WO2019179448A1 - Optical module - Google Patents

Optical module Download PDF

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Publication number
WO2019179448A1
WO2019179448A1 PCT/CN2019/078783 CN2019078783W WO2019179448A1 WO 2019179448 A1 WO2019179448 A1 WO 2019179448A1 CN 2019078783 W CN2019078783 W CN 2019078783W WO 2019179448 A1 WO2019179448 A1 WO 2019179448A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
board
optical module
circuit boards
side plate
Prior art date
Application number
PCT/CN2019/078783
Other languages
French (fr)
Chinese (zh)
Inventor
陈金磊
刘寅龙
司宝峰
Original Assignee
青岛海信宽带多媒体技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 青岛海信宽带多媒体技术有限公司 filed Critical 青岛海信宽带多媒体技术有限公司
Publication of WO2019179448A1 publication Critical patent/WO2019179448A1/en

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    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4274Electrical aspects
    • G02B6/428Electrical aspects containing printed circuit boards [PCB]
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4256Details of housings
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/144Stacked arrangements of planar printed circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04Assemblies of printed circuits
    • H05K2201/042Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/09063Holes or slots in insulating substrate not used for electrical connections
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09145Edge details

Definitions

  • the present disclosure relates to the field of optical device technologies, and in particular, to an optical module.
  • the circuit board as the medium for connecting electronic components is the basis of the optical module.
  • the single-layer circuit board has Can not meet the product communication needs, need more board layout space to arrange components, in order to increase the layout space, a multi-layer circuit board structure that can better utilize space came into being.
  • the present disclosure provides an optical module capable of fast and stable assembly, a simple assembly process, high product yield, and high product yield of the optical module.
  • optical module including:
  • a first shell and a second shell a first shell and a second shell, the first shell and the second shell enclosing a cavity, and the cavity is provided with:
  • the first circuit board is connected to the first circuit board, and includes a main board, a side board, and a first hook and a second hook.
  • the side board is convexly disposed above the main board and the two end faces of the side board are respectively Cooperating with the first circuit board and the second circuit board to support the first circuit board and the second circuit board connected to the card holder, the first hook and the second hook setting
  • the first hook is engaged with the card slot on the first circuit board at the two ends of the main board, and the second hook is engaged with the card slot of the second circuit board. So that the first circuit board and the second circuit board abut against the main board.
  • the two end faces of the side plate facing the first circuit board and the second circuit board respectively are in contact with the opposite surfaces of the first circuit board and the second circuit board,
  • the side plates located between the first circuit board and the second circuit board support the first circuit board and the second circuit board.
  • the length of the side panel is not greater than the length of the main board in a direction along the second shell toward the first shell.
  • the first circuit board defines a first notch and the first notch is disposed corresponding to the card slot on the first circuit board, and the first notch is located on the first circuit board.
  • the outer edge is recessed along the width direction of the first circuit board, the end of the main board is located in the first notch;
  • the second circuit board is provided with a second notch and the second notch is a card slot on the second circuit board is correspondingly disposed, the second notch is located at an outer edge of the second circuit board and is recessed along a width direction of the second circuit board, and an end of the main board is located at the Said in the second gap.
  • the first hooks are respectively disposed on one end of the main board near the first circuit board, and the first hooks are protruded in a direction toward the first circuit board.
  • the second hooks are respectively disposed on one end of the main board near the second circuit board, and the second hooks are protruded in a direction toward the second circuit board.
  • the number of the side plates is two, including a first side plate and a second side plate, and the first side plate and the second side plate are convexly disposed along a surface direction of the main board. Both sides of the motherboard.
  • the number of the side plates is two, including a first side plate and a second side plate, and the first side plate and the second side plate are bent in a direction toward the inside of the first circuit board. Folded on both sides of the motherboard.
  • the card holder is a sheet metal member.
  • FIG. 1 is a schematic structural view showing a structure of a two-layer circuit board in the related art
  • FIG. 2 is a schematic structural diagram of an optical module according to an embodiment of the present disclosure
  • FIG. 3 is a schematic structural view of an optical module at the A position in FIG. 2;
  • FIG. 4 is a schematic structural diagram of a position corresponding to a circuit board and a card holder in an optical module according to an embodiment of the present disclosure
  • FIG. 5 is a schematic structural diagram of a card holder in an optical module according to an embodiment of the present disclosure
  • FIG. 6 is a schematic structural diagram of a card holder in an optical module according to an embodiment of the present disclosure.
  • the existing two-layer circuit board structure adopts two copper pillars to support the fixing manner of two circuit boards.
  • the main circuit board 01 and the sub-circuit board 02 are arranged in parallel above and below, and the copper pillars are arranged.
  • 03 is respectively soldered on the side of the main circuit board 01 and the sub-board 02, and is supported by the copper post 03 and connected to the main circuit board 01 and the sub-board 02. After the main circuit board 01 and the sub-board 02 are fixed, the pair is doubled.
  • the layer circuit board structure is loaded into the casing to form an optical module.
  • the existing double-layer circuit board structure is fixed by the copper pillar 03 welding method, on the one hand, the high price of the copper pillar 03 makes the manufacturing cost of the double-layer circuit board structure increase.
  • the welding process is complicated, and it is easy to affect the main circuit board 01 and the sub circuit board 02.
  • the fixed support effect is poor, and the support strength of the copper post 03 to the sub circuit board 02 cannot meet the demand, and it is not easy to realize when welding.
  • the parallel arrangement of the main circuit board 01 and the sub-board 02 has a low product yield. In order to achieve parallel arrangement of the two to avoid skew after soldering, additional parallelism detection is required to make the manufacturing cost of the double-layer circuit board structure.
  • the optical module comprises a first shell 1 and a second shell 4 which are connected by a fastening, and are formed by the first shell 1 and the second shell 4.
  • Two circuit boards 2 are disposed in the cavity, and the two circuit boards 2 are disposed opposite to each other in the direction in which the second casing 4 is directed to the first casing 1 (see A direction in FIG. 2), and also include two circuits respectively.
  • the card holder 3 is connected to the card holder 3, and the card holder 3 includes a main board 31, a side plate 32 and two hooks 33.
  • the side plate 32 is convexly disposed on the main board 31 and the end surface B of the side plate 32 is opposite to the two circuit boards 2.
  • the two circuit boards 2 are connected to the card holder 3, and the hooks 33 are disposed at two ends of the main board 31.
  • the two circuit boards 2 are provided with card slots 21, and the hooks 33 are opposite to the card slots 21.
  • the card is connected so that both circuit boards 2 abut on the main board 31.
  • the opposite surfaces of the circuit board 2 are respectively attached to the end faces B of the side plates 32 so as to be located.
  • the side plate 32 between the two circuit boards 2 supports the circuit board 2, and the hooks 33 are coupled to the card slots 21 so that the circuit board 2 abuts against the main board 21, ensuring the bonding of the circuit board 2 and the end surface B, preventing The circuit board 2 is rotated to be separated from the end face B.
  • the side plates 32 are formed with two upper and lower end faces parallel to each other, the end faces of the side plates 32 and the hooks 33 together realize the assembly of the card holder 3 and the circuit board 2, and the circuit board 2 is protruded from the end face B provided on the main board 31.
  • the two boards 2 are fixed to the two end faces B to support and fix the two circuit boards 2, which ensures the parallelism of the fixed connection of the two circuit boards 2 arranged up and down, and improves the product yield.
  • the contact surface is large, and the strength of the fixed support is high, which can meet the support strength requirements of the two circuit boards 2, that is, the connection stability of the above optical module is better;
  • the manner in which the hooks 33 on the card holders 3 are snap-connected to the card slots 21 on the two circuit boards 2 can quickly realize the fixed connection between the card holders 3 and the two circuit boards 2, that is, the two circuits can be quickly fixed.
  • the above-mentioned snap connection mode is relatively simple to operate, the connection process does not cause damage to the two circuit boards 2, and the detachable connection can be realized, and the connection strength is high, and the connection is improved.
  • the above optical module can achieve fast and stable assembly, the assembly process is simple, and the product yield is high.
  • the main board 31 is provided with two side plates 32, and the two side plates 32 are respectively disposed on two sides of the main board 31, and the two side boards 32 are used.
  • the four end faces B of the two circuit boards 2 are supported, and the two end faces B are arranged up and down, thereby ensuring the stability of the two circuit boards 2 connected by the card holder 3.
  • the two side plates 32 are respectively disposed on the two sides of the main board 31 along the surface direction of the main board 31, that is, the side boards 32 are protruded from the surface where the main board 31 is located, and the side boards 32 are provided. Coplanar with the motherboard 31.
  • the two side plates 32 are bent and disposed on two sides of the main board 31 in a direction toward the inside of the circuit board 2, that is, the side boards 32 are disposed obliquely to the surface of the main board 31, and the side boards 32 are facing the circuit board.
  • the inner direction of 2 is to support the surface of the circuit board 2.
  • the side plates 32 are disposed in a direction perpendicular to the surface of the main board 31, so that the four end faces B formed by the two side plates 32 can ensure a good abutting effect on the circuit board 2, thereby ensuring the card holder 3 and After the circuit board 2 is fixedly connected, the fixing effect is good, and the support strength of the card holder 3 is ensured.
  • each circuit board 2 is provided with a main board 31 for receiving the main board 31.
  • the notch 22 is formed in the outer edge of the circuit board 2 and is recessed in the width direction of the circuit board 2.
  • the end of the main board 31 is disposed in the notch 22, and the end of the main board 31 is abutted by the notch 22 to limit the circuit board 2.
  • the degree of freedom along the width and length directions ensures the positioning of the circuit board 2.
  • the notch 22 is disposed corresponding to the card slot 21 so that the end of the main plate 31 is received in the notch 22, and the hook 33 disposed on the main board 31 is easily engaged with the card slot 21.
  • the end face B formed by the side plate 32 can be used for a large contact surface area in contact with the circuit board 2 with respect to the soldering surface of the copper post, and the card holder 3 is ensured to the circuit board 2.
  • the support strength can meet the support strength requirements of the two circuit boards 2, that is, the connection stability of the above optical module is good.
  • two hooks 33 are respectively disposed on the main board 31 near the two ends of the circuit board 2, and the hooks 33 are protruded from the main board 31 in the direction toward the circuit board 2, and the hooks 33 are facing the circuit board 2.
  • the surface cooperates with the contact surface of the circuit board 2, thereby limiting the degree of freedom of the two circuit boards 2 in the A direction, ensuring that the two circuit boards 2 are relatively fixed in the up and down direction; the hooks 33 and the main board 31 connected to the hooks 33 are The cooperation limits the degree of freedom of the circuit board 2 along the width direction thereof, and ensures that the two circuit boards 2 are relatively fixed in the left-right direction; each of the hooks 33 is snap-connected with the card slots 21 of the two circuit boards 2, and the hooks are hooked.
  • the card holder 3 can fix two circuit boards 2 to realize A relatively fixed connection of two circuit boards 2 in the optical module.
  • the length of the side plate 32 is not greater than the length of the main board 31, so that the assembly of the card holder 3 and the circuit board 2 can be facilitated, and the stable support of the card holder 3 and the circuit board 2 can be ensured.
  • the length of the side plate 32 is equal to the length of the main plate 31 along the direction in which the second casing 4 is directed to the first casing 1.
  • the side plates 32 and the end faces of the main plate 31 are located on the same plane to form a contact surface of the circuit board 2, At this time, the area of the contact surface of the circuit board 2 is relatively large, so that the contact surface area of the circuit board 2 and the card holder 3 is large, and the strength of the fixed support can be ensured to be high, and the support strength requirement for the two circuit boards 2 can be satisfied. That is, the connection stability of the above optical module is good.
  • the two hooks 33 are respectively disposed on the main board 31.
  • the two ends of the circuit board 2 are protruded from the main board 31 in the direction of the circuit board 2, and the buckles of the card holders 3 and the circuit board 2 are buckled by the hooks of the hooks 33 and the card slots 21,
  • the two hooks 33 respectively disposed at the two ends of the circuit board 2 are respectively engaged with the two circuit boards 2.
  • the number of the card holders 3 in the optical module is two, each A circuit board 2 is symmetrically disposed on both sides in the width direction to be provided with a notch 22 for accommodating the main board 31.
  • the two card holders 3 jointly support the two circuit boards 2 from both sides of the circuit board 2.
  • the seat 3 can realize the fixed connection of the card holder 3 and the two circuit boards 2 relatively quickly, that is, the two circuit boards 2 can be quickly fixed; compared with the manner of welding connection in the prior art, the above-mentioned hooks 33 and the card slots 21
  • the mode operation is relatively simple, the connection process does not cause damage to the two circuit boards 2, and the detachable connection can be realized, and the utilization rate of the product is improved.
  • one card holder 3 can be used, and for the longer circuit board 2, a plurality of card holders 3 can be used, two card holders 3 are used, and two card holders 3 are symmetrically disposed on the circuit board.
  • the two of the two can ensure the balance of the board, ensure the balance of the optical module and the stability of the assembly, and improve the product yield.
  • the card holder 3 can be prepared from a metal material or other materials that satisfy the support strength of the card holder 3 to the circuit board 2.
  • the preparation material of the card holder 3 can be made according to the actual situation of the optical module. select.
  • the card holder 3 may be a sheet metal member.
  • the card holder 3 may be a sheet metal member or other integrally formed structure.
  • the specific structure of the card holder 3 is selected according to the actual situation of the optical module.
  • the card holder 3 When the card holder 3 is a sheet metal member, the card holder 3 of a specific shape is prepared by performing a cold working process such as punching and bending on the sheet metal material, since the sheet metal member has light weight, high strength, low cost, and large-scale amount. Features such as good production performance, widely used in the field of electronic devices.

Abstract

An optical module, comprising a fastener (3) separately connected to two circuit boards (2). The fastener (3) comprises a main plate (31), side plates (32), and two hooks (33); the side plates (32) are provided on the main plate (31) in a protruding manner, and end faces (B) of the side plates (32) are attached to the two circuit boards (2) to support the two circuit boards (2) connected to the fastener (3); the hooks (33) are provided at two ends of the main plate (31), and the hooks (33) are fastened to slots (21) provided on the circuit boards (2), so that the two circuit boards (2) are abutted against the main plate (31). The two circuit boards (2) are fixed on two end faces (B) of the side plates (32), so that the two circuit boards (2) are fixed in parallel, thereby ensuring parallelism of a fixed connection of the two circuit boards (2) and improving product yield. Moreover, contact areas are large when the circuit boards (2) are fixed on the end faces (B) and connection stability is high; the two circuit boards (2) can be fixed quickly by adopting a snap-fitting manner to connect the hooks (33) and the slots (21) of the two circuit boards (2), the operation is simple and the two circuit boards are protected from being damaged during the connection process; moreover, a detachable connection can be achieved and the utilization rate of the product is improved.

Description

一种光模块Optical module
本公开要求在2018年03月19日提交中国专利局、申请号为201810232602.8、申请名称为“一种光模块”的中国专利申请的优先权,其全部内容通过引用结合在本公开中。The present disclosure claims priority to Chinese Patent Application No. 201101232602.8, filed on Jan.
技术领域Technical field
本公开涉及光器件技术领域,尤其涉及一种光模块。The present disclosure relates to the field of optical device technologies, and in particular, to an optical module.
背景技术Background technique
在电子元件领域,电路板作为用以连接电子元件的媒介是光模块的基础,随着光模块传输功率和功能的增加,尤其在电子元件微小量大密集化的情况下,单层电路板已无法满足产品通讯需求,需要更多的电路板布板空间来布置元器件,为增大布板空间,能够较好利用空间的多层电路板结构应运而生。In the field of electronic components, the circuit board as the medium for connecting electronic components is the basis of the optical module. As the transmission power and function of the optical module increase, especially in the case of a large amount of dense electronic components, the single-layer circuit board has Can not meet the product communication needs, need more board layout space to arrange components, in order to increase the layout space, a multi-layer circuit board structure that can better utilize space came into being.
发明内容Summary of the invention
本公开提供了一种光模块,该光模块能够实现快速稳定装配,装配过程简单,产品良率较高,具有该光模块的产品良率较高。The present disclosure provides an optical module capable of fast and stable assembly, a simple assembly process, high product yield, and high product yield of the optical module.
本公开提供一种光模块,包括:The present disclosure provides an optical module, including:
第一壳和第二壳,所述第一壳和所述第二壳围设形成腔体,所述腔体内设置有:a first shell and a second shell, the first shell and the second shell enclosing a cavity, and the cavity is provided with:
第一电路板和第二电路板,所述第一电路板和第二电路板沿所述第二壳朝向所述第一壳的方向所相对设置,均设置有卡槽;卡座,与所述第一电路板和第一电路板连接,包括主板、侧板和第一卡钩和第二卡钩,所述侧板凸出设置于所述主板上方且所述侧板的两个端面分别与所述第一电路板和第二电路板相贴合,以支撑与所述卡座相连接的所述 第一电路板和第二电路板,所述第一卡钩和第二卡钩设置于所述主板的两端,所述第一卡钩与所述第一电路板上的卡槽相卡接,且所述第二卡钩与所述第二电路板上的卡槽相卡接,以使所述第一电路板和第二电路板抵接于所述主板。a first circuit board and a second circuit board, the first circuit board and the second circuit board are oppositely disposed along a direction of the second shell toward the first shell, and are provided with a card slot; The first circuit board is connected to the first circuit board, and includes a main board, a side board, and a first hook and a second hook. The side board is convexly disposed above the main board and the two end faces of the side board are respectively Cooperating with the first circuit board and the second circuit board to support the first circuit board and the second circuit board connected to the card holder, the first hook and the second hook setting The first hook is engaged with the card slot on the first circuit board at the two ends of the main board, and the second hook is engaged with the card slot of the second circuit board. So that the first circuit board and the second circuit board abut against the main board.
在一些实施方式中,所述侧板上朝向于所述第一电路板和第二电路板的两个端面分别与所述第一电路板第二电路板之间相对的表面相贴合,以使位于所述第一电路板和第二电路板之间的所述侧板支撑所述第一电路板和第二电路板。In some embodiments, the two end faces of the side plate facing the first circuit board and the second circuit board respectively are in contact with the opposite surfaces of the first circuit board and the second circuit board, The side plates located between the first circuit board and the second circuit board support the first circuit board and the second circuit board.
在一些实施方式中,在沿所述第二壳朝向所述第一壳的方向上,所述侧板的长度不大于所述主板的长度。In some embodiments, the length of the side panel is not greater than the length of the main board in a direction along the second shell toward the first shell.
在一些实施方式中,所述第一电路板上开设第一缺口且所述第一缺口与所述第一电路板上的卡槽相对应设置,所述第一缺口位于所述第一电路板的外缘并沿所述第一电路板的宽度方向凹陷开设,所述主板的端部位于所述第一缺口内;所述第二电路板上开设第二缺口且所述第二缺口与所述第二电路板上的卡槽相对应设置,所述第二缺口位于所述第二电路板的外缘并沿所述第二电路板的宽度方向凹陷开设,所述主板的端部位于所述第二缺口内。In some embodiments, the first circuit board defines a first notch and the first notch is disposed corresponding to the card slot on the first circuit board, and the first notch is located on the first circuit board. The outer edge is recessed along the width direction of the first circuit board, the end of the main board is located in the first notch; the second circuit board is provided with a second notch and the second notch is a card slot on the second circuit board is correspondingly disposed, the second notch is located at an outer edge of the second circuit board and is recessed along a width direction of the second circuit board, and an end of the main board is located at the Said in the second gap.
在一些实施方式中,所述第一卡钩分别设置在所述主板上靠近所述第一电路板的一端,所述第一卡钩沿朝向所述第一电路板的方向凸出设置,所述第二钩分别设置在所述主板上靠近所述第二电路板的一端,所述第二卡钩沿朝向所述第二电路板的方向凸出设置。In some embodiments, the first hooks are respectively disposed on one end of the main board near the first circuit board, and the first hooks are protruded in a direction toward the first circuit board. The second hooks are respectively disposed on one end of the main board near the second circuit board, and the second hooks are protruded in a direction toward the second circuit board.
在一些实施方式中,所述侧板的数目为两个,包括第一侧板和第二侧板,所述第一侧板和第二侧板沿所述主板的表面方向所凸出设置在所述主板的两侧。In some embodiments, the number of the side plates is two, including a first side plate and a second side plate, and the first side plate and the second side plate are convexly disposed along a surface direction of the main board. Both sides of the motherboard.
在一些实施方式中,所述侧板的数目为两个,包括第一侧板和第二侧板,所述第一侧板和第二侧板沿朝向所述第一电路板内部的方向弯折设置在所述主板的两侧。In some embodiments, the number of the side plates is two, including a first side plate and a second side plate, and the first side plate and the second side plate are bent in a direction toward the inside of the first circuit board. Folded on both sides of the motherboard.
在一些实施方式中,所述卡座为钣金件。In some embodiments, the card holder is a sheet metal member.
附图说明DRAWINGS
为了更清楚地说明本公开实施例中的技术方案,下面将对实施例描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本公开的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure, the drawings used in the description of the embodiments will be briefly described below. It is obvious that the drawings in the following description are only some embodiments of the present disclosure. Other drawings may also be obtained from those of ordinary skill in the art in light of the inventive work.
图1示出了相关技术中双层电路板结构的结构示意图;1 is a schematic structural view showing a structure of a two-layer circuit board in the related art;
图2示出了本公开一种实施例提供的一种光模块的结构示意图;FIG. 2 is a schematic structural diagram of an optical module according to an embodiment of the present disclosure;
图3示出了图2中A位置的光模块的结构示意图;3 is a schematic structural view of an optical module at the A position in FIG. 2;
图4示出了本公开一种实施例提供的一种光模块中电路板与卡座对应位置的结构示意图;FIG. 4 is a schematic structural diagram of a position corresponding to a circuit board and a card holder in an optical module according to an embodiment of the present disclosure;
图5示出了本公开一种实施例提供的一种光模块中卡座的结构示意图;FIG. 5 is a schematic structural diagram of a card holder in an optical module according to an embodiment of the present disclosure;
图6示出了本公开一种实施例提供的一种光模块中卡座的结构示意图。FIG. 6 is a schematic structural diagram of a card holder in an optical module according to an embodiment of the present disclosure.
具体实施方式detailed description
下面将结合本公开实施例中的附图,对本公开实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本公开一部分实施例,而不是全部的实施例。基于本公开中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本公开保护的范围。The technical solutions in the embodiments of the present disclosure are clearly and completely described in the following with reference to the accompanying drawings in the embodiments of the present disclosure. It is obvious that the described embodiments are only a part of the embodiments of the present disclosure, and not all of the embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments of the present disclosure without departing from the inventive scope are the scope of the disclosure.
需要说明的是,目前,现有的双层电路板结构采用两根铜柱支撑两个电路板的固定方式,如图1所示,主电路板01和副电路板02上下平行排列,铜柱03分别焊接在主电路板01与副电路板02的边侧,由铜柱03支撑并连接主电路板01和副电路板02,完成主电路板01和副电路板02的固定后,将双层电路板结构装入机壳形成光模块,由于现有的双层电路板结构的固定采用铜柱03焊接的方式,一方面铜柱03的价格较高使得双层电路板结构的制作成本增加,且焊接工序操作复杂,容易对主电路板01和副电路板02造成影响,另一方面固定支撑效果较差,铜柱03对副电路板02的支撑强度不能满足需求,焊接时不容易实现主电路板01和副电路板02的平行设置,产品 良率低,为了实现二者的平行设置避免焊接后出现歪斜,需要采取附加的平行度检测,使得双层电路板结构的制作成本增加,再者,通过铜柱焊接相连的主电路板01和副电路板02不可拆卸,增添装配工作量和难度。因此,需要设计一种能够实现快速稳定装配的光模块。It should be noted that at present, the existing two-layer circuit board structure adopts two copper pillars to support the fixing manner of two circuit boards. As shown in FIG. 1 , the main circuit board 01 and the sub-circuit board 02 are arranged in parallel above and below, and the copper pillars are arranged. 03 is respectively soldered on the side of the main circuit board 01 and the sub-board 02, and is supported by the copper post 03 and connected to the main circuit board 01 and the sub-board 02. After the main circuit board 01 and the sub-board 02 are fixed, the pair is doubled. The layer circuit board structure is loaded into the casing to form an optical module. Since the existing double-layer circuit board structure is fixed by the copper pillar 03 welding method, on the one hand, the high price of the copper pillar 03 makes the manufacturing cost of the double-layer circuit board structure increase. The welding process is complicated, and it is easy to affect the main circuit board 01 and the sub circuit board 02. On the other hand, the fixed support effect is poor, and the support strength of the copper post 03 to the sub circuit board 02 cannot meet the demand, and it is not easy to realize when welding. The parallel arrangement of the main circuit board 01 and the sub-board 02 has a low product yield. In order to achieve parallel arrangement of the two to avoid skew after soldering, additional parallelism detection is required to make the manufacturing cost of the double-layer circuit board structure. Was added, and further, the main circuit board 01 and the sub-circuit board by soldering the copper pillar 02 is connected to non-removable, and increase the difficulty of assembly work. Therefore, it is necessary to design an optical module capable of achieving a fast and stable assembly.
如图2、图3、图4、图5以及图6所示,光模块包括扣接相连的第一壳1和第二壳4,在由第一壳1和第二壳4围设形成的腔体内设置有两个电路板2,两个电路板2沿第二壳4指向第一壳1的方向(请参见图2中的A向所示)所相对设置,还包括分别与两个电路板2相连接的卡座3,卡座3包括主板31、侧板32和两个卡钩33,侧板32凸出设置于主板31上且侧板32的端面B与两个电路板2相贴合,以支撑与卡座3相连接的两个电路板2,卡钩33设置于主板31的两端,两个电路板2上均设置有卡槽21,卡钩33与卡槽21相卡接,以使两个电路板2均抵接于主板31上。As shown in FIG. 2, FIG. 3, FIG. 4, FIG. 5 and FIG. 6, the optical module comprises a first shell 1 and a second shell 4 which are connected by a fastening, and are formed by the first shell 1 and the second shell 4. Two circuit boards 2 are disposed in the cavity, and the two circuit boards 2 are disposed opposite to each other in the direction in which the second casing 4 is directed to the first casing 1 (see A direction in FIG. 2), and also include two circuits respectively. The card holder 3 is connected to the card holder 3, and the card holder 3 includes a main board 31, a side plate 32 and two hooks 33. The side plate 32 is convexly disposed on the main board 31 and the end surface B of the side plate 32 is opposite to the two circuit boards 2. The two circuit boards 2 are connected to the card holder 3, and the hooks 33 are disposed at two ends of the main board 31. The two circuit boards 2 are provided with card slots 21, and the hooks 33 are opposite to the card slots 21. The card is connected so that both circuit boards 2 abut on the main board 31.
在上述光模块中,通过将上下排列的两个电路板2分别贴合设置在侧板32的端面B上,电路板2相对的表面分别与侧板32的端面B相贴合,以使位于两个电路板2之间的侧板32支撑电路板2,卡钩33与卡槽21的卡扣连接以使得电路板2抵接于主板21,保证电路板2与端面B的贴合,防止电路板2发生转动以脱离于端面B。由于侧板32本身形成有相互平行的上下两个端面,侧板32的端面和卡钩33共同实现卡座3与电路板2的装配,电路板2由凸出设置在主板31上的端面B所贴合,故两个电路板2固定于两个端面B就可以实现两个电路板2的支撑固定,保证了对上下排列的两个电路板2固定连接的平行度,提高了产品良率,同时电路板2固定于端面B时的接触面较大,固定支撑的强度较高,能够满足对两个电路板2的支撑强度要求,即上述光模块的连接稳定性较好;而由于采用卡座3上的卡钩33与两个电路板2上的卡槽21卡扣连接的方式,能够较为快速的实现卡座3和两个电路板2的固定连接,即能够快速固定两个电路板2;相对于现有技术中焊接连接的方式,上述卡扣连接的方式操作较为简单、连接过程不会对两个电路板2造成损伤,且能够实现可拆卸连接,连接强度较高,提高产品的利用率。In the above optical module, by arranging the two circuit boards 2 arranged one above the other on the end faces B of the side plates 32, the opposite surfaces of the circuit board 2 are respectively attached to the end faces B of the side plates 32 so as to be located. The side plate 32 between the two circuit boards 2 supports the circuit board 2, and the hooks 33 are coupled to the card slots 21 so that the circuit board 2 abuts against the main board 21, ensuring the bonding of the circuit board 2 and the end surface B, preventing The circuit board 2 is rotated to be separated from the end face B. Since the side plates 32 are formed with two upper and lower end faces parallel to each other, the end faces of the side plates 32 and the hooks 33 together realize the assembly of the card holder 3 and the circuit board 2, and the circuit board 2 is protruded from the end face B provided on the main board 31. The two boards 2 are fixed to the two end faces B to support and fix the two circuit boards 2, which ensures the parallelism of the fixed connection of the two circuit boards 2 arranged up and down, and improves the product yield. At the same time, when the circuit board 2 is fixed to the end face B, the contact surface is large, and the strength of the fixed support is high, which can meet the support strength requirements of the two circuit boards 2, that is, the connection stability of the above optical module is better; The manner in which the hooks 33 on the card holders 3 are snap-connected to the card slots 21 on the two circuit boards 2 can quickly realize the fixed connection between the card holders 3 and the two circuit boards 2, that is, the two circuits can be quickly fixed. Compared with the prior art method of soldering connection, the above-mentioned snap connection mode is relatively simple to operate, the connection process does not cause damage to the two circuit boards 2, and the detachable connection can be realized, and the connection strength is high, and the connection is improved. Product utilization
因此,上述光模块能够实现快速稳定装配,装配过程简单,产品良率较高。Therefore, the above optical module can achieve fast and stable assembly, the assembly process is simple, and the product yield is high.
为更好地保证连接稳定性,具体地,如图5所示,主板31上设置有两个侧板32,两个侧板32分别设置在主板31的两侧,两个侧板32具有用于支撑两个电路板2的四个端面B,且两两端面B沿上下布设,由此可以保证由卡座3所连接的两个电路板2的稳定性。可选的,两个侧板32分别沿主板31的表面方向凸出设置在主板31的两侧,也就是说,侧板32是延伸于主板31所在的表面的所凸出设置,侧板32与主板31共面设置。可选的,两个侧板32沿朝向电路板2内部的方向弯折设置在主板31的两侧,也就是说,侧板32倾斜于主板31的表面所设置,侧板32并朝向电路板2的内部方向,以承托电路板2的表面。优选的,侧板32沿垂直于主板31表面的方向所设置,可保证两个侧板32所形成的四个端面B对电路板2的抵接效果较好,进而能够保证在卡座3与电路板2固定连接后固定效果较好,保证了卡座3的支撑强度。In order to better ensure the stability of the connection, specifically, as shown in FIG. 5, the main board 31 is provided with two side plates 32, and the two side plates 32 are respectively disposed on two sides of the main board 31, and the two side boards 32 are used. The four end faces B of the two circuit boards 2 are supported, and the two end faces B are arranged up and down, thereby ensuring the stability of the two circuit boards 2 connected by the card holder 3. Optionally, the two side plates 32 are respectively disposed on the two sides of the main board 31 along the surface direction of the main board 31, that is, the side boards 32 are protruded from the surface where the main board 31 is located, and the side boards 32 are provided. Coplanar with the motherboard 31. Optionally, the two side plates 32 are bent and disposed on two sides of the main board 31 in a direction toward the inside of the circuit board 2, that is, the side boards 32 are disposed obliquely to the surface of the main board 31, and the side boards 32 are facing the circuit board. The inner direction of 2 is to support the surface of the circuit board 2. Preferably, the side plates 32 are disposed in a direction perpendicular to the surface of the main board 31, so that the four end faces B formed by the two side plates 32 can ensure a good abutting effect on the circuit board 2, thereby ensuring the card holder 3 and After the circuit board 2 is fixedly connected, the fixing effect is good, and the support strength of the card holder 3 is ensured.
为能够提供电路板2与端面B较大的接触面面积,保证电路板2的定位稳定,如图4以及图5所示,具体地,每一电路板2上设有用于容置主板31的缺口22,缺口22开口于电路板2的外缘且沿电路板2的宽度方向凹陷开设,主板31的端部设置在缺口22内,由缺口22与主板31端部相抵接,限制电路板2沿宽度和长度方向的自由度,保证电路板2的定位。缺口22与卡槽21相对应设置,以便主板31的端部容纳在缺口22内的同时,方便设置在主板31上的卡钩33与卡槽21相卡扣。In order to provide a large contact area of the circuit board 2 and the end surface B, the positioning of the circuit board 2 is ensured to be stable. As shown in FIG. 4 and FIG. 5, specifically, each circuit board 2 is provided with a main board 31 for receiving the main board 31. The notch 22 is formed in the outer edge of the circuit board 2 and is recessed in the width direction of the circuit board 2. The end of the main board 31 is disposed in the notch 22, and the end of the main board 31 is abutted by the notch 22 to limit the circuit board 2. The degree of freedom along the width and length directions ensures the positioning of the circuit board 2. The notch 22 is disposed corresponding to the card slot 21 so that the end of the main plate 31 is received in the notch 22, and the hook 33 disposed on the main board 31 is easily engaged with the card slot 21.
在上述光模块中,相对于铜柱用作焊接的焊接面,侧板32形成的端面B能够用于与电路板2相接触的接触面面积较大,保证了卡座3对电路板2的支撑强度,能够满足对两个电路板2的支撑强度要求,即上述光模块的连接稳定性较好。In the above optical module, the end face B formed by the side plate 32 can be used for a large contact surface area in contact with the circuit board 2 with respect to the soldering surface of the copper post, and the card holder 3 is ensured to the circuit board 2. The support strength can meet the support strength requirements of the two circuit boards 2, that is, the connection stability of the above optical module is good.
对于上述光模块,两个卡钩33分别设置在主板31上靠近于电路板2的两端,卡钩33沿朝向电路板2的方向凸出设置在主板31上,卡钩33朝向电 路板2的表面与电路板2接触面相配合,以此限制两个电路板2在A向上的自由度,保证两个电路板2在上下方向相对固定;卡钩33和与卡钩33相连的主板31相配合限制了电路板2沿其宽度方向上的自由度,保证了两个电路板2在左右方向上相对固定;每一卡钩33与两个电路板2的卡槽21卡扣连接,卡钩33和卡槽21相配和限制了电路板2沿其长度方向上的自由度,保证了两个电路板2在前后方向上相对固定;因此,卡座3能够固定两个电路板2,以实现光模块中两个电路板2的相对固定连接。For the above optical module, two hooks 33 are respectively disposed on the main board 31 near the two ends of the circuit board 2, and the hooks 33 are protruded from the main board 31 in the direction toward the circuit board 2, and the hooks 33 are facing the circuit board 2. The surface cooperates with the contact surface of the circuit board 2, thereby limiting the degree of freedom of the two circuit boards 2 in the A direction, ensuring that the two circuit boards 2 are relatively fixed in the up and down direction; the hooks 33 and the main board 31 connected to the hooks 33 are The cooperation limits the degree of freedom of the circuit board 2 along the width direction thereof, and ensures that the two circuit boards 2 are relatively fixed in the left-right direction; each of the hooks 33 is snap-connected with the card slots 21 of the two circuit boards 2, and the hooks are hooked. 33 and the card slot 21 are matched and limit the degree of freedom of the circuit board 2 along its length, which ensures that the two circuit boards 2 are relatively fixed in the front-rear direction; therefore, the card holder 3 can fix two circuit boards 2 to realize A relatively fixed connection of two circuit boards 2 in the optical module.
在上述光模块的基础上,为了便于卡座3与两个电路板2之间的卡扣连接,具体地,沿第二壳4指向第一壳1的方向(请参见图2中的A向所示),侧板32的长度不大于主板31的长度,以此可方便卡座3与电路板2的装配,并保证卡座3与电路板2的稳定支撑。其中,沿第二壳4指向第一壳1的方向,侧板32的长度与主板31的长度相等,使得侧板32和主板31的端面位于同一平面上,共同形成电路板2的接触面,此时,电路板2接触面的面积较大,使得电路板2与卡座3的接触面面积较大,能够保证固定支撑的强度较高,能够满足对两个电路板2的支撑强度要求,即上述光模块的连接稳定性较好。On the basis of the above optical module, in order to facilitate the snap connection between the card holder 3 and the two circuit boards 2, specifically, the direction in which the second housing 4 is directed toward the first housing 1 (refer to the A direction in FIG. 2) As shown, the length of the side plate 32 is not greater than the length of the main board 31, so that the assembly of the card holder 3 and the circuit board 2 can be facilitated, and the stable support of the card holder 3 and the circuit board 2 can be ensured. The length of the side plate 32 is equal to the length of the main plate 31 along the direction in which the second casing 4 is directed to the first casing 1. The side plates 32 and the end faces of the main plate 31 are located on the same plane to form a contact surface of the circuit board 2, At this time, the area of the contact surface of the circuit board 2 is relatively large, so that the contact surface area of the circuit board 2 and the card holder 3 is large, and the strength of the fixed support can be ensured to be high, and the support strength requirement for the two circuit boards 2 can be satisfied. That is, the connection stability of the above optical module is good.
在上述光模块便于卡座3与两个电路板2之间的卡扣连接的基础上,为了保证光模块的连接稳定性较好,具体地,两个卡钩33分别设置在主板31上靠近电路板2的两端,卡钩33沿朝向电路板2的方向凸出设置在主板31上,通过卡钩33与卡槽21的卡扣,实现卡座3与电路板2的卡扣连接,其中,分别设置在电路板2两端的两个卡钩33分别与两个电路板2相卡接。On the basis of the above-mentioned optical module facilitating the snap connection between the card holder 3 and the two circuit boards 2, in order to ensure better connection stability of the optical module, specifically, the two hooks 33 are respectively disposed on the main board 31. The two ends of the circuit board 2 are protruded from the main board 31 in the direction of the circuit board 2, and the buckles of the card holders 3 and the circuit board 2 are buckled by the hooks of the hooks 33 and the card slots 21, The two hooks 33 respectively disposed at the two ends of the circuit board 2 are respectively engaged with the two circuit boards 2.
为了更好地实现卡座3与两个电路板2之间的卡扣连接,如图4以及图5所示,一种优选实施方式中,光模块中卡座3的数目为两个,每一电路板2沿宽度方向的两侧对称设有要用于容置主板31的缺口22,由两个卡座3从电路板2的两侧共同支撑两个电路板2。In order to better realize the snap connection between the card holder 3 and the two circuit boards 2, as shown in FIG. 4 and FIG. 5, in a preferred embodiment, the number of the card holders 3 in the optical module is two, each A circuit board 2 is symmetrically disposed on both sides in the width direction to be provided with a notch 22 for accommodating the main board 31. The two card holders 3 jointly support the two circuit boards 2 from both sides of the circuit board 2.
上述光模块中,装配时将两个电路板2上下平行设置两个卡座3的端面B上,主板31容置在缺口22内,然后将每一卡钩33与两个电路板2的卡槽21 卡扣连接,以使的每一电路板2均固定于卡座3的端面B,进而将两个电路板2固定于端面B,此时,而采用卡钩33和卡槽21实现卡座3能够较为快速的实现卡座3和两个电路板2的固定连接,即能够快速固定两个电路板2;相对于现有技术中焊接连接的方式,上述卡钩33和卡槽21的方式操作较为简单、连接过程不会对两个电路板2造成损伤,且能够实现可拆卸连接,提高产品的利用率。In the above optical module, two circuit boards 2 are arranged in parallel on the end faces B of the two card holders 3 in parallel, the main board 31 is housed in the notch 22, and then each card hook 33 and the card of the two circuit boards 2 are mounted. The slots 21 are snap-connected so that each circuit board 2 is fixed to the end surface B of the card holder 3, thereby fixing the two circuit boards 2 to the end surface B. At this time, the card 33 and the card slot 21 are used to implement the card. The seat 3 can realize the fixed connection of the card holder 3 and the two circuit boards 2 relatively quickly, that is, the two circuit boards 2 can be quickly fixed; compared with the manner of welding connection in the prior art, the above-mentioned hooks 33 and the card slots 21 The mode operation is relatively simple, the connection process does not cause damage to the two circuit boards 2, and the detachable connection can be realized, and the utilization rate of the product is improved.
对于较为短小的电路板2可以采用一个卡座3,而对于较长的电路板2可以采用多个卡座3,采用两个卡座3、且两个卡座3对称设置在所述电路板2的两个能够保证电路板受力均衡,保证光模块的平衡和装配的稳定性,提高产品良率。For the shorter circuit board 2, one card holder 3 can be used, and for the longer circuit board 2, a plurality of card holders 3 can be used, two card holders 3 are used, and two card holders 3 are symmetrically disposed on the circuit board. The two of the two can ensure the balance of the board, ensure the balance of the optical module and the stability of the assembly, and improve the product yield.
为了保证卡座3的支撑强度,卡座3可以由金属材料制备,也可由满足卡座3对电路板2支撑强度的其他材料制备,卡座3的制备材料可以根据光模块的具体实际情况进行选择。具体地,卡座3可以为钣金件。In order to ensure the support strength of the card holder 3, the card holder 3 can be prepared from a metal material or other materials that satisfy the support strength of the card holder 3 to the circuit board 2. The preparation material of the card holder 3 can be made according to the actual situation of the optical module. select. Specifically, the card holder 3 may be a sheet metal member.
在上述光模块中,卡座3可以为钣金件,也可以为其他一体成型的结构形式,卡座3的具体结构形式根据光模块的具体实际情况进行选择。In the above optical module, the card holder 3 may be a sheet metal member or other integrally formed structure. The specific structure of the card holder 3 is selected according to the actual situation of the optical module.
在卡座3为钣金件时,通过对钣金材料进行冲切、折弯等冷加工工艺以制备特定形状的卡座3,由于钣金件具有重量轻、强度高、成本低、大规模量产性能好等特点,广泛应用于电子器件领域。When the card holder 3 is a sheet metal member, the card holder 3 of a specific shape is prepared by performing a cold working process such as punching and bending on the sheet metal material, since the sheet metal member has light weight, high strength, low cost, and large-scale amount. Features such as good production performance, widely used in the field of electronic devices.
显然,本领域的技术人员可以对本公开实施例进行各种改动和变型而不脱离本公开的精神和范围。这样,倘若本公开的这些修改和变型属于本公开权利要求及其等同技术的范围之内,则本公开也意图包含这些改动和变型在内。It will be apparent to those skilled in the art that various modifications and changes can be made in the embodiments of the present disclosure without departing from the spirit and scope of the disclosure. Thus, it is intended that the present invention cover the modifications and the modifications

Claims (8)

  1. 一种光模块,包括:An optical module comprising:
    第一壳和第二壳,所述第一壳和所述第二壳围设形成腔体,所述腔体内设置有:a first shell and a second shell, the first shell and the second shell enclosing a cavity, and the cavity is provided with:
    第一电路板和第二电路板,所述第一电路板和第二电路板沿所述第二壳朝向所述第一壳的方向所相对设置,均设置有卡槽;a first circuit board and a second circuit board, the first circuit board and the second circuit board are oppositely disposed along a direction of the second shell toward the first shell, and are provided with a card slot;
    卡座,与所述第一电路板和第一电路板连接,包括主板、侧板和第一卡钩和第二卡钩,所述侧板凸出设置于所述主板上方且所述侧板的两个端面分别与所述第一电路板和第二电路板相贴合,以支撑与所述卡座相连接的所述第一电路板和第二电路板,所述第一卡钩和第二卡钩设置于所述主板的两端,所述第一卡钩与所述第一电路板上的卡槽相卡接,且所述第二卡钩与所述第二电路板上的卡槽相卡接,以使所述第一电路板和第二电路板抵接于所述主板。a card holder, connected to the first circuit board and the first circuit board, including a main board, a side board, and a first hook and a second hook, the side board protrudingly disposed above the main board and the side board The two end faces respectively fit the first circuit board and the second circuit board to support the first circuit board and the second circuit board connected to the card holder, the first hook and a second hook is disposed at two ends of the main board, the first hook is engaged with the card slot of the first circuit board, and the second hook is opposite to the second circuit board The card slot is snapped so that the first circuit board and the second circuit board abut against the main board.
  2. 根据权利要求1所述的光模块,所述侧板上朝向于所述第一电路板和第二电路板的两个端面分别与所述第一电路板第二电路板之间相对的表面相贴合,以使位于所述第一电路板和第二电路板之间的所述侧板支撑所述第一电路板和第二电路板。The optical module according to claim 1, wherein two side faces of the side plate facing the first circuit board and the second circuit board respectively face an opposite surface of the first circuit board and the second circuit board. The bonding is such that the side plates located between the first circuit board and the second circuit board support the first circuit board and the second circuit board.
  3. 根据权利要求1所述的光模块,在沿所述第二壳朝向所述第一壳的方向上,所述侧板的长度不大于所述主板的长度。The optical module according to claim 1, wherein a length of the side plate is not greater than a length of the main board in a direction along the second case toward the first case.
  4. 根据权利要求1所述的光模块,所述第一电路板上开设第一缺口且所述第一缺口与所述第一电路板上的卡槽相对应设置,所述第一缺口位于所述第一电路板的外缘并沿所述第一电路板的宽度方向凹陷开设,所述主板的端部位于所述第一缺口内;所述第二电路板上开设第二缺口且所述第二缺口与所述第二电路板上的卡槽相对应设置,所述第二缺口位于所述第二电路板的外缘并沿所述第二电路板的宽度方向凹陷开设,所述主板的端部位于所述第 二缺口内。The optical module of claim 1 , wherein a first notch is defined on the first circuit board and the first notch is disposed corresponding to a card slot on the first circuit board, and the first notch is located in the An outer edge of the first circuit board is recessed along a width direction of the first circuit board, an end of the main board is located in the first notch; a second gap is formed on the second circuit board, and the The second notch is disposed corresponding to the card slot on the second circuit board, the second notch is located at an outer edge of the second circuit board and is recessed along a width direction of the second circuit board, where the main board is The end is located within the second gap.
  5. 根据权利要求1所述的光模块,所述第一卡钩分别设置在所述主板上靠近所述第一电路板的一端,所述第一卡钩沿朝向所述第一电路板的方向凸出设置,所述第二钩分别设置在所述主板上靠近所述第二电路板的一端,所述第二卡钩沿朝向所述第二电路板的方向凸出设置。The optical module according to claim 1, wherein the first hooks are respectively disposed on one end of the main board near the first circuit board, and the first hooks are convex in a direction toward the first circuit board. The second hooks are respectively disposed on one end of the main board near the second circuit board, and the second hooks are convexly disposed in a direction toward the second circuit board.
  6. 根据权利要求1所述的光模块,所述侧板的数目为两个,包括第一侧板和第二侧板,所述第一侧板和第二侧板沿所述主板的表面方向所凸出设置在所述主板的两侧。The optical module according to claim 1, wherein the number of the side plates is two, including a first side plate and a second side plate, and the first side plate and the second side plate are along a surface direction of the main board. The protrusions are disposed on both sides of the main board.
  7. 根据权利要求1所述的光模块,所述侧板的数目为两个,包括第一侧板和第二侧板,所述第一侧板和第二侧板沿朝向所述第一电路板内部的方向弯折设置在所述主板的两侧。The optical module according to claim 1, wherein the number of the side plates is two, including a first side plate and a second side plate, the first side plate and the second side plate facing the first circuit board The inner direction is bent at both sides of the main board.
  8. 根据权利要求1所述的光模块,所述卡座为钣金件。The optical module of claim 1 wherein the card holder is a sheet metal member.
PCT/CN2019/078783 2018-03-19 2019-03-19 Optical module WO2019179448A1 (en)

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Publication number Priority date Publication date Assignee Title
CN108471672A (en) * 2018-03-19 2018-08-31 青岛海信宽带多媒体技术有限公司 A kind of optical module
CN114750087A (en) * 2022-03-21 2022-07-15 西安易朴通讯技术有限公司 Positioning device

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2735722Y (en) * 2004-08-18 2005-10-19 华为技术有限公司 Printed circuit board mounting device
CN204103067U (en) * 2014-08-12 2015-01-14 比亚迪股份有限公司 Can be used for the connector of circuit board interconnect and there is its circuit board interconnecting device
US9814128B1 (en) * 2017-03-10 2017-11-07 Crestron Electronics, Inc. Multiple board standoff
CN207039609U (en) * 2017-06-07 2018-02-23 中天宽带技术有限公司 A kind of miniaturization ONU being used under monitoring scene
CN108471672A (en) * 2018-03-19 2018-08-31 青岛海信宽带多媒体技术有限公司 A kind of optical module

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2762350Y (en) * 2003-06-20 2006-03-01 佛山市顺德区顺达电脑厂有限公司 Combined fin
CN100482060C (en) * 2006-02-22 2009-04-22 富准精密工业(深圳)有限公司 Heat radiator

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2735722Y (en) * 2004-08-18 2005-10-19 华为技术有限公司 Printed circuit board mounting device
CN204103067U (en) * 2014-08-12 2015-01-14 比亚迪股份有限公司 Can be used for the connector of circuit board interconnect and there is its circuit board interconnecting device
US9814128B1 (en) * 2017-03-10 2017-11-07 Crestron Electronics, Inc. Multiple board standoff
CN207039609U (en) * 2017-06-07 2018-02-23 中天宽带技术有限公司 A kind of miniaturization ONU being used under monitoring scene
CN108471672A (en) * 2018-03-19 2018-08-31 青岛海信宽带多媒体技术有限公司 A kind of optical module

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