CN217330836U

CN217330836U - Semiconductor refrigerating device, refrigerator and wine cabinet

Info

Publication number: CN217330836U
Application number: CN202123080903.XU
Authority: CN
Inventors: 王乾新
Original assignee: Individual
Current assignee: Individual
Priority date: 2021-12-09
Filing date: 2021-12-09
Publication date: 2022-08-30
Anticipated expiration: 2031-12-09

Abstract

The utility model relates to a semiconductor refrigerating device, a refrigerator and a wine cabinet, which comprises a semiconductor refrigerating sheet, a cold guide plate arranged at the cold end of the semiconductor refrigerating sheet and a radiator arranged at the hot end of the semiconductor refrigerating sheet; the cold guide plate is a micro-channel soaking plate, the micro-channel soaking plate is a micro-channel cavity formed by extrusion molding of aluminum or aluminum alloy, the port is welded and sealed, and the inside of the micro-channel cavity is vacuum and filled with a phase-change heat transfer working medium. The refrigerator and the wine cabinet adopt the refrigerating device. The utility model discloses in, this refrigerating plant leads cold effectually owing to adopted the microchannel soaking plate to do.

Description

Semiconductor refrigerating device, refrigerator and wine cabinet

Technical Field

The utility model relates to a semiconductor refrigerating plant and semiconductor refrigeration refrigerator, semiconductor refrigeration gradevin.

Background

At present, semiconductor refrigeration devices such as refrigerators, wine cabinets and the like generally adopt aluminum plates as cold guide plates, the cost is increased along with the rise of the price of aluminum, and the effect of the aluminum plates as the cold guide plates is not good enough.

SUMMERY OF THE UTILITY MODEL

Aiming at the semiconductor refrigerating device in the market at present, the aluminum plate is adopted as the cold guide plate, the cost is high, the effect is not ideal, and the semiconductor refrigerating device is provided.

The utility model discloses a realize that the technical scheme that its technical purpose adopted is: the utility model provides a semiconductor refrigerating plant, includes the semiconductor refrigeration piece, sets up at the cold end of semiconductor refrigeration piece lead cold plate and set up the radiator in semiconductor refrigeration piece hot junction, its characterized in that: the cold guide plate is a micro-channel soaking plate, the micro-channel soaking plate is a micro-channel cavity formed by extrusion molding of aluminum or aluminum alloy, the port is welded and sealed, and the inside of the micro-channel cavity is vacuum and filled with a phase-change heat transfer working medium.

Further, in the semiconductor refrigeration apparatus described above: the cross section of the micro-channel cavity of the micro-channel soaking plate is polygonal.

Further, in the semiconductor refrigeration apparatus described above: the cross section of the micro-channel cavity of the soaking plate is quadrilateral.

Further, in the semiconductor refrigeration apparatus described above: the surface of the micro-channel cavity of the micro-channel soaking plate is provided with micro grooves, and the micro grooves and the micro-channel cavity are integrally formed in an extrusion mode.

Further, in the semiconductor refrigeration apparatus described above: each micro-channel cavity in the micro-channel vapor chamber is independently sealed, and each micro-channel cavity is a micro heat pipe.

Further, in the semiconductor refrigeration apparatus described above: the surface of the micro-channel soaking plate is sprayed with a cold radiation enhancing coating or paint.

The utility model discloses still contain a semiconductor refrigeration refrigerator and semiconductor refrigeration gradevin, adopted above-mentioned refrigerating plant in refrigerator and the gradevin.

The utility model discloses because adopted the microchannel soaking plate to do and lead cold plate, lead cold effectual.

The present invention will be described in detail with reference to the accompanying drawings and specific embodiments.

Drawings

Fig. 1 is a front view of a semiconductor refrigeration device according to embodiment 1 of the present invention;

fig. 2 is a front view of a semiconductor refrigeration device according to embodiment 2 of the present invention;

figure 3 is the structural schematic diagram of the micro-channel soaking plate of the utility model.

Detailed Description

In order to make the technical solutions of the present application better understood, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described examples are only a part of the embodiments of the present application, but not all of the embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments in the present application without making any creative effort belong to the protection scope of the present application.

Embodiment 1, this embodiment is a refrigerating apparatus of a semiconductor refrigeration refrigerator or a semiconductor refrigeration wine cabinet, and the refrigerating apparatus includes a semiconductor refrigeration sheet, a cold conducting plate disposed at a cold end 2 of the semiconductor refrigeration sheet, and a heat sink disposed at a hot end of the semiconductor refrigeration sheet. In the embodiment, the cold conducting plate is a micro-channel soaking plate 1, the micro-channel soaking plate 1 is a micro-channel cavity 4 formed by extrusion of aluminum or aluminum alloy, the port is welded and sealed, and the micro-channel cavity 4 is vacuum and filled with a phase change heat transfer working medium. In this embodiment, the phase-change heat transfer working medium is deionized water.

In this embodiment, the cross section of the microchannel cavity 4 is polygonal, specifically quadrilateral, and the microchannel 5 is formed in the cavity, and the microchannel 5 and the soaking plate are integrally extruded and formed, so that the cross section of the microchannel cavity 4 is more accurately described as quadrilateral with the microchannel 5. In this embodiment, each microchannel cavity 4 in the microchannel soaking plate 1 is independently sealed, and each microchannel cavity 4 is a micro heat pipe. In this embodiment, the surface of the microchannel heat spreader plate 1 is coated with a cold-radiation enhancing coating to facilitate better heat exchange with air.

When the semiconductor wafer is electrified and starts to work, the heating end of the semiconductor wafer becomes hot, heat is dissipated in the air through the radiator, the cold end 2 of the semiconductor wafer becomes cold, and cold energy exchanges heat with the air in the refrigerator or the wine cabinet through the cold conduction plate 1 to refrigerate the air.

Embodiment 2, this embodiment is also a refrigerating apparatus for a semiconductor refrigeration refrigerator or a semiconductor refrigeration wine cabinet, and the main difference from the above embodiment 1 is that three soaking plates are used, wherein two soaking plates with the same size are arranged side by using the micro-channel soaking plate 1, the third soaking plate 3 spans the two micro-channel soaking plates 1, the cold end 2 of the semiconductor refrigeration piece is tightly attached to the surface of the third soaking plate 3, in practice, the third soaking plate 3 may also be a micro-channel soaking plate, as shown in fig. 2. In this embodiment, the paths of cold chain transfer are: the cold end 2 of the semiconductor refrigerating sheet → the third soaking plate 3 → the microchannel soaking plate 1 → air.

Claims

1. The utility model provides a semiconductor refrigerating device, includes the semiconductor refrigeration piece, sets up at the cold plate of leading of semiconductor refrigeration piece cold junction and sets up the radiator in semiconductor refrigeration piece hot junction, its characterized in that: the cold conducting plate is a micro-channel soaking plate (1), the micro-channel soaking plate (1) is a micro-channel cavity (4) formed by extrusion of aluminum or aluminum alloy, a port is welded and sealed, and a phase-change heat transfer working medium is filled in the micro-channel cavity (4) in a vacuum mode.

2. The semiconductor cooling device according to claim 1, wherein: the cross section of the micro-channel cavity (4) of the micro-channel soaking plate (1) is polygonal.

3. A semiconductor refrigeration unit as recited in claim 2, wherein: the cross section of the micro-channel cavity (4) of the micro-channel soaking plate (1) is quadrilateral.

4. The semiconductor cooling device according to claim 1, wherein: the surface of the micro-channel cavity (4) of the micro-channel soaking plate (1) is provided with micro grooves (5), and the micro grooves (5) are formed by integrally extruding and forming the micro-channel cavity (4).

5. The semiconductor cooling device according to claim 1, wherein: each micro-channel cavity (4) in the micro-channel soaking plate (1) is independently sealed, and each micro-channel cavity (4) is a micro heat pipe.

6. The semiconductor cooling device according to claim 1, wherein: the surface of the micro-channel soaking plate (1) is sprayed with a coating for enhancing cold radiation.

7. The semiconductor cooling device according to claim 6, wherein: the coating is paint.

8. A refrigerator, characterized in that: comprising a semiconductor refrigeration device according to any one of claims 1 to 7.

9. A wine cabinet is characterized in that: comprising a semiconductor refrigeration device according to any one of claims 1 to 7.