CN217237764U

CN217237764U - Detection device for semiconductor device

Info

Publication number: CN217237764U
Application number: CN202220886981.4U
Authority: CN
Inventors: 李稳
Original assignee: Hubei Kerui Semiconductor Technology Co ltd
Current assignee: Hubei Kerui Semiconductor Technology Co ltd
Priority date: 2022-04-13
Filing date: 2022-04-13
Publication date: 2022-08-19
Anticipated expiration: 2032-04-13

Abstract

The utility model discloses a semiconductor device's detection device, include: the detection box is fixedly installed on a vertical plate of a mounting frame, a scanner is fixedly arranged on the inner wall of the top of the detection box, a group of transmission rollers are respectively arranged on the left side and the right side of the detection box on the mounting frame and are in transmission connection through the transmission belt, one group of transmission rollers are driven by a driving motor and penetrate through a rectangular through groove in the side wall of the detection box, the electric push rod is fixedly arranged on the inner wall of the mounting frame above the transmission belt, the push plate is fixedly arranged at the free end of the electric push rod, and the bottom of the detection box is designed to be of a conical structure; the utility model discloses a rotating the cylinder and will transporting to the guide plate on whole the range from the semiconductor chip that is not conform to the requirement of feed opening inside, and then be convenient for revive the semiconductor chip that is not conform to the requirement and repair, also prevent to take place irregular collision between the chip and damage the chip.

Description

Detection device for semiconductor device

Technical Field

The utility model belongs to the semiconductor testing field, specifically speaking relates to a semiconductor device's detection device.

Background

The semiconductor is a substance with conductivity between an insulator and a conductor, and the conductivity of the semiconductor is easy to control and can be used as an element material for information processing. The core elements of many electronic products, such as computers, mobile phones, and digital recorders, utilize the conductivity change of semiconductors to process information, and the common semiconductor materials include silicon, germanium, gallium arsenide, etc., while silicon is the most influential one of various semiconductor materials in commercial applications.

Carry out outward appearance detection to the semiconductor chip among the prior art and adopt the scanner directly to go on more, then push down the semiconductor chip that does not conform to the requirement from transport mechanism and get into the collecting box and collect, then repair the semiconductor chip that does not satisfy the requirement again, the chaotic stack of semiconductor chip back of pushing down from transport mechanism is not only inconvenient for take out it in the collecting box and repaiies, can mutual striking between the semiconductor chip simultaneously and make the quality of semiconductor chip impaired.

SUMMERY OF THE UTILITY MODEL

The to-be-solved technical problem of the utility model lies in overcoming the not enough of prior art, provides a semiconductor device's detection device, for solving above-mentioned technical problem, the utility model discloses a technical scheme's basic design is:

an inspection apparatus of a semiconductor device, comprising: the detection box is fixedly arranged on a vertical plate of the mounting frame, the inner wall of the top of the detection box is fixedly provided with a scanner, a group of driving rollers are respectively arranged on the left side and the right side of the detection box on the mounting rack, the two groups of driving rollers are in transmission connection through a transmission belt, one group of driving rollers is driven by a driving motor, the transmission belt passes through the rectangular through groove on the side wall of the detection box, an electric push rod is fixedly arranged on the inner wall of the mounting frame above the conveying belt, a push plate is fixedly arranged at the free end of the electric push rod, the bottom of the detection box is designed to be a conical structure, and the bottom of the detection box is provided with a feed opening, a rotary drum is arranged below the detection box, the outer edge of the rotary drum is provided with a transport groove, the bottom of mounting bracket is equipped with the guide plate, and both sides are fixed to be equipped with the limiting plate around the guide plate, and the rear end pivot of rotating the cylinder passes the vertical board on the mounting bracket and the driving motor transmission.

When the detection box is driven to rotate to a position corresponding to the top of the guide plate along with the rotation of the rotating roller, the semiconductor chips can be separated from the inside of the transportation groove and slide to the surface of the guide plate to be integrally arranged;

the utility model discloses a rotating the cylinder and will transporting to the guide plate on whole the range from the semiconductor chip that is not conform to the requirement of feed opening inside, and then be convenient for revive the semiconductor chip that is not conform to the requirement and repair, also prevent to take place irregular collision between the chip and damage the chip.

Preferably, the transport grooves are provided with a plurality of groups, and the transport grooves in the plurality of groups are annularly arranged at the outer edge of the rotary drum at equal intervals.

Preferably, a vibrating rod is fixedly arranged at a position, close to the rotating roller, of the side face of the guide plate, and the outer edge of the rotating roller is fixedly connected with the impact rod through a rubber rod at a position, close to the front end.

Rotate cylinder pivoted in-process, the striking pole will collide with the vibrating arm of guide plate side, and then makes the guide plate take place vibrations, avoids the chip to stop and can't glide in the slope department of guide plate.

Preferably, the interior of the rotary roller is of a hollow structure, the rubber air bag is fixedly arranged at the position, corresponding to the transport groove, of the inner wall of the rotary roller, the bottom of the transport groove is communicated with the interior of the rubber air bag through an air inlet, and an extrusion mechanism for extruding the rubber air bag is arranged in the rotary roller.

Specifically, rotating cylinder pivoted in-process, extrusion mechanism will extrude the rubber gasbag for the inside gas of rubber gasbag gets into the inside of conveyer trough through the inlet port, and then can blow the dust removal with the chip of conveyer trough inside, and the chip of also being convenient for inside of conveyer trough is blown on the guide plate by wind simultaneously.

Preferably, the extrusion mechanism comprises a rubber roller, the rubber roller is movably mounted at the outer side end of the connecting rod, the rubber roller is located at the eccentric position of the rotating roller, and the rubber roller corresponds to the top end of the guide plate.

The rubber roller is corresponding to the top end of the guide plate, so that the rubber roller just extrudes the rubber air bag at the position corresponding to the guide plate, air in the rubber air bag enters the inside of the transport groove from the air inlet, and the chip is convenient to fall off from the inside of the transport groove.

Preferably, the inner side end of the connecting rod is fixedly connected with the edge of a horizontal rod of the L-shaped rod piece, the horizontal rod of the L-shaped rod piece is inserted into the rotary drum and is positioned at the central shaft of the rotary drum, and the bottom end of a vertical rod of the L-shaped rod piece is fixedly installed on a horizontal plate of the installation frame.

Preferably, the rubber air bag is in a pressing state when passing through the outer edge of the rubber roller.

Compared with the prior art, the utility model following beneficial effect has:

1. the utility model transports the semiconductor chips which do not meet the requirements from the inner part of the feed opening to the guide plate to be integrally arranged by rotating the roller, thereby facilitating the correction and the trimming of the semiconductor chips which do not meet the requirements and preventing the chips from being damaged due to irregular collision;

2. at the in-process that rotates the cylinder pivoted, extrusion mechanism will extrude the rubber gasbag for the inside gas of rubber gasbag gets into the inside of conveyer trough through the inlet port, and then can blow the dust removal with the chip of conveyer trough inside, and the chip of the inside conveyer trough of also being convenient for is blown on the guide plate by wind simultaneously.

The following describes embodiments of the present invention in further detail with reference to the accompanying drawings.

Drawings

In the drawings:

fig. 1 is a schematic view of a first structure of the present invention;

fig. 2 is a second schematic structural view of the present invention;

FIG. 3 is a schematic view showing an inner structure of a rotary drum;

fig. 4 is an enlarged schematic view of the structure at a in fig. 3.

In the figure: mounting bracket 1, detection case 2, electric putter 3, push pedal 4, transmission band 5, driving roller 6, striking pole 7, conveyer trough 8, rotation cylinder 9, L shape member 10, guide plate 12, limiting plate 13, scanner 14, feed opening 15, rubber air bag 16, connecting rod 17, rubber drum 18, inlet port 19, rectangle through groove 20, vibrting spear 21.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and the following embodiments are used to illustrate the present invention.

As shown in fig. 1 to 4, an inspection apparatus for a semiconductor device includes: the detection box 2, the electric push rod 3, the push plate 4 and the transmission belt 5, the detection box 2 is fixedly arranged on a vertical plate of the mounting frame 1, the scanner 14 is fixedly arranged on the inner wall of the top of the detection box 2, a group of transmission rollers 6 are respectively arranged on the left side and the right side of the detection box 2 on the mounting frame 1, the two groups of transmission rollers 6 are in transmission connection through the transmission belt 5, one group of transmission rollers 6 is driven by a driving motor, the transmission belt 5 passes through a rectangular through groove 20 on the side wall of the detection box 2, the electric push rod 3 is fixedly arranged on the inner wall of the mounting frame 1 above the transmission belt 5, the push plate 4 is fixedly arranged at the free end of the electric push rod 3, the bottom of the detection box 2 is in a conical structure design, the bottom of the detection box 2 is provided with a feed opening 15, the lower part of the detection box 2 is provided with a rotary roller 9, the outer edge of the rotary roller 9 is provided with a transportation groove 8, and the bottom of the mounting frame 1 is provided with a guide plate 12, limiting plates 13 are fixedly arranged on the front side and the rear side of the guide plate 12, and a rear side end rotating shaft of the rotating roller 9 penetrates through a vertical plate on the mounting frame 1 to be in transmission with the driving motor.

When the detection box 2 passes through the interior of the detection box 2, the detection box 2 on the inner wall of the top of the detection box 2 can perform appearance detection on the chips, semiconductor chips meeting requirements can be continuously transported forwards, semiconductor chips which do not meet the requirements can fall into the bottom of the detection box 2 under the pushing of the electric push rod 3 and the push plate 4 and enter a blanking port 15 at the bottom of the detection box 2 and then enter a transport groove 8 at the edge of the rotary roller 9, and along with the rotation of the rotary roller 9, when the transport groove 8 rotates to a position corresponding to the top of the guide plate 12, the semiconductor chips can be separated from the interior of the transport groove 8 and slide to the surface of the guide plate 12 to be integrally arranged;

the utility model discloses a rotating cylinder 9 and will following the inside semiconductor chip that is not conform to the requirement of feed opening 15 and transport whole range to guide plate 12 on, and then be convenient for revive the semiconductor chip that is not conform to the requirement and repair, also prevent to take place irregular collision between the chip and damage the chip.

The transport troughs 8 are provided with a plurality of groups, and the transport troughs 8 in the plurality of groups are annularly arranged at the outer edge of the rotary roller 9 at equal intervals.

A vibrating rod 21 is fixedly arranged at the side of the guide plate 12 close to the rotary drum 9, and the outer edge of the rotary drum 9 close to the front end is fixedly connected with the impact rod 7 through a rubber rod.

In the rotating process of the rotating roller 9, the impact rod 7 collides with the vibrating rod 21 on the side surface of the guide plate 12, so that the guide plate 12 vibrates, and the chip is prevented from stopping at the slope of the guide plate 12 and cannot slide down.

The interior of the rotary roller 9 is of a hollow structure, a rubber air bag 16 is fixedly arranged at a position, corresponding to the transport groove 8, of the inner wall of the rotary roller 9, the bottom of the transport groove 8 is communicated with the interior of the rubber air bag 16 through an air inlet 19, and an extrusion mechanism for extruding the rubber air bag 16 is arranged in the rotary roller 9.

Specifically, rotating cylinder 9 pivoted in-process, extrusion mechanism will extrude rubber air bag 16 for the inside gas of rubber air bag 16 gets into the inside of conveyer trough 8 through inlet port 19, and then can blow the dust removal with the chip of the inside of conveyer trough 8, and the chip of the inside of conveyer trough 8 of also being convenient for simultaneously is blown to guide plate 12 on by the wind.

The extrusion mechanism comprises a rubber roller 18, the rubber roller 18 is movably arranged at the outer end of the connecting rod 17, the rubber roller 18 is positioned at the eccentric position of the rotary roller 9, and the rubber roller 18 corresponds to the top end position of the guide plate 12.

The rubber roller 18 corresponds to the top end of the guide plate 12, and then the rubber roller 18 just extrudes the rubber air bag 16 at the position corresponding to the guide plate 12, and the air in the rubber air bag 16 enters the inside of the transport groove 8 from the air inlet 19, so that the chip can fall off from the inside of the transport groove 8 conveniently.

The inner side end of the connecting rod 17 is fixedly connected with the edge of the horizontal rod of the L-shaped rod piece 10, the horizontal rod of the L-shaped rod piece 10 is inserted into the rotary drum 9 and is positioned at the central shaft of the rotary drum 9, and the bottom end of the vertical rod of the L-shaped rod piece 10 is fixedly installed on the horizontal plate of the installation frame 1.

When the bladder 16 passes the outer edge of the blanket cylinder 18, the bladder 16 is in compression.

Claims

1. An inspection apparatus of a semiconductor device, comprising: the detection box (2), the electric push rod (3), the push plate (4) and the transmission belt (5) are characterized in that the detection box (2) is fixedly arranged on a vertical plate of a mounting frame (1), a scanner (14) is fixedly arranged on the inner wall of the top of the detection box (2), a group of transmission rollers (6) are respectively arranged on the left side and the right side of the detection box (2) on the mounting frame (1), the two groups of transmission rollers (6) are in transmission connection through the transmission belt (5), one group of transmission rollers (6) are driven by a driving motor, the transmission belt (5) penetrates through a rectangular through groove (20) in the side wall of the detection box (2), the electric push rod (3) is fixedly arranged on the inner wall of the mounting frame (1) above the transmission belt (5), the push plate (4) is fixedly arranged on the free end of the electric push rod (3), the bottom of the detection box (2) is designed in a conical structure, and the bottom of the detection box (2) is provided with a feed opening (15), the below of detection case (2) is equipped with rotates cylinder (9), rotates the outward flange of cylinder (9) and has seted up transport tank (8), the bottom of mounting bracket (1) is equipped with guide plate (12), and both sides are fixed around guide plate (12) are equipped with limiting plate (13), and the back side pivot of rotating cylinder (9) passes the vertical board and the driving motor transmission of (1) on the mounting bracket.

2. The inspection apparatus for semiconductor devices as claimed in claim 1, wherein the transport slots (8) are provided in groups, and the groups of transport slots (8) are arranged in an equidistant circle at the outer edge of the rotating drum (9).

3. The semiconductor device inspection apparatus according to claim 1, wherein a vibration bar (21) is fixedly disposed on the side of the deflector (12) near the rotating drum (9), and the outer edge of the rotating drum (9) near the front end is fixedly connected to the striker bar (7) through a rubber bar.

4. The semiconductor device inspection apparatus according to claim 1, wherein the interior of the rotary drum (9) is hollow, and a rubber air bag (16) is fixedly disposed at a position where the inner wall of the rotary drum (9) corresponds to the transportation tank (8), the bottom of the transportation tank (8) is communicated with the interior of the rubber air bag (16) through an air inlet hole (19), and a pressing mechanism for pressing the rubber air bag (16) is disposed inside the rotary drum (9).

5. The inspection apparatus for semiconductor devices according to claim 4, wherein the pressing mechanism comprises a rubber roller (18), the rubber roller (18) is movably mounted at the outer end of the connecting rod (17), and the rubber roller (18) is located at an eccentric position of the rotating roller (9), and the rubber roller (18) corresponds to the top end position of the deflector (12).

6. The semiconductor device inspection apparatus according to claim 5, wherein the inner ends of the connecting rods (17) are fixedly connected to the horizontal rod edges of the L-shaped rod members (10), the horizontal rods of the L-shaped rod members (10) are inserted inside the rotating drum (9) and located at the central axis of the rotating drum (9), and the bottom ends of the vertical rods of the L-shaped rod members (10) are fixedly mounted on the horizontal plate of the mounting frame (1).

7. The inspection apparatus for semiconductor devices according to claim 4, wherein the rubber bladder (16) is in a compressed state when the rubber bladder (16) passes the outer edge of the rubber roller (18).