CN217283258U - Power amplifier device with shockproof function - Google Patents

Abstract

The utility model discloses a power amplifier device with shockproof function relates to power amplifier technical field. The novel cooling device comprises a housin, first rectangle box is installed through first locking bolt to the leading flank of casing, the second rectangle box is installed through second locking bolt to the trailing flank of casing, first rectangle box all is provided with buffer gear with the side that second rectangle box faces mutually, the centre gripping is fixed in circuit assembly between the buffer gear, it has a screw thread section of thick bamboo to be rectangle fixed mounting on the lower lateral wall of casing, the lower surface of a screw thread section of thick bamboo is installed through adjustment mechanism and is filled up the foot, be provided with cooling mechanism in the mounting box. The utility model discloses can highly adjust this power amplifier device, conveniently place and use on the mesa of co-altitude not, dual buffering simultaneously makes this power amplifier device have better shockproof function, and inside electrical component is difficult for receiving the vibration not hard up or drops, has better cooling effect, and sealed effectual, prevents effectively that dust and water from getting into.

Description

Power amplifier device with shockproof function

Technical Field

The utility model relates to a power amplifier technical field specifically is a power amplifier device with shockproof function.

Background

With the continuous development of society, power amplifier devices are more and more common in life, most of the common power amplifier devices are power amplifiers, which are commonly called amplifiers, and the power amplifiers are used for amplifying weak signals from sound sources or front-stage amplifiers to push sound boxes to play sound. Power amplifiers can be broadly divided into three major categories: professional power amplification, civil power amplification and special power amplification.

Among the prior art, traditional power amplifier device can't carry out altitude mixture control, and lacks buffering shock-absorbing function, causes inside electric elements vibration not hard up or drops easily when being bumped by the mistake, and the cooling effect is not good when traditional heat dissipation fan dispels the heat, can cause a large amount of dust to get into simultaneously, leads to electric elements to be infected with the dust, influences life.

SUMMERY OF THE UTILITY MODEL

The utility model provides a power amplifier device with shockproof function to solve the problem in the background art.

In order to achieve the above object, the utility model provides a following technical scheme: a power amplifier device with shockproof function comprises a shell, wherein a first rectangular box is arranged on the front side surface of the shell through a first locking bolt, a control panel is embedded on the front side wall of the first rectangular box, a second rectangular box is installed on the rear side surface of the shell through a second locking bolt, the rear side wall of the second rectangular box is embedded with an inserting panel, the side surfaces of the first rectangular box and the second rectangular box which face each other are provided with a buffer mechanism, the buffer mechanisms are clamped and fixed between the circuit components, the lower side wall of the shell is fixedly provided with a thread cylinder in a rectangular shape, the lower surface of the thread cylinder is of an opening structure, the lower surface of the thread cylinder is provided with a foot pad through an adjusting mechanism, the left side wall and the right side wall of the shell are both fixedly provided with a mounting box, and the side of the mounting box far away from the circuit assembly is of an open structure, and a cooling mechanism is arranged in the mounting box.

Furthermore, rectangular openings are formed in the side walls, close to the circuit assembly, of the first rectangular box and the second rectangular box.

Further, buffer gear includes first spring and centre gripping box, first spring is rectangle fixed mounting on first rectangle box and the facing side of second rectangle box, equal fixed mounting has the centre gripping box on the facing side of first spring, and around the centre gripping box with the circuit module centre gripping fixed.

Furthermore, the clamping boxes are of a grid structure, and the opposite side surfaces of the front clamping box and the rear clamping box are of an opening structure.

Furthermore, the adjusting mechanism comprises a bolt rod, a second spring and a connecting rod, the bolt rod is installed in the threaded cylinder in a threaded mode, the connecting rod is fixedly installed on the lower surface of the bolt rod through the second spring, and the lower surface of the connecting rod is fixedly connected with the upper surface of the pad foot.

Further, cooling mechanism includes dust screen, waterproof ventilated membrane, semiconductor refrigeration piece and temperature sensor, dust screen fixed mounting keeps away from the circuit subassembly position between the mounting box inner wall, be provided with waterproof ventilated membrane on the dust screen, the semiconductor refrigeration piece inlays and locates on the mounting box is close to the lateral wall of circuit subassembly, temperature sensor installs on the right side inner wall of casing.

Compared with the prior art, the utility model provides a power amplifier device with shockproof function possesses following beneficial effect:

1. this power amplifier device with shockproof function can adjust this power amplifier device's height through setting up adjustment mechanism, conveniently places and uses on the mesa of co-altitude, and adjustment mechanism and buffer gear make this power amplifier have dual shockproof effect simultaneously, and inside electrical component is difficult for receiving the vibration not hard up or drops.

2. This power amplifier device with shockproof function through setting up first rectangle box and second rectangle box with the casing around the side sealed, sealed effectual, effectively prevents that dust and water from getting into, controls the interior cooling mechanism of mounting box and can effectively reduce the casing internal temperature simultaneously, makes each subassembly work under the reasonable temperature, increase of service life.

Drawings

Fig. 1 is a schematic structural view of the present invention;

fig. 2 is a top cross-sectional view of the present invention;

FIG. 3 is a cross-sectional view of the threaded cylinder of the present invention;

fig. 4 is a sectional view of the mounting box of the present invention.

In the figure: 1. a housing; 2. a first locking bolt; 3. a first rectangular box; 4. a control panel; 5. a second locking bolt; 6. a second rectangular box; 7. a plug panel; 8. a buffer mechanism; 801. a first spring; 802. a clamping box; 9. a circuit component; 10. a threaded barrel; 11. an adjustment mechanism; 111. a bolt shank; 112. a second spring; 113. a connecting rod; 12. a foot pad; 13. mounting a box; 14. a cooling mechanism; 141. a dust screen; 142. a waterproof breathable film; 143. a semiconductor refrigeration sheet; 144. a temperature sensor; 15. a rectangular opening.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-4, the present invention discloses a power amplifier device with shockproof function, comprising a housing 1, wherein a first rectangular box 3 is installed on the front side of the housing 1 through a first locking bolt 2, a control panel 4 is embedded on the front side wall of the first rectangular box 3, a second rectangular box 6 is installed on the rear side of the housing 1 through a second locking bolt 5, an inserting panel 7 is embedded on the rear side wall of the second rectangular box 6, buffer mechanisms 8 are respectively arranged on the opposite sides of the first rectangular box 3 and the second rectangular box 6, a circuit assembly 9 is clamped and fixed between the buffer mechanisms 8, a threaded cylinder 10 is fixedly installed on the lower side wall of the housing 1 in a rectangular shape, the lower surface of the threaded cylinder 10 is in an open structure, a pad 12 is installed on the lower surface of the threaded cylinder 10 through an adjusting mechanism 11, installation boxes 13 are fixedly installed on the left and right side walls of the housing 1, and the side of the mounting box 13 far away from the circuit assembly 9 is an open structure, and a cooling mechanism 14 is arranged in the mounting box 13.

Specifically, rectangular openings 15 are formed in the side walls, close to the circuit assembly 9, of the first rectangular box 3 and the second rectangular box 6.

In this embodiment, the rectangular opening 15 facilitates the passage of cables on the control panel 4 and the plug panel 7, and facilitates the electrical connection between the cables and the circuit component 9.

Specifically, the buffer mechanism 8 includes a first spring 801 and a clamping box 802, the first spring 801 is fixedly mounted on the opposite side surfaces of the first rectangular box 3 and the second rectangular box 6 in a rectangular shape, the clamping boxes 802 are fixedly mounted on the opposite side surfaces of the first spring 801, and the circuit assembly 9 is clamped and fixed by the front and rear clamping boxes 802.

In this embodiment, the upper and lower first springs 801 make the upper and lower clamping boxes 802 have a buffering function, and the upper and lower clamping boxes 802 make the circuit assembly 9 have a better buffering and damping function.

Specifically, the clamping boxes 802 are in a grid structure, and the opposite sides of the front and rear clamping boxes 802 are in an open structure.

In this embodiment, the clamping box 802 has a better heat dissipation function, so that the circuit assembly 9 can dissipate heat better.

Specifically, the adjusting mechanism 11 includes a bolt rod 111, a second spring 112 and a connecting rod 113, the bolt rod 111 is installed in the threaded cylinder 10 in a threaded manner, the connecting rod 113 is fixedly installed on the lower surface of the bolt rod 111 through the second spring 112, and the lower surface of the connecting rod 113 is fixedly connected with the upper surface of the pad 12.

In this embodiment, the bolt bar 111 moves up and down in the threaded cylinder 10, and the second spring 112 and the connecting rod 113 can drive the pad 12 to move up and down, so as to achieve the effect of adjusting the height of the casing 1, and meanwhile, the second spring 112 transfers the pad 12 to the connecting rod 113 to reduce vibration, so that the casing 1 has a better shockproof function.

Specifically, cooling mechanism 14 includes dust screen 141, waterproof ventilated membrane 142, semiconductor refrigeration piece 143 and temperature sensor 144, dust screen 141 fixed mounting keeps away from circuit assembly 9 position between the installation box 13 inner wall, be provided with waterproof ventilated membrane 142 on the dust screen 141, semiconductor refrigeration piece 143 inlays and locates on the installation box 13 is close to the lateral wall of circuit assembly 9, temperature sensor 144 installs on the right side inner wall of casing 1.

In this embodiment, temperature sensor 144 monitors the temperature in casing 1, and when the temperature was greater than the setting value, semiconductor refrigeration piece 143 began to refrigerate towards circuit module 9's refrigeration face, to cooling down in the casing 1, made the interior subassembly of casing 1 be in work under the reasonable temperature, and dust screen 141 and waterproof ventilated membrane 142 effectively avoided outside dust and water to get into simultaneously.

When in use, the bolt rod 111 in the adjusting mechanism 11 moves up and down in the threaded cylinder 10, the second spring 112 and the connecting rod 113 can drive the pad 12 to move up and down, so as to achieve the effect of adjusting the height of the shell 1, meanwhile, the second spring 112 can transfer the pad 12 to the connecting rod 113 to reduce the vibration, so that the shell 1 has a better shockproof function, the upper clamping box 802 and the lower clamping box 802 have a buffering function through the upper and lower first springs 801 in the buffering mechanism 8, the circuit assembly 9 has a better buffering and damping function through the upper and lower clamping boxes 802, the height of the power amplifier device can be adjusted, the power amplifier device is conveniently placed on table boards with different heights to use, has a double shockproof effect, internal electrical elements are not easy to be loosened or fall off due to vibration, the front side and the rear side of the shell 1 are sealed through the first rectangular box 3 and the second rectangular box 6, the sealing effect is good, and dust and water are effectively prevented from entering, temperature sensor 144 monitors the temperature in casing 1 in the mechanism 14 of cooling down in controlling the mounting box 13 simultaneously, and when the temperature was greater than the setting value, semiconductor refrigeration piece 143 began to refrigerate towards the refrigeration face of circuit subassembly 9, and to cooling down in the casing 1, the subassembly is in work under reasonable temperature in making the casing 1, and dust screen 141 and waterproof ventilated membrane 142 effectively avoid outside dust and water to get into simultaneously, increase of service life.

To sum up, this power amplifier device with shockproof function can adjust this power amplifier device's height, conveniently places and uses on the mesa of co-altitude not, and double buffering simultaneously makes this power amplifier device have better shockproof function, and inside electrical component is difficult for receiving the vibration not hard up or drops, has better cooling effect, and sealed effectual, effectively prevents dust and water entering.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (6)

1. The utility model provides a power amplifier device with shockproof function, includes casing (1), its characterized in that: the front side face of the shell (1) is provided with a first rectangular box (3) through a first locking bolt (2), a control panel (4) is embedded on the front side wall of the first rectangular box (3), the rear side face of the shell (1) is provided with a second rectangular box (6) through a second locking bolt (5), a splicing panel (7) is embedded on the rear side wall of the second rectangular box (6), the side faces of the first rectangular box (3) and the second rectangular box (6) which face each other are respectively provided with a buffer mechanism (8), a circuit assembly (9) is fixedly clamped between the buffer mechanisms (8), a threaded cylinder (10) is fixedly arranged on the lower side wall of the shell (1) in a rectangular manner, the lower surface of the threaded cylinder (10) is of an open structure, a pad foot (12) is arranged on the lower surface of the threaded cylinder (10) through an adjusting mechanism (11), and a mounting box (13) is fixedly arranged on the left side wall and right side wall of the shell (1), and the side surfaces of the mounting box (13) far away from the circuit assembly (9) are both of an open structure, and a cooling mechanism (14) is arranged in the mounting box (13).

2. The power amplifier device with shockproof function of claim 1, wherein: rectangular openings (15) are formed in the side walls, close to the circuit assembly (9), of the first rectangular box (3) and the second rectangular box (6).

3. The power amplifier device with shockproof function of claim 1, wherein: buffer gear (8) include first spring (801) and centre gripping box (802), first spring (801) are rectangle fixed mounting on first rectangle box (3) and second rectangle box (6) side that faces mutually, equal fixed mounting has centre gripping box (802) on the side that first spring (801) faces mutually, and centre gripping box (802) are fixed with circuit assembly (9) centre gripping around and.

4. The power amplifier device with shockproof function of claim 3, wherein: the clamping boxes (802) are of a grid structure, and the opposite side surfaces of the front clamping box and the rear clamping box (802) are of an opening structure.

5. The power amplifier device with shockproof function of claim 1, wherein: the adjusting mechanism (11) comprises a bolt rod (111), a second spring (112) and a connecting rod (113), wherein the bolt rod (111) is installed in the threaded cylinder (10) in a threaded mode, the connecting rod (113) is fixedly installed on the lower surface of the bolt rod (111) through the second spring (112), and the lower surface of the connecting rod (113) is fixedly connected with the upper surface of the pad foot (12).

6. The power amplifier device with shockproof function of claim 1, wherein: cooling mechanism (14) include dust screen (141), waterproof ventilated membrane (142), semiconductor refrigeration piece (143) and temperature sensor (144), dust screen (141) fixed mounting keeps away from circuit subassembly (9) position between installation box (13) inner wall, be provided with waterproof ventilated membrane (142) on dust screen (141), semiconductor refrigeration piece (143) are inlayed and are located on installation box (13) is close to the lateral wall of circuit subassembly (9), temperature sensor (144) are installed on the right side inner wall of casing (1).

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