CN217317555U - Vacuum chuck - Google Patents
Vacuum chuck Download PDFInfo
- Publication number
- CN217317555U CN217317555U CN202220606127.8U CN202220606127U CN217317555U CN 217317555 U CN217317555 U CN 217317555U CN 202220606127 U CN202220606127 U CN 202220606127U CN 217317555 U CN217317555 U CN 217317555U
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- Prior art keywords
- chassis
- sucker
- vacuum
- sealing groove
- groove
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Abstract
A vacuum chuck, comprising: a sucker and a chassis; wherein, the sucker is detachably connected with the chassis; one end surface of the sucking disc is provided with a sinking groove, and the other end surface is provided with a sucking disc sealing groove; a plurality of through hole disc structures are uniformly distributed on the sinking groove; the sealing groove of the sucker is positioned on the outer side of the hole disc structure; the chassis is provided with a chassis sealing groove and a plurality of vacuum areas; the chassis sealing groove is positioned at the outer side of the vacuum area; the sucker sealing groove corresponds to and is matched with the chassis sealing groove, and a sealing ring is arranged in the sucker sealing groove to realize the sealing connection between the sucker and the chassis; the hole plate structure corresponds to and is matched with the vacuum area; the vacuum areas are communicated, and the side part of one of the vacuum areas is provided with a suction hole which penetrates out of the chassis.
Description
Technical Field
The utility model relates to the field of semiconductor technology, concretely relates to vacuum chuck.
Background
High brightness AlGaInP leds have been widely used in high efficiency solid state lighting applications, such as display panels, automotive lights, backlights, traffic lights, landscape lighting, and the like. The LED wafer thinning machine is a common device for manufacturing a high-brightness LED device thinning process, and the LED thinning process technology is a key technology for large-scale production of the LED device thinning machine.
The LED wafer thinning machine has the working principle that a white film or a blue film is used for laminating a chip, the chip is placed on a wafer bearing table for vacuum suction so as to be more laminated, a grinding wheel is installed by high-speed rotation of a main shaft, the grinding wheel and the wafer bearing table rotate in the opposite direction, the effect of thinning and polishing the wafer is achieved, the wafer is ground and thinned by materials such as a silicon integrated circuit, a light emitting diode, gallium arsenide, sapphire, alumina, ferric oxide, quartz and a solar cell, and the effects of high brightness and quick heat dissipation are achieved.
However, after the thinning process is completed, it is necessary to perform a wafer unloading operation, and it is difficult to separate the wafer on the white film or the blue film during the wafer unloading operation, so that the breakage rate and the scratch rate are increased. Therefore, there is a need for a device that can facilitate the release of the film and reduce the breakage rate and scratch rate.
SUMMERY OF THE UTILITY MODEL
The utility model provides a vacuum chuck, when needs carry out the lower piece to the wafer, the iron ring instrument that the white membrane of wafer or blue membrane passing through the adaptation will be laminating is put at vacuum chuck and is corresponded the position, and vacuum chuck can inhale tightly with the wafer that corresponds, alright tear white membrane or blue membrane, tear the back, close the vacuum, available tweezers take off the wafer, can effectively reduce broken piece rate and fish tail rate to solve the above-mentioned technical problem.
In one aspect of the present disclosure, a vacuum chuck is provided, including:
a sucker and a chassis;
wherein the sucker is detachably connected with the chassis;
one end face of the sucking disc is provided with a sinking groove, and the other end face of the sucking disc is provided with a sucking disc sealing groove;
a plurality of through hole disc structures are uniformly distributed on the sinking groove;
the sucker sealing groove is positioned on the outer side of the hole disc structure;
the chassis is provided with a chassis sealing groove and a plurality of vacuum areas;
the chassis sealing groove is positioned on the outer side of the vacuum area;
the sucker sealing groove corresponds to and is matched with the chassis sealing groove, and a sealing ring is arranged in the sucker sealing groove to realize the sealing connection between the sucker and the chassis;
the hole disc structure corresponds to and is matched with the vacuum area;
the vacuum areas are communicated, a suction hole is formed in the side portion of one of the vacuum areas, and the suction hole penetrates out of the outer side of the chassis.
Furthermore, a plurality of circular grooves are formed in the sinking groove, and the circular grooves are located on the outer side portion of the hole disc structure.
Further, the suction cup and the side edge of the bottom plate are provided with a plurality of connecting holes which are uniformly distributed;
the sucker is connected with the base plate through the connecting hole.
Furthermore, a channel is arranged between the adjacent vacuum areas;
the channels communicate between adjacent vacuum zones.
Further, the orifice plate structure has a plurality of vacuum orifices uniformly distributed.
Further, the sucker sealing groove and the chassis sealing groove are circular.
Furthermore, a Teflon coating is arranged at the surface end of the sinking groove.
The utility model has the advantages that:
sealing connection is realized through the sealing washer after sucking disc and chassis are connected, connect outside evacuation's device through inhaling the hole, carry out the evacuation operation to the vacuum area, white membrane or the blue membrane that will laminate the wafer take the iron ring instrument of adaptation to place after sinking the groove, the position and every hole dish structure of wafer are corresponding, because the hole dish structure also is corresponding with the vacuum area, after carrying out the evacuation operation to the vacuum area, the wafer can be inhaled tightly through the hole dish structure, can tear white membrane or blue membrane from the iron ring instrument this moment, the outside evacuating device of accessible opens and puts vacuum switch after tearing, with the wafer from the hole dish structure loosen, the wafer is taken off to the rethread tweezers, whole piece process of unloading is very convenient and can effectively reduce fragmentation rate and fish tail rate.
Drawings
FIG. 1 is a perspective view of the chuck;
FIG. 2 is a perspective view of the chuck at another angle;
FIG. 3 is a perspective view of the chassis;
FIG. 4 is a top view perspective of the chuck;
fig. 5 is a detail view at a.
1. A suction cup; 2. a chassis; 3. sinking the tank; 4. a sucker sealing groove; 5. a hole disk structure; 6. a chassis sealing groove; 7. a vacuum zone; 8. sucking holes; 9. a circular groove; 10. connecting holes; 11. a channel; 12. and (4) vacuum holes.
Detailed Description
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood as a specific case by those skilled in the art.
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail with reference to the accompanying drawings in combination with the following embodiments. It should be understood that the description is intended to be illustrative only and is not intended to limit the scope of the present invention. Moreover, in the following description, descriptions of well-known structures and techniques are omitted so as to not unnecessarily obscure the concepts of the present invention.
As shown in fig. 1-5, a vacuum chuck comprising:
a sucker 1 and a chassis 2;
wherein the sucker 1 and the chassis 2 are detachably connected;
one end face of the sucking disc 1 is provided with a sink groove 3, and the other end face is provided with a sucking disc sealing groove 4;
a plurality of perforated hole disc structures 5 are uniformly distributed on the sinking groove 3;
the sucker sealing groove 4 is positioned at the outer side of the hole disc structure 5;
the chassis 2 is provided with a chassis sealing groove 6 and a plurality of vacuum areas 7;
the chassis sealing groove 6 is positioned at the outer side of the vacuum area 7;
the sucker sealing groove 4 corresponds to and is matched with the chassis sealing groove 6, and a sealing ring is arranged in the sucker sealing groove to realize the sealing connection between the sucker 1 and the chassis 2;
the hole disc structure 5 corresponds to and is matched with the vacuum area 7;
the vacuum areas 7 are communicated, the side part of one vacuum area 7 is provided with a suction hole 8, and the suction hole 8 penetrates out of the chassis 2.
Specifically, after the suction cup 1 is connected with the chassis 2, the suction cup sealing groove 4 and the chassis sealing groove 6 correspond to each other, and the corresponding part between the suction cup 1 and the chassis 2 is hermetically connected through the sealing ring. The wafer is connected with an external vacuumizing device through a suction hole 8, the external vacuumizing device is provided with two switches which can respectively carry out vacuumizing operation and vacuum releasing operation, when vacuumizing is carried out, the vacuumizing device carries out vacuumizing operation on a vacuum area 7, a white film or a blue film attached to the wafer is placed in a sink groove 3 with an adaptive iron ring tool, the position of the wafer corresponds to each hole disc structure 5, the hole disc structures 5 and the vacuum area 7 are also corresponding, after the vacuumizing operation is carried out on the vacuum area 7, the wafer can be tightly sucked through the hole disc structures 5, the white film or the blue film can be torn from the iron ring tool at the moment, so that the wafer is separated from the white film or the blue film, then the vacuum releasing switch can be opened through the external vacuumizing device, the wafer is loosened from the hole disc structures 5, and then the wafer can be taken down through tweezers, the whole piece discharging process is very convenient and fast, and the piece breaking rate and the scratch rate can be effectively reduced.
Optionally, the hole disc structure 5 and the vacuum area 7 may be set to be 5, and are arranged in an annular array, so that the chuck can tightly suck 5 wafers correspondingly.
It should be noted that, after the suction cup 1 and the chassis 2 are connected in place, they can be placed on an external heating system, and the temperature of the heating plate is controlled by the temperature controller, so that the viscosity of the white film and the blue film is reduced by heating, the film-dropping efficiency is improved, and the film-breaking rate is reduced.
In some alternative embodiments, the sink 3 has a plurality of circular slots 9 therein, the circular slots 9 being at the outer side of the aperture disk structure 5.
By adopting the technical scheme, the iron ring tool adhered with the white film or the blue film can be placed and taken conveniently.
In some alternative embodiments, the suction cup 1 and the lateral edge of the bottom plate 2 have a plurality of connection holes 10 distributed uniformly;
the suction cup 1 and the chassis 2 are connected by a connecting hole 10.
By adopting the technical scheme, the side edge is provided with a circle of connecting holes 10, and the sucker 1 and the chassis 2 are connected through bolts, but the technical scheme is not limited to the mode of connecting through bolts. In this way, the sucker 1 and the chassis 2 can be connected into a whole and can be detached.
In some alternative embodiments, channels 11 are provided between adjacent vacuum zones 7;
the channels 11 communicate between adjacent vacuum zones 7.
Technical scheme more than adopting, communicate through passageway 11 between each vacuum region 7, can make every vacuum region 7 can both carry out the evacuation operation when carrying out the evacuation to one of them vacuum region 7 through inhaling hole 8 to can also keep every vacuum region 7 mutually independent and the hole dish structure 5 that corresponds to cooperate.
In some alternative embodiments, the orifice disk structure 5 has a plurality of vacuum orifices 12 distributed uniformly.
The uniformly distributed vacuum holes 12 can tightly suck the corresponding wafer when the vacuum area 7 is vacuumized, and can not suck external white films or blue films. Alternatively, the vacuum holes 12 on each hole disk structure 5 are four concentric circles, with the vacuum holes 12 on each circle arranged in four incremental ways (see fig. 5).
In some alternative embodiments, the suction cup seal groove 4 and the base plate seal groove 6 are circular.
Technical scheme more than adopting, sucking disc seal groove 4 and chassis seal groove 6 are circular can the holding sealing washer better, can form better sealed environment after sucking disc 1 and chassis 2 are connected.
In some alternative embodiments, the sink 3 is coated with teflon on the surface end.
By adopting the technical scheme, the breakage rate and the scratch rate of the lower wafer can be reduced, and the lower wafer efficiency is improved.
In some embodiments, the suction cup 1 has a length, width, and height of 385 × 10 mm; the length, width and height of the base plate 2 are 385 x 10mm, the connecting holes 10 on the edge are designed into 24 threaded holes of M5, and the suction cup 1 and the base plate 2 are locked through bolts. The length, the width and the height of a sinking groove 3 in the center of the sucker 1 are 347 x 2mm, the sinking groove is sunk by 2mm, a 10-inch iron ring tool can be just put down, the middle part of a white film or a blue film is attached to a wafer, the edge of the white film or the blue film is attached to the iron ring tool, the iron ring is fittingly placed in the sinking groove 3, and the wafer can correspond to a hole disc structure 5; 4 circular grooves 9 are arranged, and the diameter of each circular groove is 50mm, and the circular grooves sink 5 mm; the iron ring tool is convenient to take down. The vacuum hole 12 was set to 1 mm. The vacuum areas 7 are set to be 5 and 4 inches in size, and the diameter of the suction hole 8 is 12 mm.
It is to be understood that the above-described embodiments of the present invention are merely illustrative of or explaining the principles of the invention and are not to be construed as limiting the invention. Therefore, any modifications, equivalents, improvements and the like which are made without departing from the spirit and scope of the present invention should be considered within the protection scope of the present invention. Further, it is intended that the appended claims cover all such variations and modifications as fall within the scope and boundaries of the appended claims or the equivalents of such scope and boundaries.
Claims (7)
1. A vacuum chuck, comprising:
a sucker (1) and a chassis (2);
wherein the sucker (1) is detachably connected with the chassis (2);
a sink groove (3) is formed in one end face of the sucker (1), and a sucker sealing groove (4) is formed in the other end face of the sucker;
a plurality of perforated hole disc structures (5) are uniformly distributed on the sinking groove (3);
the sucker sealing groove (4) is positioned on the outer side of the hole disc structure (5);
the chassis (2) is provided with a chassis sealing groove (6) and a plurality of vacuum areas (7);
the chassis sealing groove (6) is positioned at the outer side of the vacuum area (7);
the sucker sealing groove (4) corresponds to and is matched with the chassis sealing groove (6), and a sealing ring is arranged in the sucker sealing groove to realize the sealing connection between the sucker (1) and the chassis (2);
the hole disc structure (5) corresponds to and is matched with the vacuum area (7);
the vacuum zones (7) are communicated, a suction hole (8) is formed in the side portion of one of the vacuum zones (7), and the suction hole (8) penetrates out of the outer side of the chassis (2).
2. A vacuum chuck according to claim 1, wherein:
the sink tank (3) is internally provided with a plurality of circular grooves (9), and the circular grooves (9) are positioned at the outer side part of the hole disc structure (5).
3. A vacuum chuck according to claim 1 wherein:
the side edges of the sucker (1) and the chassis (2) are provided with a plurality of connecting holes (10) which are uniformly distributed;
the sucker (1) is connected with the chassis (2) through the connecting hole (10).
4. A vacuum chuck according to claim 1, wherein:
a channel (11) is arranged between the adjacent vacuum areas (7);
the channels (11) communicate between adjacent vacuum zones (7).
5. A vacuum chuck according to claim 1, wherein:
the hole plate structure (5) has a plurality of vacuum holes (12) distributed uniformly.
6. A vacuum chuck according to claim 1, wherein:
the sucker sealing groove (4) and the chassis sealing groove (6) are circular.
7. A vacuum chuck according to claim 1, wherein:
the surface end of the sinking groove (3) is provided with a Teflon coating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220606127.8U CN217317555U (en) | 2022-03-18 | 2022-03-18 | Vacuum chuck |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220606127.8U CN217317555U (en) | 2022-03-18 | 2022-03-18 | Vacuum chuck |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217317555U true CN217317555U (en) | 2022-08-30 |
Family
ID=83002255
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220606127.8U Active CN217317555U (en) | 2022-03-18 | 2022-03-18 | Vacuum chuck |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217317555U (en) |
-
2022
- 2022-03-18 CN CN202220606127.8U patent/CN217317555U/en active Active
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