CN217279211U - Display device - Google Patents

Abstract

The application discloses a display device for improving the transfer yield of a Mini LED. The display device provided in the embodiment of the present application includes: a display panel for displaying an image; the backlight module is positioned at the light incident side of the display panel; the backlight module comprises a lamp panel used as a light source; the lamp plate includes: a substrate; the first circuit layer is positioned on one side of the substrate facing the display panel; the anisotropic conductive adhesive film is positioned on one side of the circuit layer, which is far away from the substrate, so as to cover the first circuit layer; the first solder mask is positioned on one side, away from the substrate, of the anisotropic conductive adhesive film and is provided with a window for exposing the anisotropic conductive adhesive film; and the light source is positioned on one side of the circuit layer, which is far away from the substrate. In this application, replace the tin cream through set up anisotropic conductive adhesive film above first circuit layer for make Mini LED and first circuit layer electricity be connected, promoted Mini LED's transfer precision, and prevented because of the base plate size is big or the precision is not enough, the tin cream brush that leads to is inclined to one side.

Description

Display device

Technical Field

The application relates to the technical field of display, in particular to a display device.

Background

The sub-millimeter Light Emitting Diode (Mini LED) has become a current hot spot in Liquid Crystal Display (LCD) as backlight, which can greatly improve the effect of Liquid Crystal Display, not only realize the thinning of backlight, but also realize more refined dynamic control, and improve the dynamic contrast of Liquid Crystal Display.

In the related art, the circuit board adopted by the Mini LED mostly adopts an etching process, copper is coated on the surface of a substrate, and then the process flows of exposure, development, etching and the like are carried out, so that the circuit layer is manufactured. When the circuit board under the process is used for manufacturing the lamp panel, solder paste is needed to be brushed to transfer the Mini LED, and finally the Mini LED is electrically connected with the circuit layer in the circuit board through reflow soldering. Along with the fact that the Mini LED is smaller and smaller in size or the adopted circuit board is larger and larger in size, the precision requirement for brushing the tin paste is higher and higher, the lead-out tin paste is easy to brush off, the brush is oblique, and then the problem that the transfer yield of the Mini LED is low can be caused.

SUMMERY OF THE UTILITY MODEL

The application aims to provide a display device for improving the transfer yield of a Mini LED.

In a first aspect, an embodiment of the present application provides a display device, including:

a display panel for displaying an image;

the backlight module is positioned at the light incident side of the display panel; the backlight module comprises a lamp panel as a light source;

the lamp plate includes:

a substrate;

the first circuit layer is positioned on one side, facing the display panel, of the substrate;

the anisotropic conductive adhesive film is positioned on one side of the circuit layer, which is far away from the substrate, so as to cover the first circuit layer;

the first solder mask layer is positioned on one side, away from the substrate, of the anisotropic conductive adhesive film and is provided with a window for exposing the anisotropic conductive adhesive film;

and the light source is positioned on one side of the circuit layer, which is far away from the substrate.

In this application, replace the tin cream through set up anisotropic conductive adhesive film above the circuit layer for make electronic components and circuit layer electricity be connected, promoted Mini LED's transfer precision, and prevented because of the base plate size is big or the precision is not enough, the tin cream brush that leads to is inclined to the side.

In some possible embodiments, the anisotropic conductive film covers the whole of the first circuit layer; or the like, or, alternatively,

covering the first circuit layer exposed from the windowing part of the first solder mask layer; or the like, or, alternatively,

and covering the first circuit layer including the part of the first circuit layer exposed by the windowing part of the first solder mask layer.

In this application, anisotropic conductive adhesive film's cover mode includes above three kinds for this application has more the universality, and the saving cost that the mode that only covers the circuit layer that the portion of windowing exposes is more.

In some possible embodiments, the light source is a sub-millimeter light emitting diode.

In a second aspect, the present application also provides a display device, the device comprising:

a display panel for displaying an image;

the backlight module is positioned at the light incident side of the display panel; the backlight module comprises a lamp panel as a light source;

the lamp plate includes:

the display panel comprises a substrate and a plurality of first and second substrates, wherein the substrate comprises a first surface and a second surface, the first surface is the side of the substrate facing the display panel, and the second surface is the side of the substrate departing from the display panel;

the first circuit layer is positioned on the first surface of the substrate;

a second circuit layer on the second surface of the substrate;

the anisotropic conductive adhesive film is positioned on the first circuit layer, faces away from the first surface, and covers the first circuit layer;

the first solder mask layer is positioned on the anisotropic conductive adhesive film and deviates from the first surface, and the first solder mask layer is provided with a window for exposing the anisotropic conductive adhesive film;

the light source is positioned on one side, away from the substrate, of the first circuit layer;

is located the second circuit layer deviates from the second solder mask of second surface, the second solder mask is equipped with and is used for exposing the windowing of second circuit layer

And the electronic components are positioned on the second circuit layer.

In this application, replace the tin cream through set up anisotropic conductive adhesive film above the circuit layer for make electronic components and circuit layer electricity be connected, promoted Mini LED's transfer precision, and prevented because of the base plate size is big or the precision is not enough, the tin cream brush that leads to is inclined to the side. In addition, in the present application, the circuit layer may be a single-layer circuit layer or a double-layer circuit layer, so that the display device provided by the present application has more universality.

In some possible embodiments, the first circuit layer of the substrate and the second circuit layer of the substrate are connected by a through hole.

In the present application, in the case of a double-layer wiring layer, in order to make the double-layer wiring layer electrically connectable, the first wiring layer and the second wiring layer are connected by a via hole.

In some possible embodiments, the anisotropic conductive paste covers the whole of the first circuit layer; or the like, or, alternatively,

covering the first circuit layer exposed from the windowing part of the first solder mask layer; or the like, or a combination thereof,

and covering the first circuit layer including the part of the first circuit layer exposed by the windowing part of the first solder mask layer.

In this application, anisotropic conductive adhesive film's cover mode includes above three kinds for this application has more the universality, and the saving cost that the mode that only covers the circuit layer that the portion of windowing exposes is more.

In some possible embodiments, the apparatus further comprises: the anisotropic conductive adhesive film is positioned on the second circuit layer and faces away from the first surface so as to cover the second circuit layer;

the anisotropic conductive adhesive covers the whole second circuit layer; or the like, or, alternatively,

the second circuit layer covers the part, exposed out of the window opening, of the second solder mask layer; or the like, or, alternatively,

and covering a second circuit layer including the part of the second circuit layer exposed by the windowing part of the second solder mask layer.

In this application, anisotropic conductive adhesive film can cover first circuit layer and second circuit layer, and the mode of covering on second circuit layer includes above three kinds for this application has more the universality, and only covers the saving cost more of the mode on the circuit layer that the part exposes of windowing.

In some possible embodiments, the electronic component includes: any one or combination of the following: display driver IC, capacitance, resistance, inductor, terminals.

In the present application, the type and number of the electronic components are not limited, so that the present application is more general.

Additional features and advantages of the application will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by the practice of the application. The objectives and other advantages of the application may be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments of the present application will be briefly described below, and it is obvious that the drawings described below are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1A is a schematic device diagram of a display device according to an embodiment of the present disclosure;

fig. 1B is a schematic view of a lamp panel of a display device provided in an embodiment of the present application;

fig. 2 is a schematic diagram of a circuit layer of a lamp panel of a display device provided in an embodiment of the present application;

fig. 3 is a schematic view of a whole of a bonding pad formed at a window opening position covered by an anisotropic conductive film strip of a lamp panel of a display device according to an embodiment of the present disclosure;

fig. 4 is a top view of a whole of a pad formed at a window opening position covered by an anisotropic conductive film strip of a lamp panel of a display device according to an embodiment of the present disclosure;

fig. 5 is a schematic view illustrating that an anisotropic conductive film of a lamp panel of a display device according to an embodiment of the present disclosure only covers a circuit layer at a window;

fig. 6 is a top view of a display device provided in an embodiment of the present application, where an anisotropic conductive film of a lamp panel only covers a circuit layer at a window;

fig. 7 is a schematic view of a surface of a substrate where an anisotropic conductive adhesive film of a lamp panel of a display device according to an embodiment of the present disclosure covers a circuit layer;

fig. 8 is a schematic diagram of a solder mask layer of a lamp panel of a display device provided in an embodiment of the present application;

fig. 9 is another schematic view of a lamp panel of a display device according to an embodiment of the present application;

fig. 10 is a schematic substrate diagram of a lamp panel of a display device provided in an embodiment of the present application.

Detailed Description

In order to make the objects, technical solutions and advantages of the present application more apparent, the technical solutions in the embodiments of the present application will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application. In the present application, the embodiments and features of the embodiments may be arbitrarily combined with each other without conflict. Also, while a logical order is shown in the flow diagrams, in some cases, the steps shown or described may be performed in an order different than here.

The terms "first" and "second" in the description and claims of the present application and the above-described drawings are used for distinguishing between different objects and not for describing a particular order. Furthermore, the term "comprises" and any variations thereof, which are intended to cover non-exclusive protection. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements but may alternatively include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus. The "plurality" in the present application may mean at least two, for example, two, three or more, and the embodiments of the present application are not limited.

In the description of the present application, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the present application and simplifying the description, but do not indicate or imply that the referred device or element must have a particular orientation, be constructed in a particular orientation, and be operated, and thus should not be construed as limiting the present application.

In the description of the present application, it should be noted that, unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, a fixed connection, a detachable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.

The inventor researches and discovers that the Mini LED as backlight becomes a current hot spot in LCD display, the effect of liquid crystal display can be greatly improved, the thinning of the backlight can be realized, the more refined dynamic control can be realized, and the dynamic contrast of the liquid crystal display is improved.

In the related art, the circuit board adopted by the Mini LED mostly adopts an etching process, copper is coated on the surface of a substrate, and then the process flows of exposure, development, etching and the like are carried out, so that the circuit layer is manufactured. When the circuit board under the process is used for manufacturing the lamp panel, solder paste is needed to be brushed to transfer the Mini LED, and finally the Mini LED is electrically connected with the circuit layer in the circuit board through reflow soldering. Along with the fact that the Mini LED is smaller and smaller in size or the adopted circuit board is larger and larger in size, the precision requirement for brushing the tin paste is higher and higher, the lead-out tin paste is easy to brush off, the brush is oblique, and then the problem that the transfer yield of the Mini LED is low can be caused.

In view of the above, the present application proposes a display device for solving the above problems. The display device provided by the application is shown in fig. 1A, which comprises: a backlight module 100 and a display panel 200.

The display panel 200 is located on the light emitting side of the backlight module 100 for displaying images. The shape and size of the display panel 200 and the shape and size of the display device are adapted. When applied to the field of televisions or mobile terminals, etc., the display panel 200 may be configured in a rectangular shape including a top side, a bottom side, a left side and a right side, wherein the top side and the bottom side are opposite, the left side and the right side are opposite, the top side is connected to one end of the left side and one side of the right side, respectively, and the bottom side is connected to the other end of the left side and the other end of the right side, respectively. When applied to a special-shaped display device, the display panel 200 may also be in a shape of a circle, and the like, and is not limited herein.

The display panel 200 is a transmissive display panel, which can modulate the transmittance of light, but does not emit light by itself. The display panel 200 has a plurality of pixel units arranged in an array, and each pixel unit can independently control the transmittance and color of light incident to the pixel unit from the backlight module 100, so that the light transmitted by all the pixel units forms a displayed image.

The backlight module 100 is generally disposed at the bottom of the display device, and has a shape and size corresponding to those of the display device. When applied to the field of televisions or mobile terminals, the backlight module generally takes a rectangular shape.

The embodiment of the utility model provides an in backlight unit adopt straight following formula backlight unit for even light that sends in whole light-emitting surface provides sufficient and the even light that distributes of luminance for display panel, so that display panel can normally show the image.

Wherein, backlight unit 100 includes the lamp plate as the light source, as shown in fig. 1B, is one of the cross-sectional structure schematic diagrams of the lamp plate among the display device that the embodiment of the utility model provides. The figure includes: a substrate 101; a circuit layer 102 formed on the surface of the substrate; an anisotropic conductive film 103 formed on a side of the circuit layer 102 away from the substrate 101 to cover each circuit layer 102; a solder mask layer 104 formed on the side of the anisotropic conductive film 103 away from the substrate 101, the solder mask layer 104 being provided with a window 105 for exposing the circuit layer; a light source 106 on a side of the wiring layer facing away from the substrate; pins of the light source 106 extend into the window 105 to connect with the circuit layer 102 through the anisotropic conductive film 103.

In order to facilitate understanding, in the structure of the lamp panel in the display device provided in the embodiment of the present application, each part included in the lamp panel is described below:

1. substrate board

In the embodiment of the present application, in order to make the display device provided in the embodiment of the present application more universal, the material of the substrate is not limited in the present application, and the substrate may be any one of the following: BT resin substrate, epoxy glass fiber cloth substrate, aluminum substrate, glass substrate, flexible substrate, phenolic paper substrate, composite substrate. In specific implementation, a skilled person can select a material of the substrate according to a requirement to manufacture the display device provided in the embodiment of the present application.

2. Line layer

In the display device provided in the embodiment of the present application, the circuit layer is formed on the surface of the substrate, as shown in fig. 2.

In the embodiments of the present application, the material of each circuit layer is not limited, wherein the material of each circuit layer includes, but is not limited to: copper wire, aluminum wire, silver wire, copper-containing alloy wire, aluminum-containing alloy wire, tin-containing alloy wire, nickel-containing alloy wire, zinc-containing alloy wire, silver-containing alloy wire, other metal wire or other alloy wire; the skilled person can select suitable materials as the material of the circuit layer according to the requirement.

3. Anisotropic conductive adhesive film

In the embodiment of the present application, an anisotropic conductive film is disposed above the circuit layer for electrically connecting the light source and the circuit layer, and the anisotropic conductive film mainly comprises colloid and conductive particles. Under the action of heating and pressure, the conductive particles in the anisotropic conductive adhesive film are pressed by the electrodes of the light source to be conducted with the circuit layer below, and the conductive particles pressed to the gap between the two parallel electrodes of the light source are not directly pressed by pressure and cannot be contacted with each other, so that the conductive particles are relatively insulated.

In the embodiment of the present application, the coverage degree of the anisotropic conductive film includes a plurality of kinds, wherein: as shown in fig. 3, the anisotropic conductive film may cover the entire pads formed at the windowing position in a strip shape, and as shown in fig. 4, is a top view of the anisotropic conductive film covering the entire pads formed at the windowing position in a strip shape; or, as shown in fig. 5, the circuit layer only covering the exposed open window portion of the solder resist layer, i.e. only covering the pad, as shown in fig. 6, is a top view of the circuit layer only covering the exposed open window portion of the solder resist layer; alternatively, as shown in fig. 7, the circuit layer and the substrate on which the circuit layer is disposed are covered. The covering method shown in fig. 7 has lower requirements on precision, and the covering method shown in fig. 5 reduces the amount of the anisotropic conductive adhesive film, so that the cost is lower; in the specific implementation, the skilled person can determine the coverage degree of the anisotropic conductive film according to the requirement on the precision and the budget of the project, which is not limited in the present application.

In the embodiment of the present application, in order to make the display device provided by the present application more universal, the material of the colloid in the anisotropic conductive film is not limited, wherein the material of the colloid of the anisotropic conductive film includes but is not limited to: epoxy resin, organic silicon resin, polyimide resin, phenolic resin, polyurethane and acrylic resin. The skilled person can select the material of the colloid in the anisotropic conductive adhesive film according to the requirement.

4. Solder mask

In the embodiment of the application, in order to protect the circuit layer, the solder mask layer is arranged on one side of the anisotropic conductive adhesive film, which deviates from the substrate, and the anisotropic conductive adhesive film is arranged in a silk-screen printing mode, so that the service life of the circuit layer can be obviously prolonged by the method. As shown in fig. 8, in order to make the circuit layer electrically connected to the electronic component, a window needs to be provided in the solder resist layer for leaking the anisotropic conductive film, i.e., forming a pad position.

5. Light source

In the embodiment of the application, the pins of the light source extend into the window to be connected with the circuit layer through the anisotropic conductive film. As shown in fig. 1B, the pins of the light source respectively extend into the windows and are connected with the circuit layer through the anisotropic conductive adhesive. In the embodiment of the present application, the number of the light sources is not limited, and the light sources may be: a sub-millimeter light emitting diode. The skilled person can determine the number of light sources by himself or herself according to the requirements.

Based on the same inventive concept, the present application also provides a display device, including: a display panel for displaying an image; the backlight module is positioned at the light incident side of the display panel; the backlight module and the display panel are the same as above, and are not described herein again. The backlight module comprises a lamp panel used as a light source; the structure of lamp plate is shown in fig. 9, and includes: the display panel comprises a substrate 101, wherein the substrate comprises a first surface 1011 and a second surface 1012, the first surface 1011 is the side of the substrate 101 facing the display panel, and the second surface 1012 is the side of the substrate 101 departing from the display panel; a first circuit layer 102A on the first surface 1011 of the substrate 101; a second circuit layer 102B on the second surface 1012 of the substrate 101; the anisotropic conductive film 103A is positioned on the first circuit layer 102A, is away from the first surface 1011, and covers the first circuit layer 102A; the first solder mask layer 104A is positioned on the anisotropic conductive adhesive film 103A and deviates from the first surface 1011, and the first solder mask layer 104A is provided with a window 105A for exposing the anisotropic conductive adhesive film; a light source 106 located on a side of the first circuit layer 102A facing away from the substrate; a second solder resist layer 104B located on the second circuit layer 102B away from the second surface 1012, the second solder resist layer 104B being provided with an opening 105B for exposing the second circuit layer 102B; and an electronic component 107 located on the second circuit layer 102B, wherein the first circuit layer 102A and the second circuit layer 102B are connected through a through hole 108.

The components of the lamp panel are described below, and the base plate in the lamp panel is the same as the base plate in the lamp panel, so that the description is omitted here.

1. Line layer

As shown in fig. 10, the substrate includes a first surface and a second surface, wherein the first surface is provided with a first circuit layer, and the second surface is provided with a second circuit layer.

In some possible embodiments, the first circuit layer disposed on the first surface of the substrate is connected to the second circuit layer disposed on the second surface of the substrate by a via. The material of the through hole is the same as that of the circuit layer.

In the present application, the method for disposing the second circuit layer is the same as the method for disposing the first circuit layer, and the method for disposing the anisotropic conductive film on the first circuit layer is the same as the method for disposing the single-layer circuit layer on the substrate, and the method for disposing the anisotropic conductive film on the second circuit layer is the same as the method for disposing the single-layer circuit layer on the substrate; the arrangement of the solder mask layer and the light source are the same as the above, and are not described herein again.

2. Electronic component

In the embodiment of the present application, the electronic components include, but are not limited to: display driver IC, capacitance, resistance, inductor, terminals. Technicians can arrange the electronic components on the substrate in the same welding mode as the light source according to requirements. And will not be described in detail herein.

It should be understood that the second circuit layer may be formed by solder paste instead of anisotropic conductive film to reduce the cost.

To sum up, replace the tin cream through set up anisotropic conductive adhesive film above first circuit layer in this application for make Mini LED and first circuit layer electricity be connected, promoted Mini LED's transfer precision, and prevented because of the base plate size is big on the left or the precision is not enough, the tin cream brush that leads to is inclined to the left. And the material of each part is not limited in the application, so that the universality of the application is further improved.

It should be noted that although several units or sub-units of the apparatus are mentioned in the above detailed description, such division is merely exemplary and not mandatory. Indeed, the features and functions of two or more units described above may be embodied in one unit, according to embodiments of the application. Conversely, the features and functions of one unit described above may be further divided into embodiments by a plurality of units.

Further, while the operations of the methods of the present application are depicted in the drawings in a particular order, this does not require or imply that these operations must be performed in this particular order, or that all of the illustrated operations must be performed, to achieve desirable results. Additionally or alternatively, certain steps may be omitted, multiple steps combined into one step execution, and/or one step broken down into multiple step executions.

As will be appreciated by one skilled in the art, embodiments of the present application may be provided as a method, system, or computer program product. Accordingly, the present application may take the form of an entirely hardware embodiment, an entirely software embodiment or an embodiment combining software and hardware aspects. Furthermore, the present application may take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, and the like) having computer-usable program code embodied therein.

The present application is described with reference to flowchart illustrations and/or block diagrams of methods, apparatus (systems), and computer program products according to the application. It will be understood that each flow and/or block of the flow diagrams and/or block diagrams, and combinations of flows and/or blocks in the flow diagrams and/or block diagrams, can be implemented by computer program instructions. These computer program instructions may be provided to a processor of a general purpose computer, special purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create means for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.

These computer program instructions may also be stored in a computer-readable memory that can direct a computer or other programmable data processing apparatus to function in a particular manner, such that the instructions stored in the computer-readable memory produce an article of manufacture including instruction means which implement the function specified in the flowchart flow or flows and/or block diagram block or blocks.

These computer program instructions may also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer implemented process such that the instructions which execute on the computer or other programmable apparatus provide steps for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.

It will be apparent to those skilled in the art that various changes and modifications may be made in the present application without departing from the spirit and scope of the application. Thus, if such modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is intended to include such modifications and variations as well.

Claims (9)

1. A display device, comprising:

a display panel for displaying an image;

the backlight module is positioned on the light incident side of the display panel; the backlight module comprises a lamp panel used as a light source;

the lamp plate includes:

a substrate;

the first circuit layer is positioned on one side, facing the display panel, of the substrate;

the anisotropic conductive adhesive film is positioned on one side of the circuit layer, which is far away from the substrate, so as to cover the first circuit layer;

the first solder mask layer is positioned on one side, away from the substrate, of the anisotropic conductive adhesive film and is provided with a window for exposing the anisotropic conductive adhesive film;

and the light source is positioned on one side of the circuit layer, which is far away from the substrate.

2. The display device according to claim 1, wherein the anisotropic conductive film covers the entirety of the first wiring layer; or the like, or, alternatively,

the first circuit layer is exposed from the windowing part of the first solder mask layer in a covering mode; or the like, or, alternatively,

and covering the first circuit layer including the part of the first circuit layer exposed by the windowing part of the first solder mask layer.

3. The display device of claim 1, wherein the light source is a sub-millimeter light emitting diode.

4. The display device according to claim 1, wherein the solder mask is disposed on a side of the anisotropic conductive film facing away from the substrate by silk-screen printing.

5. A display device, characterized in that the device comprises:

a display panel for displaying an image;

the backlight module is positioned at the light incident side of the display panel; the backlight module comprises a lamp panel as a light source;

the lamp plate includes:

the display panel comprises a substrate and a plurality of first and second substrates, wherein the substrate comprises a first surface and a second surface, the first surface is the side of the substrate facing the display panel, and the second surface is the side of the substrate departing from the display panel;

the first circuit layer is positioned on the first surface of the substrate;

a second circuit layer located on the second surface of the substrate;

the anisotropic conductive adhesive film is positioned on the first circuit layer, faces away from the first surface, and covers the first circuit layer;

the first solder mask layer is positioned on the anisotropic conductive adhesive film and departs from the first surface, and is provided with a window for exposing the anisotropic conductive adhesive film;

the light source is positioned on one side, away from the substrate, of the first circuit layer;

the second solder mask layer is positioned on the second circuit layer and departs from the second surface, and is provided with a window used for exposing the second circuit layer;

and the electronic components are positioned on the second circuit layer.

6. The display device according to claim 5, wherein the first circuit layer of the substrate and the second circuit layer of the substrate are connected by a via.

7. The display device according to claim 5, wherein the anisotropic conductive paste covers all of the first wiring layer; or the like, or, alternatively,

the first circuit layer is exposed from the windowing part of the first solder mask layer in a covering mode; or the like, or, alternatively,

and covering the first circuit layer including the part of the first circuit layer exposed by the windowing part of the first solder mask layer.

8. The display device according to claim 5, wherein the device further comprises: the anisotropic conductive adhesive film is positioned on the second circuit layer, faces away from the first surface, and covers the second circuit layer;

the anisotropic conductive adhesive covers the whole second circuit layer; or the like, or a combination thereof,

the second circuit layer covers the part, exposed out of the window opening, of the second solder mask layer; or the like, or, alternatively,

and covering a second circuit layer including the part of the second circuit layer exposed by the windowing part of the second solder mask layer.

9. The display device according to claim 5, wherein the electronic component includes: any one or combination of the following: display driver IC, capacitance, resistance, inductor, terminals.

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