CN217239492U

CN217239492U - Semiconductor diode structure capable of effectively avoiding damage caused by stress during installation

Info

Publication number: CN217239492U
Application number: CN202121877114.6U
Authority: CN
Inventors: 薛敬伟
Original assignee: Binhai Yirun Electronics Co ltd
Current assignee: Binhai Yirun Electronics Co ltd
Priority date: 2021-08-12
Filing date: 2021-08-12
Publication date: 2022-08-19
Anticipated expiration: 2031-08-12

Abstract

The utility model discloses a semiconductor diode structure that can effectively avoid when installing because of the atress damage relates to diode structure technical field, cylindrical fixed surface is connected with the elastic plate, the tip fixedly connected with lug of elastic plate, the surface of movable block is seted up and is used for the lug is worn out and sliding connection's opening one with it, the inner wall of cover piece seted up with the recess of lug looks joint, still carry out the protective part that the atress was protected to semiconductor diode when installing. The utility model discloses, through the mode of joint for the diode can remove according to user's demand, consequently can improve the application scope of this device, simultaneously through the block mode that sets up slot and inserted block, the fixed mounting area of increase body and heat dissipation shell makes the stability of height-adjustable device, helps the sustained use of this device, has possessed the better effect of practicality.

Description

Semiconductor diode structure capable of effectively avoiding damage caused by stress during installation

Technical Field

The utility model relates to a diode structure technical field specifically is a semiconductor diode structure that damages because of the atress when can effectively avoid installing.

Background

Diodes, also known as crystal diodes, are widely used in the electronic field, and semiconductor diodes refer to two-terminal electronic devices utilizing semiconductor characteristics.

Present current semiconductor diode structure, mostly weld after injecing certain length and size with the diode, nevertheless in the in-service use, this diode can not remove, can not adjust the light-emitting angle of diode, consequently, can not cooperate optical device to carry out luminous flux, the adjustment of angle of incidence and facula position, application scope is less, simultaneously when diode installation and use, general diode is less to the installation fixed area of body usually, the condition of rocking easily appears when receiving the power on the body, the wearing and tearing of easy emergence to pin and inside chip and the condition of damage, cause the practicality of device not good.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a semiconductor diode structure which can effectively avoid damage caused by stress during installation, and has the advantages that the diode can move according to the requirements of users through a clamping mode, so the application range of the device can be improved, meanwhile, the fixed installation area of a tube body and a radiating shell is increased through a clamping mode of arranging a slot and an insert block, the stability of the height-adjustable device is ensured, the continuous use of the device is facilitated, the device has better practicability, the existing semiconductor diode structure is solved, the diode is mostly welded after being limited to a certain length and size, but when the diode is actually used, the diode can not move, the light-emitting angle of the diode can not be adjusted, so the light flux, the incident angle and the light spot position can not be adjusted by matching with an optical device, the application range is smaller, and when the diode is installed and used, the general diode is usually less to the installation fixed area of body, and the condition that easily appears rocking when receiving the power on the body easily appears, the condition to the wearing and tearing of pin and inside chip and damage, causes the not good problem of practicality of device.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a semiconductor diode structure that can effectively avoid damage because of atress when installing, includes body and pin, the inside of body is provided with the chip, the pin penetrates the mouth wall of body with the chip is connected, the right side fixedly connected with heat dissipation shell of body, the right side fixedly connected with movable block of heat dissipation shell, the surface cover of movable block is equipped with the cover piece, the inner wall fixedly connected with cylinder of movable block, cylindrical fixed surface is connected with the elastic plate, the tip fixedly connected with lug of elastic plate, the surface of movable block is offered and is used for the lug is worn out and sliding connection's opening one with it, the inner wall of cover piece offer with the recess of lug looks joint, still include the protective part that carries out the atress protection to semiconductor diode during the installation.

Optionally, the protection component includes a double-layer insulation board, the double-layer insulation board is connected with the side face of the heat dissipation shell through a bolt, the surface of the pipe body is fixedly connected with the insertion block, and a slot for inserting the insertion block is formed between the double-layer insulation board.

Optionally, a connecting ring is fixedly connected to a side surface of the moving block, an internal thread is formed in the inner wall of the connecting ring, and the connecting ring is connected with a handle through the internal thread.

Optionally, the inner wall of the heat dissipation shell is provided with a water tank and a refrigeration piece, the side face of the water tank is fixedly communicated with a water-cooling pipe, and a water pump is arranged inside the water-cooling pipe.

Optionally, the surface of the handle is provided with anti-slip lines, and the water cooling pipe is provided with a plurality of corners.

Optionally, an anti-oxidation layer is arranged inside the pipe body, and a waterproof layer is arranged on the outer side of the anti-oxidation layer.

Compared with the prior art, the beneficial effects of the utility model are as follows:

one, the utility model discloses a removal of movable block, make lug and recess joint stable, make to drive left pin and body and move in step, weld after for injecing certain length and size with the diode usually because of current semiconductor diode, nevertheless in the in-service use, this type of diode can not remove, can not adjust the light-emitting angle of diode, consequently, can not cooperate optical device to carry out luminous flux, the adjustment of angle of incidence and facula position, so to the user that needs the precision control parameter, can not satisfy user's user demand, the mode of joint is passed through to this mode, make the diode can remove according to user's demand, thereby change luminous flux and angle of incidence isoparametric, consequently, the application scope of this device can be improved, make the practicality better.

Two, the utility model discloses an insert the inserted block in inserting the slot between the double-deck insulation board, and the relation of connection of inserted block and body, when receiving power on the body when actual use, can transmit the heat dissipation shell through the inserted block on, can prevent to damage because of the atress at the chip in installation or the during operation body, can play certain protecting effect to the chip, this formula design is simple simultaneously, and can help improving and reduce rocking of body, avoids causing the condition of wearing and tearing to pin and chip because of rocking.

Thirdly, the utility model discloses a mode of joint for the diode can remove according to user's demand, consequently can improve the application scope of this device, simultaneously through the block mode that sets up slot and inserted block, the fixed mounting area of increase body and heat dissipation shell makes the stability of adjustable high device, helps lasting the use of this device, has possessed the better effect of practicality.

Drawings

FIG. 1 is a front view of the structure of the present invention;

FIG. 2 is a front sectional view of the structure of the present invention;

FIG. 3 is an enlarged view of the structure A of FIG. 2 according to the present invention;

fig. 4 is a side view of the pipe body, the heat dissipating casing, the double-layer insulating plate and the insert block structure of the present invention.

In the figure: 1. a pipe body; 3. a pin; 4. a heat dissipation housing; 5. a moving block; 6. sleeving a block; 7. a cylinder; 8. an elastic plate; 9. a bump; 10. a groove; 11. a double-layer insulating plate; 12. a slot; 13. inserting a block; 14. a connecting ring; 15. a handle; 16. a water tank; 17. a refrigeration plate; 18. a water-cooled tube; 19. and (4) a water pump.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts all belong to the protection scope of the present invention.

Referring to fig. 1 to 4, the present invention provides a technical solution: a semiconductor diode structure capable of effectively avoiding damage caused by stress during installation comprises a tube body 1 and pins 3, wherein a chip is arranged inside the tube body 1, the pins 3 penetrate through the opening wall of the tube body 1 and are connected with the chip, the right side of the tube body 1 is fixedly connected with a heat dissipation shell 4, the right side of the heat dissipation shell 4 is fixedly connected with a movable block 5, the surface of the movable block 5 is sleeved with a sleeve block 6, the inner wall of the movable block 5 is fixedly connected with a cylinder 7, the surface of the cylinder 7 is fixedly connected with an elastic plate 8, the end part of the elastic plate 8 is fixedly connected with a lug 9, the surface of the movable block 5 is provided with a first opening through which the lug 9 penetrates out and is in sliding connection with the first opening, the inner wall of the sleeve block 6 is provided with a groove 10 clamped with the lug 9, the semiconductor diode structure further comprises a protection component for protecting the semiconductor diode under stress during installation, the movement of the movable block 5 drives the cylinder 7, the elastic plate 8 and the lug 9 to move, the convex block 9 is clamped with different grooves 10, when the diode moves to a position required by a user, the convex block 9 and the grooves 10 are stably clamped, and due to the elastic restorability of the elastic plate 8, the convex block 9 is given with elastic force, so that the clamping effect is firmer, the pin 3 on the left side and the tube body 1 can be driven to synchronously move, because the conventional semiconductor diode is generally welded after the diode is limited to a certain length and size, but in actual use, the diode can not move, the light emitting angle of the diode can not be adjusted, and the light flux, the incident angle and the light spot position can not be adjusted by matching with an optical device, so that the use requirement of the user can not be met for the user needing precise control parameters, and the diode can move according to the requirement of the user by adopting the clamping mode, thereby change light flux and incident angle isoparametric, consequently can improve the application scope of this device for the practicality is better, under the effect through protective part, can prevent to damage because of the atress at the chip in installation or during operation body 1, can play certain safeguard effect to the chip, this formula design is simple simultaneously, and can help improving and reduce rocking of body 1, avoids causing the condition of wearing and tearing to pin and chip because of rocking.

Further, the protective part includes double-deck insulation board 11, double-deck insulation board 11 passes through the bolt and is connected with the side of heat dissipation shell 4, the fixed surface of body 1 is connected with inserted block 13, offer between the double-deck insulation board 11 and be used for inserted block 13 male slot 12, through inserting inserted block 13 in the slot 12 between the double-deck insulation board 11, and inserted block 13 and body 1's relation of connection, when receiving power on body 1 when actual use, can transmit on the heat dissipation shell 4 through inserted block 13.

For the stability of this device when removing is better, the accurate nature of removal is higher, influence to pin 3 and body 1 is less, it is further, the side fixedly connected with go-between 14 of movable block 5, the internal thread has been seted up to the inner wall of go-between 14, go-between 14 has handle 15 through internal thread threaded connection, through rotating handle 15, and because the threaded connection relation of handle 15 and go-between 14, and the fixed connection relation of go-between 14 and movable block 5, and the shape of movable block 5 is the rectangle, make movable block 5 can be by lateral shifting, the form that makes movable block 5 remove through setting up the screw rotation, compare in direct plug-type mode, can make the stability of this device when removing better, the accurate nature of removal is higher, influence to pin 3 and body 1 is less.

In order to make the heat that this device produced keep within certain scope, it is further, the inner wall of heat dissipation shell 4 is provided with water tank 16 and refrigeration piece 17, the fixed intercommunication in side of water tank 16 has water-cooled tube 18, the inside of water-cooled tube 18 is provided with water pump 19, the drainage effect of cooling water cooperation water pump 19 in through water tank 16, make the coolant liquid distribute in water-cooled tube 18, make when using the diode produce and transmit the heat to heat dissipation shell 4 and carry out the heat transfer, in order to reach the effect of cooling, the cooling water cools down through refrigeration piece 17's effect again at last, in order to reach the radiating effect of circulation, can make the heat that this device produced keep within certain within range.

In order to reach high-efficient radiating effect, furtherly, anti-skidding line has been seted up on the surface of handle 15, and water-cooled tube 18 is provided with a plurality of turnings, and through setting up anti-skidding line, can increase the area of contact of handle 15 and user's palm, avoids the condition that handle 15 takes off the hand, is provided with a plurality of turnings through setting up water-cooled tube 18, can increase water-cooled tube 18 and radiating shell 4's area of contact, can reach high-efficient radiating effect.

In order to guarantee the life of this device, improve the protecting effect of this device, furthermore, the inside of body 1 is provided with the antioxidation layer, the outside of antioxidation layer is provided with the waterproof layer, through setting up the antioxidation layer, the material of antioxidation layer is epoxy, can prevent the condition that takes place the oxidation after 1 live time of body is longer, material through setting up the waterproof layer is the acrylate, can prevent the condition that can't use after the inside chip intakes, through setting up antioxidation layer and waterproof layer, can guarantee the life of this device, improve the protecting effect of this device.

The working principle is as follows: when the semiconductor diode structure capable of effectively avoiding damage caused by stress during installation is used, the cylinder 7, the elastic plate 8 and the bump 9 are driven to move through the movement of the movable block 5, so that the bump 9 is clamped with different grooves 10, when the semiconductor diode structure moves to a position required by a user, the bump 9 is stably clamped with the groove 10, and due to the elastic restorability of the elastic plate 8, the bump 9 is given with elastic force, so that the clamping effect is firmer, the pin 3 on the left side and the tube body 1 can be driven to synchronously move, because the conventional semiconductor diode usually limits the diode to a certain length and size and then welds, in actual use, the diode can not move, the light-emitting angle of the diode can not be adjusted, and therefore, the diode can not be matched with an optical device to adjust the luminous flux, the incident angle and the light spot position, and therefore, for the user needing precise control parameters, the use requirements of users cannot be met, the diode can move according to the requirements of the users by the clamping mode, so that parameters such as luminous flux, incident angle and the like are changed, the application range of the device can be enlarged, and the practicability is better;

through inserting the inserted block 13 in the slot 12 between the double-deck insulation board 11, and the relation of connection of inserted block 13 and body 1, when receiving the power on the body 1 when actual use, can transmit to on the heat dissipation shell 4 through inserted block 13, can prevent that the chip in installation or during operation body 1 from damaging because of the atress, can play certain safeguard effect to the chip, this mode design is simple simultaneously, and can help improving and reduce rocking of body 1, avoid causing the condition of wearing and tearing to pin and chip because of rocking.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a can effectively avoid semiconductor diode structure of damage because of atress during installation, includes body (1) and pin (3), the inside of body (1) is provided with the chip, pin (3) penetrate the oral wall of body (1) with the chip is connected its characterized in that: the right side fixedly connected with heat dissipation shell (4) of body (1), the right side fixedly connected with movable block (5) of heat dissipation shell (4), the surface cover of movable block (5) is equipped with cover piece (6), the inner wall fixedly connected with cylinder (7) of movable block (5), the fixed surface of cylinder (7) is connected with elastic plate (8), the tip fixedly connected with lug (9) of elastic plate (8), the surface of movable block (5) is offered and is used for lug (9) are worn out and sliding connection's opening one with it, the inner wall of cover piece (6) seted up with recess (10) of lug (9) looks joint, still carry out the protective part of atress protection to semiconductor diode during the installation.

2. The semiconductor diode structure of claim 1, which is capable of effectively avoiding damage caused by force during installation, wherein: the protection part comprises a double-layer insulating plate (11), the double-layer insulating plate (11) is connected with the side face of the heat dissipation shell (4) through a bolt, an insertion block (13) is fixedly connected to the surface of the pipe body (1), and an insertion groove (12) used for inserting the insertion block (13) is formed between the double-layer insulating plate (11).

3. The semiconductor diode structure of claim 2, wherein the semiconductor diode structure is capable of effectively avoiding damage caused by a force during installation, and the semiconductor diode structure comprises: the side surface of the moving block (5) is fixedly connected with a connecting ring (14), inner threads are formed in the inner wall of the connecting ring (14), and the connecting ring (14) is connected with a handle (15) through the inner threads.

4. The semiconductor diode structure of claim 3, wherein the semiconductor diode structure is capable of effectively avoiding damage caused by a force during installation, and the semiconductor diode structure further comprises: the inner wall of the heat dissipation shell (4) is provided with a water tank (16) and a refrigerating sheet (17), the side face of the water tank (16) is fixedly communicated with a water-cooling pipe (18), and a water pump (19) is arranged inside the water-cooling pipe (18).

5. The semiconductor diode structure of claim 4, which is capable of effectively avoiding damage caused by force during installation, wherein: the surface of the handle (15) is provided with anti-skid grains, and the water cooling pipe (18) is provided with a plurality of corners.

6. The semiconductor diode structure of claim 1, wherein the semiconductor diode structure is capable of effectively avoiding damage caused by a force during installation, and the semiconductor diode structure comprises: an anti-oxidation layer is arranged inside the pipe body (1), and a waterproof layer is arranged on the outer side of the anti-oxidation layer.