CN217276047U - Contourgraph for wafer test - Google Patents
Contourgraph for wafer test Download PDFInfo
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- CN217276047U CN217276047U CN202221115606.6U CN202221115606U CN217276047U CN 217276047 U CN217276047 U CN 217276047U CN 202221115606 U CN202221115606 U CN 202221115606U CN 217276047 U CN217276047 U CN 217276047U
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- mounting panel
- annular groove
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- 238000012360 testing method Methods 0.000 title claims abstract description 26
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 12
- 239000010959 steel Substances 0.000 claims abstract description 12
- 239000003381 stabilizer Substances 0.000 claims abstract description 3
- 238000005096 rolling process Methods 0.000 claims description 7
- 238000000034 method Methods 0.000 abstract description 4
- 230000007547 defect Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
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Abstract
The utility model discloses a contourgraph that wafer test was used, the on-line screen storage device comprises a base, base upper surface central point puts fixed mounting has the electronic slope platform, the upper surface of electronic slope platform is equipped with the objective table, the rigidity that lower base surface is close to the four corners has the stabilizer blade, the rigidity that the base upper surface is close to the rear surface installs the measuring head, the inboard of measuring head is equipped with interference objective, the objective table includes mounting panel, revolving stage, electric telescopic handle, gyro wheel, annular groove, rubber pad, bar groove, spherical open slot, roll steel ball, L shape frame, circular through-hole, electric motor and No. two gyro wheels. A contourgraph that wafer test was used, through the rotatory wafer chip of objective table ability, observe the position that detects wafer chip surface difference, and can restrict not equidimension wafer chip's position, prevent that wafer chip position from taking place the skew in the testing process.
Description
Technical Field
The utility model relates to a contourgraph structure technical field that the wafer was used, in particular to contourgraph that wafer test was used.
Background
The contourgraph is an instrument for testing and inspecting the contour, two-dimensional size and two-dimensional displacement of an object, is widely applied to the automobile manufacturing and railway industries as a precision measuring instrument, the contourgraph for the wafer test is an optical 3D surface contourgraph, and the optical 3D surface contourgraph realizes ultrahigh repeated precision 3D measurement aiming at the surface of a sample in a non-contact scanning mode, and obtains 2D and 3D data representing the surface quality of the sample.
The existing contourgraph has certain defects in use, the objective table cannot rotate the wafer chips, and the positions of the wafer chips with different sizes are limited.
SUMMERY OF THE UTILITY MODEL
A primary object of the present invention is to provide a profiler for wafer test, which can effectively solve the problems of the background art.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the utility model provides a contourgraph that wafer test was used, includes the base, base upper surface central point puts fixed mounting has electronic slope platform, electronic slope platform's upper surface is equipped with the objective table, the fixed position that lower base surface is close to the four corners has the stabilizer blade, the fixed position that the base upper surface is close to the rear surface has the measuring head, the inboard of measuring head is equipped with the interference objective, the objective table includes mounting panel, revolving stage, electric telescopic handle, gyro wheel, annular groove, rubber pad, bar groove, spherical open slot, roll steel ball, L shape frame, circular through-hole, electric motor and No. two gyro wheels.
Preferably, the mounting panel is fixed in the upper surface of electronic slope platform, electric telescopic handle is fixed in the position that the mounting panel upper surface is close to the four corners, a gyro wheel is fixed in the adjacent one end of electric telescopic handle, the position at mounting panel upper surface center is seted up to the annular groove.
Preferably, the rubber pad is fixed in the upper surface of revolving stage, the upper surface at the rubber pad is seted up to the bar recess, the bar recess is seted up a plurality of, bar recess evenly distributed is in the upper surface of rubber pad, spherical open slot is seted up in the position that the revolving stage lower surface is close to the edge, the inside of spherical open slot is located to the roll steel ball, the quantity that spherical open slot was seted up is six, spherical open slot evenly distributed is close to the position at edge in the revolving stage lower surface.
Preferably, the L shape frame is fixed in the position that the mounting panel upper surface is close to the annular groove, the one end of L shape frame upper surface is seted up to circular through-hole, electric motor is fixed in the inboard of circular through-hole, No. two gyro wheels are fixed in the outside of electric motor axis of rotation, the fixed quantity of L shape frame is three, L shape frame evenly distributed is in the position that the mounting panel upper surface is close to the annular groove.
Preferably, the lower end of the rolling steel ball is clamped in the annular groove.
Preferably, the outer side of the rotating table is in contact with the outer side of the second roller.
Compared with the prior art, the utility model discloses following beneficial effect has:
the utility model discloses in, through the objective table that sets up, the wafer chip can be rotated to the objective table, observes the position that detects wafer chip surface difference, and can restrict not equidimension wafer chip's position, prevents that wafer chip position from taking place the skew in the testing process.
Drawings
Fig. 1 is a schematic view of an overall structure of a profiler for wafer testing according to the present invention;
fig. 2 is an enlarged schematic view of a portion a of the profiler for wafer testing according to the present invention in fig. 1;
fig. 3 is an exploded view of the stage of the profiler for wafer testing according to the present invention;
fig. 4 is an enlarged schematic view of a portion B in fig. 2 of the profiler for wafer testing according to the present invention.
In the figure: 1. a base; 2. an electrically powered tilting platform; 3. an object stage; 301. mounting a plate; 302. a rotating table; 303. an electric telescopic rod; 304. a first roller; 305. an annular groove; 306. a rubber pad; 307. a strip-shaped groove; 308. a spherical open slot; 309. rolling the steel ball; 310. an L-shaped frame; 311. a circular through hole; 312. an electric motor; 313. a second roller; 4. a leg; 5. a measuring head; 6. an interference objective.
Detailed Description
In order to make the utility model realize, the technical means, the creation characteristics, the achievement purpose and the efficacy are easy to understand and understand, the utility model is further explained by combining the specific implementation mode.
As shown in fig. 1-4, a profiler for wafer testing comprises a base 1, an electric tilting platform 2 is fixedly installed at the center of the upper surface of the base 1, an object stage 3 is installed on the upper surface of the electric tilting platform 2, support legs 4 are fixed at the positions of the lower surface of the base 1 near the four corners, a measuring head 5 is fixedly installed at the position of the upper surface of the base 1 near the rear surface, an interference objective lens 6 is installed inside the measuring head 5, the object stage 3 comprises a mounting plate 301, a rotating table 302, an electric telescopic rod 303, a first roller 304, an annular groove 305, a rubber pad 306, a strip-shaped groove 307, a spherical open groove 308, a rolling steel ball 309, an L-shaped frame 310, a circular through hole 311, an electric motor 312 and a second roller 313, the object stage 3 can rotate a wafer chip to observe and detect different positions of the surface of the wafer chip, the positions of the wafer chips with different sizes can be limited, and the wafer chips are prevented from being deviated in the testing process;
the mounting plate 301 is fixed on the upper surface of the electric inclined platform 2, the electric telescopic rod 303 is fixed on the upper surface of the mounting plate 301 at the position close to four corners, the first roller 304 is fixed at one end adjacent to the electric telescopic rod 303, and the annular groove 305 is formed in the center of the upper surface of the mounting plate 301; the rubber pad 306 is fixed on the upper surface of the rotating platform 302, the strip-shaped grooves 307 are formed in the upper surface of the rubber pad 306, a plurality of strip-shaped grooves 307 are formed, the strip-shaped grooves 307 are uniformly distributed in the upper surface of the rubber pad 306, the spherical open groove 308 is formed in the position, close to the edge, of the lower surface of the rotating platform 302, the rolling steel balls 309 are arranged inside the spherical open groove 308, the number of the spherical open grooves 308 is six, and the spherical open grooves 308 are uniformly distributed in the position, close to the edge, of the lower surface of the rotating platform 302; the L-shaped frame 310 is fixed on the upper surface of the mounting plate 301 close to the annular groove 305, the circular through hole 311 is formed in one end of the upper surface of the L-shaped frame 310, the electric motor 312 is fixed on the inner side of the circular through hole 311, the second roller 313 is fixed on the outer side of the rotating shaft of the electric motor 312, the number of the L-shaped frames 310 is three, and the L-shaped frames 310 are uniformly distributed on the upper surface of the mounting plate 301 close to the annular groove 305; the lower end of the rolling steel ball 309 is clamped inside the annular groove 305; the outer side of the rotary table 302 contacts the outer side of the second roller 313.
It should be noted that the present invention is a profiler for wafer testing, when in use, a wafer chip is placed on the upper surface of the rubber pad 306, the first roller 304 abuts against the side surface of the wafer chip through the electric telescopic rod 303 to prevent the wafer chip from shifting in position during rotation, the electric motor 312 drives the second roller 313 to rotate, the mounting plate 301 is driven to rotate through the second roller 313, the wafer chip rotates accordingly, the rolling steel balls 309 in the spherical opening groove 308 roll along the inside of the annular groove 305 during the rotation, the first roller 304 rolls along with the rotation of the wafer chip, the measuring head 5 detects the surface defect of the wafer chip through the interference objective 6, after the test, the finger takes off the wafer chip on the surface of the rubber pad 306 along the inside of the bar groove 307, the stage 3 can rotate the wafer chip to observe and detect different positions on the surface of the wafer chip, and the positions of the wafer chips with different sizes can be limited, and the wafer chips are prevented from being deviated in the testing process.
The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (6)
1. A profilometer for wafer testing, comprising: including base (1), base (1) upper surface center fixed mounting has electronic tilt platform (2), the upper surface of electronic tilt platform (2) is equipped with objective table (3), the rigidity that base (1) lower surface is close to the four corners has stabilizer blade (4), the rigidity that base (1) upper surface is close to the rear surface has measuring head (5), the inboard of measuring head (5) is equipped with interference objective (6), objective table (3) are including mounting panel (301), revolving stage (302), electric telescopic handle (303), gyro wheel (304), annular groove (305), rubber pad (306), bar groove (307), spherical open slot (308), roll steel ball (309), L shape frame (310), circular through-hole (311), electric motor (312) and No. two gyro wheels (313).
2. The profiler for wafer testing as set forth in claim 1, wherein: mounting panel (301) are fixed in the upper surface of electronic slope platform (2), electric telescopic handle (303) are fixed in the position that mounting panel (301) upper surface is close to the four corners, gyro wheel (304) are fixed in the adjacent one end of electric telescopic handle (303), the position at mounting panel (301) upper surface center is seted up in annular groove (305).
3. The profiler for wafer testing as set forth in claim 2, wherein: rubber pad (306) is fixed in the upper surface of revolving stage (302), the upper surface of rubber pad (306) is seted up in bar recess (307), the quantity is seted up in bar recess (307) a plurality of, bar recess (307) evenly distributed is in the upper surface of rubber pad (306), the position that the revolving stage (302) lower surface is close to the edge is seted up in spherical open slot (308), the inside of spherical open slot (308) is located in roll steel ball (309), the quantity that spherical open slot (308) were seted up is six, spherical open slot (308) evenly distributed is in the position that the revolving stage (302) lower surface is close to the edge.
4. The profiler for wafer testing as set forth in claim 3, wherein: l shape frame (310) are fixed in the position that mounting panel (301) upper surface is close to annular groove (305), the one end of L shape frame (310) upper surface is seted up in circular through-hole (311), electric motor (312) are fixed in the inboard of circular through-hole (311), No. two gyro wheels (313) are fixed in the outside of electric motor (312) axis of rotation, the fixed quantity of L shape frame (310) is three, L shape frame (310) evenly distributed is in the position that mounting panel (301) upper surface is close to annular groove (305).
5. The profiler for wafer testing as set forth in claim 4, wherein: the lower end of the rolling steel ball (309) is clamped in the annular groove (305).
6. The profiler for wafer testing as set forth in claim 5, wherein: the outer side of the rotating platform (302) is contacted with the outer side of the second roller (313).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221115606.6U CN217276047U (en) | 2022-05-10 | 2022-05-10 | Contourgraph for wafer test |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221115606.6U CN217276047U (en) | 2022-05-10 | 2022-05-10 | Contourgraph for wafer test |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217276047U true CN217276047U (en) | 2022-08-23 |
Family
ID=82884779
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221115606.6U Active CN217276047U (en) | 2022-05-10 | 2022-05-10 | Contourgraph for wafer test |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217276047U (en) |
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2022
- 2022-05-10 CN CN202221115606.6U patent/CN217276047U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20240115 Address after: 518000 3rd floor, building 5, Xifa District C, Yintian Industrial Zone, Xixiang street, Bao'an District, Shenzhen City, Guangdong Province Patentee after: SHENZHEN MICRUN INNOVATION INDUSTRIAL CO.,LTD. Address before: 518180 13th floor, building A3, Zhongtai Information Technology Industrial Park, innovation world, No. 2, Dezheng Road, Shilong community, Shiyan street, Bao'an District, Shenzhen, Guangdong Patentee before: Zhengyuanxin semiconductor (Shenzhen) Co.,Ltd. |