CN114911331A - Device for reducing temperature and noise of GPU chip and the like in high-pressure cold air clearance mode - Google Patents

Device for reducing temperature and noise of GPU chip and the like in high-pressure cold air clearance mode Download PDF

Info

Publication number
CN114911331A
CN114911331A CN202210449847.2A CN202210449847A CN114911331A CN 114911331 A CN114911331 A CN 114911331A CN 202210449847 A CN202210449847 A CN 202210449847A CN 114911331 A CN114911331 A CN 114911331A
Authority
CN
China
Prior art keywords
gas
air
box
gpu
pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202210449847.2A
Other languages
Chinese (zh)
Inventor
王晓丹
廖礼毅
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sichuan Honasoft Technology Co ltd
Original Assignee
Sichuan Honasoft Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sichuan Honasoft Technology Co ltd filed Critical Sichuan Honasoft Technology Co ltd
Priority to CN202210449847.2A priority Critical patent/CN114911331A/en
Publication of CN114911331A publication Critical patent/CN114911331A/en
Priority to CN202211638160.XA priority patent/CN116107402A/en
Priority to CN202211638076.8A priority patent/CN116243781A/en
Priority to CN202223413009.4U priority patent/CN219329008U/en
Priority to CN202223412960.8U priority patent/CN219085390U/en
Pending legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/26—Power supply means, e.g. regulation thereof
    • G06F1/32—Means for saving power
    • G06F1/3203—Power management, i.e. event-based initiation of a power-saving mode
    • G06F1/3234—Power saving characterised by the action undertaken
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management

Abstract

The invention discloses a device for reducing temperature and noise of a GPU chip and the like in a high-pressure cold air gap mode, and relates to a device capable of reducing temperature and noise of a GPU efficiently by using high-pressure cold air flow. The air pressure pump is communicated with the high-pressure air storage tank, and the high-pressure air storage tank is communicated with an air inlet hole of the GPU box to blow in high-pressure cold air; a gas pressure sensor is arranged in the high-pressure storage cold air box, a gas pipe pneumatic valve is arranged on a gas outlet pipe of the gas storage box, and the gas pipe pneumatic valve is connected with an automatic controller through a wire; the automatic controller is respectively connected with the gas pressure sensor and the power automatic switch through wires. The advantages are that: the air pressure valve of the air pipe is used as a gap type air supply part, and the device cools the GPU chip in a high-pressure air cooling gap mode, so that the problem of fog and dew generation in a GPU box is solved, high-pressure air cooling at 10-17 ℃ can be used, the noise of a machine room can be greatly reduced without a fan, the cooling operation efficiency is improved more quickly, the refrigeration energy is saved, and the operation efficiency is improved.

Description

Device for reducing temperature and noise of GPU chip and the like in high-pressure cold air clearance mode
Technical Field
The invention relates to the technical field of computer server heat dissipation, in particular to a device for efficiently cooling a GPU (graphics processing unit) by using high-pressure cold air flow and reducing noise by using a fan or without using the fan.
Background
At present, the heat dissipation method for the GPU (or CPU, circuit board, etc.) of a computer server mainly comprises wind cooling and liquid cooling.
Regarding the air cooling method, the air draft of the fan is to continuously extract the heat dissipation of the indoor cold air in the environment outside the machine room cabinet outside the case to the GPU above 40 ℃, and the defects are that the utilization efficiency of the refrigeration energy of the indoor cold air is low, the cost is high, and the noise of the fan is large; the reason is as follows: firstly, a large amount of meaningless refrigeration energy is consumed in a large amount of space in the machine room if the temperature of the machine room environment is 10 ℃, and the temperature difference between an operator of the machine room and the machine room is large, so that the machine room is easy to get ill, and secondly, the heat dissipation effect of the machine room environment on the GPU is very poor, so that the machine room is easy to shut down due to overtemperature, and even the GPU and other heating parts are damaged if the temperature of the machine room environment is 35 ℃; and thirdly, as the temperature of 25 ℃ in the common machine room environment dissipates heat of the GPU, the temperature difference between the cold air of 25 ℃ and the GPU of 40 ℃ is small, and the fan needs to operate with large function to generate rapid airflow, so that the noise of the machine room is large, and the influence on operators and the vibration damage to the server.
Regarding the liquid-cooling evaporative cooling method, the equipment is complex and high in cost, and if the cooling liquid leaks, the cooling liquid can damage the GPU and the circuit board.
Regarding the cooling liquid soaking type cooling method, the cooling liquid is expensive, the equipment is complex, the cooling liquid is inconvenient to take out and repair from the soaking liquid, the cost is higher, and the application range is narrow.
Chinese patent 201610058267.5 of Langchao electronic information industry GmbH, a heat dissipation method of a novel integrated high-density GPU, the invention discloses a heat dissipation method of a novel integrated high-density GPU, which comprises the following concrete implementation processes: firstly, a server system is divided into an upper layer of independent heat dissipation space and a lower layer of independent heat dissipation space through a board card, a GPU (graphics processing unit) display card is placed in the upper layer of space, a switching chip is placed in the lower layer of space, and the two independent spaces are all subjected to heat dissipation through a heat dissipation fan arranged at the rear part of a server case; and carrying out partition type heat dissipation on the GPU display cards on the upper layer, and connecting the gaps between the front row of GPU display cards to the corresponding gaps between the rear row of GPU display cards through the air guide cover. Compared with the prior art, the novel heat dissipation method of the integrated high-density GPU solves the heat dissipation of the rear GPU display card through a layered architecture and an isolated heat dissipation design, and can ensure the heat dissipation of the exchange chip at the same time, thereby ensuring the optimal heat dissipation of the whole server system; the independent air guide cover is utilized, the display card can be highly integrated, the application range is wide, and the air guide cover can be applied to the heat dissipation design of all electronic products. This patent has solved the even radiating problem of a plurality of GPU display cards of different positions in a casing, but be used for radiating forced air cooling gas still to be the computer lab gas, and the general C level computer lab gas temperature permissible range is at 10 ~ 35 ℃, and the temperature is lower, and then a large amount of energy consumptions that a large amount of spaces are meaningless if computer lab environment 10 ℃, then very poor to GPU's radiating effect if computer lab environment 35 ℃, very easy overtemperature shutdown appears, damage GPU chip and other parts that generate heat even.
The invention discloses a novel server heat dissipation design method of a high-density integrated graphics card, belonging to a server heat dissipation design method, and aiming at solving the technical problem of meeting the heat dissipation requirement of a high-power-consumption GPU card and ensuring the heat dissipation of a high-power-consumption exchange chip. The technical scheme is as follows: the method comprises the following steps: 1 position of the display card: the system is provided with a high-power display card, one half of the display card is arranged in the front row, and the other half of the display card is arranged in the rear row; the display cards in the front row and the back row are at the same height, and the display cards in the front row and the back row are arranged in a staggered manner; 2, heat dissipation channel: the air duct comprises a channel A and a channel B which are independent; 3, a 1U space of the server case system is provided with an exchange module: spaced from the upper 3U space.
The invention provides a circulating liquid cooling heat dissipation server node case, which belongs to the technical field of processing and heat dissipation and aims at solving the problems that the case of the existing complete machine air path cannot be completely sealed and dust is easy to enter by 201910689432.0 & ltinformation communication company 201910689432.0 & gt circulating liquid cooling heat dissipation server node case of Heilongjiang province electric power Limited company. The radiator is fixed on the shell, the shell and the radiator form a sealed space, and the CPU heat exchanger, the GPU heat exchanger, the liquid pump and the liquid tank are arranged in the space; the liquid tank is filled with cooling liquid, the radiator is provided with a plurality of radiating fins which are of hollow structures, the cooling liquid flows in a snake shape in the radiating fins to conduct heat to the radiating fins, and the cooling liquid sequentially flows into the liquid tank from the liquid tank, the CPU heat exchanger, the radiator and the GPU heat exchanger to form circulating liquid; the CPU heat exchanger is tightly contacted with a CPU main circuit board of the server and conducts heat generated by the CPU to the cooling liquid; and the GPU heat exchanger is closely contacted with the GPU slave circuit board of the server and conducts heat generated by the GPU slave circuit board to the cooling liquid. This patent is with circulative cooling liquid in the heat exchanger, to GPU and circuit board heat dissipation, but this kind of setting is complicated, and is with high costs, if takes place the coolant liquid and leaks, the coolant liquid will cause the damage to GPU and circuit board.
Disclosure of Invention
The invention aims to provide a device for reducing temperature and noise of a GPU chip and the like in a high-pressure cold air clearance mode, which has the advantages of high-efficiency utilization of refrigeration energy, low noise of a machine room, keeping of the GPU chip and the like clean, lower working temperature of the GPU chip and the like and higher actual operation capacity of the GPU chip and the like.
The GPU chip and the like in the invention refer to a GPU chip, a CPU chip and a radiator on the chip, and the GPU chip is simply replaced by simple characters for description.
The GPU refers to an arithmetic unit to be heated, such as a GPU chip or a CPU chip, and is simply replaced with GPU simple characters for description.
The GPU box 4 is a box body provided with a GPU chip or a CPU chip and is provided with an air inlet and an air outlet.
High-pressure cold air means: the high-pressure cold air is the same as the high-pressure cold air, the high-pressure cooling air and the high-pressure cooling air in terms of concept, and different words are used only for convenience of different terms. The high pressure of the high pressure cold air is from more than one atmospheric pressure to slightly less than the atmospheric pressure of a common household pressure cooker, so that the flow velocity of the air blown out of the high pressure cold air to a GPU chip and the like is 5 m/s-40 m/s, and different air pressure values are adopted due to the influences of the size, the length and the like of a gas pipeline from a high pressure cold air box to the GPU chip and the like and the bending generated by the physical installation of the gas pipeline, so the specific meaning of the high pressure is the variable air pressure with the pressure ranging from 105KPa to 150 KPa. The cold air is the refrigerating gas which is output by the refrigerating equipment and is at the temperature of 10-17 ℃ lower than the ambient room temperature. Compared with the negative pressure of the current fan, the high pressure of the high-pressure cold air means the refrigeration gas with positive pressure. The power of the fans of the GPU box and the case cannot be too high due to noise and vibration problems in the prior art, and the power of the fans is limited. The invention is characterized in that the high-pressure quick airflow generated by the air pressure pump is used for replacing the low-pressure slow airflow of the fan of the GPU box and the chassis.
The conception of the invention is as follows: according to the invention, the air pressure pump 1 which can be placed outside the machine room is used for generating air pressure, the power of the air pressure pump 1 is not limited, high air pressure which is higher than the power of the fan and higher in air flow speed can be provided, demisting dew can be effectively driven by using the high air pressure, the temperature of gas which is lower than that of the existing fan can be used for cooling a GPU chip and the like, the cooling efficiency is improved by using the lower gas temperature, the GPU chip and the like are better protected, and the operation capability of the GPU chip is improved. The invention is characterized in that the high-pressure air pump 1 is used for generating high-pressure fast air flow to replace low-pressure slow air flow of a fan of the GPU box 4 and the chassis, high-pressure air is used for removing fog and dew, and air for heat dissipation can be used at the temperature of 10-17 ℃ which is lower than the temperature of the fan.
The temperature of the common machine room for cooling by the existing fan is room temperature or about 25 ℃, because the working mode of continuous exhaust of the fan saves refrigerating energy in the temperature range, but the defects are that the temperature difference between the temperature of the temperature range of about 25 ℃ and heating elements such as a GPU chip is small, the heat dissipation efficiency is not high, the utilization rate of the refrigerating energy is low, the cooling cost is high, the noise of the fan is large, particularly when the workload of the GPU chip is large and the temperature is high, the heat dissipation of the fan is slow, the cooling effect is poor, the temperature of the GPU chip is not raised continuously, the computing capability is reduced, and the GPU chip is easy to stop or damage.
The invention solves the problem with lower cold air heat dissipation: in order to solve the problems that the temperature difference between the radiated gas temperature and the GPU chip is small, the invention blows cold air of 10-17 ℃ in a high-pressure clearance mode to directly blow the GPU chip and the like for cooling, the temperature difference between the cold air and heating elements such as the GPU chip and the like is increased, the radiating efficiency is improved, the utilization rate of the refrigerated energy is high, the cooling cost is reduced, no fan or low-power fan is used, the noise is low, the refrigeration equipment is placed outside a machine room, the noise does not influence the machine room, particularly the working temperature of the GPU chip and the like can be reduced, the machine cannot be stopped, the service life of the GPU chip and the like is prolonged, and the operational capability is enhanced.
The existing fan does not need to cool by 10-17 ℃, so that the defect of temperature selection is caused: the existing fan is used for cooling, gas is continuously discharged, negative pressure generated by the fan is very low, high-speed airflow cannot be generated around a GPU chip and the like, so that the heat dissipation effect is poor, the temperature of the sucked cooling gas is the same as that of the air in a machine room, for example, the temperature of the air in the machine room is 10-17 ℃, refrigeration energy is too wasted due to low temperature of a large amount of space in the machine room, the air at 10-17 ℃ is continuously discharged, so that a large amount of refrigeration energy is discharged under the condition of insufficient utilization, the temperature of the machine room is too low, the GPU chip and the like cannot fully utilize the refrigeration energy of the airflow, so that the existing fan cooling machine room does not use the cooling temperature of 10-17 ℃, and the national standard GB 2887-89 stipulates that the environmental temperature of the GPU chip is A level 22 +/-2 ℃.
The cooling gas of the invention has the temperature range of 10-17 ℃ for the following reasons: the first reason is about the problems of energy saving and noise reduction, but the invention can use 10 ℃ to 17 ℃ of cold air for cooling by using a high-pressure clearance mode, because the room temperature is not high-pressure cold air, when the high-pressure cold air only blows GPU chips and the like, the temperature difference is larger than the temperature-reduced gas of the existing fan, the temperature can be more quickly reduced, the blowing can be stopped after the temperature is reduced to a rated value, the 10 ℃ to 17 ℃ of cold air reserved in the GPU box and the machine box is fully utilized to continuously reduce the new heat of the GPU chips, and the refrigeration energy is fully utilized; the refrigerating machine can be placed outside the machine room, and the machine room is free from noise, so that the invention can reduce the overall energy consumption for cooling the GPU chip and the like, reduce the cooling cost, ensure better working temperature of the GPU chip and the like, enhance the computing power and reduce the noise. For the second reason, regarding the anti-fog dew problem, the prior art stipulates that the national standard GB 2887-89 of the fan cooling technology stipulates that the environmental temperature of the GPU chip is 22 +/-2 ℃ on the A level, 15-30 ℃ on the B level and 10-35 ℃ on the C level; when the environmental humidity A is 45% -65%, the maximum dew point temperature suitable for the data center environment is 17 ℃. The minimum temperature is 10 ℃ specified by the standard, so 10 ℃ is selected as the minimum temperature in the present invention. The reason why the high temperature is 17 ℃ is that the technical scheme of blowing cold air with high pressure is adopted in the invention, and the flow rate of the cold air is far greater than the flow rate of cooling gas generated by a fan in the prior art, so the invention can disperse fog and dew by blowing the cold air with high pressure, and the invention can select low-temperature gas with the high limit value of 17 ℃ and the temperature of more than 10 ℃ and less than 17 ℃ to cool GPU chips and the like. Because the invention can disperse fog and dew at any time by blowing cold air at high pressure, the temperature which can not be selected by the existing fan for cooling and is easy to generate fog and dew is 10-17 ℃. The reason that the low limit temperature of the cold air is 10 ℃ is that the low limit temperature is 10 ℃ specified in the prior art, if the actual normal working temperature of a specific GPU chip and the like is lower than 10 ℃, for example, the temperature is better than 5 ℃, the low limit value of the high-pressure cold air temperature can be 5 ℃ in the technology provided by the invention, because the invention solves the problem that fog and dew are generated in the cold air at 5 ℃.
The cooling gas 105 KPa-150 KPa high pressure range of the invention selects the reason: the high pressure value and the temperature selection of the cooling gas are related to various factors such as the length and the diameter of the gas outlet pipe 8 of the gas storage box and the gas outlet pipe 19 of the equalizing box, and are also related to the heat productivity of a GPU chip, the air pressure range is selected from 105KPa to 150KPa, the low pressure value is 105KPa which is more than one atmosphere pressure [100KPa ], and the small air flow can be used for compensating the heat reduction of the GPU chip after the GPU chip and the like are reduced to the rated low temperature. The high limit of the air pressure is less than that of the household pressure cooker, so the high limit is 150KPa for safety. The temperature of the GPU chip is reduced to be different at different time intervals when the high-pressure cooling gas is blown to the GPU chip, and a specific value in the pressure range of 105 KPa-150 KPa can be selected at different time intervals, namely the specific value in the pressure range of 105 KPa-150 KPa is selected at different temperatures of the GPU chip.
The invention is characterized in that: firstly, high-pressure cooling gas which can generate air flow faster than that of a general GPU box fan or a chassis fan is used for cooling GPU chips and the like, because the high-pressure cooling gas is blown onto a GPU in the GPU box 4 or a GPU radiating fin 27, the temperature is quickly cooled, possible fog dew in the GPU box 4 can be blown out of the GPU box 4, the fog dew problem is solved, the high-pressure cooling gas can be cooled at a lower cooling temperature of 10-17 ℃ which cannot be used by the fan, and becomes the high-pressure cooling body which can be used by the invention. Because the high-pressure gas cooling body which is blown in firstly is cooled at 10-17 ℃ in the GPU and the radiating fins 27, and a large amount of cooling energy in the GPU box 4 can be reserved and utilized, the blowing of the compressed gas cooling body can be suspended, so that a gap type that cold air is sometimes not blown out, or a gap type that the flow is sometimes large and sometimes small is provided for cooling the compressed gas cooling body, in short, the method for cooling the GPU chips and the like in the high-pressure cold air gap type is a method for cooling the GPU chips and the like in a high-pressure cooling mode, and the fog dew is removed because the cooling gas flows at high speed due to high pressure; and the refrigeration equipment can be placed outside the machine room without using a fan, with less fan or with a fan for clearance, so that the noise of the machine room is greatly reduced.
In a word, the problem of fog and dew is solved by using the forward high-pressure cold air, the noise can be greatly reduced without using a fan, the cold air can be provided in a clearance mode, the cold air is fully utilized, the refrigeration energy is saved, the problem of fog and dew is solved, the cold air with the low temperature of 10-17 ℃ can be used for quickly cooling, a GPU chip can work in a lower temperature environment than a fan cooling method, the GPU chip and the like are better protected, and the operation efficiency of the GPU chip is improved; the invention also aims to save energy, reduce noise and improve operation efficiency.
The content of the invention is as follows:
the device for reducing temperature and noise of the GPU chip and the like in a high-pressure air cooling clearance mode comprises a pneumatic pump 1, a high-pressure air cooling box 2, a GPU chip, a radiator 3 and an automatic controller 13, and is characterized in that: the GPU chip and the radiator 3 are arranged in a GPU box 4, and the GPU box 4 is provided with an air inlet 5 and an air outlet 6;
the air outlet of the air pressure pump 1 is communicated with the air inlet of the high-pressure storage air-conditioning box 2 through an air outlet pipe 7, and the air outlet of the high-pressure storage air-conditioning box 2 is communicated with the air inlet of the air inlet 5 of the GPU box 4 through an air outlet pipe 8 of the air storage box;
a power switch 11 is arranged on a power line 10 connected with the air pressure pump 1;
a gas pressure sensor 9 is arranged in the high-pressure storage cold air box 2;
an air pipe pressure valve 15 is arranged on an air outlet pipe 8 of the air storage tank;
the automatic controller 13 is connected to the gas pressure sensor 9 and the power switch 11 with electric wires, respectively.
In order to prevent the high-pressure cold gas from reversely flowing back, the pump air outlet pipe 7 is provided with a one-way valve 14 through which the gas can only flow from the pneumatic pump 1 to the high-pressure cold gas storage tank 2.
The check valve 14 prevents the high-pressure cold gas stored in the high-pressure cold gas storage tank 2 from flowing backward into the pneumatic pump 1 after the pneumatic pump 1 stops working.
The automatic controller 13 is connected with the air pipe pneumatic valve 15 through an electric wire. The air pressure valve 15 of the air pipe is a control part for outputting high-pressure cold gas in a clearance mode by the high-pressure cold gas storage box 2, and the opening or micro-opening or closing of the air pressure valve 15 of the air pipe is controlled by the automatic controller 13. The automatic controller 13 may be a fixed time setting or may use the chip temperature sensor 16 as a source of control information.
For the normal refrigeration control loop of temperature, the significance of setting rated gas pressure or rated time by using the gas pressure valve 15 of the gas pipe to output high-pressure cold gas is as follows: the gas pressure sensor 9 is mainly used for setting the rated gas pressure in the high-pressure storage cold air tank 2, particularly setting the highest rated gas pressure, and the implementation method is that the power switch 11 of the pneumatic pump 1 is controlled by the air pressure information of the gas pressure sensor 9 through the automatic controller 13, so that the air pressure in the high-pressure storage cold air tank 2 is controlled not to exceed the rated air pressure value. The rated pressure or the rated time is set, the cooling gas which flows rapidly with the pressure can be discontinuously or undulatedly rushed to the GPU chip and the radiator 3, the high-temperature gas which is stuck near the GPU chip and the radiator 3 can be rapidly removed, and the purpose of rapidly cooling the GPU chip and the radiator 3 is achieved. The cooling effect of the low-temperature cooling gas with the same energy consumption, such as 10 ℃, towards the GPU chip and the radiator 3 and the surrounding high-temperature gas is certainly better than the dispersive wide cooling effect of continuously sucking the room temperature of 25 ℃ by a fan. That is, the cooling method by blowing low-temperature gas of the invention has better cooling effect and saves more energy than the cooling method by sucking higher-temperature gas by the existing fan. The air pressure valve 15 of the air pipe is opened intermittently, so that a GPU fan and a chassis fan can not be used continuously, and the noise of the machine room is greatly reduced; because the pneumatic pump 1 can be placed outside the room, there is only a slight, low frequency, intermittent airflow sound inside the room, rather than a large, high frequency, even resonant, even metal-scrubbing, continuous fan sound. Therefore, the device adds high-pressure cold air to intermittently blow the GPU chip and the radiator 3, has better cooling effect on the GPU chip and the radiator 3, saves cooling energy and has low noise in a machine room.
The automatic control mode is as follows: the air pressure pump 1 presses the cold air into the high-pressure cold air storage box 2, the chip temperature sensor 16 controls the output and time of the high-pressure cold air in the high-pressure cold air storage box 2 to the GPU chip and the radiator 3 by controlling the opening, micro opening and closing of the air pipe air pressure valve 15 through the automatic controller 13, and the high-pressure cold air discharged in a clearance mode controls the GPU chip and the radiator 3 in a set temperature change range; the specific mode is as follows:
when the temperature of the chip temperature sensor 16 reaches a high-temperature set value, the chip temperature sensor 16 enables the automatic controller 13 to drive the air pipe pneumatic valve 15 to be opened, and the air outlet pipe 8 of the air storage tank discharges a large amount of high-pressure cold air to the GPU chip in the GPU box 4 and the radiator 3, so that the GPU chip and the radiator 3 are rapidly cooled.
When the chip temperature sensor 16 is lowered to a rated low-temperature set value, the chip temperature sensor 16 enables the automatic controller 13 to drive the air pressure valve 15 to be slightly opened, and the air outlet pipe 8 of the air storage tank discharges a small amount of cold air to the GPU chip and the radiator 3 in the GPU box 4 to keep the GPU chip and the radiator 3; or when the chip temperature sensor 16 is lowered to the low-temperature set value, the chip temperature sensor 16 enables the automatic controller 13 to drive the air pipe pneumatic valve 15 to be closed, and the GPU chip and the radiator 3 are slowly heated.
When in use, the pressure of the high-pressure cold air is preferably 105KPa to 150KPa, and the temperature is preferably 10 ℃ to 17 ℃.
Regarding the choice of air pressure and air flow: the GPU chip and the radiator attached to the GPU chip are cooled by blowing cooling gas, a certain gas flow velocity is selected from 5 m/s to 40 m/s according to the flow rate of the cooling gas, the pressure of the cooling gas in the high-pressure storage air cooling box 2 is selected according to the requirements of the flow rate and the wind speed of the cooling gas, the pressure in the high-pressure storage air cooling box 2 is generally within the range of 105KPa to 150KPa, and the pressure is sufficient and safe.
The air outlet pipe 8 of the air storage box is provided with an air pipe pressure valve 15, which is a key technical arrangement for providing high-pressure cold air in a clearance mode, the clearance mode provides the high-pressure cold air to ensure that the temperature of the cold air can be lower than the room normal temperature or the room temperature of 17-35 ℃ of a machine room cabinet in a continuous air extraction mode of the existing fan, the invention preferably provides the high-pressure cold air with the cooling effect of 10-17 ℃ which is obviously better than the room temperature of 17-35 ℃ of the existing fan, and the clearance mode provides the energy of the 10-17 ℃ temperature in a box or a case during the clearance air inflation of the high-pressure cold air, but the continuous air exhaust in the prior art wastes cold air energy, and the continuous air exhaust in the prior art ensures that the energy of the machine room refrigeration cannot be fully utilized.
Temperature settings and advantages regarding interstitial cryogenics: because the invention blows cooling gas in high pressure interval type, the temperature of the high pressure cooling gas can be 10-17 ℃, which is far lower than the indoor normal temperature or 17-35 ℃ of the machine room cabinet of the prior fan continuous type air extraction mode, the fan continuous type air extraction can only use higher indoor normal temperature or 17-35 ℃, if 10-17 ℃ is used, the low temperature gas continuously discharged by the fan wastes too much energy, therefore, 10-17 ℃ low temperature cooling gas with better GPU efficiency is used, energy is not wasted, cooling gas can only be blown in the interval of the invention, when the temperature of the power consumption elements such as GPU chips is raised to the rated high temperature such as 50-65 ℃, a large amount of 10-17 ℃ low temperature cooling gas is blown in, after the temperature of the power consumption elements such as GPU chips is lowered to 10-17 ℃, the blowing of 10-17 ℃ low temperature cooling gas or a small amount of low temperature cooling gas is stopped, when the temperature of the GPU chip rises to 50-65 ℃, a large amount of low-temperature cooling gas of 10-17 ℃ is blown in, and then the power consumption elements such as the GPU chip are cooled to 10-17 ℃. When a large amount of 10-17 ℃ low-temperature cooling gas is blown in, the temperature difference between the cooling gas and the GPU chip is large, and the cooling is faster than the indoor normal-temperature gas of the fan, so that the energy utilization efficiency of cooling the GPU chip and the like by using the cooling gas is higher, the energy is saved, the GPU chip and the like have longer low-temperature working time, and the operation capability of the GPU chip is higher. The blowing-in type cooling of the cooling gas can blow off dust and water mist at any time, does not have crystal water to damage GPU chips and the like, and enables the cooling gas to be cooled at 10-17 ℃ lower than a fan mode.
The clearance mode of the energy-saving method provides high-pressure cold air: when the temperature of the chip temperature sensor 16 reaches a high-temperature set value, the gas storage box gas outlet pipe 8 discharges a large amount of high-pressure cold gas of 130KPa to 150KPa, the gas flow rate is 20 m/s to 40 m/s, and the temperature is 10 ℃ to 17 ℃;
when the temperature of the chip temperature sensor 16 reaches a low-temperature set value, the air pressure valve 15 is slightly opened, a small amount of high-pressure cold air 105 KPa-130 KPa is discharged from the air outlet pipe 8 of the air storage box, the gas flow rate is 5 m/s-20 m/s, and the temperature is 10 ℃ to 17 ℃; or when the temperature of the chip temperature sensor 16 reaches a low-temperature set value, the air pressure valve 15 of the air pipe is closed, and high-pressure cold air is not discharged.
The key point of the invention is that the high-pressure cold air cooling can be carried out in a clearance mode: high-pressure cold gas is blown in by using a gas pipe pressure valve 15 and the like to realize clearance cooling, when the temperature of the high-pressure cold gas blown in by the clearance cooling is 10-17 ℃, gas with lower temperature below 10 ℃ can also be input to cool the GPU chip and the radiator 3, the cooling is faster, the clearance time from the lowest temperature to the highest temperature for starting the cooling is prolonged, but the time for generating water mist dew at the low temperature below 10 ℃ is very fast, and the water mist dew can not be completely blown off by 130-150 KPa high-pressure gas flow, so that the proposal is not used. After the GPU chip and the radiator 3 are cooled to 10-17 ℃ from the high-pressure cold gas of 10-17 ℃, the high-pressure cold gas is stopped or slightly blown in, so that the GPU chip and the radiator 3 are heated to 50-60 ℃ for a certain heating time, and in the time of stopping or slightly blowing in the high-pressure cold gas, the cold gas energy of 10-17 ℃ in the GPU box 4 is fully utilized, the energy consumption of cooling is reduced, and the cooling cost is saved.
In the prior art, the fan continuously exhausts air, the air at room temperature or constant 25 ℃ is used for heat dissipation, the air for heat dissipation is continuously pumped out by the fan, the air for heat dissipation has high temperature, the temperature difference between the air for heat dissipation and the GPU chip and the heat sink 3 is small, the cooling efficiency is low, and the power consumption of the fan for heat dissipation and the energy of refrigerating air are wasted; for example, in the prior art, the temperature of the gas for heat dissipation is changed to be 15 ℃ at low temperature, although the temperature difference between the gas for heat dissipation and the GPU chip and the heat radiator 3 is higher, the energy for preparing the gas for heat dissipation at 15 ℃ is more consumed in a large amount of useless space of a machine room, and is continuously pumped out by a fan, so that the energy is more romantic; for example, the gas for heat dissipation in the prior art is changed into high temperature of 40 ℃, the temperature difference between the gas and the GPU chip and the heat radiator 3 is too small, the cooling effect is too poor, and the gas cannot be used, so that the gas is meaningless. Therefore, the clearance type high-pressure cold air cooling is a method with high cooling efficiency and energy conservation.
In order to communicate the working temperature of the GPU with the heat dissipation device to form an automatic heat dissipation mode, the GPU chip and the heat dissipation device 3 are provided with chip temperature sensors 16, and the chip temperature sensors 16 are connected with the automatic controller 13 through wires. In practice, the chip temperature sensor 16 is self-contained in the GPU chip and generally does not need to be provided.
In order to perform emergency dehumidification and fog removal, a box internal humidity sensor 17 is arranged in the GPU box 4, the box internal humidity sensor 17 is connected with an automatic controller 13 through a wire, and when wet fog, namely a fog dew signal, sent by the box internal humidity sensor 17 exceeds an allowable value, the device automatically starts an emergency dehumidification and fog removal working mode.
An emergency dehumidification and fog-dispersing control loop: the working environment of GPU chips and the like has a specified range for temperature and humidity, and the maximum dew point temperature is 17 ℃ under the condition that the national standard B2887-89 considers that the environmental humidity is 45% -65% of A level. Under the condition that the humidity is 45-65%, the temperature rated value of the chip temperature sensor 16 is 10-45 ℃, namely when the temperature of the chip temperature sensor 16 reaches 45 ℃, high-pressure cold air with the temperature of 10-17 ℃ is blown into the GPU box 4 for cooling, the high-pressure cold air is stopped blowing when the temperature is reduced to 10 ℃, the high-pressure cold air is blown for cooling when the temperature of the chip temperature sensor 16 reaches 45 ℃ again, and a cycle of stopping blowing, blowing again stopped cooling and stopping is formed. In the cycle time of cooling and stopping, if fog dew is generated in the GPU box 4, the fog dew is also driven out of the GPU box 4 by the high-pressure cold air blown in next time, so that the fog dew cannot exist in the GPU box 4 for a long time. Therefore, under the condition that the environmental humidity is 45-65%, the problem that the GPU chip is influenced by fog and dew is solved. However, if the time delay of the generation of fog in the GPU box 4 is long and the amount of fog is increased under the special bad condition that the environmental humidity is more than 85%, which may be harmful to the GPU chip and the like for a long time, in order to solve the problem that the fog is prolonged and the amount of fog is also increased, the invention arranges the box internal humidity sensor 17 in the GPU box 4, the box internal humidity sensor 17 uses the fog data of the time length and the amount of the generated fog, and controls the air pipe air pressure valve 15 to be closed through the automatic controller 13, so that the air pipe air pressure valve 15 can be opened in advance by the fog data before the temperature of the chip temperature sensor 16 does not reach 45 ℃, and the fog in the GPU box 4 can be forcibly expelled by high-pressure cold air in advance, thereby realizing the emergency humidity reduction and the expelling of fog under the special bad condition that the environmental humidity is more than 85%, and protecting the GPU chip and the like from the fog.
The GPU chip radiator has a structure with two air flow channels, namely a fast air flow channel and a slow air flow channel: a plurality of vertical radiating small columns 24 are vertically arranged on a radiating plate 23 of the GPU chip and radiator 3, a plurality of vertical radiating small columns 24 are arranged into a plurality of rows of corrugated curves 25, and a plurality of corrugated curves 25 are arranged on the GPU chip and radiator 3.
The plurality of vertical radiating small columns 24 of the GPU chip and the radiator 3 are respectively arranged in parallel to form a plurality of corrugated curves 25, and the gap distance between adjacent corrugated curves 25 is larger than the gap distance between adjacent vertical radiating small columns 24 in the same corrugated curve 25.
The corrugated curves 25 form a primary air flow channel and a secondary air flow channel which have fast and slow speeds to uniformly dissipate heat and quickly dissipate heat: a corrugated curve 25 group consisting of a primary airflow channel and a secondary airflow channel and formed by a plurality of vertical radiating small columns 24 is arranged on a plurality of GPU chips and radiating fins 27 of the radiator 3, the gap distance between the adjacent corrugated curves 25 is wider and is used as a primary airflow channel, the gap distance between the adjacent vertical radiating small columns 24 in one corrugated curve 25 is narrower and is used as a secondary airflow channel, and the width of the primary airflow channel is larger than that of the secondary airflow channel; when the high-pressure cold gas output by the gas outlet pipe 8 of the gas storage tank or the gas outlet pipe 19 of the even distribution box is blown on the corrugated curve 25 group, the main gas flow channel is arranged, so that the high-pressure cold gas can completely pass through the corrugated curve 25 group from front to back, and the secondary gas flow channel generates gas vortex, so that the cooling time of the high-pressure cold gas staying on the vertical radiating small column 24 is prolonged.
Structure of the ripple curve 25: a plurality of vertical radiating small columns 24 are vertically arranged on a radiating plate 23 of the GPU chip and the radiator 3, a plurality of vertical radiating small columns 24 are arranged into a plurality of rows of corrugated curves 25, and a plurality of corrugated curves 25 are arranged on the GPU chip and the radiator 3; a plurality of vertical radiating small columns 24 of the GPU chip and the radiator 3 are respectively arranged in parallel to form a plurality of corrugated curves 25, and the gap distance between adjacent corrugated curves 25 is larger than the gap distance between adjacent vertical radiating small columns 24 in the same corrugated curve 25; the gap distance between the adjacent corrugated curves 25 is a main cold air channel, and the flow line of the blown air of the air outlet pipe 8 of the air storage box or the air outlet pipe 19 of the equipartition box is consistent with the channel direction of the opening section of the main cold air channel between the plurality of corrugated curves 25; the width of the distance 30 between the wave crest and the wave trough of the corrugated curve 25 close to the gas outlet pipe 8 of the gas storage box or close to the gas outlet pipe 19 of the equipartition box is larger than the width of the distance 30 between the wave crest and the wave trough of the corrugated curve 25 far away from the gas outlet pipe 8 of the gas storage box or far away from the gas outlet pipe 19 of the equipartition box.
The corrugated curve 25 groups on the GPU chip and the radiator 3 are provided with primary and secondary airflow channels, so that high-pressure cold air can flow through all the corrugated curve 25 groups, hot air and fog dew stagnating in the corrugated curve 25 groups are washed away by high air pressure, the cooling time of the high-pressure cold air on the vertical radiating small columns 24 can be prolonged by using vortex, the vertical radiating small columns 24 are accelerated to be cooled, low-temperature gas at the pipe orifices is blown out firstly, the refrigerating energy is fully utilized, and the cooling cost is reduced.
If a plurality of GPU chips are arranged on one mainboard, and the plurality of GPU chips and the radiator 3 share one heat dissipation plate 23, a plurality of heat dissipation plates 27 with gaps 26 are vertically arranged on the heat dissipation plate 23, and a reciprocating wind shield 28 capable of reciprocating and displacing is arranged above the plurality of heat dissipation plates 27; the support frame 29 for fixing the reciprocating wind deflector 28 is provided in the gap 26 between the heat sinks 27, or on a rail additionally provided to the heat sink 23.
9. The method of claim 8, wherein: the heat dissipation plate 23 is disposed in an inclined manner, or the slide rail on the heat dissipation plate 23 is disposed in an inclined manner.
The reciprocating wind deflector 28 enables a mobile distribution device of minimum cooling throughout the elongated fins 27: a reciprocating wind deflector 28 which can reciprocate along with the pressure change of high-pressure cold gas is arranged on a heat radiating fin 27 shared by a plurality of GPU chips and the heat radiator 3, the pressure change from the beginning to the end of a period of blowing out the high-pressure cold gas enables the reciprocating wind deflector 28 to block the high-pressure cold gas flow at different positions of the heat radiating fin 27, and the high-pressure cold gas has the opportunity of generating gas vortex at each position of the long heat radiating fin 27, so that the heat radiation at each position of the long heat radiating fin 27 is uniform.
The reciprocating wind deflector 28 generates a swirling airflow. Because the reciprocating wind deflector 28 blocks the high-pressure cold gas flow at different positions of the heat sink 27, at any blocking position, the high-pressure cold gas changes from a linear flow to a vortex flow, and the vortex flow increases the flow temperature-reducing residence time at the position, so as to prevent the high-pressure cold gas from rapidly leaving the heat sink 27, thereby enhancing the heat dissipation effect on the heat sink 27 at the position.
The reciprocating wind deflector 28 is movable on the upper fins 27 without closing the structural design of the fins 27: this open structure also makes it possible to extend the time of high-pressure cold gas when it has a high pressure as much as possible, and to retain the high-pressure cold gas on the heat sink 27 in the form of a swirling flow. The reciprocating wind shield 28 can prolong the time of cooling the GPU chip and the radiator 3 at each point by the high-pressure cold gas when the high-pressure cold gas is blown, and blow away the high-temperature gas of the radiating fins 27 on the GPU chip and the radiator 3 as much as possible by high pressure to realize rapid cooling; and when no high-pressure cold gas is blown in, the heat dissipation and the cold and hot gas flow of the radiating fins 27 are not shielded. Therefore, when the high-pressure cold gas contacts the object to be cooled first, the reciprocating wind shield 28 slows down diffusion, prolongs the heat dissipation contact time, and makes full use of the high pressure of the high-pressure cold gas to blow away the retained hot gas, and when no high-pressure cold gas is blown, the heat dissipation fins 27 do not shield the rapid convection of the cold and hot gases, so that the refrigeration energy is fully utilized, and the cooling cost is reduced.
Rectangular gas uniform distribution box: when the gas storage tank gas outlet pipe 8 outputs heat to a plurality of GPU boxes 4 for heat dissipation at the same time, the cooling gas output by the gas storage tank gas outlet pipe 8 needs to be uniformly distributed. The gas storage box is characterized by further comprising a gas equalizing box 18, wherein a gas inlet of the gas equalizing box 18 is communicated with a gas storage box gas outlet pipe 8, the gas equalizing box 18 is provided with a plurality of gas outlets, each gas outlet of the gas equalizing box 18 is communicated with a gas inlet 5 of the GPU box 4 through an equalizing box gas outlet pipe 19, or the equalizing box gas outlet pipe 19 is communicated with a flat horn-shaped gas outlet pipe 20 arranged in the GPU box 4; a porous gas uniform distribution plate 21 is obliquely arranged in the gas uniform distribution box 18; the porous gas uniform distribution plate 21 is provided with air leakage holes 22 with different sizes, and the area of an air guide opening of the air leakage hole 22 close to the air inlet of the gas uniform distribution box 18 is smaller than the area far away from the air inlet of the gas uniform distribution box 18.
Gas in 8 quick evenly distributed to many tracheal structures of gas storage box outlet ducts: uniformly dispersing and inputting high-pressure cold gas in an air outlet pipe 8 of a gas storage tank in a gas equalizing box 18 to a plurality of GPU boxes 4 or a plurality of GPU chips and radiators 3 by using one gas equalizing box 18 and a plurality of equalizing box air outlet pipes 19; each gas equalizing box 18 is communicated with a plurality of equalizing box air outlet pipes 19, each equalizing box air outlet pipe 19 enters an air inlet hole 5 on the GPU box 4, and high-pressure cold gas is input into the GPU box 4, or each equalizing box air outlet pipe 19 is directly aligned with one GPU chip and the radiator 3 to blow out the high-pressure cold gas.
Because the high-pressure cold air is intermittently blown out from the air equalizing box 18, the air pressure in the air equalizing box 18 is changed cyclically, when the high-pressure cold air storage tank 2 starts to output high-pressure air to the air equalizing box 18 each time, the air equalizing box 18 is always in a low-pressure state, and in order to quickly enable each air outlet pipe 19 of the air equalizing box 18 to obtain the same air pressure and air flow, a porous air equalizing plate 21 is required to be arranged in the air equalizing box 18 to serve as an air pressure and air flow quick equalizing device.
The gas equipartition box 18 is used for reducing the number of gas storage box gas outlet pipes 8, one gas storage box gas outlet pipe 8 and one gas equipartition box 18 can be used for one cabinet in a machine room with a large number of cabinets, and a plurality of equipartition box gas outlet pipes 19 are matched, so that the machine room is neat and orderly, otherwise, the gas storage box gas outlet pipes 8 are too many and are disordered, faults cannot be cleared and the maintenance is difficult, and each GPU box 4 or each GPU chip and the radiator 3 in the same cabinet can be used for obtaining high-pressure cooling gas with the same pressure, the same flow and the same temperature.
The porous gas uniform distribution plate 21 is used for making the air leakage hole 22 close to the air outlet pipe 8 of the air storage box smaller, and the air leakage hole 22 far away from the air outlet pipe 8 of the air storage box larger, because the area of the air leakage hole 22 close to the air outlet pipe 8 of the air storage box is small but the air pressure is large, and the area of the air leakage hole 22 far away from the air outlet pipe 8 of the air storage box is large but the air pressure is small; thus, the outlet pipe 19 of the even distribution box which is close to and far away from can evenly obtain the flow of the high-pressure cold gas from the outlet pipe 8 of the gas storage box. The porous gas uniform distribution plate 21 is preferably arranged in an inclined manner, so that the position close to the gas storage box gas outlet pipe 8 is higher, the position far away from the gas storage box gas outlet pipe 8 is lower, high-pressure cold gas can automatically flow to the uniform distribution box gas outlet pipe 19 far away from the gas storage box gas outlet pipe 8, and the close and far uniform distribution box gas outlet pipes 19 can averagely obtain the flow of the high-pressure cold gas from the gas storage box gas outlet pipe 8.
Uniformly diffusing the small beam of cooling gas discharged from the pipe orifice into gas flow beams with the sizes of the GPU chip and the radiator 3: the small open end of the flat horn-shaped air outlet pipe 20 is communicated with the air outlet pipe 19 of the equipartition box, and the large open end of the flat horn-shaped air outlet pipe 20 is aligned with the GPU chip and the radiator 3; a plurality of gas uniform distribution strip-shaped bulges 32 distributed in a radial manner are arranged on the inner wall of the flat trumpet-shaped air outlet pipe 20, and the radial concentrated end of the gas uniform distribution strip-shaped bulges is positioned at one end close to the air outlet pipe 19 of the uniform distribution box; the strip-shaped bulges 32 for evenly distributing the gas discharged from the evenly-distributing box gas outlet pipe 19 are evenly distributed at the large opening end of the flat flared gas outlet pipe 20 and blown to the GPU chip and the radiator 3.
In order to ensure that the centers and the edge positions of the GPU chip and the radiator 3 can obtain cooling gas with the same flow, a plurality of gas equally distributing strip-shaped bulges 32 are radially distributed on the inner wall of the flat flared gas outlet pipe 20, and the cooling gas with high concentration output by the equally distributing box gas outlet pipe 19 is uniformly dispersed to each position of the GPU chip and the radiator 3, so that the heat dissipation of the GPU chip and the radiator 3 is more uniform.
Spherical gas uniform distribution box: when the gas storage tank gas outlet pipe 8 outputs heat to a plurality of GPU boxes 4 for heat dissipation at the same time, the cooling gas output by the gas storage tank gas outlet pipe 8 needs to be uniformly distributed. The gas equalizing box 18 is a spherical shell formed by two or more parts which can be disassembled and sealed, and a plurality of equalizing box gas outlet pipes 19 are uniformly distributed outside the spherical shell and are communicated with the inside of the spherical shell; one or more gas distribution cone protrusions 31 are arranged in a gas distribution box 18 of the spherical shell, the tip of each gas distribution cone protrusion 31 is close to the opening part of a gas storage box gas outlet pipe 8 in the gas distribution box 18, the bottom of each gas distribution cone protrusion 31 is fixedly connected with the inner wall of the gas distribution box 18, and all gas distribution box gas outlet pipes 19 communicated with the gas distribution box 18 can obtain cooling gas with the same air pressure and flow rate.
The gas equalizing box 18 is a spherical shell, so that the distance between the opening parts of the gas outlet pipes 19 of the equalizing box and the gas outlet pipes 8 of the gas storage box in the gas equalizing box 18 can be reduced, and the gas equalizing efficiency is improved; the gas-sharing cone projection 31 quickly and uniformly disperses the columnar gas input into the gas-sharing box 18 from the gas storage tank gas outlet pipe 8 to each gas-sharing box gas outlet pipe 19 by using a cone inclined plane. The spherical shell has a larger surface area per unit volume for connecting the air outlet pipes 19 of the uniform distribution boxes, and the structure can reduce the internal volume of the spherical shell air uniform distribution box 18 as much as possible, so that the time for the air to rise from low pressure to high pressure in the air uniform distribution box 18 is shortened, a plurality of uniform distribution box air outlet pipes 19 communicated with one air uniform distribution box 18 can obtain cooling air with the same air pressure and the same flow at the fastest speed, and heat dissipation is uniformly carried out on different GPU chips and the heat radiator 3.
The invention has the advantages that: the device of the invention generates high-pressure cold air to cool the GPU chip and the like, and has the advantages that the problem of fog dew generation in the GPU box is solved by using forward high-pressure cold air, and the air flow velocity generated by high pressure is 20-40 m/s higher than that of a fan, so that the noise of a machine room can be greatly reduced without the fan; the high-pressure cold air at 10-17 ℃ can be used for providing cold air in a clearance mode, so that the cold air can be fully utilized to save refrigeration energy; the problem of fog and dew is solved, low-temperature cold air of 10-17 ℃ can be used for cooling the GPU chip and the like more quickly, the temperature of the cold air is lower than that of air of a fan, the GPU chip and the like are protected better, the working temperature of the GPU chip and the like is ensured not to be over-temperature, and the operation efficiency of the GPU chip is improved; energy conservation and noise reduction are realized, and the operation efficiency is improved.
The device is matched with high-pressure cold air, so that the cooling air can be output in a clearance mode to dissipate heat of the GPU chip and the radiator, the heat dissipation energy consumption is saved, the operation efficiency is improved, the calculation cost is saved, and the noise of a machine room is reduced.
The air pressure valve of the air pipe is a key component for controlling whether the high-pressure air storage box outputs cooling air to the GPU chip and the radiator or not by temperature and humidity, and is a final component for outputting the cooling air in a clearance mode.
The automatic controller is controlled by the chip temperature sensor, and the automatic controller is used for controlling the air pressure valve and the air pressure pump, so that the heat dissipation of the GPU chip and the like is removed in an automatic clearance mode of high-pressure cold air.
The gas equalizing box has the effects of reducing the number of gas outlet pipes of the gas storage box and the number of gas outlet pipes of the equalizing box, so that the machine room is neat and orderly, and each GPU chip and each radiator obtain high-pressure cooling gas with the same pressure, the same flow and the same temperature.
The ripple curve and the reciprocating wind shield can generate vortex to prolong the cooling time of high-pressure cold gas to the GPU chip and the radiator, reduce valance diffusion and quickly cool down, make full use of the gas blown in at the lowest temperature at first, make full use of the refrigerated energy and reduce the cooling cost.
The emergency dehumidification and fog-dispelling control loop can emergently dispel fog dew under the special bad condition that the environmental humidity is more than 85%, and protect GPU chips and the like from being influenced by the fog dew.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the high-pressure storage cold air box of the present invention for directly cooling the GPU chips and the like in a GPU box;
FIG. 2 is a schematic diagram of the overall structure of the high-pressure storage cold air box of the present invention for cooling the GPU chips in multiple GPU boxes through one gas equalizing box;
FIG. 3 is a schematic view of a split gas equalizer box and multiple GPU boxes according to the present invention;
FIG. 4 is a schematic perspective view of a GPU chip and a plurality of vertical heat-dissipating pillars in the GPU box of the present invention;
FIG. 5 is a schematic diagram of a structure of two corrugated curves of a row formed by a plurality of vertical heat dissipation pillars;
FIG. 6 is a schematic structural view of a plurality of corrugated curves and an air outlet pipe of an equal distribution box, wherein the corrugated curves and the air outlet pipe are arranged in a spliced manner by a plurality of vertical radiating small columns;
FIG. 7 is a schematic view of a three-dimensional structure of a heat sink with a plurality of GPU chips sharing a heat sink type, wherein a reciprocating wind shield is arranged on the heat sink and receives high-pressure cooling gas blown out by an air outlet pipe of an even distribution box to dissipate heat of the GPU chips and the heat sink, the reciprocating wind shield moves back and forth under the change of air pressure to block the high-pressure cooling gas, so that the high-pressure cooling gas generates vortex, the high-pressure cooling gas is extended in gaps among a plurality of heat sinks, and the utilization rate of the high-pressure cooling gas is improved;
FIG. 8 is a schematic view of a three-dimensional structure of a reciprocating wind deflector disposed in a gap between a plurality of heat sinks on a GPU chip according to the present invention;
FIG. 9 is a schematic structural diagram of the reciprocating wind deflector of the present invention with the support frame disposed in the gap between the heat sink and the reciprocating wind deflector moving back and forth due to the change of air pressure;
FIG. 10 is a schematic sectional view of the spherical gas-homogenizing box according to the present invention;
FIG. 11 is a schematic view of the structure of the flat flared outlet pipe of the present invention.
In the figure, 1 is a pneumatic pump, 2 is a high-pressure cold air storage box, 3 is a GPU chip and a radiator, 4 is a GPU box, 5 is an air inlet hole, 6 is an air outlet hole, 7 is a pump air outlet pipe, 8 is an air outlet pipe of the air storage box, 9 is a gas pressure sensor, 10 is a power cord, 11 is an air pump electrical switch, 13 is an automatic controller, 14 is a one-way valve, 15 is an air pipe pneumatic valve, 16 is a chip temperature sensor, 17 is an in-box humidity sensor, 18 is a gas uniform distribution box, 19 is a uniform distribution box air outlet pipe, 20 is a flat horn-shaped air outlet pipe, 21 is a porous gas uniform distribution plate, 22 is an air outlet hole, 23 is a heat dissipation plate, 24 is a vertical heat dissipation column, 25 is a corrugated curve, 26 is a gap, 27 is a heat dissipation plate, 28 is a reciprocating wind deflector, 29 is a support frame, 30 is a peak-valley space, 31 is a uniform distribution gas cone bulge, and 32 is a gas uniform distribution strip-shaped bulge.
Detailed Description
Example 1 Manual device for reducing temperature and noise of GPU chip and the like by using high-pressure cold air gap mode
As shown in figure 1 of the drawings, in which,
the device for reducing temperature and noise of the GPU chip and the like in a high-pressure cold air clearance mode comprises a pneumatic pump 1, a high-pressure storage cold air box 2, a GPU chip, a radiator 3 and an automatic controller 13, and is characterized in that: the GPU chip and the radiator 3 are arranged in a GPU box 4, and the GPU box 4 is provided with an air inlet 5 and an air outlet 6;
the air outlet of the air pressure pump 1 is communicated with the air inlet of the high-pressure storage air-conditioning box 2 through an air outlet pipe 7, and the air outlet of the high-pressure storage air-conditioning box 2 is communicated with the air inlet of the air inlet 5 of the GPU box 4 through an air outlet pipe 8 of the air storage box;
a power switch 11 is arranged on a power line 10 connected with the air pressure pump 1;
a gas pressure sensor 9 is arranged in the high-pressure storage cold air box 2;
an air pipe pressure valve 15 is arranged on an air outlet pipe 8 of the air storage tank;
the automatic controller 13 is connected to the gas pressure sensor 9 and the power switch 11 with electric wires, respectively.
The automatic controller 13 is controlled by the gas pressure sensor 9, and then the automatic controller 13 is used for controlling the gas pipe pressure valve 15 and the power switch 11, so that the output gas is automatically controlled within a rated high pressure value range, and conditions are provided for removing the heat dissipation gas in a clearance mode.
The air pressure valve 15 of the air pipe can be a valve which gradually changes from small to large, so that the air pressure valve can be incompletely closed after the temperature of the GPU chip and the radiator 3 is reduced to reach the rated value, a small amount of cooling gas is remained in a small gap to be used as partial heat to be consumed for compensating the subsequent temperature rise of the GPU chip and the radiator 3, and the time for the GPU chip and the radiator 3 to reach the high-temperature rated value again is prolonged.
Setting parameters: when the GPU chip and the radiator 3 reach the high temperature rated value of 45 ℃ or 65 ℃, the automatic controller 13 is manually operated, the air pressure valve 15 of the air pipe is opened to release cooling gas to radiate the heat of the GPU chip and the radiator 3, the air pressure of the high-pressure cold air matched with the invention is 105 KPa-150 KPa, the temperature is 10 ℃ to 17 ℃, and the gas flow rate is 5 m/s to 40 m/s.
Embodiment 2 device for reducing temperature and noise of GPU chip and the like by using high-pressure cold air gap mode with automatic temperature and humidity control
As shown in figure 2 of the drawings, in which,
the present embodiment is the same as embodiment 1, and only the structure of embodiment 1 is additionally designed as follows:
the pump air outlet pipe 7 is provided with a one-way valve 14 which can only lead the air to flow from the pneumatic pump 1 to the high-pressure cold air storage tank 2.
The automatic controller 13 is connected with the air pipe pneumatic valve 15 through an electric wire.
And a chip temperature sensor 16 is arranged on the GPU chip and the radiator 3, and the chip temperature sensor 16 is connected with the automatic controller 13 through a wire.
A box internal humidity sensor 17 is arranged in the GPU box 4, and the box internal humidity sensor 17 is connected with the automatic controller 13 through a wire.
The check valve 14 serves to prevent the cooling gas in the high-pressure storage cold gas tank 2 from reversely flowing into the pneumatic pump 1.
The air pressure valve 15 of the air pipe is a process-controllable electromagnetic valve which can be opened or slightly opened or closed, and can control the opening process from small to large and stop. The air pipe pressure valve 15 is used for controlling the cooling air which outputs different flows to the GPU chip and the radiator 3 at different time, and ensuring that the cooling air has a certain set rated pressure value of 105 KPa-150 KPa.
The chip temperature sensor 16 is actually a GPU chip, and generally does not need to be set, but the connection pin of the chip temperature sensor 16 of the GPU chip is connected to the automatic controller 13 by a wire, so that the temperature electrical signal of the chip temperature sensor 16 can be received by the automatic controller 13.
A box internal humidity sensor 17 is arranged in the GPU box 4, and the box internal humidity sensor 17 is connected with the automatic controller 13 through a wire to form a control loop for outputting high-pressure cold gas at emergency rated gas pressure or rated time to remove demisting dew. If the humidity sensor 17 in the box senses that the relative humidity in the GPU box 4 reaches or exceeds 70 percent, the automatic controller 13 enables the power switch 11 to be connected and conducted, the air pressure pump 1 adds cooling air to the high-pressure storage air conditioner 2 to enable the cooling air to reach 150KPa, and the automatic controller 13 enables the air pipe air pressure valve 15 to be in a constantly open state; when the humidity sensor 17 in the box senses that the relative humidity in the GPU box 4 reaches or falls below 40%, the automatic controller 13 powers off the power switch 11, and the automatic controller 13 also returns the air tube pressure valve 15 to the normal state as described in embodiment 1.
Embodiment 3 device for cooling and reducing noise of GPU chip and the like in high-pressure cold air gap mode and provided with rectangular gas uniform distribution box
As shown in the figures 2 and 3, the above-mentioned figures,
the present embodiment is the same as embodiment 2, and only the structure of embodiment 2 is additionally designed as follows:
the gas storage box is characterized by further comprising a gas equalizing box 18, wherein a gas inlet of the gas equalizing box 18 is communicated with a gas storage box gas outlet pipe 8, the gas equalizing box 18 is provided with a plurality of gas outlets, each gas outlet of the gas equalizing box 18 is communicated with a gas inlet 5 of the GPU box 4 through an equalizing box gas outlet pipe 19, or the equalizing box gas outlet pipe 19 is communicated with a flat horn-shaped gas outlet pipe 20 arranged in the GPU box 4; a porous gas uniform distribution plate 21 is obliquely arranged in the gas uniform distribution box 18; the porous gas uniform distribution plate 21 is provided with air leakage holes 22 with different sizes, and the area of an air guide opening of the air leakage hole 22 close to the air inlet of the gas uniform distribution box 18 is smaller than the area far away from the air inlet of the gas uniform distribution box 18.
In order to make the gas equalizing box 18 better distribute the gas in the gas outlet pipe 8 of the gas storage tank to a plurality of equalizing box gas outlet pipes 19 evenly through the gas equalizing box 18, a porous gas equalizing plate 21 is added in the gas equalizing box 18 as a gas acting equalizing device, and the gas equalizing device can use the following porous gas equalizing plate 21. The concrete structure is as follows:
the porous gas uniform distribution plate 21 obliquely arranged in the gas uniform distribution box 18 is provided with air leakage holes 22 with different sizes on the porous gas uniform distribution plate 21, and the area of the air leakage hole 22 close to the position of the gas inlet of the gas uniform distribution box 18 is smaller than the area of the air leakage hole 22 far away from the gas inlet of the gas uniform distribution box 18. The size distribution rule of the air leakage holes 22 on the porous gas uniform distribution plate 21 meets the requirement of uniformly distributing high-pressure cold air in the gas uniform distribution box 18.
What porous gas equipartition board 21 slope set up means, porous gas equipartition board 21 will be put high apart from the position that gas storage box outlet duct 8 is close, will be put low apart from the position that gas storage box outlet duct 8 is far away, and the gas of gas storage box outlet duct 8 in gas equipartition box 18 of being convenient for can automatic flow to far away position, and the equipartition is far away and near the position obtains equivalent gas.
The air storage box air outlet pipe 8 is communicated with an air uniform distribution box 18 with one inlet and multiple outlets, and the high-pressure cold air in the air storage box air outlet pipe 8 is uniformly inserted into the GPU boxes 4 through a plurality of uniform distribution box air outlet pipes 19 by the air uniform distribution box 18, so that the high-pressure cold air with the same air pressure, air flow and air temperature can be obtained in each GPU box 4.
Embodiment 4 device for cooling and reducing noise of GPU chip and the like in high-pressure cold air gap mode and provided with spherical gas uniform distribution box
As shown in the figures 2 and 10, respectively,
the present embodiment is the same as embodiment 2, and only the structure of embodiment 2 is additionally designed as follows:
only with the spherical gaseous equipartition box 18 of a one-inlet many-outlets of gas storage box outlet duct 8 switch-on, insert a plurality of GPU boxes 4 with the even difference of many equipartition box outlet ducts 19 of high-pressure air conditioning in a gas storage box outlet duct 8 with a spherical gaseous equipartition box 18 in, can both obtain the high-pressure air conditioning with atmospheric pressure, air current, temperature the same in making every GPU box 4, concrete structure is as follows:
the gas equalizing box 18 is a spherical shell formed by two parts of removable sealing connection, and a plurality of equalizing box gas outlet pipes 19 are uniformly distributed outside the spherical shell and communicated with the inside of the spherical shell; one or more gas distribution cone protrusions 31 are arranged in a gas distribution box 18 of the spherical shell, the tip of each gas distribution cone protrusion 31 is close to the opening part of a gas storage box gas outlet pipe 8 in the gas distribution box 18, the bottom of each gas distribution cone protrusion 31 is fixedly connected with the inner wall of the gas distribution box 18, and all gas distribution box gas outlet pipes 19 communicated with the gas distribution box 18 can obtain cooling gas with the same air pressure and flow rate.
The gas equalizing box 18 is a spherical shell formed by detachably and hermetically connecting an upper hemispherical shell and a lower hemispherical shell, the central position of the upper hemispherical shell is communicated with the gas storage box gas outlet pipe 8, a central position equalizing gas cone projection 31 is fixedly arranged in the lower hemispherical shell in the gas storage box gas outlet pipe 8, a plurality of side position equalizing gas cone projections 31 can be arranged in the gas storage box gas outlet pipe 8, and the side position equalizing gas cone projections 31 are shorter than and smaller than the central position equalizing gas cone projection 31. The contact annular ring of the upper hemispherical shell and the lower hemispherical shell is sealed by a rubber ring, and the two parts are fixed by fasteners or bolts outside the upper hemispherical shell and the lower hemispherical shell, so that the upper hemispherical shell and the lower hemispherical shell can bear the high pressure of high-pressure cooling gas in the shell and cannot leak gas.
The included angle of the cone top of the gas-sharing cone-shaped projection 31 is selected to be 15-30 degrees, and is determined according to the proportion of the length of the gas-sharing cone-shaped projection 31 to the diameter of the spherical gas-sharing box 18, and the longer the gas-sharing cone-shaped projection 31 is, the smaller the included angle of the cone top of the gas-sharing cone-shaped projection 31 is.
Embodiment 5, a device for reducing temperature and noise of a GPU chip and the like using a high-pressure cold air gap method, in which the heat sink has a corrugated curve heat dissipation pillar structure
As shown in figures 2, 4, 5, 6, 10, 11,
this embodiment is the same as embodiment 4, and only the structure of embodiment 4 is additionally designed as follows:
a corrugated curve 25 group consisting of a primary airflow channel and a secondary airflow channel and formed by a plurality of vertical radiating small columns 24 is arranged on a plurality of GPU chips and radiating fins 27 of the radiator 3, the gap distance between adjacent corrugated curves 25 is a main airflow channel, the gap distance between adjacent vertical radiating small columns 24 in one corrugated curve 25 is a secondary airflow channel, and the width of the main airflow channel is greater than that of the secondary airflow channel; when the high-pressure cold gas output by the gas outlet pipe 8 of the gas storage tank or the gas outlet pipe 19 of the even distribution box is blown on the corrugated curve 25 group, the main gas flow channel is arranged, so that the high-pressure cold gas can completely pass through the corrugated curve 25 group from front to back, and the secondary gas flow channel generates gas vortex, so that the cooling time of the high-pressure cold gas staying on the vertical radiating small column 24 is prolonged.
A plurality of vertical radiating small columns 24 are vertically arranged on a radiating plate 23 of the GPU chip and radiator 3, a plurality of vertical radiating small columns 24 are arranged into a plurality of rows of corrugated curves 25, and a plurality of corrugated curves 25 are arranged on the GPU chip and radiator 3.
The plurality of vertical radiating small columns 24 of the GPU chip and the radiator 3 are respectively arranged in parallel to form a plurality of corrugated curves 25, and the gap distance between adjacent corrugated curves 25 is larger than the gap distance between adjacent vertical radiating small columns 24 in the same corrugated curve 25.
The heat dissipation pillars 24 are made of copper, the height is 30.0 mm, the diameter is 1.0 mm, the width of a main airflow channel between two adjacent corrugated curves 25 is 1.5 mm, and the width of a secondary airflow channel between two adjacent heat dissipation pillars 24 is 0.5 mm.
A flat flared gas outlet pipe 20 is arranged in the GPU box 4, the small open end of the flat flared gas outlet pipe 20 is communicated with a gas outlet pipe 19 of the equalizing box, and the large open end of the flat flared gas outlet pipe 20 is aligned with the GPU chip and the radiator 3; a plurality of gas uniform strip-shaped bulges 32 distributed in a radial manner are arranged on the inner wall of the flat trumpet-shaped gas outlet pipe 20, and the radial concentrated end of the gas uniform strip-shaped bulges is positioned at one end close to the gas outlet pipe 19 of the uniform box; the strip-shaped bulges 32 for evenly distributing the gas discharged from the evenly-distributing box gas outlet pipe 19 are evenly distributed at the large opening end of the flat flared gas outlet pipe 20 and blown to the GPU chip and the radiator 3.
Embodiment 6 device for cooling and reducing noise of GPU chip and the like by high-pressure cold air gap method with heat radiator having reciprocating wind shield structure
As shown in figures 2, 7, 8, 9, 10, 11,
this embodiment is the same as embodiment 4, and only the structure of embodiment 4 is additionally designed as follows:
the GPU chips and the radiator 3 share one heat dissipation plate 23, a plurality of heat dissipation plates 27 with gaps 26 are vertically arranged on the heat dissipation plate 23, and reciprocating wind shields 28 capable of reciprocating and displacing are arranged above the heat dissipation plates 27; the support frame 29 for fixing the reciprocating wind deflector 28 is provided in the gap 26 between the heat sinks 27, or on a rail additionally provided to the heat sink 23.
The heat dissipation plate 23 is disposed in an inclined manner, or the slide rail on the heat dissipation plate 23 is disposed in an inclined manner. In a word, the support frame 29 is arranged on an inclined slideway, and when high-pressure cold air blows the reciprocating wind deflector 28, the reciprocating wind deflector 28 moves upwards; when the high-pressure cold gas does not blow the reciprocating wind deflector 28, the reciprocating wind deflector 28 moves downwards; the pressure of the high-pressure cold gas is changed in a clearance type size cycle manner, the reciprocating wind deflector 28 is changed in a reciprocating displacement manner upwards and downwards, and the high-pressure cold gas is uniformly distributed on the heat radiating fins 27 which slide along the way by using the reciprocating displacement change of the reciprocating wind deflector 28.
A flat flared gas outlet pipe 20 is arranged in the GPU box 4, the small open end of the flat flared gas outlet pipe 20 is communicated with a gas outlet pipe 19 of the equalizing box, and the large open end of the flat flared gas outlet pipe 20 is aligned with the GPU chip and the radiator 3; a plurality of gas uniform distribution strip-shaped bulges 32 distributed in a radial manner are arranged on the inner wall of the flat trumpet-shaped air outlet pipe 20, and the radial concentrated end of the gas uniform distribution strip-shaped bulges is positioned at one end close to the air outlet pipe 19 of the uniform distribution box; the strip-shaped bulges 32 for evenly distributing the gas discharged from the evenly-distributing box gas outlet pipe 19 are evenly distributed at the large opening end of the flat flared gas outlet pipe 20 and blown to the GPU chip and the radiator 3.

Claims (14)

1. The device for reducing temperature and noise of the GPU chip and the like in a high-pressure air cooling clearance mode comprises a pneumatic pump 1, a high-pressure air cooling box 2, a GPU chip, a radiator 3 and an automatic controller 13, and is characterized in that: the GPU chip and the radiator 3 are arranged in a GPU box 4, and the GPU box 4 is provided with an air inlet 5 and an air outlet 6;
the air outlet of the air pressure pump 1 is communicated with the air inlet of the high-pressure storage air-conditioning box 2 through an air outlet pipe 7, and the air outlet of the high-pressure storage air-conditioning box 2 is communicated with the air inlet of the air inlet 5 of the GPU box 4 through an air outlet pipe 8 of the air storage box;
a power switch 11 is arranged on a power line 10 connected with the air pressure pump 1;
a gas pressure sensor 9 is arranged in the high-pressure storage cold air box 2;
an air pipe pressure valve 15 is arranged on an air outlet pipe 8 of the air storage tank;
the automatic controller 13 is connected to the gas pressure sensor 9 and the power switch 11 with electric wires, respectively.
2. The device for reducing temperature and noise of GPU chips and the like by high-pressure cold air gap method according to claim 1, characterized in that: the pump air outlet pipe 7 is provided with a one-way valve 14 which can only lead air to flow from the pneumatic pump 1 to the high-pressure cold air storage tank 2.
3. The device for reducing temperature and noise of GPU chips and the like by high-pressure cold air gap method according to claim 1, characterized in that: the automatic controller 13 is connected with the air pipe pneumatic valve 15 through an electric wire.
4. The device for reducing temperature and noise of GPU chips and the like by high-pressure cold air gap method according to claim 1, characterized in that: and a chip temperature sensor 16 is arranged on the GPU chip and the radiator 3, and the chip temperature sensor 16 is connected with the automatic controller 13 through a wire.
5. The device for reducing temperature and noise of GPU chips and the like by high-pressure cold air gap method according to claim 1, characterized in that: and a box internal humidity sensor 17 is arranged in the GPU box 4, and the box internal humidity sensor 17 is connected with the automatic controller 13 through a wire.
6. The device for reducing temperature and noise of GPU chips and the like by high-pressure cold air gap method according to claim 1, characterized in that: a plurality of vertical radiating small columns 24 are vertically arranged on a radiating plate 23 of the GPU chip and radiator 3, a plurality of vertical radiating small columns 24 are arranged into a plurality of rows of corrugated curves 25, and a plurality of corrugated curves 25 are arranged on the GPU chip and radiator 3.
7. The device for reducing temperature and noise of GPU chips and the like by using high-pressure cold air gap manner according to claim 6, characterized in that: the plurality of vertical radiating small columns 24 of the GPU chip and the radiator 3 are respectively arranged in parallel to form a plurality of corrugated curves 25, and the gap distance between adjacent corrugated curves 25 is larger than the gap distance between adjacent vertical radiating small columns 24 in the same corrugated curve 25.
8. The device for reducing temperature and noise of GPU chips and the like by high-pressure cold air gap method according to claim 1, characterized in that: a plurality of GPU chips and the radiator 3 share one heat dissipation plate 23, a plurality of heat dissipation plates 27 with gaps 26 are vertically arranged on the heat dissipation plate 23, and reciprocating wind shields 28 capable of reciprocating and moving are arranged above the plurality of heat dissipation plates 27; the support frame 29 for fixing the reciprocating wind deflector 28 is provided in the gap 26 between the heat sinks 27, or on a rail additionally provided to the heat sink 23.
9. The device for reducing temperature and noise of GPU chips and the like by high-pressure cold air gap method according to claim 8, characterized in that: the heat dissipation plate 23 is disposed in an inclined manner, or the slide rail on the heat dissipation plate 23 is disposed in an inclined manner.
10. The device for reducing temperature and noise of GPU chips and the like by using high-pressure cold air gap mode according to any one of claims 1 to 9, characterized in that: the gas storage box is characterized by further comprising a gas uniform distribution box 18, wherein the gas inlet of the gas uniform distribution box 18 is communicated with a gas storage box gas outlet pipe 8, the gas uniform distribution box 18 is provided with a plurality of gas outlets, each gas outlet of the gas uniform distribution box 18 is communicated with a gas inlet 5 of the GPU box 4 through a uniform distribution box gas outlet pipe 19, or the uniform distribution box gas outlet pipe 19 is communicated with a flat horn-shaped gas outlet pipe 20 arranged in the GPU box 4.
11. The device for reducing temperature and noise of GPU chips and the like by high-pressure cold air gap method according to claim 10, wherein: the gas equalizing box 18 is internally provided with a porous gas equalizing plate 21 which is obliquely arranged.
12. The device for reducing temperature and noise of GPU chips and the like by high-pressure cold air gap method according to claim 11, wherein: the porous gas uniform distribution plate 21 is provided with air leakage holes 22 with different sizes, and the area of an air guide opening of the air leakage hole 22 close to the air inlet of the gas uniform distribution box 18 is smaller than the area far away from the air inlet of the gas uniform distribution box 18.
13. The device for reducing temperature and noise of GPU chips and the like by high-pressure cold air gap method according to claim 10, wherein: the small open end of the flat horn-shaped air outlet pipe 20 is communicated with the air outlet pipe 19 of the equipartition box, and the large open end of the flat horn-shaped air outlet pipe 20 is aligned with the GPU chip and the radiator 3; a plurality of gas uniform distribution strip-shaped bulges 32 distributed in a radial manner are arranged on the inner wall of the flat trumpet-shaped air outlet pipe 20, and the radial concentrated end of the gas uniform distribution strip-shaped bulges is positioned at one end close to the air outlet pipe 19 of the uniform distribution box; the strip-shaped bulges 32 for evenly distributing the gas discharged from the evenly-distributing box gas outlet pipe 19 are evenly distributed at the large opening end of the flat flared gas outlet pipe 20 and blown to the GPU chip and the radiator 3.
14. The device for reducing temperature and noise of GPU chips and the like by high-pressure cold air gap method according to claim 10, wherein: the gas equalizing box 18 is a spherical shell formed by two or more parts which can be disassembled and sealed, and a plurality of equalizing box gas outlet pipes 19 are uniformly distributed outside the spherical shell and are communicated with the inside of the spherical shell; one or more gas distribution cone protrusions 31 are arranged in a gas distribution box 18 of the spherical shell, the tip of each gas distribution cone protrusion 31 is close to the opening part of the gas storage box gas outlet pipe 8 in the gas distribution box 18, the bottom of each gas distribution cone protrusion 31 is fixedly connected with the inner wall of the gas distribution box 18, and all gas distribution box gas outlet pipes 19 communicated with the gas distribution box 18 can respectively obtain gas with the same gas pressure and flow.
CN202210449847.2A 2022-04-27 2022-04-27 Device for reducing temperature and noise of GPU chip and the like in high-pressure cold air clearance mode Pending CN114911331A (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CN202210449847.2A CN114911331A (en) 2022-04-27 2022-04-27 Device for reducing temperature and noise of GPU chip and the like in high-pressure cold air clearance mode
CN202211638160.XA CN116107402A (en) 2022-04-27 2022-12-20 Device for reducing temperature and noise of GPU chip and the like by high-pressure cold air gap mode
CN202211638076.8A CN116243781A (en) 2022-04-27 2022-12-20 Energy-saving device for cooling GPU chip and the like by using closed-cycle high-pressure cold air
CN202223413009.4U CN219329008U (en) 2022-04-27 2022-12-20 Energy-saving cooling device combining heat pump and water shower device
CN202223412960.8U CN219085390U (en) 2022-04-27 2022-12-20 Energy-saving device for cooling GPU chip by using closed-cycle high-pressure cold air

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210449847.2A CN114911331A (en) 2022-04-27 2022-04-27 Device for reducing temperature and noise of GPU chip and the like in high-pressure cold air clearance mode

Publications (1)

Publication Number Publication Date
CN114911331A true CN114911331A (en) 2022-08-16

Family

ID=82764056

Family Applications (5)

Application Number Title Priority Date Filing Date
CN202210449847.2A Pending CN114911331A (en) 2022-04-27 2022-04-27 Device for reducing temperature and noise of GPU chip and the like in high-pressure cold air clearance mode
CN202211638160.XA Pending CN116107402A (en) 2022-04-27 2022-12-20 Device for reducing temperature and noise of GPU chip and the like by high-pressure cold air gap mode
CN202211638076.8A Pending CN116243781A (en) 2022-04-27 2022-12-20 Energy-saving device for cooling GPU chip and the like by using closed-cycle high-pressure cold air
CN202223412960.8U Active CN219085390U (en) 2022-04-27 2022-12-20 Energy-saving device for cooling GPU chip by using closed-cycle high-pressure cold air
CN202223413009.4U Active CN219329008U (en) 2022-04-27 2022-12-20 Energy-saving cooling device combining heat pump and water shower device

Family Applications After (4)

Application Number Title Priority Date Filing Date
CN202211638160.XA Pending CN116107402A (en) 2022-04-27 2022-12-20 Device for reducing temperature and noise of GPU chip and the like by high-pressure cold air gap mode
CN202211638076.8A Pending CN116243781A (en) 2022-04-27 2022-12-20 Energy-saving device for cooling GPU chip and the like by using closed-cycle high-pressure cold air
CN202223412960.8U Active CN219085390U (en) 2022-04-27 2022-12-20 Energy-saving device for cooling GPU chip by using closed-cycle high-pressure cold air
CN202223413009.4U Active CN219329008U (en) 2022-04-27 2022-12-20 Energy-saving cooling device combining heat pump and water shower device

Country Status (1)

Country Link
CN (5) CN114911331A (en)

Also Published As

Publication number Publication date
CN116243781A (en) 2023-06-09
CN219329008U (en) 2023-07-11
CN219085390U (en) 2023-05-26
CN116107402A (en) 2023-05-12

Similar Documents

Publication Publication Date Title
CN202374619U (en) Novel heat-exchange communication cabinet
CN101453856B (en) Communication equipment
CN206977887U (en) A kind of rack semiconductor cooling device
CN201741527U (en) Air and water cooling transformer
CN205029550U (en) Converter and wind generating set
CN201571292U (en) Active heat radiation type cabinet
CN204616254U (en) A kind of radiating cabinet
CN104994707A (en) Liquid-cooled heat dissipation type cabinet door
CN111901988A (en) Robot control cabinet
CN217279499U (en) Device for reducing temperature and noise of GPU chip and the like in high-pressure cold air clearance mode
CN114911331A (en) Device for reducing temperature and noise of GPU chip and the like in high-pressure cold air clearance mode
CN203590656U (en) Heat exchanging device and electrical cabinet containing heat exchanging device
CN109757085A (en) Tapered gradual-enlargement type forced air cooling system
CN205030039U (en) Cabinet
CN114911330A (en) Method for reducing temperature and noise of GPU chip and the like in high-pressure cold air gap mode
CN201796226U (en) Cooling device of exposure lamp on exposure machine
CN211128755U (en) Energy-saving and reconstruction heat dissipation system of high-voltage frequency converter
CN204761945U (en) Radiating switch of inner loop machine case
CN215121722U (en) Cloud data server data computer lab power supply temperature control device
CN101338953A (en) Semiconductor refrigerator
CN110793348A (en) Box air-cooled finned tube radiator of oil for large-scale equipment
CN219679105U (en) Cabinet cooling device
CN212231826U (en) Robot control cabinet
CN103327782A (en) Container cooling system
CN218772765U (en) Fresh air natural cooling air wall of data center

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20220816

WD01 Invention patent application deemed withdrawn after publication