CN217283814U - Water cooling plate of high-power solid-state power supply - Google Patents
Water cooling plate of high-power solid-state power supply Download PDFInfo
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- CN217283814U CN217283814U CN202122618729.3U CN202122618729U CN217283814U CN 217283814 U CN217283814 U CN 217283814U CN 202122618729 U CN202122618729 U CN 202122618729U CN 217283814 U CN217283814 U CN 217283814U
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- water
- cooling plate
- cooling
- power supply
- cooling pipe
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
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Abstract
The utility model provides a water-cooling plate of a high-power solid-state power supply, which comprises a water-cooling plate, wherein a water-cooling pipe is arranged on the water-cooling plate, the water-cooling pipe is wave-shaped, an embedded groove matched with the water-cooling pipe is arranged on the water-cooling plate, the water-cooling pipe adopts an embedded structure to be connected with the water-cooling plate, and the end part of the water-cooling pipe is detachably connected with a joint; a plurality of fixing holes are formed in the upper side and the lower side of the water cooling plate; the utility model adopts the water cooling mode to dissipate heat of the high-power solid-state power supply, has compact structure and can not generate noise pollution; the power device can be rapidly cooled through rapid water flow; in addition, the water cooling pipe is wavy, so that the contact area can be increased, and the heat dissipation effect is improved; in addition, the water-cooling pipe adopts embedded structure and water-cooling plate to be connected for the water-cooling pipe is not fragile, improves life, and can conveniently maintain, and the result of use is better.
Description
Technical Field
The utility model relates to a water-cooling board specifically is a water-cooling board of high-power solid state power supply.
Background
The requirements of high-power solid-state power supplies on reliability, performance indexes and the like are higher and higher, and the thermal design of extra-high voltage electronic equipment is more and more important. The high-power device IGBT and the energy storage capacitor are key devices in most electronic equipment, and the reliability, the safety and the service life of the whole machine are directly influenced by the working state of the high-power device IGBT and the energy storage capacitor. Therefore, the thermal design of the power device is one of the indispensable procedures of the high-power solid-state power supply. The efficiency of the heat dissipation design is higher and higher while the high-power supply needs to be compact in structure. The mode of adopting the water cooling plate to dissipate heat is one of the modes of dissipating heat efficiently by the high-power solid-state power supply at the present stage.
At present, a high-power solid-state power supply on the market mostly adopts an air cooling design, the size is large, the compactness of a system is poor, and the air cooling can generate noise pollution to cause health damage of research and users. Meanwhile, the water cooling plate of the current electronic product in the market generally has the problems of short service life, difficult maintenance and the like. Therefore, the utility model provides a water-cooling board for high-power solid state power supply to solve the problem that proposes in the above-mentioned background art.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a water-cooling board of high-power solid state power to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme:
a water cooling plate of a high-power solid-state power supply comprises a water cooling plate, wherein a water cooling pipe is arranged on the water cooling plate, the water cooling pipe is wavy, an embedded groove matched with the water cooling pipe is formed in the water cooling plate, the water cooling pipe is connected with the water cooling plate by adopting an embedded structure, and a joint is detachably connected to the end part of the water cooling pipe; the upper side and the lower side of the water cooling plate are provided with a plurality of fixing holes.
As a further aspect of the present invention: the water cooling plate is made of red copper.
As a further aspect of the present invention: and four corners of the water cooling plate adopt a fillet structure.
As a further aspect of the present invention: the water cooling pipe is made of red copper.
As a further aspect of the present invention: the joint is made of brass.
As a further aspect of the present invention: the joint is detachably connected with the end part of the water-cooling pipe in a threaded connection mode.
Compared with the prior art, the beneficial effects of the utility model are that:
by adopting the structure, the utility model adopts the water cooling mode to dissipate heat of the high-power solid power supply through the mutual matching of the water cooling plate, the embedded groove and the joint, the structure is compact, and no noise pollution is generated; through quick water flow, can carry out rapid cooling to power device. Moreover, the water cooling pipe is wavy, so that the contact area can be increased, and the heat dissipation effect can be improved. In addition, the water-cooling pipe adopts embedded structure and water-cooling plate to be connected for the water-cooling pipe is not fragile, improves life, and can conveniently maintain, and the result of use is better.
Drawings
Fig. 1 is a schematic structural diagram of a water-cooling plate of a high-power solid-state power supply.
Fig. 2 is a schematic structural diagram of a water cooling tube in a water cooling plate of a high-power solid-state power supply.
Fig. 3 is a schematic structural diagram of a water cooling plate in a water cooling plate of a high-power solid-state power supply.
Fig. 4 is a schematic structural diagram of a joint in a water-cooling plate of a high-power solid-state power supply.
In the figure: 1. a water-cooled tube; 2. a water-cooling plate; 3. and (4) a joint.
Detailed Description
The technical solution of the present patent will be described in further detail with reference to the following embodiments.
Referring to fig. 1-4, a water-cooling plate of a high-power solid-state power supply comprises a water-cooling plate 2, wherein a water-cooling tube 1 is arranged on the water-cooling plate 2, the water-cooling tube 1 is wave-shaped, an embedded groove matched with the water-cooling tube 1 is formed in the water-cooling plate 2, the water-cooling tube 1 is connected with the water-cooling plate 2 by adopting an embedded structure, a connector 3 is detachably connected to the end of the water-cooling tube 1, the connector 3 is in conduction connection with an external water pump, the power device can be rapidly cooled through rapid water flow, the pressure of water for cooling is mainly controlled by the external water pump, and the flow rate of the water is externally controllable; the upper side and the lower side of the water cooling plate 2 are provided with a plurality of fixing holes for fixing energy storage capacitors of a high-power pulse power supply, so that the energy storage capacitors are cooled, the water cooling plate 2 is provided with a power control device and an energy storage capacitor which are arranged on two sides, the structure is compact, and the power devices and the energy storage capacitor are arranged on two sides of the water cooling plate 2 and can uniformly dissipate heat.
In this embodiment, the water-cooling plate 2 is made of red copper, and is convenient for processing the layout and the corners. Four corners of the water cooling plate 2 adopt a fillet structure, so that the service life is prolonged. The water-cooling pipe 1 is made of red copper, has flexibility and is convenient to bend into a wave shape. The joint 3 is made of brass, so that the strength of the joint is ensured. The joint 3 is detachably connected with the end part of the water-cooling pipe 1 in a threaded connection mode, can be quickly disassembled and assembled and is convenient to use.
In addition, the cooling water of the water cooling plate 2 provides deionized water for the site, and the flow requirement is more than or equal to 5 liters per minute; a normally closed 50 ℃ temperature switch is attached to the water cooling plate 2, so that the temperature rise caused by water cut-off or water leakage is prevented, and the temperature is prevented from being out of control.
The utility model discloses a theory of operation is: when the water cooling type water cooling device is used, the power device and the energy storage capacitor are arranged on two sides of the water cooling 2 plate, the external water body rapidly flows through the release 3 and the water cooling pipe 1, and the power device and the energy storage capacitor are cooled in a water cooling mode.
Although the preferred embodiments of the present patent have been described in detail, the present patent is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present patent within the knowledge of those skilled in the art.
Claims (6)
1. A water cooling plate of a high-power solid-state power supply comprises a water cooling plate (2) and is characterized in that a water cooling pipe (1) is arranged on the water cooling plate (2), the water cooling pipe (1) is wavy, an embedded groove matched with the water cooling pipe (1) is formed in the water cooling plate (2), the water cooling pipe (1) is connected with the water cooling plate (2) through an embedded structure, and a connector (3) is detachably connected to the end part of the water cooling pipe (1); a plurality of fixing holes are arranged on the upper side and the lower side of the water cooling plate (2).
2. The water-cooling plate of the high-power solid-state power supply according to claim 1, wherein the water-cooling plate (2) is made of red copper.
3. The water-cooling plate of the high-power solid-state power supply according to claim 1, wherein the four corners of the water-cooling plate (2) are in a round corner structure.
4. The water-cooling plate for the high-power solid-state power supply according to claim 1, wherein the water-cooling tube (1) is made of red copper.
5. The water-cooled plate of a high-power solid-state power supply according to claim 1, wherein the joint (3) is made of brass.
6. The water-cooling plate for the high-power solid-state power supply according to claim 1, wherein the joint (3) is detachably connected with the end of the water-cooling tube (1) in a threaded manner.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122618729.3U CN217283814U (en) | 2021-10-29 | 2021-10-29 | Water cooling plate of high-power solid-state power supply |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122618729.3U CN217283814U (en) | 2021-10-29 | 2021-10-29 | Water cooling plate of high-power solid-state power supply |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217283814U true CN217283814U (en) | 2022-08-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122618729.3U Active CN217283814U (en) | 2021-10-29 | 2021-10-29 | Water cooling plate of high-power solid-state power supply |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217283814U (en) |
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2021
- 2021-10-29 CN CN202122618729.3U patent/CN217283814U/en active Active
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