JP2002040466A - Liquid crystal device, its connecting method and electronic equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a liquid crystal device which can be mounted on electronic equipment by an easy method. SOLUTION: This liquid crystal device has a liquid crystal layer sandwiched between a couple of substrates arranged opposite each other, and is made easy to mount on external equipment by providing an external connection terminal on at least one side of an end part of one substrate or either on at least one side of the mount surface of one substrate or outside the display area of one substrate. For example, a signal electrode is provided on the internal surface of the lower substrate between the couple of substrates, a lead-around wire for the signal electrode is provided over the external surface of the substrate through a through hole penetrating the lower substrate, and the external connection terminal is connected to the lead-around wire on the external surface of the substrate. A socket terminal, a pin array, a ball grid array, etc., are usable as the external connection terminal.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal device and an electronic device, and more particularly, to a liquid crystal device which can be easily connected when the liquid crystal device is mounted on another electronic component or electronic device, a method of connecting the same, and such a liquid crystal device. The present invention relates to an electronic device provided.

[0002]

2. Description of the Related Art In recent years, liquid crystal display panels have been widely used as means for displaying various types of information in portable electronic devices such as notebook personal computers, mobile phones, wristwatches, and the like. In particular, in portable electronic devices and the like, a liquid crystal display panel is accommodated in a limited space inside a housing, and furthermore, there is a demand for increasing the amount of information that can be displayed. In this specification, this portion is called a non-display region or a frame).

Usually, in a liquid crystal display device of this type, particularly a liquid crystal display device of a passive matrix (simple matrix) type, two opposing transparent substrates are pasted together with a sealant, and a sealant is applied between the two substrates. Liquid crystal is sealed in the enclosed area. Striped transparent electrodes that intersect each other are formed on the opposing surfaces of the bonded transparent substrates. In this liquid crystal display device, a portion in which transparent electrodes on two substrates intersect each other becomes a pixel, and a method of externally driving the liquid crystal for each pixel is employed.
Here, the display area is an area in which pixels are formed as a group inside the area surrounded by the sealing material. In order to control and display the liquid crystal crystals from the outside, for example, one substrate is extended outward from the outer shape of the other substrate, and the substrate surface of the extended region is pulled out from the transparent electrode of the display region. Driving ICs for supplying signals to the arranged wirings are mounted, and terminals of each driving IC and the wirings are electrically connected.

Then, in order to narrow the frame of the liquid crystal display panel (reduce the non-display area) and reduce the number of driving ICs used, in the case of a small-sized panel having a relatively small number of pixels, two panels are used. A method has been proposed in which all the electrodes on a transparent substrate are electrically connected to a large number of routing wirings provided in a non-display area on one substrate, and driving is performed by one driving IC connected to these routing wirings. . FIG. 25 and FIG. 26 show a configuration example of a liquid crystal display device of this system.

FIG. 25 shows a so-called COF (Chip On Film).
This is a form called mounting, in which one side of the lower substrate 100 protrudes outside the upper substrate 101, and a flexible printed circuit 103 (hereinafter referred to as a “flexible printed circuit”) on which one driving IC 102 is mounted. , FPC). Lower substrate 1
A large number of striped electrodes 104 and 105 are formed on the opposing surface of the upper substrate 101 and the upper substrate 101 in directions perpendicular to each other.

FIG. 26 shows a so-called COG (Chip On Glas).
s) In a form called mounting, the lower substrate 110
One side is protruding outside the upper substrate 111, and a driving IC 112 is directly mounted on this portion, and an FPC 113 for supplying a driving signal to the driving IC 112.
Are joined.

In either case, the wiring for the electrodes on the lower substrate and the wiring for the electrodes on the upper substrate are all collected on one side of the lower substrate on which the FPC and the driving IC are mounted. Have been.

FIG. 27 shows an example of the connection structure of the routing wiring.
This will be described in detail with reference to FIG. FIG. 27 is a plan view showing the arrangement of the electrodes and the routing wiring on the upper substrate.
FIG. 8 is a plan view showing the arrangement of the electrodes and the routing wiring on the lower substrate. As shown in FIG. 27, on the upper substrate 120, a strip-shaped scanning electrode 121 extending in the horizontal direction in the drawing is provided.
Are arranged in stripes. Here, a region where a large number of scanning electrodes 121 are formed becomes a display region 122 as a liquid crystal display device. In addition, in the non-display area outside the display area 122 (the right and left sides of the display area 122 in the figure), the scanning electrode lead-out wiring 123 for supplying a signal to each scanning electrode 121 is arranged. After the lead-out wiring 123 is drawn out in the direction in which the electrodes extend, it is bent and one side of the upper substrate 120 (the lower side in the drawing)
Are gathered at both ends.

On the other hand, as shown in FIG.
At 0, a large number of strip-shaped signal electrodes 131 extending in a direction (vertical direction in the figure) orthogonal to the scanning electrodes 121 are arranged in a stripe shape. In addition, in the non-display area outside the display area 122 (the lower central part of the display area 122 in the drawing), the signal electrode lead-out wiring 132 for supplying a signal to each signal electrode 131 is arranged. . Also, on both sides of the region where the signal electrode lead-out lines 132 are arranged, the scan electrode lead-out lines 133 for electrically connecting to the scan electrode lead-out lines 123 of the upper substrate 120 are provided with the scan electrodes 121. As many as are arranged. Further, the pitch of the scanning electrode lead-out lines 133 matches the pitch of the scan electrode lead-out lines 123 on the upper substrate 120. In the present configuration example, all the lead wires 123 and 132 are formed integrally with the scanning electrode 121 or the signal electrode 131, and are made of indium tin oxide (hereinafter abbreviated as ITO) or the like. It is formed of a transparent conductive film.

[0010] The upper substrate 120 and the lower substrate 13 having the above configuration.
0, the outer shape of the upper substrate 120 is larger than the outer shape of the lower substrate 130, and the lower end of the scanning electrode routing wiring 123 on the upper substrate 120 and the scanning electrode routing on the lower substrate 130. The upper end of the wiring 133 is positioned so as to face the upper and lower conductive portions indicated by reference numeral 134 in the drawing. For example, an anisotropic conductive film, a conductive material containing conductive particles, and the like are provided in the upper and lower conductive portions 134, and the scanning electrode lead-out wiring 123 on the upper substrate 120 and the lower substrate 1 are provided therethrough.
The scanning electrode lead-out wiring 133 on 30 is electrically connected. In this manner, all of the scanning electrode lead-out lines 133 and all of the signal electrode lead-out lines 132 are gathered on one side of the lower substrate 130, and this part is shown in FIG. 25, for example. When such a COF mounting is performed, all the scanning electrodes 1 are driven from one driving IC on the COF.
A signal can be supplied to the signal 21 and the signal electrode 131.

[0011]

However, the liquid crystal display device having the above configuration has the following problems.

That is, when a conventional liquid crystal display device is mounted on another electronic component or electronic device, as shown in FIGS. 25 and 26, in order to supply a signal to a driving IC, another signal is supplied via an FPC. A method of joining with electronic parts and electronic devices has been adopted. Since the FPC for supplying a signal is provided so as to protrude largely from the substrate of the liquid crystal display device, the result of the narrowing of the frame of the liquid crystal display panel is not sufficiently exhibited. Further, when the liquid crystal display device is housed in the housing of the electronic device, the FPC portion is a useless space. Furthermore, in the process of mounting the liquid crystal display device on another electronic component or electronic device, the flexible FPC must be conveyed while being suspended, and there is a problem that handling is difficult.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and is an FPC for supplying a signal to a driving IC when a liquid crystal display device is mounted on another electronic component or electronic device. It is an object of the present invention to provide a liquid crystal display device that can be reliably connected to other electronic components or the like by a simple method without using a liquid crystal display and that is convenient for handling. Accordingly, it is an object of the present invention to provide a liquid crystal display device that maximizes the effect of narrowing the frame of the liquid crystal display panel and an electronic device using the same.

[0014]

In order to achieve the above object, a liquid crystal device according to the present invention is a liquid crystal device in which a liquid crystal layer is sandwiched between a pair of substrates disposed to face each other. An external connection terminal is provided on at least one side of the outer surface opposite to the surface in contact with the liquid crystal layer and on one end of the substrate. The end of the circuit board is the end of the circuit board. The external connection terminal is configured to be inserted into a socket of a peripheral partner.

By providing the external connection terminals on a part of the substrate of the liquid crystal device as described above, the liquid crystal device can be directly mounted on another electronic device or electronic component without the intervention of the FPC. Since it can be omitted, the effect of narrowing the frame can be maximized, the handling is simple, and the mounting work is also simplified. Also,
In the liquid crystal device of the present invention, the external connection terminal can be provided on at least one side of the outer surface of the one substrate opposite to the surface in contact with the liquid crystal layer. The outer surface of the substrate is a surface opposite to the side facing the liquid crystal layer, and is a surface opposite to the surface on which electrodes for driving liquid crystal are formed. At least one side of the outer surface is at least one side of the four sides on the outer surface. By providing external connection terminals on the outer surface of the substrate, the liquid crystal device can be mounted directly on other electronic devices or electronic components, so that unnecessary space can be saved and the effect of narrowing the frame is maximized. And the handling is simple and the mounting operation is simplified. Further, in the liquid crystal device of the present invention, the wiring for connecting the external connection terminal is formed on the outer surface opposite to the surface in contact with the liquid crystal layer of one substrate, and the external connection terminal is formed on the liquid crystal layer of one substrate. It can be provided on at least one side outside the display area on the inner surface that is the side in contact.

The inner surface of the substrate is the surface on the side where the substrate faces the liquid crystal layer, and is the surface on which electrodes for driving the liquid crystal are formed. At least one side outside the display area on the inner surface is defined as 4 outside the display area on the substrate provided with the liquid crystal drive circuit.
At least one of the sides. By providing the external connection terminal on at least one side outside the display area, the drive circuit surface of the liquid crystal device can be mounted directly on another electronic device or electronic component, so that useless space can be saved. In addition, the effect of narrowing the frame can be maximized, and the handling is simple and the mounting operation is simplified.

Here, as the external connection terminal used in the liquid crystal device of the present invention, a pin or a solder ball can be used. If pins or solder balls are arranged in a grid array and they are used, the liquid crystal device can be reliably connected to other electronic devices and electronic components by a simple method of simply heating and pressing a large number of connection terminals at the same time. can do. Further, the liquid crystal device of the present invention may be any of a reflective liquid crystal device, a transmissive liquid crystal device, and a transflective liquid crystal device. According to the present invention, in all types of liquid crystal devices, the effect of narrowing the frame is exhibited, and the handling is simple and the mounting operation is simplified.

One of the methods for connecting the liquid crystal device of the present invention to another electronic component is to use a liquid crystal device having an external connection terminal on at least one side of an end of one of the substrates. In this connection method, a connection terminal is inserted into an external connection socket of another electronic component or electronic device. Since an external connection terminal is provided on the liquid crystal device side, connection can be made extremely simply by inserting the external connection terminal into an electronic component or an external connection socket of an electronic device. Another connection method between the liquid crystal device of the present invention and another electronic component uses a liquid crystal device having an external connection terminal on at least one side of the outer surface of one substrate, and connects the external connection terminal to another electronic component. This is a connection method for connecting to an external connection terminal of an electronic component. Since the liquid crystal device is directly connected to other electronic components, there is an advantage that space can be saved. Still another method for connecting another liquid crystal device to another electronic component is to use a liquid crystal device having an external connection terminal on at least one side outside a display area on the inner surface of one substrate, and to connect the external connection terminal to the other electronic component. This is a method of connecting an external connection terminal of another electronic component via a bonding wire. Since the external connection terminal surface of the liquid crystal device and the external connection terminal of another electronic component can be arranged facing the same surface, there is an advantage that workability is improved.

An electronic apparatus according to the present invention includes the liquid crystal device according to the present invention. According to the present invention, since the liquid crystal device and the electronic device are directly connected, no extra space is required, the effect of narrowing the frame is maximized, and the display area is small in spite of the small size of the entire device. A wide and portable electronic device can be realized.

[0020]

DESCRIPTION OF THE PREFERRED EMBODIMENTS [First Embodiment] A first embodiment of the present invention will be described below with reference to FIGS.

This embodiment is an example in which the liquid crystal device of the present invention is applied to a passive matrix type liquid crystal display device.
This is an example of a liquid crystal display device having a display electrode also serving as a light reflection portion, a so-called reflection electrode.

FIG. 1 is a perspective view of the entire liquid crystal display device of the present embodiment as viewed from above, FIG. 2 is a perspective view as viewed from below.
3 is a top view (electrode formation surface) of the lower substrate, FIG. 4 is a bottom view of the lower substrate, FIG. 5 is a bottom view (electrode formation surface) of the upper substrate,
6 is a perspective view showing a state in which the upper substrate and the lower substrate are superimposed, FIG. 7 is a cross-sectional view along the line AA ′ in FIG. 6, and FIG. 8 is a cross-sectional view along the line BB ′ in FIG. It is. In all of the following drawings, the scale of each layer and each member is different in order to make each layer and each member have a size recognizable in the drawings.

As shown in FIG. 1, the liquid crystal display device 1 of the present embodiment has a lower substrate 2 (first substrate) and an upper substrate 3
A liquid crystal layer (not shown in FIG. 1) is sandwiched between substrates surrounded by a sealing material (not shown in FIG. 1). In the present embodiment, an opaque substrate made of polyimide or the like is used as the lower substrate 2, and a transparent substrate made of polycarbonate, polyether sulfone, acrylic resin, or the like is used as the upper substrate 3. In the following description, the surface of both substrates facing the liquid crystal layer is referred to as “inner surface”, and the surface on the opposite side is referred to as “outer surface”. A phase difference plate 4 (λ / 4) is provided on the outer surface of the upper substrate 3.
Plate) and a polarizing plate 5 (polarizing means) are sequentially adhered. In the drawings after FIG. 2, the illustration of the retardation plate 4 and the polarizing plate 5 is omitted.

On the inner surface of the lower substrate 2, a number of signal electrodes 6
(First conductive portions) are provided in a stripe shape, and a number of scanning electrodes 7 (second conductive portions) extending in a direction orthogonal to the signal electrodes 6 are formed on the inner surface of the upper substrate 3 facing the stripes. It is provided in the shape. A portion where the signal electrode 6 intersects with the scanning electrode 7 becomes an individual pixel 8, and a region where a number of pixels 8 are arranged in a matrix becomes a display region 9. In the present embodiment, the electrode on the lower substrate 2 side is described as a signal electrode, and the electrode on the upper substrate 3 side is described as a scanning electrode. However, the order may be reversed. Further, one of four sides of the lower substrate 2 is provided with an overhang portion 2a for providing an external connection terminal.

As shown in FIG. 2, a driving I / O is provided in a region corresponding to the display region 9 in a transmission plane on the outer surface of the lower substrate 2.
C10 is implemented. The driving IC 10 receives a signal input from an external circuit (not shown) and supplies an image signal to the signal electrode 6 and a scanning signal to the scanning electrode 7. Also, on the outer surface of the lower substrate 2, a signal electrode connection wire 12 (a first outer surface connection portion) which constitutes a part of a signal electrode lead wire (a first lead conductive portion) described later. , And a scanning electrode connection wiring 14 (a second outer surface connection part) which constitutes a part of the scanning electrode wiring (a second wiring conductive part). It is electrically connected to the terminal. An external connection terminal 26 is provided at the tip of the protruding portion 2 a of the lower substrate 2.
Is connected to the driving IC 10 via a signal input wiring 27 for supplying a driving signal to the IC.

As shown in FIG. 3, on the inner surface of the lower substrate 2, a number of signal electrodes 6 made of a metal thin film having a high light reflectivity such as aluminum or silver (or an alloy containing silver) are provided in a stripe shape. Have been. These signal electrodes 6 also serve as reflection layers, and enter from outside the upper substrate 3 during display,
The light transmitted through the liquid crystal layer is reflected on the surface of the signal electrode 6, and an image is displayed. Signal electrode 6
Has one end extending in the extending direction of the electrode as it is, and the tip thereof is formed in a circular shape, and serves as a land 16 for connecting to an in-hole connecting portion (first in-hole connecting portion) described later. In the center of the land 16, a through hole is formed that penetrates between the inner surface and the outer surface of the lower substrate 2. This portion of the end portion of the signal electrode 6 serves as a signal electrode connection wiring 18 which forms a part of a signal electrode lead-out wiring for electrically connecting the signal electrode 6 and the driving IC 10.

In the case of the present embodiment, the signal electrode connection wirings 18 are arranged in an order from the uppermost signal electrode 6 in FIG. As a result, the distance between the connection wirings adjacent in the vertical direction is ensured to be wide, and the connection wirings are not easily short-circuited. However, if there is no problem particularly in the interval between the connection wirings, all the connection wirings are drawn out in the same direction, for example, the upper half connection wiring is drawn out on the left side, and the lower half connection wiring is drawn out on the right side.
The connection wiring may be drawn in any direction. Further, a configuration in which a through-hole is simply provided at an end of the signal electrode 6 may be used without particularly forming a portion thinner than the signal electrode 6 as a connection wiring.

Further, above and below the signal electrode formation region in FIG. 3, an electrical connection is made between a vertical conducting portion (substrate connecting portion) and a hole connecting portion (second hole connecting portion), which will be described later. A large number of scanning electrode connection wirings 21 (second inner surface connection portions) are formed. These scanning electrode connection wirings 21 are electrically connected to each scanning electrode 7 of the upper substrate 3.
In the case of the present embodiment, one end of each scanning electrode connection wiring 21 is a rectangular land 22 in contact with the upper and lower conductive portions, and the other end is a circular land 23 in contact with the in-hole connection portion. In the center, a through-hole penetrating between the inner surface and the outer surface of the lower substrate 2 is formed. These scanning electrode connection wires 21 are also formed of the same material as the signal electrode 6 such as aluminum or silver (or an alloy containing silver).

FIG. 4 shows a state in which the lower substrate 2 shown in FIG. Circular lands 24 and 25 are provided on the outer surface of the lower substrate 2 corresponding to the positions of the through holes of the signal electrode connection wiring 18 and the scanning electrode connection wiring 21 shown in FIG. Each land 24 corresponding to a through hole of the signal electrode connection wiring 18
Are connected to the mounting region of the driving IC 10 from the signal electrode connection wirings 12, respectively.
Drive IC from each land 25 corresponding to the through hole of
The scanning electrode connection wiring 14 is provided toward the ten mounting regions.

A large number of the lands 24 and 25 are arranged along three sides of four sides of the peripheral portion of the lower substrate 2.
A large number of external connection terminals 26 are formed along the side of the remaining overhang portion 2a. This external connection terminal 26
Is provided on the side of the substrate opposite to the side of the substrate where the lands 23 and 25 for establishing electrical continuity between the upper and lower substrates are formed at the ends. The external connection terminal 26 is a terminal for connecting the liquid crystal display device 1 to a drive external circuit or the like when connecting the same to another electronic component or another electronic device. A signal input wiring 27 for supplying a drive signal to the drive IC 10 is provided from each of the external connection terminals 26 toward the mounting area of the drive IC 10. In the case of the present embodiment, the connection wiring 12 for signal electrodes, the connection wiring 14 for scanning electrodes, and the external connection terminals 2 formed on the outer surface of the lower substrate 2
6, the signal input wiring 27 and the like are all made of a material such as aluminum or silver (or an alloy containing silver), like the signal electrode 6 on the inner surface side and the connection wirings 18 and 21 and the like.

The outer surface of the lower substrate 2 is
It is desirable to cover the area where the wiring is exposed, except for the mounting area of No. 0 and the area where the external connection terminal 26 is formed, with a resin such as polyimide or resist. When such a coating layer is formed, corrosion of wirings such as the signal electrode connection wiring 12, the scanning electrode connection wiring 14, and the signal input wiring 41,
Problems such as disconnection and short-circuit can be prevented.

As shown in FIG. 5, a large number of scanning electrodes 7 made of a transparent conductive thin film such as ITO are provided on the inner surface of the upper substrate 3 in a stripe shape. The upper end of each scanning electrode 7 in FIG. 5 is a portion connected to the upper and lower conductive portions. The outer surface of the upper substrate 3 (not shown) is a flat surface on which nothing is formed.

When the lower substrate 2 and the upper substrate 3 having the above structure are overlapped, the result is as shown in FIG.

In FIG. 6, reference numeral 41 shown by a two-dot chain line
Is a sealing material for sealing the liquid crystal layer between the substrates. A portion where the signal electrode 6 and the scanning electrode 7 intersect is an individual pixel 8, and a region in which many pixels 8 are arranged in a matrix is a display region 9. In the case of the present embodiment, the outer shape of the upper substrate 3 is smaller than the outer shape of the lower substrate 2, and the lower substrate 2 protrudes outside the upper substrate 3. One side of the lower substrate 2 is a protruding portion 2a that protrudes and protrudes larger than the outer shape of the upper substrate 3. An external connection terminal 26 and a signal input wiring 27 are provided on the overhang portion 2a. The lands 16 at the tips of the signal electrode connection wirings 18 on the inner surface of the lower substrate 2 are formed at positions protruding outward from the outer shape of the upper substrate 3. On the other hand, as for the connection wiring 21 for each scanning electrode on the inner surface of the lower substrate 2, the portion of the rectangular land 22 in contact with the vertical conducting portion is located at the portion where the seal material 41 is formed, and the circular land provided with the through hole is provided. The land 23 is formed at a position protruding outward from the outer shape of the upper substrate 3.

FIG. 7 is a cross-sectional view taken along the line AA ′ of FIG. 6, that is, a cross-sectional view cut in a direction along the signal electrode 6. As shown in this figure, the lower substrate 2 and the upper substrate 3 are bonded together by a seal material 41 between the two substrates, and the liquid crystal layer 28 is placed in a space sealed by the lower substrate 2, the upper substrate 3 and the seal material 41. It is pinched. Here, the liquid crystal layer 28
For example, a general liquid crystal such as an STN (Super Twisted Nematic) liquid crystal can be used.

On the inner surface of the lower substrate 2, the signal electrode 6 and the signal electrode connection wiring 18 integrally formed with the signal electrode 6 are formed, and on the outer surface of the lower substrate 2, the signal electrode connection wiring 12 is formed. Is formed, and both signal electrode connection wirings 1 are formed.
Through holes 17 penetrating the substrate are formed in the lands at the tips of the ends 2 and 18. The inside of the through-hole 17 is filled with a conductive material such as a silver paste, and the conductive material electrically connects the signal electrode connection wiring 18 on the inner surface and the signal electrode connection wiring 12 on the outer surface. The connection part 15 in a hole which connects is comprised.

Here, as a more detailed configuration of the connection portion 15 in the hole, for example, a conductive material such as silver paste is embedded in the through hole 17 to form the connection portion 15 in the hole. When a coating layer is formed by coating the surface with an insulating resin or the like, corrosion of the conductive material can be prevented.

Alternatively, after the conductive material is buried in the through hole 17 to form the connection portion 15 in the hole, the lower substrate 2 is formed so as to cover the upper and lower surfaces of the connection portion 15 in the hole.
Connection wirings 1 for signal electrodes on the inner surface and the outer surface of
8, 12 may be formed.

Alternatively, the connection portion in the hole is only required to be able to electrically connect the signal electrode connection wirings on the inner surface side and the outer surface side, and may not necessarily be embedded in the entire inside of the hole. Therefore, a conductive material may be adhered only to the inner wall of the through hole 17 by using an electrolytic plating method to form the connection portion 15 in the hole.

As shown in FIG. 7, the terminal 3 of the driving IC 10 is provided at the end of the signal electrode connection wiring 12 on the outer surface of the lower substrate 2 opposite to the side where the through hole 17 is provided.
1 is connected. By adopting the wiring structure as described above, the image signal output from the driving IC 10 is connected to the signal electrode connection wiring 12 on the outer surface of the lower substrate 2, the connection portion 15 in the hole, and the inner surface of the lower substrate 2. Connection wiring 18 for signal electrodes
Is supplied to each signal electrode 6 via Therefore, the connection wiring 12 for signal electrodes on the outer surface of the lower substrate 2, the connection portion 15 in the hole, and the connection wiring 1 for signal electrodes on the inner surface of the lower substrate 2
8 constitutes the lead wiring 11 for signal electrodes.

The mounting form of the driving IC 10 shown in FIG.
The so-called face-down mounting (or ILB (Inner Lead B) with the surface (terminal formation surface) side of the IC facing the substrate side
onding), for example, a BG that forms the terminal 31 by solder balls arranged in a matrix.
An A (Ball Grid Array) type semiconductor element or the like is used.

Alternatively, as shown in FIG.
The so-called face-up mounting (or OLB (Outer Lead Bonding)) in which the back side of C10 is fixed on the lower substrate 2 and the electrode pads 33 on the IC front side and the signal electrode connection wiring 12 are bonded by bonding wires 34.
The driving IC may be mounted in a mounting form called “mounting”.

As shown in FIG. 7, a large number of scanning electrodes 7 are formed on the inner surface of the upper substrate 3. Further, alignment films 35 and 36 are formed on the uppermost layers of both the lower substrate 2 and the upper substrate 3 which are in contact with the liquid crystal layer 28, respectively. The alignment films 35 and 36 are made of a film such as polyimide, and have been subjected to an alignment process such as rubbing. Further, spacers 37 are dispersed between the lower substrate 2 and the upper substrate 3 to keep the distance between the substrates (hereinafter, referred to as a cell gap) constant.

FIG. 8 is a cross-sectional view taken along the line BB 'of FIG. 6, that is, a cross-sectional view cut in a direction along the scanning electrode 7, showing the configuration of the scanning electrode lead-out wiring 13. I have. As shown in this figure, the scanning electrode 7 is formed on the inner surface of the upper substrate 3 so as to be in contact with the upper surface of the sealing material 41. A large number of signal electrodes 6 are formed on the inner surface of the lower substrate 2, and connection wires 21 for scanning electrodes are formed so as to be in contact with the lower surface of the sealing material 41. Here, a conductive material such as metal particles is mixed in a binder such as a resin inside the sealing material 41, and the scanning electrode 7 and the scanning electrode connection wiring 21 that are in contact with the upper surface and the lower surface of the sealing material 41, respectively. Are electrically connected to each other to form the upper / lower conducting portion 19.

Hereinafter, the configuration from the inner surface to the outer surface of the lower substrate 2 is the same as that of the signal electrode lead-out wiring 11. That is, the scanning electrode connection wiring 14 is formed on the outer surface of the lower substrate 2, and the through holes 38 are formed in the lands 23, 25 at the tips of the scanning electrode connection wirings 21, 14 on both the inner surface and the outer surface. Have been. The inside of the through hole 38 is filled with a conductive material such as a silver paste, and the conductive material forms the connection portion 20 in the hole, and electrically connects the inner and outer scanning electrode connection wirings 21 and 14 to each other. Connected to

A terminal 31 of the driving IC 10 is connected to an end of the scanning electrode connection wiring 14 on the outer surface of the lower substrate 2 opposite to the end on which the through hole 38 is provided. By adopting the above wiring structure, the driving I
The scanning signal output from C10 includes the scanning electrode connection wiring 14 on the outer surface of the lower substrate 2, the connection portion 20 in the hole, the scanning electrode connection wiring 21 on the inner surface of the lower substrate 2,
Is supplied to each scanning electrode 7 via Therefore, the scanning electrode connection wiring 14 on the outer surface of the lower substrate 2, the connection portion 20 in the hole, and the scanning electrode connection wiring 2 on the inner surface of the lower substrate 2.
1 and the upper and lower conducting portions 19 are the lead-out wirings 1 for the scanning electrodes.
3 will be constituted. Overhang portion 2 of lower substrate 2
A signal input wiring 27 is formed to extend on the outer surface of a, and an external connection terminal 26a is formed at the tip thereof. In this embodiment, the external connection terminal 26a is formed only on the same outer surface side of the overhanging portion 2a of the lower substrate 2 as the signal input wiring 27. The external connection terminal 26a is formed one step thicker than the signal input wiring 27.

FIG. 9 shows the overhanging portion 2 a of the lower substrate 2.
As another example of the external connection terminals provided on the lower substrate 2, the outer surface of the extended portion 2a of the lower substrate 2, that is, the same side as the signal input wiring 27, the end surface of the extended portion 2a, and the inner surface of the extended portion 2a of the lower substrate 2 That is, the external connection terminal 26b having a U-shaped cross section is shown on three surfaces on which the signal electrode 6 is provided. In this embodiment, the external connection terminal 26 provided on the overhanging portion 2a of the lower substrate 2 is inserted into an external connection socket of another electronic component or electronic device to be connected. What is necessary is just to form according to the socket for external connection of an electronic component or an electronic device.

It is to be noted that a conductive material is mixed into the sealing material 41 and this portion is used as the upper / lower conducting portion 19, but the through hole of the lower substrate 2 outside the sealing material 41 on the inner surface of the upper substrate 2 is used. The scanning electrode 7 may be extended to a position above the lower electrode 38, and an arbitrary vertical conductive material may be formed above the through hole 38 of the lower substrate 2, and this portion may be used as a vertical conductive portion. The upper and lower conductive members can be formed by printing, for example, silver paste or the like. In the case of this configuration, the sealing material 4
Although there is no electrical continuity in the portion 1, continuity between the substrates is formed in the portion where the vertical conductive material is formed, and the conduction path is almost the same as the structure in FIG. 8.

Hereinafter, a method of manufacturing the liquid crystal display device having the above configuration will be described.

A polyimide substrate is prepared as a material of the lower substrate 2, and a conductive thin film made of a metal material such as aluminum is formed on both sides of the substrate. Next, after a photosensitive resist is applied on the conductive thin film on both surfaces of the substrate, a photomask is arranged on both surfaces of the substrate, and exposure is performed simultaneously. Next, by simultaneously patterning the conductive thin films on both the front and back surfaces of the lower substrate using well-known photolithography and etching techniques, the signal electrodes 6 on the inner surface side of the lower substrate 2 are formed.
Connection wirings 18 and 21, connection wiring 1 for signal electrode on outer surface side
2. The scanning electrode connection wiring 14, the signal input wiring 27, the external connection terminal 26, and the like are collectively formed.

Next, through holes 17 and 38 penetrating the substrate are formed by irradiating a predetermined portion of each connection wiring end portion on the substrate with a CO2 laser or the like. As another method of forming the through hole, chemical etching or the like using a resist pattern as a mask may be used. afterwards,
The insides of the through holes 17 and 38 are filled with a conductive material such as silver paste to form the connection portions 15 and 20 in the holes, and the connection wirings on both surfaces of the lower substrate 2 are electrically connected. Also,
As another method of forming the connection portion in the hole, a method of attaching a conductive material to the inner wall of the through hole using an electrolytic plating process or the like may be used. In any case, in the case of the present embodiment,
Since the same conductive thin film material is used on both the front and back surfaces of the substrate, the signal electrodes and the like on the inner surface side of the lower substrate 2 and various connection wirings and the like on the outer surface side can be simultaneously formed in one photolithography and etching process. The process can be greatly simplified.

On the other hand, a transparent substrate made of polycarbonate, polyethersulfone, acrylic resin or the like is prepared as a material for the upper substrate 3, and an IT (inner surface) side is provided on one side of the substrate.
A transparent conductive film such as O is formed. Next, the transparent conductive film is patterned using well-known photolithography and etching techniques to form a stripe-shaped scanning electrode 7.

Next, after coating and baking polyimide or the like on the inner surfaces of both the lower substrate 2 and the upper substrate 3, an alignment process such as a rubbing method is performed to form alignment films 35 and 36, respectively. Next, a spacer 37 for maintaining a cell gap on one of the lower substrate 2 and the upper substrate 3
After printing the resin material to be the sealing material 41,
The lower substrate 2 and the upper substrate 3 are bonded together, and a sealing material 41 is attached.
Is cured to produce an empty cell. In the case of the present embodiment, a conductive material such as metal particles is mixed in a resin material to be the seal material 41 in order to make the seal material 41 a vertical conductive portion.

Next, a liquid crystal is injected into the empty cell from a liquid crystal injection port of a sealing material by a vacuum injection method or the like, and the liquid crystal injection port is sealed, whereby a liquid crystal cell is manufactured. Further, after the retardation plate 4 and the polarizing plate 5 are sequentially attached to the outer surface side of the upper substrate 3,
The driving IC 10 is mounted on the outer surface side of the lower substrate 2 in a form such as face-down mounting or face-up mounting. Further, if necessary, for example, when forming a U-shaped external connection terminal 26b shown in FIG. 9, a conductive film is formed on the end surface of the protruding portion 2a of the lower substrate 2 using a conductive paste. Are connected to each other to obtain a U-shaped external connection terminal 26b.

Alternatively, a U-shaped external connection terminal 26b
May be formed by a method in which a U-shaped terminal fitting is fitted from the end face of the overhang portion 2a of the lower substrate 2 and swaged. Through the above steps, the liquid crystal display device 1 of the present embodiment
Is completed.

In the liquid crystal display device 1 of the present embodiment, the signal electrodes 6 on the inner surface of the lower substrate 2 are provided on the outer surface of the lower substrate 2.
And a driving IC 10 electrically connected to the scanning electrodes 7 on the inner surface of the upper substrate 3 and supplying signals to these electrodes.
Has been implemented. In the conventional configuration, the lead wiring of each electrode is led, for example, to the outside of the display area on the inner surface of the lower substrate, whereas in the configuration of the present embodiment, the lead wiring for the signal electrode is provided. 11, both of the scanning electrode routing wiring 13 are routed from the inner surfaces of the lower substrate 2 and the upper substrate 3 to the outer surface of the lower substrate 2 through the inside of the lower substrate 2.

Therefore, according to the present embodiment, the routing area provided outside the display area on the inner surface of the lower substrate in the conventional configuration, and the mounting area for the FPC and the electronic components are not required, so that it is not necessary. Only the frame can be significantly narrowed compared with the conventional case. Also, a large number of connection wirings can be laid out on the entire outer surface of the lower substrate 2 including the display area 9 and the pitch between the connection wirings can be designed with a margin, so that the drawing resistance is reduced. The problem of increase does not occur.

Further, as in the present embodiment, the lower substrate 2 is not necessarily a transparent substrate as in the case of using polyimide as the material of the lower substrate 2, so that a conventional substrate material for a liquid crystal display device is generally used. In addition to a transparent substrate such as glass or quartz, a resin substrate such as polyimide, a ceramic substrate, or the like can be used, and the degree of freedom in selecting the material of the lower substrate 2 is improved. For example, when a ceramic substrate is used for the lower substrate 2,
Since the rigidity of the lower substrate is improved, the deformation of the substrate is less likely to occur, and a liquid crystal display device having excellent cell gap uniformity and thus excellent display uniformity can be obtained. Further, both the upper and lower substrates may be formed of a flexible substrate such as a plastic film substrate. With this configuration, the liquid crystal display device can be made thinner and lighter, breakage such as breakage of the substrate is less likely to occur, and a curved surface can be displayed by bending the substrate. And the like.

Further, one of the projecting portions 2a of the lower substrate 2
Since the external connection terminal 26 is provided on the side, when mounting on another electronic component or electronic device, it is not necessary to use an FPC or the like for supplying a drive signal to the drive IC 10.
The connection between the external connection terminal 26 and another electronic component or electronic device can be easily performed by a simple method of simply inserting it into a socket. Further, no stress is generated when the external connection terminal 26 is connected to another electronic component or electronic device, and the display is not adversely affected.

In the case of the present embodiment, since the positions of the through holes 17 and 38 of the lower substrate 2 are arranged outside the sealing material 41, the connection portions 15 and 2 of the through holes 17 and 38 in the holes.
Even if the portion of “0” has a slightly raised shape on the lower substrate 2, the display area 9 inside the sealing material 41 is affected by the influence.
The cell gap does not change, and there is no problem in displaying images.

In the present embodiment, as described above,
Since the signal electrodes 6 and the like on the inner surface of the lower substrate 2 and the various connection wirings and the like on the outer surface are made of the same material such as aluminum,
Although the manufacturing process can be simplified, the signal electrodes 6 and the like on the inner surface of the lower substrate 2 and various connection wirings and the like on the outer surface may be formed of different materials. For example, the signal electrode 6 on the inner surface side
, A metal material having high light reflectance such as silver or aluminum may be used, and a metal material such as copper which is a low-resistance material may be used for the connection wiring on the outer surface side. In this case, instead of obtaining the above advantage of simplifying the manufacturing process,
The routing resistance can be further reduced. FIG. 10 is a diagram illustrating a method of mounting the driving IC 10 of the liquid crystal device having the external connection terminal 26 according to the present invention. The mounting mode shown in FIG. 10 is a so-called face-down mounting (or IL) in which the surface (terminal forming surface) side of the IC faces the substrate side.
B (Inner Lead Bonding) mounting, for example, a BGA (Ball Grid Array) type semiconductor element in which solder balls arranged in a matrix form the terminal 31 is used. FIG. 11 is a diagram showing another mounting method of the driving IC 10 of the liquid crystal device having the external connection terminal 26 according to the present invention. The mounting form shown in FIG.
The so-called face-up mounting (or OLB (Outer Lead Bonding)) in which the back side of C10 is fixed on the lower substrate 2 and the electrode pads 33 on the IC front side and the signal electrode connection wiring 12 are bonded by bonding wires 34.
Implementation).

FIG. 12 is a diagram showing a state in which the liquid crystal device having the external connection terminal 26 of the present invention is connected to another electronic component or electronic equipment. As shown in the figure, external connection terminals 26 are provided on the protruding portion 2 a of the lower substrate 2 of the liquid crystal display device 1. By simply inserting the overhanging portion 2a of the lower substrate 2 to which the external connection terminal 26 is attached into, for example, an external connection socket 46 of another electronic device 45 in the direction of the arrow in FIG. Electronic device 45 can be easily mounted. Further, since no special space is required for mounting, an extremely compact mounting can be realized.

[Second Embodiment] Hereinafter, a second embodiment of the present invention will be described.
The embodiment will be described with reference to FIGS.

In this embodiment, as in the first embodiment,
This is an example in which the liquid crystal device of the present invention is applied to a passive matrix type liquid crystal display device, and is an example of a liquid crystal display device having a display electrode also serving as a light reflection portion, a so-called reflective electrode. First
The present embodiment is different from the first embodiment in that solder balls or pins are used as external connection terminals.

As described above, the schematic configuration of the liquid crystal device according to the present embodiment is the same as that of the first embodiment, and the illustration and description of the common configuration will be omitted.

FIG. 13 is a view corresponding to FIG. 8 of the first embodiment, and is a cross-sectional view along the line BB 'in FIG.
Note that, in these drawings, the same components as those in FIGS. 1 to 12 are denoted by the same reference numerals.

The liquid crystal display device 51 of the present embodiment is similar to that of FIG.
As shown in FIG. 3, a solder ball 26c is provided as an external connection terminal 26 at the tip of the signal input wiring 27 in the protruding portion 2a of the lower substrate 2. Other configurations are exactly the same as those of the first embodiment.

FIG. 14 is a diagram showing another example corresponding to FIG. 8 of the first embodiment.
It is sectional drawing which follows the B 'line. In these drawings, the same reference numerals are given to the same components as those in FIGS.

As shown in FIG. 14, the liquid crystal device 61 according to the present embodiment has a pin 2 serving as an external connection terminal 26 at the tip of the signal input wiring 27 of the projecting portion 2 a of the lower substrate 2.
6d are provided. Other configurations are exactly the same as those of the first embodiment. FIGS. 15 and 16 show a connection method when the liquid crystal display device 51 or the liquid crystal device 61 shown in FIGS. 13 and 14 is mounted on another electronic component or electronic device. FIG. 15 is a transparent plan view of the case where the liquid crystal device of the present invention is mounted on another electronic component or the like. FIG. 16 is a sectional view taken along line CC ′ of FIG. As shown in FIG. 15, a liquid crystal device 61 of the present invention is arranged so as to overlap a predetermined position of another electronic device 45. In the liquid crystal device 61 of the present invention, for example,
d are arranged in a grid array, and are arranged so as to match the position of a predetermined connection socket 47 of another electronic device 45. FIG. 16 shows this state in cross section. When the liquid crystal device 61 is pressed against another electronic device 45 in this state, the pins 26 arranged in a grid array form are pressed.
d is inserted into the connection socket 47 of the other electronic device 45,
The liquid crystal display device 1 of the present invention is mounted on another electronic device 45. Further, the terminal for external connection provided in the liquid crystal display device 51 of the present invention is a solder ball 26 as shown in FIG.
When a plurality of c are arranged in a grid array,
A connection pad corresponding to the grid array is provided in place of the connection socket 47 of FIG. 45.

[Third Embodiment] Hereinafter, a third embodiment of the present invention will be described.
Will be described with reference to FIGS. 17 and 18. FIG.

This embodiment is an example in which the liquid crystal device of the present invention is applied to a passive matrix type liquid crystal display device, as in the first and second embodiments. This embodiment is different from the first and second embodiments in that a metal pad 26c is provided as the external connection terminal 26 of the liquid crystal display device 61. The metal pad 26e may be formed of a conductive thin film as in the first embodiment, or may be formed of a metal plate. It is only necessary that the surface be flat. This liquid crystal display device 1 is connected to an anisotropic conductive film.
FIG. 18 shows a cross-sectional view of a case where the electronic device 45 is mounted on another electronic device 45 using a film (ACF) 56. In this case, a metal pad 48 for the electronic device 45 is formed at a predetermined position of another electronic device 45 with a flat surface. When the metal pad 26e of the liquid crystal display device 61 and the metal pad 48 of the other electronic device 45 are overlapped and pressure-bonded with an anisotropic conductive film (ACF) 56 interposed therebetween, the liquid crystal display device 61 can be connected to another electronic device. It can be easily mounted on the device 45.

[Fourth Embodiment] Finally, a fourth embodiment of the present invention will be described with reference to FIGS.

This embodiment is an example in which the liquid crystal device of the present invention is applied to a passive matrix type liquid crystal device, as in the first to third embodiments. However, the difference between the fourth embodiment and the first to third embodiments is that the fourth embodiment is different from the first to third embodiments.
In the embodiment, the external connection terminal 26 of the liquid crystal display device 1 is used.
Is provided on the outer surface of the substrate opposite to the liquid crystal display surface, whereas in the fourth embodiment, the liquid crystal display device 7 is provided.
One is that the external connection terminal 26f is provided on the same surface as the liquid crystal display surface of the circuit board. Other configurations are the same as those of the first to third embodiments, and a detailed description thereof will be omitted.
FIG. 19 is a cross-sectional view taken along line BB ′ of FIG. 6 corresponding to FIG. 8 of the first embodiment. A through hole 39 is provided at the tip of the signal input wiring 27 in the protruding portion 2 a of the lower substrate 2, and an external connection terminal 26 f is provided as the external connection terminal 26. Other configurations are exactly the same as those of the first embodiment. The inside of the through hole 39 is filled with a conductive material such as a silver paste, and the conductive material is used to electrically connect the signal input wiring 27 on the outer surface and the external connection terminal 26f on the inner surface. The inner connection part 55 is constituted.

Here, as a more detailed configuration of the connection portion 55 in the hole, a connection material 55 in the hole is formed by embedding a conductive material such as a silver paste in the inside of the through hole 39.
After bonding the wire to the external connection terminal 26f,
When a coating layer is formed by, for example, coating the surface of a conductive material with an insulating resin, corrosion of the conductive material can be prevented.

FIG. 20 is a plan view showing a case where such a liquid crystal display device 71 of the present invention is mounted on another electronic device 45. FIG. 21 shows a cross section taken along line DD ′ of FIG. In this case, a metal pad 49 for the electronic device 45 is formed at a predetermined position on another electronic device 45 with a flat surface. Liquid crystal display 7
The external connection terminal 26f and the metal pad 49 of another electronic device 45 are arranged side by side as shown in FIG. 20, and the liquid crystal display device 71 and the other electronic device 45 are overlapped as shown in FIG. The connection terminal 26f and the metal pad 49 of another electronic device 45 are connected by a bonding wire 54. Since the external connection terminals 26f of the liquid crystal display device 71 and the metal pads 49 of the other electronic devices 45 are on the same side in this manner, the liquid crystal display device 71 can be efficiently used by using a wire bonding device (not shown). Can be mounted on another electronic device 45.

[Electronic Apparatus] An example of an electronic apparatus including the liquid crystal display device of the above embodiment will be described.

FIG. 22 is a perspective view showing an example of a mobile phone. In FIG. 22, reference numeral 1000 denotes a mobile phone main body, and reference numeral 1001 denotes a liquid crystal display unit using the above liquid crystal display device.

FIG. 23 is a perspective view showing an example of a wristwatch-type electronic device. In FIG. 23, reference numeral 1100 denotes a watch main body, and reference numeral 1101 denotes a liquid crystal display unit using the above-described liquid crystal display device.

FIG. 24 is a perspective view showing an example of a portable information processing device such as a word processor or a personal computer. 24, reference numeral 1200 denotes an information processing device, reference numeral 1202 denotes an input unit such as a keyboard, reference numeral 1204 denotes an information processing device main body, and reference numeral 1206 denotes a liquid crystal display unit using the above-described liquid crystal display device.

Since the electronic apparatus shown in FIGS. 22 to 24 includes a liquid crystal display portion using the liquid crystal display device of the above embodiment, the entire device is provided with a small liquid crystal panel with a narrow frame. An electronic device with a wide display area and excellent portability can be realized in spite of its small size. When the liquid crystal device of the present invention is used when mounting the liquid crystal device and assembling the electronic device as described above, the mounting operation can be greatly simplified.

The technical scope of the present invention is not limited to the above embodiment, and various changes can be made without departing from the spirit of the present invention. For example, when the liquid crystal device is a TFD or TFD type passive matrix liquid crystal display device, a liquid crystal device having a color filter, a liquid crystal device having a reflective layer and a display electrode separately, or a feature of these embodiments. The points may be appropriately combined. In the above description, the example in which the driving IC is arranged at the center of the outer surface of one substrate has been described. However, the driving IC may not be located at the center of the substrate, but may be arranged at the end of the substrate. It may be. When it is arranged at the edge of the substrate, it can be used for a transmission type liquid crystal display device. Furthermore, a drive IC may not be mounted, and the drive IC may be regarded as one of other electronic components.

Further, it is needless to say that the specific description of the constituent materials, shapes, manufacturing methods, and the like of the liquid crystal display devices exemplified in the above embodiments can be appropriately changed. Also,
The liquid crystal device of the present invention can be applied to a liquid crystal light valve of a projection type liquid crystal device (projector) as well as a direct view type.

[0083]

As described in detail above, by providing the external connection terminals on a part of the substrate of the liquid crystal device in this way, the liquid crystal device can be directly connected to another electronic device or electronic component without using an FPC. Since mounting can be performed, useless space can be omitted, so that the effect of narrowing the frame can be maximized, and handling is simple and mounting work is also simplified. Further, in the liquid crystal device of the present invention, since the external connection terminals are provided on at least one side of the mounting surface of the one circuit board, the liquid crystal device can be directly mounted on another electronic device or electronic component and mounted. Unnecessary space can be saved. Further, the effect of narrowing the frame can be maximized, and the handling is simple and the mounting operation is simplified. Further, in the liquid crystal device of the present invention, since the external connection terminals are provided on at least one side outside the display area of one circuit board, the drive circuit surface of the liquid crystal device is directly superimposed on another electronic device or electronic component and mounted. Therefore, useless space can be omitted, the effect of narrowing the frame can be maximized, and handling is simple and mounting work is also simplified.

If a pin grid array or a ball grid array is used as an external connection terminal, the liquid crystal device can be reliably connected to other electronic devices and electronic components by a simple method of only heating and pressing. Furthermore, if an external connection terminal provided on the liquid crystal device is used, positioning when the liquid crystal device is mounted on another electronic device becomes easy.
According to the present invention, since a wiring area and a mounting area for FPCs, electronic components, and the like, which are conventionally provided outside the display area on the inner surface of the substrate, become unnecessary, a frame portion can be significantly narrowed as compared with the related art. . In addition, since the external connection terminal is provided at an arbitrary position, by providing the leading wiring to the external connection terminal in an arbitrary direction, it is possible to further contribute to a narrower frame.

[Brief description of the drawings]

FIG. 1 is a perspective view of an entire liquid crystal device according to a first embodiment of the present invention as viewed from above.

FIG. 2 is a perspective view of the liquid crystal display device of FIG. 1 as viewed from below.

FIG. 3 is a top view (electrode formation surface) of a lower substrate included in the liquid crystal device of FIG. 1;

FIG. 4 is a bottom view of a lower substrate constituting the liquid crystal device of FIG. 1;

FIG. 5 is a bottom view (electrode formation surface) of an upper substrate constituting the liquid crystal device of FIG. 1;

FIG. 6 is a perspective view showing a state in which an upper substrate and a lower substrate constituting the liquid crystal device of FIG. 1 are overlaid;

7 is a view showing a cross-sectional structure of the liquid crystal device of FIG. 1, and is a cross-sectional view along line AA ′ of FIG. 6;

FIG. 8 is a cross-sectional view along the line BB ′ of FIG. 6;

FIG. 9 is a diagram showing another example of a cross-sectional view along line BB ′ in FIG. 6;

FIG. 10 is a diagram illustrating an example of a mounting form of a driving IC in the liquid crystal device of the present invention.

FIG. 11 is a diagram showing another example of a mounting mode of a driving IC in the liquid crystal device of the present invention.

FIG. 12 is a diagram illustrating an example in which the liquid crystal device of the present invention is mounted on another electronic device or the like.

FIG. 13 is a diagram showing another example of the external connection terminal of the liquid crystal device of the present invention.

FIG. 14 is a diagram showing another example of the external connection terminal of the liquid crystal device of the present invention.

15 is a plan view showing an example in which the liquid crystal device shown in FIG. 14 is mounted on another electronic device or the like.

FIG. 16 is a sectional view taken along line CC ′ of FIG. 15;

FIG. 17 is a sectional view showing still another example of the external connection terminal of the liquid crystal device of the present invention.

18 is a cross-sectional view illustrating an example in which the liquid crystal device illustrated in FIG. 17 is mounted on another electronic device or the like.

FIG. 19 is a sectional view showing still another example of the external connection terminal of the liquid crystal device of the present invention.

20 is a cross-sectional view illustrating an example in which the liquid crystal device illustrated in FIG. 19 is mounted on another electronic device or the like.

FIG. 21 is a sectional view taken along line DD ′ of FIG. 19;

FIG. 22 is a perspective view illustrating an example of an electronic apparatus of the invention.

FIG. 23 is a perspective view illustrating another example of the electronic apparatus of the invention.

FIG. 24 is a perspective view showing still another example of the electronic apparatus of the present invention.

FIG. 25 is a perspective view showing an example of a conventional liquid crystal device to which COF mounting is applied.

FIG. 26 is a perspective view showing an example of a conventional liquid crystal device to which COG mounting is applied.

FIG. 27 is a plan view illustrating a configuration of an upper substrate in a conventional passive matrix liquid crystal device.

FIG. 28 is a plan view showing a configuration of a lower substrate in a conventional passive matrix liquid crystal device.

[Explanation of symbols]

 1, 51, 61, 71 ... Liquid crystal display device 2 ... Lower substrate (first substrate) 3 ... Upper substrate (second substrate) 5 ... Polarizing plate (polarizing means) 6 Signal electrode 7 Scan electrode 8 Pixel 9 Display area 10 Drive ICs 12 and 18 ····· Connection wiring for signal electrode 13 ····················· Wiring wiring for scanning electrode 14, ············ Connection wiring for scanning electrode 15, 20, 55 ············ Connection part in hole 16 ···· Lands 17, 38, 39 ··························································································································································································・ Liquid crystal layer 31 ・ ・ ・ ・ ・ ・ Terminal 33 ・ ・ ・ ・ ・ ・ Electrode pad 34,54 ・ ・ ・ ・ ・ ・ Bonding wire 35,36 ・ ・ ・ ・ ・ ・ Alignment film 37 Spacer 41 Sealing material 45 Other electronic devices 46 External connection socket 47 Connection socket 48, 49 .... Metal pads 56 ... Anisotropic conductive film 100,110,130 ... Lower substrate 101,111,120 ... Upper substrate 102,112 ... Driving IC 103, 113 Flexible printed wiring board 1000 Mobile phone 1100 Wristwatch electronic device 1200 Portable information processing device

Continued on the front page (72) Inventor Takaaki Tanaka 3-5-5 Yamato, Suwa-shi, Nagano Seiko Epson Corporation (72) Inventor Yoichi Momose 3-5-35 Yamato, Suwa-shi, Nagano Seiko Epson Corporation (72) Inventor Nobutaka Suzuki 3-3-5 Yamato, Suwa-shi, Nagano F-term in Seiko Epson Corporation (reference) 2H089 HA17 HA40 KA17 NA58 QA11 TA01 TA03 TA07 TA17 2H090 JA04 JA05 JB03 JC03 LA01 LA04 2H092 GA38 GA39 GA41 GA42 GA45 GA49 GA52 GA56 GA60 MA11 MA34 NA25 PA01 5G435 AA00 AA17 BB12 BB15 BB16 EE33 EE36 EE41 FF05

Claims (12)

[Claims] 1. A liquid crystal device in which a liquid crystal layer is sandwiched between a pair of substrates opposed to each other, wherein at least one side and one side of an outer surface opposite to a surface of one of the substrates that is in contact with the liquid crystal layer. A liquid crystal device comprising an external connection terminal at an end of the substrate. 2. A liquid crystal device in which a liquid crystal layer is sandwiched between a pair of substrates opposed to each other, and an external connection terminal is provided on at least one side of an outer surface of the one substrate which is opposite to a surface in contact with the liquid crystal layer. A liquid crystal device comprising: 3. A liquid crystal device in which a liquid crystal layer is sandwiched between a pair of substrates disposed to face each other, wherein a lead wiring connected to an external connection terminal is on a side opposite to a surface of one of the substrates which is in contact with the liquid crystal layer. A liquid crystal device having an outer surface and an external connection terminal provided on at least one side outside a display area on an inner surface which is a surface of the one substrate which is in contact with the liquid crystal layer. 4. The liquid crystal device according to claim 1, wherein the external connection terminal is a pin. 5. The liquid crystal device according to claim 1, wherein the external connection terminal is a solder ball. 6. The liquid crystal device according to claim 1, wherein the liquid crystal device is a reflection type liquid crystal device. 7. The liquid crystal device according to claim 1, wherein the liquid crystal device is a transmission type liquid crystal device. 8. The liquid crystal device according to claim 1, wherein the liquid crystal device is a transflective liquid crystal device. 9. A liquid crystal device in which a liquid crystal layer is sandwiched between a pair of substrates disposed to face each other, wherein the liquid crystal device has an external connection terminal on at least one side of an end of one circuit board. A method of connecting a liquid crystal device to another electronic device or the like, wherein the external connection terminal is used and inserted into an external connection socket of another electronic device or the like. 10. A liquid crystal device in which a liquid crystal layer is sandwiched between a pair of substrates opposed to each other, and an external connection terminal is provided on at least one side of an outer surface of the one substrate which is opposite to a surface in contact with the liquid crystal layer. A method for connecting a liquid crystal device to another electronic device or the like, wherein the external connection terminal is connected to an external connection terminal of another electronic device or the like by using a liquid crystal device provided with: 11. A liquid crystal device in which a liquid crystal layer is sandwiched between a pair of substrates opposed to each other, wherein at least one of the substrates is in contact with the liquid crystal layer and has an inner surface outside a display area.
Using a liquid crystal device with external connection terminals on the sides,
A method for connecting a liquid crystal device to another electronic device or the like, wherein the external connection terminal is connected to an external connection terminal of another electronic device or the like via a bonding wire. 12. An electronic apparatus comprising the liquid crystal device according to claim 1. Description: