CN217279499U

CN217279499U - Device for reducing temperature and noise of GPU chip and the like in high-pressure cold air clearance mode

Info

Publication number: CN217279499U
Application number: CN202220987820.4U
Authority: CN
Inventors: 王晓丹; 廖礼毅
Original assignee: Sichuan Honasoft Technology Co ltd
Current assignee: Sichuan Honasoft Technology Co ltd
Priority date: 2022-04-27
Filing date: 2022-04-27
Publication date: 2022-08-23
Anticipated expiration: 2032-04-27

Abstract

The utility model discloses with the device of high pressure air conditioning clearance mode to cooling noise such as GPU chip relates to one kind and can fall the device of making an uproar to the high-efficient cooling of GPU with high-pressure cold air current. The air pressure pump is communicated with the high-pressure air storage tank, and the high-pressure air storage tank is communicated with an air inlet hole of the GPU box to blow in high-pressure cold air; a gas pressure sensor is arranged in the high-pressure storage cold air box, a gas pipe pneumatic valve is arranged on a gas outlet pipe of the gas storage box, and the gas pipe pneumatic valve is connected with an automatic controller through a wire; the automatic controller is respectively connected with the gas pressure sensor and the power automatic switch through wires. The advantages are that: the air pressure valve of the air pipe is used as a clearance type air supply part, and the GPU chip is cooled by the device in a high-pressure air cooling clearance mode, so that the problem of fog dew generated in a GPU box is solved, high-pressure air cooling at 10-17 ℃ can be used, the noise of a machine room can be greatly reduced without a fan, the cooling is faster, the operation efficiency is improved, the refrigeration energy is saved, and the operation efficiency is improved.

Description

Device for reducing temperature and noise of GPU chip and the like in high-pressure cold air clearance mode

Technical Field

The utility model relates to a computer server heat dissipation technical field especially relates to a with high-pressure cold air current to the high-efficient cooling of GPU, reducible fan or device of making an uproar falls without the fan.

Background

At present, the heat dissipation method for the GPU (or CPU, circuit board, etc.) of a computer server mainly comprises wind cooling and liquid cooling.

Regarding the air cooling method, the air draft of the fan is to continuously extract the heat dissipation of the indoor cold air in the environment outside the machine room cabinet outside the case to the GPU above 40 ℃, and the defects are that the utilization efficiency of the refrigeration energy of the indoor cold air is low, the cost is high, and the noise of the fan is large; the reason is as follows: firstly, a large amount of meaningless refrigeration energy is consumed in a large amount of space in the machine room if the temperature of the machine room environment is 10 ℃, and the temperature difference between an operator of the machine room and the machine room is large, so that the machine room is easy to get ill, and secondly, the heat dissipation effect of the machine room environment on the GPU is very poor, so that the machine room is easy to shut down due to overtemperature, and even the GPU and other heating parts are damaged if the temperature of the machine room environment is 35 ℃; and thirdly, as the temperature of 25 ℃ in the common machine room environment dissipates heat of the GPU, the temperature difference between the cold air of 25 ℃ and the GPU of 40 ℃ is small, and the fan needs to operate with large function to generate rapid airflow, so that the noise of the machine room is large, and the influence on operators and the vibration damage to the server.

Regarding the liquid-cooling evaporative cooling method, the equipment is complex and high in cost, and if cooling liquid leaks, the cooling liquid can damage the GPU and the circuit board.

Regarding the cooling liquid immersion type cooling method, the cooling liquid is expensive, the equipment is complex, the taking out and the repairing from the immersion liquid are inconvenient, the cost is higher, and the application range is narrow.

Chinese patent 201610058267.5 of Langchao electronic information industry GmbH & lt' a novel integrated high-density GPU heat dissipation method the utility model discloses a novel integrated high-density GPU heat dissipation method, its concrete realization process is: firstly, a server system is divided into an upper layer of independent heat dissipation space and a lower layer of independent heat dissipation space through a board card, a GPU (graphics processing unit) display card is placed in the upper layer of space, a switching chip is placed in the lower layer of space, and the two independent spaces are all subjected to heat dissipation through a heat dissipation fan arranged at the rear part of a server case; and carrying out partition type heat dissipation on the GPU display cards on the upper layer, and connecting the gaps between the front row of GPU display cards to the corresponding gaps between the rear row of GPU display cards through the air guide cover. Compared with the prior art, the novel heat dissipation method of the integrated high-density GPU solves the heat dissipation of the rear GPU display card through a layered architecture and an isolated heat dissipation design, and can ensure the heat dissipation of the exchange chip at the same time, thereby ensuring the optimal heat dissipation of the whole server system; the independent air guide cover is utilized, the display card can be highly integrated, the application range is wide, and the air guide cover can be applied to the heat dissipation design of all electronic products. This patent has solved the even radiating problem of a plurality of GPU display cards of different positions in a casing, but be used for radiating forced air cooling gas still to be the computer lab gas, and the general C level computer lab gas temperature permissible range is at 10 ~ 35 ℃, and the temperature is lower, and then a large amount of energy consumptions that a large amount of spaces are meaningless if computer lab environment 10 ℃, then very poor to GPU's radiating effect if computer lab environment 35 ℃, very easy overtemperature shutdown appears, damage GPU chip and other parts that generate heat even.

Wave electronic information industry limited 201510901883.8 "a novel server heat dissipation design method of high density integrated display card the utility model discloses a novel server heat dissipation design method of high density integrated display card belongs to server heat dissipation design method, the utility model discloses the technical problem that solves is how can satisfy the heat dissipation of high-power consumption GPU card, guarantees the heat dissipation of high-power consumption exchange chip again simultaneously for how. The technical scheme is as follows: the method comprises the following steps: 1 position of the display card: a high-power display card is placed in the system, one half is placed in the front row, and the other half is placed in the rear row; the display cards in the front row and the back row are at the same height, and the display cards in the front row and the back row are arranged in a staggered manner; 2, heat dissipation channel: the air duct comprises a channel A and a channel B which are independent; 3, a 1U space of the server case system is provided with an exchange module: spaced from the upper 3U space.

The utility model provides a circulation liquid cooling heat dissipation server node machine case belongs to and handles heat dissipation technical field that 201910689432.0 "circulation liquid cooling heat dissipation server node machine case can not sealed completely, easily makes the dust get into the problem to the quick-witted case of current complete machine wind path of country net black dragon Jiang province electric power limited company. The radiator of the utility model is fixed on the shell, the shell and the radiator form a sealed space, and the CPU heat exchanger, the GPU heat exchanger, the liquid pump and the liquid tank are arranged in the space; the liquid tank is filled with cooling liquid, the radiator is provided with a plurality of radiating fins which are of hollow structures, the cooling liquid flows in a snake shape in the radiating fins and conducts heat to the fins, and the cooling liquid flows into the liquid tank from the liquid tank, the CPU heat exchanger, the radiator and the GPU heat exchanger in sequence to form circulating liquid; the CPU heat exchanger is tightly contacted with a CPU main circuit board of the server and conducts heat generated by the CPU to the cooling liquid; and the GPU heat exchanger is in close contact with the GPU slave circuit board of the server and conducts heat generated by the GPU slave circuit board to the cooling liquid. This patent is with circulative cooling liquid in the heat exchanger, to GPU and circuit board heat dissipation, but this kind of setting is complicated, and is with high costs, if takes place the coolant liquid and leaks, the coolant liquid will cause the damage to GPU and circuit board.

Disclosure of Invention

The utility model aims at providing a high-pressure air conditioning clearance mode that the actual computing ability is stronger such as lower, the GPU chip to the device of cooling noise such as GPU chip of cryogenic energy high-efficient utilization, computer lab noise are low, GPU chip etc. keep clean, operating temperature such as GPU chip is lower.

GPU chip etc. indicate the radiator on GPU chip, CPU chip, the chip, for the simple characters of GPU chip replace for the narration.

The GPU refers to an arithmetic unit to be heated, such as a GPU chip or a CPU chip, and is simply replaced with GPU simple characters for description.

The GPU box 4 is a box body provided with a GPU chip or a CPU chip and is provided with an air inlet and an air outlet.

High-pressure cold air means: the high-pressure cold air is the same as the high-pressure cold air, the high-pressure cooling air and the high-pressure cooling air in terms of concept, and different words are used only for convenience of different terms. The high pressure of the high-pressure cold air is from more than one atmospheric pressure to slightly less than the atmospheric pressure of a common household pressure cooker, so that the flow velocity of the air blown out of the high-pressure cold air to the GPU chip and the like is 5 m/s-40 m/s, and different atmospheric pressure values are adopted due to the influences of the size, the length and the like of a gas pipeline from the high-pressure cold air storage box to the GPU chip and the like and the bending generated by the physical installation of the gas pipeline, so the specific meaning of the high pressure is the variable atmospheric pressure with the pressure ranging from 105KPa to 150 KPa. The cold air is the refrigerating gas which is output by the refrigerating equipment and is at the temperature of 10-17 ℃ lower than the ambient room temperature. Compare with the convulsions negative pressure of present fan, the utility model discloses high-pressure air conditioning's high pressure means, has the gaseous refrigerant of positive atmospheric pressure. Prior art can not be too big because the fan power of noise and vibration problem messenger GPU box and quick-witted case, and fan power is restricted, and the utility model discloses with forward atmospheric pressure, the pneumatic pump that can put outside the computer lab produces forward atmospheric pressure, and pneumatic pump power is not restricted, and atmospheric pressure size just can be greater than the atmospheric pressure that the fan produced, can provide more than fan power, the faster high atmospheric pressure of air velocity. The utility model discloses an important invention point is replaced the fan low atmospheric pressure slow air current of GPU box and quick-witted case with the quick air current of air pressure generation high atmospheric pressure with the air pressure pump.

The conception of the utility model is that: the utility model discloses with can put the pneumatic pump 1 outside the computer lab and produce atmospheric pressure, pneumatic pump 1 power is not restricted, can provide more than fan power, the higher atmospheric pressure that air speed is faster, can effectively drive the fog dew with the high atmospheric pressure, then just can be with than the lower gas temperature of present fan cooling to cooling such as GPU chip, just improved cooling efficiency with lower gas temperature, better protection GPU chip etc. improves GPU chip operational capability. The important invention point of the utility model is that the high-pressure air pump 1 is used to generate high-pressure fast air flow to replace the low-pressure slow air flow of the fan of the GPU box 4 and the case, and the high-pressure air is used to remove fog dew, and the air used for heat dissipation can use the temperature of the air with the temperature of 10 ℃ to 17 ℃ which is lower than the temperature of the fan.

The temperature of the common machine room for cooling by the existing fan is room temperature or about 25 ℃, because the working mode of continuous exhaust of the fan saves refrigerating energy in the temperature range, but the defects are that the temperature difference between the temperature of the temperature range of about 25 ℃ and heating elements such as a GPU chip is small, the heat dissipation efficiency is not high, the utilization rate of the refrigerating energy is low, the cooling cost is high, the noise of the fan is large, particularly when the workload of the GPU chip is large and the temperature is high, the heat dissipation of the fan is slow, the cooling effect is poor, the temperature of the GPU chip is not raised continuously, the computing capability is reduced, and the GPU chip is easy to stop or damage.

The utility model discloses a with lower air conditioning heat dissipation solution problem: for solving radiating gas temperature and these little problems of GPU chip difference in temperature, the utility model discloses blow off 10-17 ℃ of air conditioning with the high pressure clearance mode and directly blow the cooling such as GPU chip, the difference in temperature of heating element such as air conditioning and GPU chip has been increased, the radiating efficiency improves, cryogenic energy utilization is rateed highly, cooling cost reduction, need not or low-power use the fan and the noise is low, refrigeration plant puts and makes its noise not influence the computer lab outside the computer lab, especially enable the operating temperature reduction of GPU chip etc. can not shut down and increase life-span such as GPU chip, make the operational capability reinforcing.

The existing fan does not need to cool at 10-17 ℃, which causes the defect of temperature selection: the existing fan is used for cooling, gas is continuously discharged, negative pressure generated by the fan is very low, high-speed airflow cannot be generated around a GPU chip and the like, so that the heat dissipation effect is poor, the temperature of the sucked cooling gas is the same as that of the air in a machine room, for example, the temperature of the air in the machine room is 10-17 ℃, refrigeration energy is too wasted due to low temperature of a large amount of space in the machine room, the air at 10-17 ℃ is continuously discharged, so that a large amount of refrigeration energy is discharged under the condition of insufficient utilization, the temperature of the machine room is too low, the GPU chip and the like cannot fully utilize the refrigeration energy of the airflow, so that the existing fan cooling machine room does not use the cooling temperature of 10-17 ℃, and the national standard GB 2887-89 stipulates that the environmental temperature of the GPU chip is A level 22 +/-2 ℃.

The utility model discloses the reason is selected to cooling gas 10 ℃ -17 ℃ temperature range: the first reason, about energy saving and noise reduction problem, and the utility model discloses supply air conditioning just can use 10 ℃ ~ 17 ℃ air conditioning cooling with the high pressure clearance mode, because the computer lab is the room temperature not high-pressure air conditioning, only blow GPU chip etc. when high-pressure air conditioning, the difference in temperature is greater than the gas of present fan cooling, and can cool down more fast, can stop blowing in after the cooling reaches the rated value, make full use of 10 ℃ ~ 17 ℃ air conditioning that remains in the computer lab box and in the computer lab continues to cool down the heat that the GPU chip newly sent, make full use of refrigerated energy; the refrigerator can be put outside the computer lab, then the computer lab is noiseless, so the utility model discloses can make operating temperature such as the cooling of GPU chips reduces, cooling cost reduction, GPU chips is better, computing power reinforcing, noise are very low. For the second reason, regarding the anti-fog dew problem, the prior art stipulates that the national standard GB 2887-89 of the fan cooling technology stipulates that the environmental temperature of the GPU chip is 22 +/-2 ℃ on the A level, 15-30 ℃ on the B level and 10-35 ℃ on the C level; when the environmental humidity A is 45% -65%, the maximum dew point temperature suitable for the data center environment is 17 ℃. The minimum temperature is 10 ℃ specified by the standard, so the utility model selects 10 ℃ for the minimum temperature. The reason that 17 ℃ was selected to the high temperature is, the utility model discloses with the technical scheme that high pressure blew in air conditioning, the velocity of flow of air conditioning is greater than the cooling gas flow rate that prior art fan produced far away, so the utility model discloses it can disperse fog dew to blow in air conditioning with the high pressure, so the utility model discloses can choose the high limit value for use to be 17 ℃, with more than 10 ℃, the low temperature gas below 17 ℃ is to the cooling such as GPU chip. Because the utility model discloses blow in air conditioning with the high pressure and can dispel the fog dew at any time, so can have the temperature 10 ℃ -17 ℃ that the easy fog dew that produces that the fan cooling can not choose for use now. The utility model discloses the reason that air conditioning low limit temperature is 10 ℃ is that prior art regulation cooling low limit is 10 ℃, if there is the actual normal operating temperature of concrete GPU chip etc. to be less than 10 ℃, if when 5 ℃ is better, then the utility model provides a high-pressure air conditioning temperature low limit value can be chooseed for use to the technique is 5 ℃, because the utility model provides a 5 ℃ air conditioning produce the problem of fog dew.

The utility model discloses the reason is selected to the gaseous 105 KPa-150 KPa high pressure range of cooling: the utility model discloses cooling gas high pressure value and cooling gas temperature selection are relevant with each factor such as the length of gas storage box outlet duct 8 and equalling divide box outlet duct 19, diameter size, still relevant with calorific capacity such as GPU chip, and the atmospheric pressure scope is selected between 105 KPa-150 KPa, and atmospheric pressure low value is the 105KPa that will be greater than an atmospheric pressure [100KPa ], fall to behind rated low temperature at GPU chip etc. still can use the cooling that generates heat such as little air current compensation GPU chip etc.. The high limit of the air pressure is less than that of the household pressure cooker, so the high limit is 150KPa for safety. The utility model discloses high-pressure cooling gas blows to the different time quantum of GPU chip etc. and the temperature that is fallen to is different for GPU chip etc. also can select certain concrete value among 105 KPa-150 KPa atmospheric pressure scope at different time quantums, and when different temperatures such as GPU chip promptly, certain concrete value among 105 KPa-150 KPa is selected to atmospheric pressure during this time.

The utility model discloses an invention is characterized in that: firstly, can produce than general GPU box fan or quick-witted case fan air current faster high atmospheric pressure cooling gas is used for cooling down to GPU chips etc. owing to adopt high-pressure gas to blow on the GPU in GPU box 4 or on GPU fin 27, not only rapid cooling, can also blow off GPU box 4 with the possible fog dew in GPU box 4 before, can blow off GPU box 4 with the fog dew, solved the fog dew problem, then high-pressure gas can select for use the lower cooling temperature 10 ℃ that fan cooling can not be used-17 ℃, becomes the utility model discloses the high-pressure gas cooling body that could use. Because the high-pressure gas cooling body which is blown in firstly is cooled at 10-17 ℃ in the GPU and the radiating fins 27, and a large amount of cooling energy in the GPU box 4 can be reserved and utilized, the blowing of the compressed gas cooling body can be suspended, so that a gap type that cold air is sometimes not blown out, or a gap type that the flow is sometimes large and sometimes small is provided for cooling the compressed gas cooling body, in short, the method for cooling the GPU chips and the like in the high-pressure cold air gap type is a method for cooling the GPU chips and the like in a high-pressure cooling mode, and the fog dew is removed because the cooling gas flows at high speed due to high pressure; and the refrigeration equipment can be placed outside the machine room without using a fan, or using a few fans or using a fan for a gap, so that the noise of the machine room is greatly reduced.

In a word, the utility model discloses just having solved the fog dew problem with positive high-pressure air conditioning, can not having the fan again and greatly reduced the noise, can also provide air conditioning with the clearance mode and just make full use of air conditioning and practice thrift the refrigeration energy, solved the fog dew problem and just can make its cooling fast with low temperature 10 ℃ -17 ℃ air conditioning, the GPU chip can work in the lower temperature environment than fan cooling method, has protected GPU chip etc. better, makes GPU chip arithmetic efficiency improve; the invention also aims to save energy, reduce noise and improve operation efficiency.

The content of the utility model is:

the device for reducing temperature and noise of the GPU chip and the like in a high-pressure air cooling clearance mode comprises a pneumatic pump 1, a high-pressure air cooling box 2, a GPU chip, a radiator 3 and an automatic controller 13, and is characterized in that: the GPU chip and the radiator 3 are arranged in a GPU box 4, and the GPU box 4 is provided with an air inlet 5 and an air outlet 6;

the air outlet of the air pressure pump 1 is communicated with the air inlet of the high-pressure storage air-conditioning box 2 through an air outlet pipe 7, and the air outlet of the high-pressure storage air-conditioning box 2 is communicated with the air inlet of the air inlet 5 of the GPU box 4 through an air outlet pipe 8 of the air storage box;

a power switch 11 is arranged on a power line 10 connected with the air pressure pump 1;

a gas pressure sensor 9 is arranged in the high-pressure storage cold air box 2;

an air pipe pressure valve 15 is arranged on an air outlet pipe 8 of the air storage tank;

the automatic controller 13 is connected to the gas pressure sensor 9 and the power switch 11 with electric wires, respectively.

In order to prevent the high-pressure cold gas from reversely flowing back, the pump air outlet pipe 7 is provided with a one-way valve 14 through which the gas can only flow from the pneumatic pump 1 to the high-pressure cold gas storage tank 2.

The check valve 14 prevents the high-pressure cold air stored in the high-pressure cold air storage tank 2 from reversely flowing into the pneumatic pump 1 after the pneumatic pump 1 stops working.

The automatic controller 13 is connected with the air pipe pneumatic valve 15 through an electric wire. The air pressure valve 15 of the air pipe is a control part for outputting high-pressure cold gas in a clearance mode by the high-pressure cold gas storage box 2, and the opening or micro-opening or closing of the air pressure valve 15 of the air pipe is controlled by the automatic controller 13. The automatic controller 13 may be a fixed time setting or may use the chip temperature sensor 16 as a source of control information.

For the normal refrigeration control loop of temperature, the significance of setting rated gas pressure or rated time by using the gas pressure valve 15 of the gas pipe to output high-pressure cold gas is as follows: the gas pressure sensor 9 is mainly used for setting the rated gas pressure in the high-pressure storage cold air tank 2, particularly setting the highest rated gas pressure, and the realization method is that the gas pressure information of the gas pressure sensor 9 is used for controlling a power switch 11 of the pneumatic pump 1 through an automatic controller 13, so that the gas pressure in the high-pressure storage cold air tank 2 is controlled not to exceed the rated gas pressure value. The rated pressure or the rated time is set, the cooling gas which flows rapidly with the pressure can be discontinuously or undulatedly rushed to the GPU chip and the radiator 3, the high-temperature gas which is stuck near the GPU chip and the radiator 3 can be rapidly removed, and the purpose of rapidly cooling the GPU chip and the radiator 3 is achieved. The cooling effect of the cooling gas with the same energy consumption, such as the cooling gas with the lower temperature of 10 ℃ rushing towards the GPU chip and the radiator 3 and the surrounding high-temperature gas, is certainly better than the widely dispersed cooling effect of continuously sucking the room temperature of 25 ℃ by a fan. That is to say, use the utility model discloses a blow the cooling method of low temperature gas better, the more energy saving than the cooling effect of the cooling method that current fan inhales than high temperature gas. The air pressure valve 15 of the air pipe is opened intermittently, so that a GPU fan and a chassis fan can not be used continuously, and the noise of the machine room is greatly reduced; because the pneumatic pump 1 can be placed outside the room, there is only a slight, low frequency, intermittent airflow sound inside the room, rather than a large, high frequency, even resonant, even metal-scrubbing, continuous fan sound. Therefore, the device adds high-pressure cold air to intermittently blow the GPU chip and the radiator 3, has better cooling effect on the GPU chip and the radiator 3, saves cooling energy and has low noise in a machine room.

The automatic control mode is as follows: the air pressure pump 1 presses the cold air into the high-pressure cold air storage box 2, the chip temperature sensor 16 controls the output and time of the high-pressure cold air in the high-pressure cold air storage box 2 to the GPU chip and the radiator 3 by controlling the opening, micro opening and closing of the air pipe air pressure valve 15 through the automatic controller 13, and the high-pressure cold air discharged in a clearance mode controls the GPU chip and the radiator 3 in a set temperature change range; the specific mode is as follows:

when the temperature of the chip temperature sensor 16 reaches a high-temperature set value, the chip temperature sensor 16 enables the automatic controller 13 to drive the air pipe pneumatic valve 15 to be opened, and the air outlet pipe 8 of the air storage tank discharges a large amount of high-pressure cold air to the GPU chip in the GPU box 4 and the radiator 3, so that the GPU chip and the radiator 3 are rapidly cooled.

When the chip temperature sensor 16 is lowered to a rated low-temperature set value, the chip temperature sensor 16 enables the automatic controller 13 to drive the air pressure valve 15 to be slightly opened, and the air outlet pipe 8 of the air storage tank discharges a small amount of cold air to the GPU chip and the radiator 3 in the GPU box 4 to keep the GPU chip and the radiator 3; or when the chip temperature sensor 16 is lowered to the low-temperature set value, the chip temperature sensor 16 enables the automatic controller 13 to drive the air pipe pneumatic valve 15 to be closed, and the temperature of the GPU chip and the radiator 3 is slowly raised.

When in use, the pressure of the high-pressure cold air is preferably 105KPa to 150KPa, and the temperature is preferably 10 ℃ to 17 ℃.

Regarding the choice of air pressure and air flow: the GPU chip and the radiator attached to the GPU chip are cooled by blowing cooling gas, a certain gas flow velocity is selected from 5 m/s to 40 m/s according to the flow rate of the cooling gas, the pressure of the cooling gas in the high-pressure storage air cooling box 2 is selected according to the requirements of the flow rate and the wind speed of the cooling gas, the pressure in the high-pressure storage air cooling box 2 is generally within the range of 105KPa to 150KPa, and the pressure is sufficient and safe.

Set up trachea atmospheric pressure valve 15 on the gas storage tank outlet duct 8 and be the key technology setting that produces the clearance mode and provide high-pressure air conditioning, the clearance mode provides high-pressure air conditioning and makes the temperature of air conditioning can be less than the indoor normal atmospheric temperature of the computer lab rack of current fan continuous type air exhaust mode or 17 ℃ -35 ℃ air temperature, the utility model discloses the preferred cooling effect that provides high-pressure air conditioning 10 ℃ -17 ℃ is obviously superior to current fan room temperature 17 ℃ -35 ℃, and the clearance mode provides high-pressure air conditioning during the clearance inflation, but the energy of the 10 ℃ -17 ℃ air temperature in the box or the quick-witted incasement of make full use of can not make full use of in the continuous waste air conditioning energy of airing exhaust of prior art, current continuous air exhaust makes the refrigerated energy of room machine can not make full use of.

Temperature settings and advantages regarding interstitial cryogenics: the utility model discloses because it blows in cooling gas to be high-pressure clearance formula, so this high-pressure cold gas temperature optional 10 ℃ -17 ℃, then far be less than the indoor normal temperature or 17 ℃ -35 ℃ of the computer lab rack of current fan continuous type air bleed mode, fan continuous type air bleed can only use higher "indoor normal temperature or 17 ℃ -35 ℃", if use 10 ℃ -17 ℃ low temperature then the low temperature gas that the fan got rid of in succession wastes too much to the energy, so want to use the better 10 ℃ -17 ℃ low temperature cooling gas of cooling GPU efficiency, do not waste the energy, only can use the clearance of the utility model to blow in cooling gas, when power consumption components such as GPU chip rise to rated high temperature such as 50 ℃ -65 ℃, blow in 10 ℃ -17 ℃ low temperature cooling gas again in a large number, after cooling power consumption components such as GPU chip to 10 ℃ -17 ℃, stop blowing in 10 ℃ -17 ℃ low temperature cooling gas or a small amount of low temperature cooling gas, when the temperature of the GPU chip rises to 50-65 ℃, a large amount of low-temperature cooling gas of 10-17 ℃ is blown in, and then the power consumption elements such as the GPU chip are cooled to 10-17 ℃. When insufflating in 10 ℃ to 17 ℃ of low-temperature cooling gas in a large number like this, the cooling gas is big with the GPU chip difference in temperature, and the cooling is faster than the indoor normal atmospheric temperature gas of fan, so the utility model discloses with the energy efficiency of cooling gas to cooling such as GPU chip higher, more energy saving, GPU chip etc. have longer low temperature operating time, the operational capability of GPU chip is also higher. The blowing-in type cooling of the cooling gas can blow off dust and water mist at any time, does not have crystal water to damage GPU chips and the like, and enables the cooling gas to be cooled at 10-17 ℃ lower than a fan mode.

The clearance mode of the energy-saving method provides high-pressure cold air: when the temperature of the chip temperature sensor 16 reaches a high-temperature set value, the gas storage box gas outlet pipe 8 discharges a large amount of high-pressure cold gas of 130KPa to 150KPa, the gas flow rate is 20 m/s to 40 m/s, and the temperature is 10 ℃ to 17 ℃;

when the temperature of the chip temperature sensor 16 reaches a low-temperature set value, the air pressure valve 15 is slightly opened, a small amount of high-pressure cold air 105 KPa-130 KPa is discharged from the air outlet pipe 8 of the air storage box, the gas flow rate is 5 m/s-20 m/s, and the temperature is 10 ℃ to 17 ℃; or when the temperature of the chip temperature sensor 16 reaches a low-temperature set value, the air pressure valve 15 of the air pipe is closed, and high-pressure cold air is not discharged.

The utility model discloses a key is the cooling of available clearance mode high pressure air conditioning: high-pressure cold air is blown in through a gas pipe air pressure valve 15 and the like for realizing clearance cooling, when the temperature of the high-pressure cold air blown in through clearance cooling is 10-17 ℃, gas with lower temperature below 10 ℃ can also be input to cool the GPU chip and the radiator 3, the temperature is cooled more quickly, the clearance time from the lowest temperature to the highest temperature for starting cooling is prolonged, but the time for generating water mist dew at the low temperature below 10 ℃ is very quick, and the water mist dew is possibly difficult to completely blow away by 130 KPa-150 KPa high-pressure gas flow and is not recommended to be used. After the GPU chip and the radiator 3 are cooled to 10-17 ℃ from the high-pressure cold gas of 10-17 ℃, the high-pressure cold gas is stopped or slightly blown in, so that the GPU chip and the radiator 3 are heated to 50-60 ℃ for a certain heating time, and in the time of stopping or slightly blowing in the high-pressure cold gas, the cold gas energy of 10-17 ℃ in the GPU box 4 is fully utilized, the energy consumption of cooling is reduced, and the cooling cost is saved.

In the prior art, the fan continuously exhausts air, the air at room temperature or constant air at 25 ℃ is used for heat dissipation, the air for heat dissipation is continuously pumped out by the fan, the air for heat dissipation is high in temperature, the temperature difference between the air for heat dissipation and the GPU chip and the heat sink 3 is small, the cooling efficiency is low, and the power consumption of the fan for heat dissipation and the energy of refrigerating air are wasted; for example, in the prior art, the temperature of the gas for heat dissipation is changed to be 15 ℃ at low temperature, although the temperature difference between the gas for heat dissipation and the GPU chip and the heat radiator 3 is higher, the energy for preparing the gas for heat dissipation at 15 ℃ is more consumed in a large amount of useless space of a machine room, and is continuously pumped out by a fan, so that the energy is more romantic; for example, the gas for heat dissipation in the prior art is changed into high temperature of 40 ℃, the temperature difference between the gas and the GPU chip and the heat radiator 3 is too small, the cooling effect is too poor, and the gas cannot be used, so that the gas is meaningless. Therefore, the clearance type high-pressure air conditioning cooling of the utility model is a method with high cooling efficiency and energy conservation.

In order to communicate the GPU working temperature with the heat dissipation device to form an automatic heat dissipation mode, the GPU chip and the heat dissipation device 3 are provided with chip temperature sensors 16, and the chip temperature sensors 16 are connected with the automatic controller 13 through wires. In practice, the chip temperature sensor 16 is self-contained in the GPU chip and generally does not need to be provided.

For the emergent fog that dehumidifies, be equipped with interior humidity transducer 17 of GPU box 4, humidity transducer 17 uses wire connection automatic control 13 in the box, and when the wet fog that humidity transducer 17 sent in the box exceeded the allowed value promptly fog dew signal, the utility model discloses an emergent fog mode that dehumidifies is opened automatically to the device.

Emergent dehumidification fog dispersal control circuit: the working environment of GPU chips and the like has a specified range for temperature and humidity, and the maximum dew point temperature is 17 ℃ under the condition that the national standard B2887-89 considers that the environmental humidity is 45% -65% of A level. Under the condition that the humidity is 45-65%, the temperature rated value of the chip temperature sensor 16 is 10-45 ℃, namely when the temperature of the chip temperature sensor 16 reaches 45 ℃, high-pressure cold air with the temperature of 10-17 ℃ is blown into the GPU box 4 for cooling, the high-pressure cold air is stopped blowing when the temperature is reduced to 10 ℃, the high-pressure cold air is blown for cooling when the temperature of the chip temperature sensor 16 reaches 45 ℃ again, and a cycle of stopping blowing, blowing again stopped cooling and stopping is formed. In the cycle time of cooling and stopping, if fog dew is generated in the GPU box 4, the fog dew is also driven out of the GPU box 4 by the high-pressure cold air blown in next time, so that the fog dew cannot exist in the GPU box 4 for a long time. Therefore, the environmental humidity is 45% -65% and the utility model can not affect the GPU chip and other problems. However, if the environmental humidity is under the special adverse conditions of more than 85%, the time delay that produces the fog dew in the GPU box 4 is long and the volume also increases, and is probably unfavorable to GPU chip etc. for a long time like this, for solving the problem that this kind of fog dew extension and volume also increase, the utility model discloses be equipped with box internal humidity transducer 17 in GPU box 4, box internal humidity transducer 17 is with the fog dew data that produces the time length and how much of fog dew, close trachea barovalve 15 control through automatic control 13, can be so that before chip temperature sensor 16 temperature does not reach 45 ℃, open trachea barovalve 15 in advance with the fog dew data, drive the fog dew in GPU box 4 in advance with high-pressure air conditioning by force, realize under the special adverse conditions that the environmental humidity is more than 85%, emergent damp-falling drives out the fog dew, protection GPU chip etc. do not receive the fog dew influence.

The GPU chip radiator has a structure with two air flow channels, namely a fast air flow channel and a slow air flow channel: a plurality of vertical radiating small columns 24 are vertically arranged on a radiating plate 23 of the GPU chip and radiator 3, a plurality of vertical radiating small columns 24 are arranged into a plurality of rows of corrugated curves 25, and a plurality of corrugated curves 25 are arranged on the GPU chip and radiator 3.

The GPU chip and a plurality of upright radiating pillars 24 of the radiator 3 are respectively arranged in parallel to form a plurality of corrugated curves 25, and the gap distance between adjacent corrugated curves 25 is greater than the gap distance between adjacent upright radiating pillars 24 in the same corrugated curve 25.

Many ripple curves 25 make up the primary and secondary air flow channels with fast and slow speed to dissipate heat evenly and fast: a group of corrugated curves 25 consisting of a primary airflow channel and a secondary airflow channel and formed by a plurality of vertical radiating small columns 24 is arranged on the radiating fins 27 of the GPU chips and the radiator 3, the gap distance between the adjacent corrugated curves 25 is wider and is used as a primary airflow channel, the gap distance between the adjacent vertical radiating small columns 24 in one corrugated curve 25 is narrower and is used as a secondary airflow channel, and the width of the primary airflow channel is greater than that of the secondary airflow channel; when the high-pressure cold gas output by the gas outlet pipe 8 of the gas storage tank or the gas outlet pipe 19 of the even distribution box is blown on the corrugated curve 25 group, the main gas flow channel is arranged, so that the high-pressure cold gas can completely pass through the corrugated curve 25 group from front to back, and the secondary gas flow channel generates gas vortex, so that the cooling time of the high-pressure cold gas staying on the vertical radiating small column 24 is prolonged.

Structure of the ripple curve 25: a plurality of vertical radiating small columns 24 are vertically arranged on a radiating plate 23 of the GPU chip and the radiator 3, a plurality of vertical radiating small columns 24 are arranged into a plurality of rows of corrugated curves 25, and a plurality of corrugated curves 25 are arranged on the GPU chip and the radiator 3; a plurality of vertical radiating small columns 24 of the GPU chip and the radiator 3 are respectively arranged in parallel to form a plurality of corrugated curves 25, and the gap distance between adjacent corrugated curves 25 is larger than the gap distance between adjacent vertical radiating small columns 24 in the same corrugated curve 25; the gap distance between the adjacent corrugated curves 25 is a main cold air channel, and the flow line of the blown air of the air outlet pipe 8 of the air storage box or the air outlet pipe 19 of the equipartition box is consistent with the channel direction of the opening section of the main cold air channel between the plurality of corrugated curves 25; the width of the distance 30 between the wave crest and the wave trough of the corrugated curve 25 close to the gas outlet pipe 8 of the gas storage box or close to the gas outlet pipe 19 of the equipartition box is larger than the width of the distance 30 between the wave crest and the wave trough of the corrugated curve 25 far away from the gas outlet pipe 8 of the gas storage box or far away from the gas outlet pipe 19 of the equipartition box.

The corrugated curve 25 groups on the GPU chip and the radiator 3 are provided with primary and secondary airflow channels, so that high-pressure cold air can flow through all the corrugated curve 25 groups, hot air and fog dew stagnating in the corrugated curve 25 groups are washed away by high air pressure, the cooling time of the high-pressure cold air on the vertical radiating small columns 24 can be prolonged by using vortex, the vertical radiating small columns 24 are accelerated to be cooled, low-temperature gas at the pipe orifices is blown out firstly, the refrigerating energy is fully utilized, and the cooling cost is reduced.

If a plurality of GPU chips are arranged on one mainboard, and the plurality of GPU chips and the radiator 3 share one heat dissipation plate 23, a plurality of heat dissipation plates 27 with gaps 26 are vertically arranged on the heat dissipation plate 23, and a reciprocating wind shield 28 capable of reciprocating and displacing is arranged above the plurality of heat dissipation plates 27; the support frame 29 for fixing the reciprocating wind deflector 28 is provided in the gap 26 between the heat sinks 27, or on a rail additionally provided to the heat sink 23.

The heat dissipation plate 23 is provided in an inclined manner, or a slide rail on the heat dissipation plate 23 is provided in an inclined manner.

The reciprocating wind deflector 28 enables a mobile distribution device of minimum cooling throughout the elongated fins 27: a reciprocating wind deflector 28 which can reciprocate along with the pressure change of high-pressure cold gas is arranged on a heat radiating fin 27 shared by a plurality of GPU chips and the heat radiator 3, the pressure change from the beginning to the end of a period of blowing out the high-pressure cold gas enables the reciprocating wind deflector 28 to block the high-pressure cold gas flow at different positions of the heat radiating fin 27, and the high-pressure cold gas has the opportunity of generating gas vortex at each position of the long heat radiating fin 27, so that the heat radiation at each position of the long heat radiating fin 27 is uniform.

The reciprocating wind deflector 28 generates a swirling airflow. Because the reciprocating wind deflector 28 blocks the high-pressure cold gas flow at different positions of the heat sink 27, at any blocking position, the high-pressure cold gas is changed from a linear flow to a vortex flow, and the vortex flow increases the temperature reduction residence time of the flow at the blocking position, so as to prevent the high-pressure cold gas from rapidly leaving the heat sink 27, and enhance the heat dissipation effect of the heat sink 27 at the blocking position.

The reciprocating wind deflector 28 is movable on the upper fins 27 without closing the structural design of the fins 27: this open structure also makes it possible to extend the time of high-pressure cold gas when it has a high pressure as much as possible, and to cause the cold gas to stay on the heat dissipating fins 27 in a swirling flow. The reciprocating wind shield 28 can prolong the time of cooling the GPU chip and the radiator 3 at each point by the high-pressure cold gas when the high-pressure cold gas is blown, and blow away the high-temperature gas of the radiating fins 27 on the GPU chip and the radiator 3 as much as possible by high pressure to realize rapid cooling; and when no high-pressure cold gas is blown in, the heat dissipation and the cold and hot gas flow of the radiating fins 27 are not shielded. Therefore, when the high-pressure cold air first contacts the object to be cooled, the reciprocating wind shield 28 slows down diffusion, prolongs the heat dissipation contact time, and makes full use of the high pressure of the high-pressure cold air to blow away the retained hot air, and when no high-pressure cold air is blown, the heat sink 27 does not shield the rapid convection of the cold and hot air, thereby making full use of the refrigeration energy and reducing the cooling cost.

Rectangular gas uniform distribution box: when the gas storage tank gas outlet pipe 8 outputs heat to a plurality of GPU boxes 4 for heat dissipation at the same time, the cooling gas output by the gas storage tank gas outlet pipe 8 needs to be uniformly distributed. The gas storage box is characterized by further comprising a gas equalizing box 18, wherein a gas inlet of the gas equalizing box 18 is communicated with a gas storage box gas outlet pipe 8, the gas equalizing box 18 is provided with a plurality of gas outlets, each gas outlet of the gas equalizing box 18 is communicated with a gas inlet 5 of the GPU box 4 through an equalizing box gas outlet pipe 19, or the equalizing box gas outlet pipe 19 is communicated with a flat horn-shaped gas outlet pipe 20 arranged in the GPU box 4; a porous gas uniform distribution plate 21 is obliquely arranged in the gas uniform distribution box 18; the porous gas uniform distribution plate 21 is provided with air leakage holes 22 with different sizes, and the area of an air guide opening of the air leakage hole 22 close to the air inlet of the gas uniform distribution box 18 is smaller than the area far away from the air inlet of the gas uniform distribution box 18.

The structure that gas in 8 gas storage box outlet pipes is fast evenly distributed to many trachea: uniformly dispersing and inputting high-pressure cold gas in an air outlet pipe 8 of a gas storage tank in a gas equalizing box 18 to a plurality of GPU boxes 4 or a plurality of GPU chips and radiators 3 by using one gas equalizing box 18 and a plurality of equalizing box air outlet pipes 19; each gas equalizing box 18 is communicated with a plurality of equalizing box air outlet pipes 19, each equalizing box air outlet pipe 19 enters an air inlet hole 5 on the GPU box 4, and high-pressure cold gas is input into the GPU box 4, or each equalizing box air outlet pipe 19 is directly aligned with one GPU chip and the radiator 3 to blow out the high-pressure cold gas.

Because the high-pressure cold air is intermittently blown out from the air equalizing box 18, the air pressure in the air equalizing box 18 is changed cyclically, when the high-pressure cold air storage tank 2 starts to output high-pressure air to the air equalizing box 18 each time, the air equalizing box 18 is always in a low-pressure state, and in order to quickly enable each air outlet pipe 19 of the air equalizing box 18 to obtain the same air pressure and air flow, a porous air equalizing plate 21 is required to be arranged in the air equalizing box 18 to serve as an air pressure and air flow quick equalizing device.

The gas equipartition box 18 is used for reducing the number of gas storage box gas outlet pipes 8, one gas storage box gas outlet pipe 8 and one gas equipartition box 18 can be used for one cabinet in a machine room with a large number of cabinets, and a plurality of equipartition box gas outlet pipes 19 are matched, so that the machine room is neat and orderly, otherwise, the gas storage box gas outlet pipes 8 are too many and are disordered, faults cannot be cleared and the maintenance is difficult, and each GPU box 4 or each GPU chip and the radiator 3 in the same cabinet can be used for obtaining high-pressure cooling gas with the same pressure, the same flow and the same temperature.

The porous gas uniform distribution plate 21 is used for making the air leakage hole 22 close to the air outlet pipe 8 of the air storage box smaller, and the air leakage hole 22 far away from the air outlet pipe 8 of the air storage box larger, because the area of the air leakage hole 22 close to the air outlet pipe 8 of the air storage box is small but the air pressure is large, and the area of the air leakage hole 22 far away from the air outlet pipe 8 of the air storage box is large but the air pressure is small; thus, the outlet pipe 19 of the even distribution box which is close to and far from can obtain the flow of the high-pressure cold gas from the outlet pipe 8 of the gas storage box on average. The porous gas uniform distribution plate 21 is preferably arranged in an inclined manner, so that the position close to the gas storage box gas outlet pipe 8 is higher, the position far away from the gas storage box gas outlet pipe 8 is lower, high-pressure cold gas can automatically flow to the uniform distribution box gas outlet pipe 19 far away from the gas storage box gas outlet pipe 8, and the close and far uniform distribution box gas outlet pipes 19 can averagely obtain the flow of the high-pressure cold gas from the gas storage box gas outlet pipe 8.

Uniformly diffusing the small beam of cooling gas discharged from the pipe orifice into gas flow beams with the sizes of the GPU chip and the radiator 3: the small open end of the flat horn-shaped air outlet pipe 20 is communicated with the air outlet pipe 19 of the equipartition box, and the large open end of the flat horn-shaped air outlet pipe 20 is aligned with the GPU chip and the radiator 3; a plurality of gas uniform distribution strip-shaped bulges 32 distributed in a radial manner are arranged on the inner wall of the flat trumpet-shaped air outlet pipe 20, and the radial concentrated end of the gas uniform distribution strip-shaped bulges is positioned at one end close to the air outlet pipe 19 of the uniform distribution box; the strip-shaped bulges 32 for evenly distributing the gas discharged from the evenly-distributing box gas outlet pipe 19 are evenly distributed at the large opening end of the flat flared gas outlet pipe 20 and blown to the GPU chip and the radiator 3.

In order to ensure that the centers and the edge positions of the GPU chip and the radiator 3 can obtain cooling gas with the same flow, a plurality of gas equally distributing strip-shaped bulges 32 are radially distributed on the inner wall of the flat flared gas outlet pipe 20, and the cooling gas with high concentration output by the equally distributing box gas outlet pipe 19 is uniformly dispersed to each position of the GPU chip and the radiator 3, so that the heat dissipation of the GPU chip and the radiator 3 is more uniform.

Spherical gas uniform distribution box: when the gas storage tank gas outlet pipe 8 outputs heat to a plurality of GPU boxes 4 for heat dissipation at the same time, the cooling gas output by the gas storage tank gas outlet pipe 8 needs to be uniformly distributed. The gas equalizing box 18 is a spherical shell formed by two or more parts which can be disassembled and sealed, and a plurality of equalizing box gas outlet pipes 19 are uniformly distributed outside the spherical shell and are communicated with the inside of the spherical shell; one or more gas distribution cone protrusions 31 are arranged in a gas distribution box 18 of the spherical shell, the tip of each gas distribution cone protrusion 31 is close to the opening part of a gas storage box gas outlet pipe 8 in the gas distribution box 18, the bottom of each gas distribution cone protrusion 31 is fixedly connected with the inner wall of the gas distribution box 18, and all gas distribution box gas outlet pipes 19 communicated with the gas distribution box 18 can obtain cooling gas with the same air pressure and flow rate.

The gas equalizing box 18 is a spherical shell, so that the distance between the opening parts of the gas outlet pipes 19 of the equalizing box and the gas outlet pipes 8 of the gas storage box in the gas equalizing box 18 can be reduced, and the gas equalizing efficiency is improved; the gas-sharing cone projection 31 quickly and uniformly disperses the columnar gas input into the gas-sharing box 18 from the gas storage tank gas outlet pipe 8 to each gas-sharing box gas outlet pipe 19 by using a cone inclined plane. The spherical shell has a larger surface area per unit volume for connecting the air outlet pipes 19 of the uniform distribution boxes, and the structure can reduce the internal volume of the spherical shell air uniform distribution box 18 as much as possible, so that the time for the air to rise from low pressure to high pressure in the air uniform distribution box 18 is shortened, a plurality of uniform distribution box air outlet pipes 19 communicated with one air uniform distribution box 18 can obtain cooling air with the same air pressure and the same flow at the fastest speed, and heat dissipation is uniformly carried out on different GPU chips and the heat radiator 3.

The utility model has the advantages that: the device of the utility model generates high-pressure cold air to cool the GPU chip and the like, and has the advantages that the problem of fog and dew generation in the GPU box is solved by using the forward high-pressure cold air, the high-pressure generated gas flow velocity is 20 m/s-40 m/s higher than the fan flow velocity, and the noise of a machine room can be greatly reduced without using a fan; the high-pressure cold air at 10-17 ℃ can be used for providing cold air in a clearance mode, so that the cold air can be fully utilized to save refrigeration energy; the problem of fog and dew is solved, low-temperature cold air of 10-17 ℃ can be used for cooling the GPU chip and the like more quickly, the temperature of the cold air is lower than that of air of a fan, the GPU chip and the like are protected better, the working temperature of the GPU chip and the like is ensured not to be over-temperature, and the operation efficiency of the GPU chip is improved; energy conservation and noise reduction are realized, and the operation efficiency is improved.

Use the utility model discloses device configuration high pressure air conditioning can realize clearance mode output cooling gas to GPU chip and radiator heat dissipation, practices thrift heat dissipation power consumption, improves the operating efficiency, practices thrift the power cost of calculating, reduces the computer lab noise.

The air pressure valve of the air pipe is a key component for controlling whether the high-pressure air storage box outputs cooling air to the GPU chip and the radiator or not by temperature and humidity, and is a final component for outputting the cooling air in a clearance mode.

The automatic controller is controlled by the chip temperature sensor, and the automatic controller is used for controlling the air pressure valve and the air pressure pump, so that the heat dissipation of the GPU chip and the like is removed in an automatic clearance mode of high-pressure cold air.

The gas equalizing box has the effects of reducing the number of gas outlet pipes of the gas storage box and the number of gas outlet pipes of the equalizing box, so that the machine room is neat and orderly, and each GPU chip and each radiator obtain high-pressure cooling gas with the same pressure, the same flow and the same temperature.

The ripple curve and the reciprocating wind shield can generate vortex to prolong the cooling time of high-pressure cold gas to the GPU chip and the radiator, reduce valance diffusion and quickly cool down, make full use of the gas blown in at the lowest temperature at first, make full use of the refrigerated energy and reduce the cooling cost.

The emergency dehumidification and fog dissipation control loop can emergently dehumidify and dissipate fog dew under the special bad condition that the environmental humidity is more than 85%, and protect a GPU chip and the like from being influenced by the fog dew.

Drawings

FIG. 1 is a schematic view of the whole structure of the high-pressure storage air-conditioning box of the present invention for directly cooling the GPU chips in a GPU box;

FIG. 2 is a schematic view of the whole structure of the high-pressure storage cold air box of the present invention for cooling the GPU chips in multiple GPU boxes through one gas-equalizing box;

fig. 3 is a schematic view of an airflow three-dimensional structure of a split gas equalizing box and a plurality of GPU boxes according to the present invention;

FIG. 4 is a schematic view of the three-dimensional structure of the GPU chip and the plurality of vertical heat-dissipating pillars in the GPU box of the present invention;

FIG. 5 is a schematic view of a structure of two corrugated curves of a row of multiple vertical heat-dissipating pillars;

FIG. 6 is a schematic structural view of a plurality of corrugated curves and an air outlet pipe of a equipartition box, wherein the plurality of vertical radiating pillars form a row;

fig. 7 is a schematic view of a three-dimensional structure of the heat sink with a plurality of GPU chips sharing the heat sink of the present invention, wherein a reciprocating wind shield is provided on the heat sink to receive the high-pressure cooling gas blown from the outlet pipe of the averaging box to dissipate heat of the GPU chips and the heat sink, the reciprocating wind shield is changed by air pressure and reciprocates to block the high-pressure cooling gas, so that the high-pressure cooling gas generates vortex, the high-pressure cooling gas extends into the gaps between the plurality of heat sinks, and the utilization rate of the high-pressure cooling gas is improved;

FIG. 8 is a schematic view of a three-dimensional structure of a reciprocating wind deflector disposed in a gap between a plurality of cooling fins on a GPU chip according to the present invention;

FIG. 9 is a schematic structural view showing that the support frame of the reciprocating wind deflector of the present invention is disposed in the gap between the heat dissipating fins, and the reciprocating wind deflector reciprocates due to the change of air pressure;

FIG. 10 is a schematic sectional view of the spherical gas equalizing box of the present invention;

fig. 11 is a schematic view of the structure of the flat horn-shaped outlet pipe of the present invention.

In the figure, 1 is a pneumatic pump, 2 is a high-pressure cold air storage box, 3 is a GPU chip and a radiator, 4 is a GPU box, 5 is an air inlet hole, 6 is an air outlet hole, 7 is a pump air outlet pipe, 8 is an air outlet pipe of the air storage box, 9 is a gas pressure sensor, 10 is a power cord, 11 is an air pump electrical switch, 13 is an automatic controller, 14 is a one-way valve, 15 is an air pipe pneumatic valve, 16 is a chip temperature sensor, 17 is an in-box humidity sensor, 18 is a gas uniform distribution box, 19 is a uniform distribution box air outlet pipe, 20 is a flat horn-shaped air outlet pipe, 21 is a porous gas uniform distribution plate, 22 is an air outlet hole, 23 is a heat dissipation plate, 24 is a vertical heat dissipation column, 25 is a corrugated curve, 26 is a gap, 27 is a heat dissipation plate, 28 is a reciprocating wind deflector, 29 is a support frame, 30 is a peak-valley space, 31 is a uniform distribution gas cone bulge, and 32 is a gas uniform distribution strip-shaped bulge.

Detailed Description

Example 1 Manual device for reducing temperature and noise of GPU chip and the like by using high-pressure cold air gap mode

As shown in figure 1 of the drawings, in which,

The automatic controller 13 is controlled by the gas pressure sensor 9, and then the automatic controller 13 is used for controlling the gas pipe pressure valve 15 and the power switch 11, so that the output gas is automatically controlled within a rated high pressure value range, and conditions are provided for removing the heat dissipation gas in a clearance mode.

The air pipe air pressure valve 15 can be a valve gradually changing from small to large, so that the valve can be incompletely closed after the GPU chip and the radiator 3 are cooled to reach rated values, a small amount of cooling gas is left in a small gap to be used as partial heat to be consumed for compensating the subsequent temperature rise of the GPU chip and the radiator 3, and the time for the GPU chip and the radiator 3 to reach high-temperature rated values again is prolonged.

Setting parameters: when GPU chip and radiator 3 reach high temperature rated value 45 ℃ or 65 ℃, manual operation automatic control 13 makes trachea pneumatic valve 15 open and emit cooling gas to GPU chip and radiator 3 radiating, the utility model discloses the atmospheric pressure of the high-pressure air conditioning of adapted is 105 KPa-150 KPa, and the temperature is 10 ℃ -17 ℃, and the gas velocity of flow is 5 meters per second-40 meters per second. Embodiment 2 device for reducing temperature and noise of GPU chip and the like by using high-pressure cold air gap mode with automatic temperature and humidity control

As shown in figure 2 of the drawings, in which,

the present embodiment is the same as embodiment 1, and only the structure of embodiment 1 is additionally designed as follows:

the pump air outlet pipe 7 is provided with a one-way valve 14 which can only lead the air to flow from the pneumatic pump 1 to the high-pressure cold air storage tank 2.

The automatic controller 13 is connected with the air pipe pneumatic valve 15 through an electric wire.

And a chip temperature sensor 16 is arranged on the GPU chip and the radiator 3, and the chip temperature sensor 16 is connected with the automatic controller 13 through a wire.

A box internal humidity sensor 17 is arranged in the GPU box 4, and the box internal humidity sensor 17 is connected with the automatic controller 13 through a wire.

The check valve 14 serves to prevent the cooling gas in the high-pressure storage cold gas tank 2 from reversely flowing into the pneumatic pump 1.

The air pressure valve 15 of the air pipe is a process-controllable electromagnetic valve which can be opened or slightly opened or closed and has controllable and staying opening process from small to large. The air pipe pressure valve 15 is used for controlling the cooling air which outputs different flows to the GPU chip and the radiator 3 at different time, and ensuring that the cooling air has a certain set rated pressure value of 105 KPa-150 KPa.

The chip temperature sensor 16 is actually a GPU chip, and generally does not need to be set, but the connection pin of the chip temperature sensor 16 of the GPU chip is connected to the automatic controller 13 by a wire, so that the temperature electrical signal of the chip temperature sensor 16 can be received by the automatic controller 13.

An in-box humidity sensor 17 is arranged in the GPU box 4, and the in-box humidity sensor 17 is connected with the automatic controller 13 through a wire to form a control loop for removing fog and dew from high-pressure cold gas output under emergency rated gas pressure or rated time. If the humidity sensor 17 in the box senses that the relative humidity in the GPU box 4 reaches or exceeds 70 percent, the automatic controller 13 enables the power switch 11 to be switched on for conduction, the air pressure pump 1 adds cooling air to the high-pressure storage air conditioner 2 to enable the cooling air to reach 150KPa, and the automatic controller 13 enables the air pressure valve 15 of the air pipe to be in a state of being opened all the time; when the humidity sensor 17 in the box senses that the relative humidity in the GPU box 4 reaches or falls below 40%, the automatic controller 13 turns off the power switch 11, and the automatic controller 13 also returns the air tube pressure valve 15 to the normal state as described in embodiment 1.

Embodiment 3 device for cooling and reducing noise of GPU chip and the like in high-pressure cold air gap mode and provided with rectangular gas uniform distribution box

As shown in the figures 2 and 3, the above-mentioned figures,

the present embodiment is the same as embodiment 2, and only the structure of embodiment 2 is additionally designed as follows:

the GPU air inlet pipe is communicated with an air inlet 5 of the GPU box 4 through an air outlet pipe 19 of the gas equalizing box 18, or the air outlet pipe 19 of the equalizing box is communicated with a flat horn-shaped air outlet pipe 20 arranged in the GPU box 4; a porous gas uniform distribution plate 21 is obliquely arranged in the gas uniform distribution box 18; the porous gas uniform distribution plate 21 is provided with air leakage holes 22 with different sizes, and the area of an air guide opening of the air leakage hole 22 close to the air inlet of the gas uniform distribution box 18 is smaller than the area far away from the air inlet of the gas uniform distribution box 18.

In order to better distribute the gas in the gas storage box outlet pipe 8 to a plurality of gas outlet pipes 19 of the gas equalizing box 18 through the gas equalizing box 18, a porous gas equalizing plate 21 is added in the gas equalizing box 18 to be used as a gas homogenizing device, and the gas homogenizing device can use the following porous gas equalizing plate 21. The concrete structure is as follows:

the porous gas uniform distribution plate 21 which is obliquely arranged is arranged in the gas uniform distribution box 18, the porous gas uniform distribution plate 21 is provided with air leakage holes 22 with different sizes, and the area of the air leakage hole 22 close to the position of the gas inlet of the gas uniform distribution box 18 is smaller than the area of the air leakage hole 22 far away from the gas inlet of the gas uniform distribution box 18. The size distribution rule of the air leakage holes 22 on the porous gas uniform distribution plate 21 meets the requirement of uniformly distributing high-pressure cold air in the gas uniform distribution box 18.

What porous gas equipartition board 21 slope set up means, porous gas equipartition board 21 will be put high apart from the position that gas storage box outlet duct 8 is close, will be put low apart from the position that gas storage box outlet duct 8 is far away, and the gas of gas storage box outlet duct 8 in gas equipartition box 18 of being convenient for can automatic flow to far away position, and the equipartition is far away and near the position obtains equivalent gas.

The air storage box air outlet pipe 8 is communicated with an air uniform distribution box 18 with one inlet and multiple outlets, and the high-pressure cold air in the air storage box air outlet pipe 8 is uniformly inserted into the GPU boxes 4 through a plurality of uniform distribution box air outlet pipes 19 by the air uniform distribution box 18, so that the high-pressure cold air with the same air pressure, air flow and air temperature can be obtained in each GPU box 4.

Embodiment 4 device for cooling and reducing noise of GPU chip and the like in high-pressure cold air gap mode and provided with spherical gas uniform distribution box

As shown in the figures 2 and 10, respectively,

only with the spherical gaseous equipartition box 18 of a one-inlet many-outlets of gas storage box outlet duct 8 switch-on, insert a plurality of GPU boxes 4 with the even difference of many equipartition box outlet ducts 19 of high-pressure air conditioning in a gas storage box outlet duct 8 with a spherical gaseous equipartition box 18 in, can both obtain the high-pressure air conditioning with atmospheric pressure, air current, temperature the same in making every GPU box 4, concrete structure is as follows:

the gas equalizing box 18 is a spherical shell formed by two parts of removable sealing connection, and a plurality of equalizing box gas outlet pipes 19 are uniformly distributed outside the spherical shell and are communicated with the inside of the spherical shell; one or more equally distributed gas cone bulges 31 are arranged in a gas equally distributed box 18 of the spherical shell, the top of the equally distributed gas cone bulges 31 is close to the opening part of the gas storage box gas outlet pipe 8 in the gas equally distributed box 18, the bottom of the equally distributed gas cone bulges 31 is fixedly connected with the inner wall of the gas equally distributed box 18, and all equally distributed box gas outlet pipes 19 communicated with the gas equally distributed box 18 can respectively obtain cooling gas with the same air pressure and flow.

The gas equalizing box 18 is a spherical shell formed by detachably and hermetically connecting an upper hemispherical shell and a lower hemispherical shell, the central position of the upper hemispherical shell is communicated with the gas storage box gas outlet pipe 8, a central position equalizing gas cone projection 31 is fixedly arranged in the lower hemispherical shell in the gas storage box gas outlet pipe 8, a plurality of side position equalizing gas cone projections 31 can be arranged in the gas storage box gas outlet pipe 8, and the side position equalizing gas cone projections 31 are shorter than and smaller than the central position equalizing gas cone projection 31. The contact annular ring of the upper hemispherical shell and the lower hemispherical shell is sealed by a rubber ring, and the two parts are fixed by fasteners or bolts outside the upper hemispherical shell and the lower hemispherical shell, so that the upper hemispherical shell and the lower hemispherical shell can bear the high pressure of high-pressure cooling gas in the shell and cannot leak gas.

The included angle of the cone top of the gas-sharing cone-shaped projection 31 is selected to be 15-30 degrees, and is determined according to the proportion of the length of the gas-sharing cone-shaped projection 31 to the diameter of the spherical gas-sharing box 18, and the longer the gas-sharing cone-shaped projection 31 is, the smaller the included angle of the cone top of the gas-sharing cone-shaped projection 31 is.

Embodiment 5, a device for reducing temperature and noise of a GPU chip and the like using a high-pressure cold air gap method, in which the heat sink has a corrugated curve heat dissipation pillar structure

As shown in figures 2, 4, 5, 6, 10, 11,

this embodiment is the same as embodiment 4, and only the structure of embodiment 4 is additionally designed as follows:

a plurality of GPU chips and radiating fins 27 of the radiator 3 are provided with a corrugated curve 25 group consisting of a primary airflow channel and a secondary airflow channel which are formed by a plurality of vertical radiating small columns 24, the gap distance between adjacent corrugated curves 25 is a main airflow channel, the gap distance between adjacent vertical radiating small columns 24 in one corrugated curve 25 is a secondary airflow channel, and the width of the main airflow channel is greater than that of the secondary airflow channel; when the high-pressure cold gas output by the gas outlet pipe 8 of the gas storage tank or the gas outlet pipe 19 of the even distribution box is blown on the corrugated curve 25 group, the main gas flow channel is arranged, so that the high-pressure cold gas can completely pass through the corrugated curve 25 group from front to back, and the secondary gas flow channel generates gas vortex, so that the cooling time of the high-pressure cold gas staying on the vertical radiating small column 24 is prolonged.

A plurality of vertical radiating small columns 24 are vertically arranged on a radiating plate 23 of the GPU chip and radiator 3, a plurality of vertical radiating small columns 24 are arranged into a plurality of rows of corrugated curves 25, and a plurality of corrugated curves 25 are arranged on the GPU chip and radiator 3.

The plurality of vertical radiating small columns 24 of the GPU chip and the radiator 3 are respectively arranged in parallel to form a plurality of corrugated curves 25, and the gap distance between adjacent corrugated curves 25 is larger than the gap distance between adjacent vertical radiating small columns 24 in the same corrugated curve 25.

The heat dissipation pillars 24 are made of copper, the height is 30.0 mm, the diameter is 1.0 mm, the width of a main airflow channel between two adjacent corrugated curves 25 is 1.5 mm, and the width of a secondary airflow channel between two adjacent heat dissipation pillars 24 is 0.5 mm.

A flat flared gas outlet pipe 20 is arranged in the GPU box 4, the small open end of the flat flared gas outlet pipe 20 is communicated with a gas outlet pipe 19 of the equalizing box, and the large open end of the flat flared gas outlet pipe 20 is aligned with the GPU chip and the radiator 3; a plurality of gas uniform distribution strip-shaped bulges 32 distributed in a radial manner are arranged on the inner wall of the flat trumpet-shaped air outlet pipe 20, and the radial concentrated end of the gas uniform distribution strip-shaped bulges is positioned at one end close to the air outlet pipe 19 of the uniform distribution box; the strip-shaped bulges 32 for evenly distributing the gas discharged from the evenly-distributing box gas outlet pipe 19 are evenly distributed at the large opening end of the flat flared gas outlet pipe 20 and blown to the GPU chip and the radiator 3.

Embodiment 6, apparatus for cooling and reducing noise of heat sink with reciprocating wind shield structure for GPU chip and the like by high pressure cold air gap method

As shown in figures 2, 7, 8, 9, 10, 11,

a plurality of GPU chips and the radiator 3 share one heat dissipation plate 23, a plurality of heat dissipation plates 27 with gaps 26 are vertically arranged on the heat dissipation plate 23, and reciprocating wind shields 28 capable of reciprocating and moving are arranged above the plurality of heat dissipation plates 27; the support frame 29 for fixing the reciprocating wind deflector 28 is arranged in the gap 26 between the radiating fins 27, or arranged on a slide rail additionally arranged on the radiating plate 23.

The heat dissipation plate 23 is disposed in an inclined manner, or the slide rail on the heat dissipation plate 23 is disposed in an inclined manner. In a word, the support frame 29 is arranged on an inclined slideway, and when high-pressure cold air blows the reciprocating wind deflector 28, the reciprocating wind deflector 28 moves upwards; when the high-pressure cold gas does not blow the reciprocating wind deflector 28, the reciprocating wind deflector 28 moves downwards; the pressure of the high-pressure cold gas is changed in a clearance type size cycle manner, the reciprocating wind deflector 28 is changed in a reciprocating displacement manner upwards and downwards, and the high-pressure cold gas is uniformly distributed on the heat radiating fins 27 which slide along the way by using the reciprocating displacement change of the reciprocating wind deflector 28.

A flat flared gas outlet pipe 20 is arranged in the GPU box 4, the small open end of the flat flared gas outlet pipe 20 is communicated with a gas outlet pipe 19 of the equalizing box, and the large open end of the flat flared gas outlet pipe 20 is aligned with the GPU chip and the radiator 3; a plurality of gas uniform distribution strip-shaped bulges 32 distributed in a radial manner are arranged on the inner wall of the flat trumpet-shaped air outlet pipe 20, and the radial concentrated end of the gas uniform distribution strip-shaped bulges is positioned at one end close to the air outlet pipe 19 of the uniform distribution box; the strip-shaped bulges 32 are uniformly distributed on the inner wall of the flat flared air outlet pipe 20, and the gas discharged from the uniform distribution box air outlet pipe 19 is uniformly distributed at the large opening end of the flat flared air outlet pipe 20 and blown to the GPU chip and the radiator 3.

Claims

1. Device to cooling and noise reduction such as GPU chip with high-pressure air conditioning clearance mode, including pneumatic pump (1), store up high pressure air conditioning case (2), GPU chip and radiator (3) and automatic control (13), its characterized in that: the GPU chip and the radiator (3) are arranged in a GPU box (4), and the GPU box (4) is provided with an air inlet hole (5) and an air outlet hole (6);

the air outlet of the air pressure pump (1) is communicated with the air inlet of the high-pressure air storage tank (2) through an air outlet pipe (7), and the air outlet of the high-pressure air storage tank (2) is communicated with the air inlet of the air inlet hole (5) of the GPU box (4) through an air outlet pipe (8) of the air storage tank;

a power switch (11) is arranged on a power line (10) connected with the air pressure pump (1);

a gas pressure sensor (9) is arranged in the high-pressure storage cold air box (2);

an air outlet pipe (8) of the air storage box is provided with an air pipe pressure valve (15);

the automatic controller (13) is respectively connected with the gas pressure sensor (9) and the power switch (11) through wires.

2. The device for reducing temperature and noise of GPU chips and the like by high-pressure cold air gap method according to claim 1, characterized in that: the pump air outlet pipe (7) is provided with a one-way valve (14) through which air can only flow from the pneumatic pump (1) to the high-pressure storage cold air box (2).

3. The device for reducing temperature and noise of GPU chips and the like by high-pressure cold air gap method according to claim 1, characterized in that: the automatic controller (13) is connected with the air pressure valve (15) of the air pipe through an electric wire.

4. The device for reducing temperature and noise of GPU chips and the like by high-pressure cold air gap method according to claim 1, characterized in that: and the GPU chip and the radiator (3) are provided with chip temperature sensors (16), and the chip temperature sensors (16) are connected with the automatic controller (13) through wires.

5. The device for reducing temperature and noise of GPU chips and the like by high-pressure cold air gap method according to claim 1, characterized in that: a humidity sensor (17) in the GPU box (4) is arranged in the GPU box, and the humidity sensor (17) in the GPU box is connected with an automatic controller (13) through a wire.

6. The device for reducing temperature and noise of GPU chips and the like by high-pressure cold air gap method according to claim 1, characterized in that: a plurality of vertical radiating small columns (24) are vertically arranged on a radiating plate (23) of the GPU chip and the radiator (3), a plurality of vertical radiating small columns (24) are arranged into a plurality of rows of corrugated curves (25), and a plurality of corrugated curves (25) are arranged on the GPU chip and the radiator (3).

7. The device for reducing temperature and noise of GPU chips and the like by using high-pressure cold air gap manner according to claim 6, characterized in that: a plurality of vertical radiating small columns (24) of the GPU chip and the radiator (3) are respectively arranged in parallel to form a plurality of corrugated curves (25), and the gap distance between adjacent corrugated curves (25) is greater than the gap distance between adjacent vertical radiating small columns (24) in the same corrugated curve (25).

8. The device for reducing temperature and noise of GPU chips and the like by high-pressure cold air gap method according to claim 1, characterized in that: the GPU chips and the radiator (3) share one heat dissipation plate (23), a plurality of heat dissipation plates (27) with gaps (26) are vertically arranged on the heat dissipation plate (23), and reciprocating wind shields (28) capable of reciprocating and moving are arranged above the heat dissipation plates (27); the supporting frame (29) for fixing the reciprocating wind deflector (28) is arranged in the gap (26) between the radiating fins (27), or arranged on a sliding rail additionally arranged on the radiating plate (23).

9. The device for reducing temperature and noise of GPU chips and the like by high-pressure cold air gap method according to claim 8, characterized in that: the heat dissipation plate (23) is arranged in an inclined mode, or the sliding rail on the heat dissipation plate (23) is arranged in an inclined mode.

10. The device for reducing temperature and noise of GPU chips and the like by using high-pressure cold air gap mode according to any one of claims 1 to 9, characterized in that: still include gaseous equipartition box (18), the air inlet and the gas storage box outlet duct (8) intercommunication of this gaseous equipartition box (18), this gaseous equipartition box (18) have a plurality of gas outlets, and each gas outlet of gaseous equipartition box (18) is through equipartition box outlet duct (19) and inlet port (5) intercommunication of GPU box (4), or equipartition box outlet duct (19) and the flat horn shape outlet duct (20) intercommunication that sets up in GPU box (4).

11. The device for reducing temperature and noise of GPU chips and the like by high-pressure cold air gap method according to claim 10, wherein: the gas uniform distribution box (18) is internally provided with a porous gas uniform distribution plate (21) which is obliquely arranged.

12. The device for reducing temperature and noise of GPU chips and the like by high-pressure cold air gap method according to claim 11, wherein: the porous gas uniform distribution plate (21) is provided with air leakage holes (22) with different sizes, and the area of an air guide opening of the air leakage hole (22) close to the air inlet of the gas uniform distribution box (18) is smaller than the area far away from the air inlet of the gas uniform distribution box (18).

13. The device for reducing temperature and noise of GPU chips and the like by high-pressure cold air gap method according to claim 10, wherein: the small open end of the flat trumpet-shaped air outlet pipe (20) is communicated with the air outlet pipe (19) of the equalizing box, and the large open end of the flat trumpet-shaped air outlet pipe (20) is aligned with the GPU chip and the radiator (3); a plurality of gas uniform distribution strip-shaped bulges (32) distributed in a radial manner are arranged on the inner wall of the flat trumpet-shaped air outlet pipe (20), and the radial concentrated end of the gas uniform distribution strip-shaped bulges is positioned at one end close to the air outlet pipe (19) of the uniform distribution box; a plurality of gas uniform distribution strip-shaped bulges (32) which are radially distributed on the inner wall of the flat trumpet-shaped gas outlet pipe (20) uniformly distribute the gas discharged by the uniform distribution box gas outlet pipe (19) at the large opening end of the flat trumpet-shaped gas outlet pipe (20) and blow the gas to the GPU chip and the radiator (3).

14. The device for reducing temperature and noise of GPU chips and the like by high-pressure cold air gap method according to claim 10, wherein: the gas equalizing box (18) is a spherical shell formed by sealing and connecting two or more parts in a detachable way, and a plurality of gas outlet pipes (19) of the equalizing box are uniformly distributed outside the spherical shell and are communicated with the inside of the spherical shell; in the gas equipartition box (18) of spherical shell, be equipped with one or more and equally divide the protruding (31) of gas cone, the top of equally dividing the protruding (31) of gas cone is close the opening position of gas storage box outlet duct (8) in gas equipartition box (18), equally divide the protruding (31) bottom of gas cone and gas equipartition box (18) inner wall fixed connection, make all of the intercommunication on the gas equipartition box (18) equipartition box outlet duct (19) can both obtain the gas of the same atmospheric pressure and flow respectively.