CN217181407U - Developing device for ultra-thick dry film in DPC (chemical vapor deposition) process - Google Patents

Abstract

The utility model belongs to the technical field of DPC technology, especially, a developing device for DPC technology's super thick dry film, including installing the development portion at first washing portion front end support assembly, the left side of development portion is provided with the feed portion that is used for placing the product of treating processing. This a developing device for DPC technology's super thick dry film through setting up desilting mechanism, has following advantage: 1. because the air knife generated by the operation of the air knife group can well remove the old developing solution in the line space, the later fresh developing solution can fully contact and react with the dry film in the seam, and the developing speed can be obviously accelerated; 2. because the developing solution in the seam is updated quickly, no extra large pressure (such as more than 2.51-3 Kg/cm 2) is needed, and thus uniform lines are obtained.

Description

Developing device for ultra-thick dry film in DPC (chemical vapor deposition) process

Technical Field

The utility model relates to a DPC technology technical field especially relates to a developing device that is used for DPC technology's super thick dry film.

Background

In the DPC process, the final lines are made thicker and the width-to-depth ratio of the pattern is smaller and smaller. At present, a method of performing coating, exposure and development for multiple times by using a developing machine to obtain a pattern with a thickness of 500 micrometers or more is generally adopted, wherein the existing developing machine comprises a feeding part, a developing part, a first cleaning part, a second cleaning part, an air drying part and a discharging part;

with the market demand becoming more and more fine, the width-depth ratio (seam width to seam depth) is required to be at least less than 1, the conventional manufacturing method is to manufacture dry film patterns for multiple times (the second dry film is manufactured by contraposition exposure on the basis of electroplating full copper in the first dry film pattern) and a method of electroplating for multiple times, and the defects are that the efficiency is low, and the precision of multiple contraposition cannot be guaranteed. At present, the scheme of one-step patterning is explored, the dry film pattern manufacturing is completed at one time, and the dry film pattern manufacturing is completed at one time through electroplating. The scheme of once patterning has the advantages of less burrs and low alignment requirement. The disadvantages are high requirements for development: the development pressure is too large, and the dry film is easy to drift due to too large mechanical scouring force; if the developing pressure is small, the old developing solution in the seam is clogged, resulting in incomplete development.

In order to solve the problem of old developer in the seams, the present application provides a developing device for ultra-thick dry film used in DPC process.

SUMMERY OF THE UTILITY MODEL

Based on the technical problem of incomplete development caused by old developer in the plug in the existing seam, the utility model provides a developing device for ultra-thick dry film in DPC process.

The utility model provides a developing unit of super thick dry film for DPC technology, including installing the development portion at first washing portion front end support assembly, the left side of development portion is provided with the feeding part that is used for placing the product of treating processing, development portion comprises swing motor, driving motor, etching pump, temperature sensor, level sensor, heater and cooler;

the inside of development portion is provided with desilting mechanism, and desilting mechanism includes the wind knife tackle, through old developer realizes the desilting action in the wind knife tackle is to the line spacing.

Preferably, the air knife set is composed of a titanium pipe with a through hole formed in the surface, and the diameter of the titanium pipe is 15 mm;

through the technical scheme, in order to realize the good removal of the old developing solution in the line distance, a plurality of groups of through holes with the diameter of 0.3 mm and the interval of 3mm are uniformly distributed on the surface of the titanium tube, and when the titanium tube is used, the old developing solution can be removed by filling 3-5 Kg/cm2 of clean compressed air.

The utility model provides a beneficial effect does:

through setting up desilting mechanism, have following advantage:

1. because the air knife generated by the operation of the air knife group can well remove the old developing solution in the line space, the later fresh developing solution can fully contact and react with the dry film in the seam, and the developing speed can be obviously accelerated;

2. because the developing solution in the seam is updated quickly, no extra large pressure (such as more than 2.51-3 Kg/cm 2) is needed, and thus uniform lines are obtained.

Drawings

Fig. 1 is a schematic view of a conventional display of a developing apparatus for ultra-thick dry film in DPC process according to the present invention;

fig. 2 is a front view of a developing part of the developing device for ultra-thick dry film in DPC process according to the present invention;

fig. 3 is an enlarged view of a structure at a position a in fig. 2 of the developing device for ultra-thick dry film in DPC process according to the present invention.

In FIGS. 2-3: 1. a first cleaning section; 2. a developing section; 21. a swing motor; 22. a drive motor; 23. an etching pump; 24. a temperature sensor; 25. a liquid level sensor; 26. a heater; 27. a cooler; 3. a feeding section; 4. and a wind knife set.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

Referring to fig. 2-3, a developing device for ultra-thick dry film of DPC technology, including installing the developing part 2 at first cleaning part 1 front end support assembly, the left side of developing part 2 is provided with the feed portion 3 that is used for placing the product of treating processing, developing part 2 comprises swing motor 21, driving motor 22, etching pump 23, temperature sensor 24, level sensor 25, heater 26 and cooler 27, wherein driving motor 22 drive is located the product of treating processing in feed portion 3 and transports to developing part 2, swing motor 21 is to lieing in the developing part 2 the developer on the surface of the product of treating processing realizes the swing action, etching pump 23 realizes the etching action to the product of treating processing, temperature sensor 24 realizes the action of controlling the temperature of the developer in developing part 2, level sensor 25 realizes the detection to the developer in developing part 2, the heater 26 heats the developer in the developing unit 2, and the cooler 27 cools the developer in the developing unit 2;

the inside of development portion 2 is provided with desilting mechanism, and desilting mechanism includes air knife tackle 4, through air knife tackle 4 realizes the desilting action to old developer in the line distance.

Further, the air knife set 4 is composed of a titanium tube with a through hole on the surface, and the diameter of the titanium tube is 15 mm; in order to realize the good removal of the old developing solution in the line distance, a plurality of groups of through holes with the diameter of 0.3 mm and the interval of 3mm are uniformly distributed on the surface of the titanium tube, and when the titanium tube is used, the old developing solution can be removed by filling 3-5 Kg/cm2 of clean compressed air.

Through setting up desilting mechanism, have following advantage:

1. because the air knife generated by the operation of the air knife group 4 can well remove the old developing solution in the line space, the following fresh developing solution can fully contact and react with the dry film in the seam, and the developing speed can be obviously accelerated.

2. Because the developing solution in the seam is updated quickly, no extra large pressure (such as more than 2.51-3 Kg/cm 2) is needed, and thus uniform lines are obtained.

The above, only be the embodiment of the preferred of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, which are designed to be replaced or changed equally, all should be covered within the protection scope of the present invention.

Claims (2)

1. The utility model provides a developing device for DPC technology's super thick dry film, includes the developing part (2) of installing at first washing part (1) front end support assembly, its characterized in that: a feeding part (3) for placing a product to be processed is arranged on the left side of the developing part (2), and the developing part (2) is composed of a swing motor (21), a transmission motor (22), an etching pump (23), a temperature sensor (24), a liquid level sensor (25), a heater (26) and a cooler (27);

the inside of development portion (2) is provided with desilting mechanism, and desilting mechanism includes air knife tackle (4), through air knife tackle (4) realize the desilting action to old developer in the line distance.

2. The apparatus for developing an ultra-thick dry film for DPC process according to claim 1, wherein: the air knife set (4) is composed of a titanium pipe with a through hole formed in the surface, and the diameter of the titanium pipe is 15 mm.

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