CN217216998U - Heat dissipation type multilayer circuit board - Google Patents
Heat dissipation type multilayer circuit board Download PDFInfo
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- CN217216998U CN217216998U CN202220134802.1U CN202220134802U CN217216998U CN 217216998 U CN217216998 U CN 217216998U CN 202220134802 U CN202220134802 U CN 202220134802U CN 217216998 U CN217216998 U CN 217216998U
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- circuit board
- heat dissipation
- buckle
- base plate
- monomer
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Abstract
The utility model discloses a heat dissipation type multilayer circuit board, comprising a base plate, be provided with the circuit board body on the bottom plate, the top surface border department of bottom plate is provided with a plurality of round platform form buckle hole, the circuit board body includes a plurality of circuit board monomer, adjacent circuit board monomer is connected through the axostylus axostyle, and above-mentioned circuit board monomer can buckle into the S-shaped, the circuit board monomer includes the base plate, the setting is provided with the circuit on the base plate, be provided with a plurality of heat dissipation slotted hole on the base plate, the heat dissipation slotted hole is in the clearance of circuit, it has heat dissipation aluminum fin to inlay in the heat dissipation slotted hole, the top surface of base plate is provided with the peritoneal layer, bottom surface border department at the free circuit board of bottom is fixed with the buckle pillar, the lateral wall bottom surface integrated into one piece of buckle pillar has a plurality of corrugate buckle shell fragment. The utility model discloses a structure sets up rationally, and it not only can effectively realize the assembly of multilayer circuit board and use, has better heat dispersion moreover, is favorable to improving overall structure's life, and the suitability is strong and the practicality is good.
Description
Technical Field
The utility model belongs to the technical field of the circuit board, concretely relates to heat dissipation type multilayer circuit board.
Background
The circuit board is also known as the circuit board, PCB board etc., the circuit board enables the circuit miniaturation, it is direct-viewing, to the batch production of fixed circuit with optimize with electrical apparatus overall arrangement to the important function together, along with the maturity of electronic technology, also higher and higher to the requirement of electronic product, the function is also more and more, thereby electronic components on the circuit board is also more and more, and its heat dispersion of conventional circuit board is comparatively limited, thereby cause the damage of circuit board easily, influence life, also do not do benefit to simultaneously and install, the commonality is comparatively limited, so suitability and practicality receive the restriction.
Disclosure of Invention
The utility model aims at providing a structure sets up reasonable and heat dispersion strong heat dissipation type multilayer circuit board.
The utility model discloses realize the technical scheme of purpose is a heat dissipation type multilayer circuit board, including the bottom plate be provided with the circuit board body on the bottom plate, the top surface border department of bottom plate is provided with a plurality of round platform form buckle hole, the circuit board body includes a plurality of circuit board monomer, and adjacent circuit board monomer is connected through the axostylus axostyle, and above-mentioned circuit board monomer can buckle into S-shaped, the circuit board monomer includes the base plate, sets up and is provided with the circuit on the base plate, be provided with a plurality of heat dissipation slotted hole on the base plate, the heat dissipation slotted hole is in the clearance of circuit, it has heat dissipation aluminum fin to inlay in the heat dissipation slotted hole, the top surface of base plate is provided with the peritoneal layer, is fixed with the buckle pillar in the free bottom surface border department of circuit board of bottom, the lateral wall bottom surface integrated into one piece of buckle pillar has a plurality of corrugate buckle shell fragment.
The bottom plate is provided with a position avoiding bar-shaped groove matched with the position of the radiating aluminum fin, and when the circuit board monomer at the bottom end is connected with the bottom plate, the lower part of the radiating aluminum fin extends into the position avoiding bar-shaped groove.
The surface of the top surface of the circuit board monomer is provided with a welding area, the welding area is positioned at the edge of the heat dissipation slotted hole, and the heat dissipation aluminum fin is inserted into the heat dissipation slotted hole and is welded and fixed with the welding area.
The axostylus axostyle is the plastics axostylus axostyle, and circuit board monomer and plastics axostylus axostyle interference joint.
The utility model discloses has positive effect: the utility model discloses a structure sets up rationally, and it not only can effectively realize the assembly of multilayer circuit board and use, has better heat dispersion moreover, is favorable to improving overall structure's life, and the suitability is strong and the practicality is good.
Drawings
In order that the present invention may be more readily and clearly understood, the following detailed description of the present invention is provided in connection with the following specific embodiments, taken in conjunction with the accompanying drawings, in which:
fig. 1 is a schematic structural diagram of the present invention.
Detailed Description
(example 1)
Fig. 1 shows a specific embodiment of the present invention, wherein fig. 1 is a schematic structural diagram of the present invention.
See fig. 1, a heat dissipation type multilayer circuit board, includes bottom plate 1, in this embodiment, the bottom plate is plastics or metal structure all can be provided with circuit board body 2 on the bottom plate, the top surface border department of bottom plate is provided with a plurality of round platform form buckle hole 3, circuit board body 2 includes a plurality of circuit board monomer 21, and adjacent circuit board monomer is connected through axostylus axostyle 22, and above-mentioned circuit board monomer can be buckled into the S-shaped, in the practical application in-process, the axostylus axostyle is the plastics axostylus axostyle, and circuit board monomer and plastics axostylus axostyle interference joint. Adopt the interference joint, not only can guarantee when buckling that the position of buckling is steady, also make things convenient for the operation of buckling moreover, improved the convenience of operation.
The circuit board single body 21 comprises a substrate 211, a circuit is arranged on the substrate, in the embodiment, the substrate and the circuit are common knowledge structures in the prior art, details are not recorded, the substrate is provided with a plurality of radiating slotted holes 212, the radiating slotted holes are located in gaps of the circuit, radiating aluminum fins 213 are embedded in the radiating slotted holes, the top surface of the substrate is provided with an abdominal membrane layer, a buckle support 4 is fixed at the edge of the bottom surface of the circuit board single body at the bottom end, and a plurality of corrugated buckle elastic sheets 5 are integrally formed on the bottom surface of the side wall of the buckle support. In this embodiment, the buckle pillar is the metal structure body, and the one end of its corrugate buckle shell fragment is connected with the buckle pillar, and the other end fretwork to when connecting, through the elasticity of corrugate buckle shell fragment in order to realize the stationarity andor the reliability of connecting, also easy to assemble uses.
The bottom plate is provided with a position avoiding strip-shaped groove 6 matched with the position of the radiating aluminum fin, and when the circuit board monomer at the bottom end is connected with the bottom plate, the lower part of the radiating aluminum fin extends into the position avoiding strip-shaped groove. In the embodiment, the avoiding strip-shaped groove is formed in the bottom plate, so that the gap between the circuit board monomer at the bottommost end and the bottom plate can be reduced when the circuit board is installed and used, the circuit board is favorable for being used in a narrow space, the application range of the circuit board is improved, and meanwhile, good heat dissipation performance can be guaranteed.
The surface of the top surface of the circuit board monomer is provided with a welding area 7, the welding area is positioned at the edge of the heat dissipation slotted hole, and the heat dissipation aluminum fin is inserted into the heat dissipation slotted hole and is welded and fixed with the welding area. In this embodiment, adopt above-mentioned structure to can guarantee the free stability of being connected of heat dissipation aluminum fin and circuit board, also can guarantee its good heat conduction heat dispersion through the weld zone moreover, the practicality is strong.
The utility model discloses a structure sets up rationally, and it not only can effectively realize the assembly of multilayer circuit board and use, has better heat dispersion moreover, is favorable to improving overall structure's life, and the suitability is strong and the practicality is good.
The standard parts used in the present embodiment may be purchased directly from the market, and the non-standard structural parts described in the specification may be obtained by processing directly according to the general knowledge of the prior art without any doubt, and the connection manner of the respective parts adopts the conventional means matured in the prior art, and the machines, parts and equipment are all of the types conventional in the prior art, so that detailed description thereof is omitted here.
It is obvious that the above embodiments of the present invention are only examples for clearly illustrating the present invention, and are not limitations to the embodiments of the present invention. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And such obvious changes and modifications which fall within the spirit of the invention are deemed to be covered by the present invention.
Claims (4)
1. The utility model provides a heat dissipation type multilayer circuit board, includes the bottom plate be provided with circuit board body on the bottom plate, its characterized in that: the utility model discloses a circuit board, including bottom plate, circuit board body, heat dissipation slotted hole, radiating aluminum fins, peritoneal membrane, buckle pillar, the top surface border department of bottom plate is provided with a plurality of round platform form buckle hole, the circuit board body includes a plurality of circuit board monomer, and adjacent circuit board monomer is connected through the axostylus axostyle, and above-mentioned circuit board monomer can buckle into the S-shaped, the circuit board monomer includes the base plate, sets up and is provided with the circuit on the base plate, be provided with a plurality of heat dissipation slotted hole on the base plate, the heat dissipation slotted hole is in the clearance of circuit, the downthehole inlaying of radiating slot has heat dissipation aluminum fins, the top surface of base plate is provided with the peritoneal membrane layer, is fixed with the buckle pillar in the free bottom surface border department of circuit board of bottom, the lateral wall bottom surface integrated into one piece of buckle pillar has a plurality of corrugate buckle shell fragment.
2. The heat dissipation type multilayer wiring board according to claim 1, wherein: the bottom plate is provided with a position avoiding bar-shaped groove matched with the position of the radiating aluminum fin, and when the circuit board monomer at the bottom end is connected with the bottom plate, the lower part of the radiating aluminum fin extends into the position avoiding bar-shaped groove.
3. The heat dissipation type multilayer circuit board according to claim 2, wherein: the surface of the top surface of the circuit board monomer is provided with a welding area, the welding area is positioned at the edge of the heat dissipation slotted hole, and the heat dissipation aluminum fin is inserted into the heat dissipation slotted hole and is welded and fixed with the welding area.
4. The heat dissipation type multilayer wiring board according to claim 3, wherein: the axostylus axostyle is the plastics axostylus axostyle, and circuit board monomer and plastics axostylus axostyle interference joint.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220134802.1U CN217216998U (en) | 2022-01-19 | 2022-01-19 | Heat dissipation type multilayer circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220134802.1U CN217216998U (en) | 2022-01-19 | 2022-01-19 | Heat dissipation type multilayer circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217216998U true CN217216998U (en) | 2022-08-16 |
Family
ID=82791088
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220134802.1U Active CN217216998U (en) | 2022-01-19 | 2022-01-19 | Heat dissipation type multilayer circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217216998U (en) |
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2022
- 2022-01-19 CN CN202220134802.1U patent/CN217216998U/en active Active
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