be convenient for remove gag lever post 10 through setting up pull ring 11, make the inside removal of spacing jack 7 can be followed to the one end of gag lever post 10, the inside fixedly connected with spring 12 of activity groove 8, activity groove 8 and activity hole 9 intercommunication, the inside swing joint of gag lever post 10 and activity groove 8, the one end and the pull ring 11 fixed connection of activity groove 8 are kept away from to spring 12, under spring 12's effect, can carry out spacing fixed to gag lever post 10, make gag lever post 10 be difficult for taking place to remove, thereby can improve the fixed effect between fly leaf 3 and the chip package 1, prevent that fly leaf 3 from moving on chip package 1's side surface.
When the device is used, the chip package 1 needs to be installed and fixed on the circuit board, the pins 2 can be welded on the circuit board, so as to fix the chip package, before the pins 2 are welded, four positioning mechanisms need to be respectively arranged at four corners of the chip package 1, and the T-shaped sliding block 6 corresponds to the T-shaped sliding groove 5, so that the movable plate 3 can be moved from the front of the chip package 1 to the direction of the chip package 1, the side surface of the movable plate 3 is in lap joint with the corners of the chip package 1, then the pull ring 11 is pulled, the spring 12 is extended, and the limiting rod 10 is driven to move, so that one end of the limiting rod 10, which is far away from the pull ring 11, enters the movable hole 9, so that the movable plate 3 can be continuously moved backwards, and the T-shaped sliding block 6 enters the inside of the T-shaped sliding groove 5, so as to limit the movable plate 3, when gag lever post 10 corresponds with spacing jack 7's position, under the effect of spring 12, make spring 12 shrink and recover, then can drive gag lever post 10 and move to the inside of spacing jack 7, and then realize carrying on spacing fixedly to fly leaf 3, prevent that it from taking place to move on chip package 1's side surface, then correspond four via hole positions on with four reference columns 4 respectively the circuit board, and insert the inside of via hole with reference column 4, just realize fixing a position chip package 1, prevent that it from taking place the skew condition when the installation.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. An inductance type pressure detection chip with a positioning function comprises a chip package (1), and is characterized in that: the side surface fixedly connected with pin (2) of chip package (1), the side surface of chip package (1) is provided with positioning mechanism, positioning mechanism includes fly leaf (3), right side fixedly connected with reference column (4) of chip package (1) are kept away from in fly leaf (3), T type spout (5) have been seted up in the front of chip package (1), one side fixedly connected with T type slider (6) that fly leaf (3) are close to chip package (1), the rear side of chip package (1) is provided with the circuit board.
2. The inductive pressure detecting chip with positioning function as claimed in claim 1, wherein: the corner of fly leaf (3) and chip package (1) overlap joint each other, the side surface intercommunication of T type spout (5) and chip package (1), the inside sliding connection of T type slider (6) and T type spout (5).
3. The inductive pressure detecting chip with positioning function according to claim 1, characterized in that: the through hole that runs through from top to bottom is seted up to the inside of circuit board, the rear side of reference column (4) is located the rear side of fly leaf (3), the rear end of reference column (4) is pegged graft with the inside activity of through hole.
4. The inductive pressure detecting chip with positioning function according to claim 1, characterized in that: the rear side of the movable plate (3) and the rear sides of the pins (2) are located at the same horizontal height, and the rear sides of the movable plate (3) and the pins (2) are in lap joint with the front side of the circuit board.
5. The inductive pressure detecting chip with positioning function according to claim 1, characterized in that: spacing jack (7) have been seted up to the side surface of chip package (1), movable groove (8) have been seted up to one side that chip package (1) was kept away from in fly leaf (3), movable hole (9) have been seted up to one side that fly leaf (3) are close to chip package (1), movable hole (9) are corresponding with the position of spacing jack (7), the inside swing joint of movable hole (9) has gag lever post (10), gag lever post (10) are close to the one end of chip package (1) and are pegged graft with the inside activity of spacing jack (7).
6. The inductive pressure detecting chip with positioning function as claimed in claim 5, wherein: one end fixedly connected with pull ring (11) of chip package (1) is kept away from in gag lever post (10), the inside fixedly connected with spring (12) of activity groove (8), activity groove (8) and activity hole (9) intercommunication, the inside swing joint of gag lever post (10) and activity groove (8), the one end and pull ring (11) fixed connection of activity groove (8) are kept away from in spring (12).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220104351.7U CN217331449U (en) | 2022-01-13 | 2022-01-13 | Inductance type pressure detection chip with positioning function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220104351.7U CN217331449U (en) | 2022-01-13 | 2022-01-13 | Inductance type pressure detection chip with positioning function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217331449U true CN217331449U (en) | 2022-08-30 |
Family
ID=82992697
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220104351.7U Expired - Fee Related CN217331449U (en) | 2022-01-13 | 2022-01-13 | Inductance type pressure detection chip with positioning function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217331449U (en) |
-
2022
- 2022-01-13 CN CN202220104351.7U patent/CN217331449U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20220830 |