CN217158131U - Rotary cleaning equipment with underneath type wafer - Google Patents

Abstract

The utility model provides a wafer underneath type rotary cleaning device, which comprises a cavity, a wafer frame and a cover body, wherein the cavity is provided with a rotatable ring lining and a swingable liquid spraying swing arm, and the liquid spraying swing arm is provided with at least one spray head capable of spraying a solvent; the wafer frame is used for adhering a wafer in the ring inner area through the adhesive film, and is arranged on the ring liner and leads the wafer to face downwards; the cover body is internally provided with an adsorption seat and a pressing frame in sequence from the center to the outside, and the cover body is provided with a power device which is responsible for driving the adsorption seat and the pressing frame to synchronously rotate.

Description

Rotary cleaning equipment with underneath type wafer

Technical Field

The utility model relates to a wafer surface cleaning technical field, in particular to rotatory cleaning equipment of formula under wafer.

Background

During the grinding or processing operation of the wafer, a wafer is adhered to the inner ring area of the wafer frame through the adhesive film. When cleaning, the wafer is driven to rotate upward, and the solvent or deionized water is sprayed downward from the spraying cantilever to clean the wafer. However, along with the change of the semiconductor process, some special processes can leave a layer of glue film on the surface of the wafer, the glue film must be removed by a special solvent, for example, the solvent is cyclopentanone, but the solvent also has the same dissociation effect on the viscosity of the glue film, therefore, if the present cleaning mode that the wafer faces upwards is adopted, the solvent can soak and submerge the wafer and the glue film in the cleaning process, when the glue film on the surface of the wafer is removed, the wafer can also be synchronously separated from the glue film at the bottom, so that the subsequent processes can not be carried out, therefore, the utility model discloses think about the method for solving.

SUMMERY OF THE UTILITY MODEL

The utility model discloses a main mesh provides a rotatory cleaning equipment of formula of putting under wafer, mainly sets up the wafer down, and with solvent blowout from bottom to top, gets rid of the naked surperficial glue film of wafer in the rotatory process, and does not influence the solid effect of gluing at the wafer back, consequently accords with the special demand of actual processing procedure.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

the utility model relates to a rotatory cleaning equipment of formula under wafer, include: the liquid spraying device comprises a cavity, a wafer frame and a cover body, wherein the cavity is provided with a rotatable ring lining and a swingable liquid spraying swing arm, and the liquid spraying swing arm is provided with at least one spray head capable of spraying a solvent; the wafer frame is formed by adhering a wafer to the inner area of the ring through a glue film, and the wafer frame can be arranged on the ring liner and enables the wafer to face downwards; the interior of the cover body is sequentially provided with an adsorption seat and a pressing frame from the center to the outside, the cover body is provided with a power device, the power device is responsible for driving the adsorption seat and the pressing frame to synchronously rotate, when the operation cover body descends and is aligned with the cavity, the pressing frame presses the wafer frame and the adsorption seat adsorbs the wafer, the power unit drives the pressing frame to synchronously rotate the wafer frame, and in the process, the liquid spraying swing arm swings and sprays a solvent on the surface of the wafer through a spray head so as to remove a glue layer on the surface of the wafer.

Optionally, the ring liner has an inner circular wall with an inner diameter greater than the outer diameter of the wafer. Therefore, the wafer frame is placed on the ring liner, the wafer is positioned in the inner ring wall, and only a few downward adhesive films are exposed, so that the contact between a solvent and the adhesive films during liquid spraying can be avoided.

Optionally, the top surface of the ring inner liner where the inner circular wall meets is formed with an upper conical surface which is inclined downwards and towards the center. Therefore, when the wafer is adsorbed by the adsorption seat through the adhesive film and the position of the wafer protrudes out of the surface of the wafer frame, the adhesive film is in a tight state, and the wafer is prevented from shaking during rotation.

Optionally, the inner liner forms a lower conical curved surface on the bottom surface of the joint of the inner circular wall, a conical groove seat is arranged in the cavity, and a water outlet is formed in the center of the bottom of the groove seat, so that the solvent sprayed out in the cleaning process can be recovered.

Optionally, the ring liner has at least one positioning recess, the cover body is further provided with a transmission frame inside and located at the periphery of the pressing frame, the transmission frame has at least one positioning protrusion facing downward, the transmission frame is also driven by the power device, when the cover body descends to be engaged with the cavity, the transmission frame presses on the ring liner, and the positioning protrusion is located in the positioning recess, and the transmission frame drives the ring liner to rotate synchronously when the power device is operated to drive the ring liner.

Optionally, the suction seat is a porous ceramic suction cup seat, and the power device is a motor.

Optionally, the liquid spraying swing arm is provided with two nozzles, namely a first nozzle and a second nozzle, the first nozzle provides a low-pressure solvent, and the second nozzle provides a high-pressure solvent. Therefore, in operation, the first nozzle sprays low-pressure solvent to the wafer to soften or gradually dissolve the adhesive layer on the surface of the wafer, then the first nozzle is closed, the second nozzle sprays high-pressure solvent, and the adhesive layer is peeled off from the surface of the wafer by the high-pressure solvent to fall off.

The utility model has the advantages that:

the utility model arranges the wafer downwards, and the solvent is sprayed from bottom to top, so that the solvent is only distributed on the surface of the wafer corresponding to the solvent and can not overflow to other areas, thereby achieving the purpose of avoiding the contact between the solvent and the glue film; because of the utility model discloses the wafer sets up downwards, and the hydrojet in-process utilizes gravity can let wafer surface glue film really and peel off efficiently, reaches the purpose of getting rid of wafer surface glue film.

Drawings

Fig. 1 is an exploded view of a wafer underneath spin cleaning apparatus according to an embodiment of the present invention;

fig. 2 is a schematic cross-sectional view of a wafer underneath type spin cleaning apparatus according to an embodiment of the present invention;

FIG. 3 is a schematic diagram illustrating the steps of a method for operating a wafer-level spin rinse apparatus according to an embodiment of the present invention;

fig. 4 is a schematic diagram illustrating a wafer frame disposed on an inner ring liner in a method for operating a wafer underneath type spin cleaning apparatus according to an embodiment of the present invention;

fig. 5 is a schematic view illustrating a wafer frame disposed in a cover and a chamber according to an embodiment of the present invention in a method for operating a wafer underneath type spin cleaning apparatus;

fig. 6 is a schematic diagram illustrating a cleaning state in an operation method of the wafer underlying rotary cleaning apparatus according to an embodiment of the present invention.

Description of the symbols of the drawings:

10, a cavity; 101, a bearing; 102, a butt joint wall; 11, ring inner lining; 111 inner circular wall; 112, an upper conical surface; 113, a lower conical curved surface; 114, a positioning concave part; 12, spraying a liquid swing arm; 121, a first spray head; 122, a second spray head; 13, a groove seat; 131, a water outlet; 20, a wafer frame; 30, a cover body; 31, a power device; 32, an adsorption seat; 33, pressing the frame; 24, a transmission frame; 241, a positioning convex part; 40, a wafer; 3001, a step; 3002 step (b); 3003 and (4) step (b).

Detailed Description

In order to make the technical problems, technical solutions and advantages to be solved by the present invention clearer, the following detailed description will be given with reference to the accompanying drawings and specific embodiments. In the following description, specific details are provided, such as specific configurations and components, merely to facilitate a thorough understanding of embodiments of the invention. Thus, it will be apparent to those skilled in the art that various changes and modifications may be made to the embodiments described herein without departing from the scope and spirit of the invention. In addition, descriptions of well-known functions and constructions are omitted for clarity and conciseness.

It should be appreciated that reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure or characteristic described in connection with the embodiment is included in at least one embodiment of the present invention. Thus, the appearances of the phrases "in one embodiment" or "in an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

Fig. 1 is an exploded view of the wafer underneath type spin cleaning apparatus according to the present invention. The utility model discloses rotatory cleaning equipment of wafer underneath type includes cavity 10 and cover body 30, lets the wafer frame 20 of fixing wafer 40 place wherein to the glue film to the exposed surface of wafer 40 down washs. The chamber 10 has a rotatable ring liner 11 and a swingable swing arm 12, and the swing arm 12 has at least one head capable of ejecting a solvent, in this embodiment, two heads, a first head 121 and a second head 122. The wafer frame 20 is adhered to the ring inner area by the adhesive film 21, and the wafer frame 20 is disposed on the ring liner 11 with the wafer 40 facing downward during operation. The cover body 30 is provided with a power device 31, an adsorption seat 32 and a pressing frame 33 are sequentially arranged in the cover body 30 from the center to the outside, and the power device 32 is responsible for driving the adsorption seat 32 and the pressing frame 33 to synchronously rotate; when the operation cover 30 descends to engage with the chamber 10, the pressing frame 33 presses the wafer frame 20, the suction base 32 sucks the wafer 40, the power unit 31 drives the pressing frame 33 to rotate the wafer frame 20 synchronously, and the spray swing arm 12 swings and sprays the solvent onto the surface of the wafer 40 by the first spray head 121 or the second spray head 122 during the process to remove the glue layer on the surface of the wafer 40.

The structure of each component will be described in detail as follows:

the wafer frame 20 is a standard specification for carrying wafers, and is also commonly referred to as a frame, ring or wafer ring. The wafer frame 20 is adhered with a glue film 21 on the upper surface, and the wafer 40 is adhered and fixed in the inner ring area of the wafer frame 20 by the glue film 21, in this embodiment, the glue layer adhered on the exposed surface of the wafer 40 is removed.

The chamber 10 is responsible for supplying and recovering a cleaning solvent, and carries the wafer frame 20. Referring to fig. 2, the chamber 10 has a tapered seat 13 at the center, and the seat 13 has a water outlet 131 at the center for recycling deionized water for solvent or cleaning. The liquid spraying swing arm 12 is protruded on the tank base 13, the liquid spraying swing arm 12 is provided with two nozzles, namely a first nozzle 121 and a second nozzle 122, in this embodiment, the water yields of the first nozzle 121 and the second nozzle 122 are different and the opening times are different, the first nozzle 121 provides a low-pressure solvent, the second nozzle 122 provides a high-pressure solvent, the low-pressure solvent is used for wetting the surface of the wafer 40 or dissolving the glue layer during cleaning, and the glue layer is smoothly peeled off when the high-pressure solvent is sprayed. In addition, the bottom of the chamber 10 is further provided with a driving device and a solvent supplying device connected to the liquid spraying swing arm 12 for smoothly controlling the swing of the liquid spraying swing arm 12 and the spraying of the liquid, and this part of the structure is the same as the prior art and therefore not shown in the drawings.

The chamber 10 is provided with a rotatable ring liner 11, and the ring liner 11 is mounted on the chamber 10 via a bearing 101. The inner edge of the ring liner 11 forms an inner wall 111, the inner wall 111 having an inner diameter close to but larger than the outer diameter of the wafer 40. The inner wall 111 is mainly used to reduce the solvent splashing to the exposed adhesive film 21 between the wafer 40 and the wafer frame 20. The ring liner 11 further forms an upper conical surface 112 and a lower conical surface 113 at the inner circular wall 1111, which are opposite to each other. The upper tapered surface 112 is inclined downward toward the center. The diameter of the lower tapered surface 113 increases from top to bottom, and the lower tapered surface 113 facilitates the flow of solvent or deionized water into the tank base 13 for collection. The top surface of the ring liner 11 further forms at least one positioning recess 114, and in this embodiment, there are two positioning recesses 114, and the positioning recess 114 is used for the cover 30 to drive the ring liner 11 to rotate. In addition, the top of the chamber 10 has a docking wall 102 with a smaller outer diameter, and the docking wall 102 is used for docking the cover 30.

The top of the cover 30 is provided with a power device 31, and the power device 31 is responsible for driving the internal components of the cover 30 to rotate. In the present embodiment, the suction base 32, the pressing frame 33 and the transmission frame 34 are sequentially disposed from the center to the outside in the housing 30, and all of the three components are driven by the power device 31. The suction base 32 is a porous ceramic suction base, which is a common suction device in the semiconductor industry, and thus, the detailed air holes, air passages, air supply equipment, etc. are only schematically shown in the drawings. It should be noted that the position of the suction contact surface (bottom surface) of the suction base 32 is protruded from the bottom surface of the pressing frame 33, so that when the suction base 32 sucks the wafer 40 through the adhesive film 21, the position of the wafer 40 is protruded from the lower surface of the wafer frame 20, and the tapered surface of the upper tapered surface 112 is also used to meet this requirement, so that the adhesive film 21 is tightened in the suction state, and the wafer 40 is prevented from shaking during rotation. The pressing frame 33 is annular in shape and has a diameter close to the diameter of the wafer frame 20 in order to press the wafer frame 20 against the ring liner 11 by the pressing frame 33. The transmission frame 34 is mainly used for driving the ring liner 11 to rotate, and has at least one positioning protrusion 341 protruding downward, when the operation cover 30 descends, the transmission frame 34 also presses on the ring liner 11, so that the positioning protrusion 341 is located in the positioning recess 114, when the power device 31 is driven, the transmission frame 34 drives the ring liner 11 to rotate synchronously, and the wafer frame 20 and the wafer 40 are also ensured to rotate synchronously.

In the present embodiment, the pressing frame 33 and the transmission frame 34 are two rings, but not limited thereto, and can be integrated into a single component, so as to apply pressure to the wafer frame 20 and drive the inner ring 11 to rotate synchronously.

Next, an explanation will be given of an operation method of the wafer underneath type rotary cleaning apparatus of the present invention, fig. 3 is a flow chart of the operation method of the present invention, fig. 4 to 6 are schematic diagrams of relative actions, and the operation method of the present invention includes the steps of:

step 3001: the wafer 40 is placed with the wafer frame 20 facing down on the rotating ring liner 11. As shown in fig. 4, the wafer frame 20 is disposed on the ring liner 11 of the chamber 10. In addition, the inner circular wall 111 is located at the periphery of the wafer 40, and the exposed adhesive film 21 is shielded by the ring liner 11, so as to prevent the solvent from being sprayed to the adhesive film 21 in the subsequent liquid spraying process.

Step 3002: the operation frame 33 presses the wafer frame 20 and the wafer 40 is sucked by the suction base 32. As shown in fig. 5, the operation cover 30 is lowered to be connected to the chamber 10, the pressing frame 33 presses the wafer frame 20, and the suction base 32 simultaneously lowers the position of the wafer 40 to tighten the adhesive film 21 while sucking the wafer 40 through the adhesive film 21. In addition, the positioning convex portion 341 of the transmission frame 34 is also positioned in the positioning concave portion 14 of the ring liner 11.

Step 3003: the pressing frame 33 is driven to rotate the wafer frame 20 synchronously, the liquid spraying swing arm 12 is operated to swing, and the solvent is sprayed to the surface of the wafer 40 by the spray head (such as the first spray head 121 or the second spray head 122) of the liquid spraying swing arm 12, so as to remove the glue layer on the surface of the wafer 40. As shown in fig. 6, the power device 31 drives the adsorption base 32, the pressing frame 33 and the transmission frame 33 to rotate synchronously, so that the wafer frame 20 rotates synchronously, the spraying swing arm 12 located below during the rotation process also swings synchronously, the first sprayer 121 or the second sprayer 122 sprays liquid on the surface of the wafer 40, and then the glue layer on the surface of the wafer 40 is removed, and the solvent can be prevented from splashing on the glue film 21 to affect the viscosity between the glue film 21 and the wafer 40 during the process.

In step 3003, the operation of the first nozzle 121 and the second nozzle 122 may further include: the first nozzle 121 sprays the low-pressure solvent onto the surface of the wafer 40, so that the adhesive layer on the surface of the wafer 40 is softened or gradually dissolved, the number of times can be repeated, the embodiment can be performed for three times, then the first nozzle 121 is closed, the second nozzle 122 sprays the high-pressure solvent, and the adhesive layer is peeled off from the surface of the wafer 40 by using the high-pressure liquid column, so that the adhesive layer on the surface of the wafer 40 is effectively removed.

It is above to synthesize, the utility model discloses a wafer 40 mode down, usable gravity of in-process is letting the glue film more efficient and peel off really during the hydrojet, and the hydrojet is spout from bottom to top in addition, and the position can only be on the wafer 40 surface of department that corresponds, can not overflow other regions, reaches the utility model discloses can prevent the purpose of solvent and glued membrane 21 contact, accord with the special requirement in the specific semiconductor processing procedure.

The foregoing is directed to the preferred embodiments of the present invention, and it will be understood by those skilled in the art that various changes and modifications may be made without departing from the principles of the invention, and that such changes and modifications are intended to be included within the scope of the invention.

Claims (7)

1. A wafer underneath type rotary cleaning apparatus, comprising:

the cavity is provided with a rotatable ring lining and a swingable liquid spraying swing arm, and the liquid spraying swing arm is provided with at least one spray head capable of spraying a solvent;

a wafer frame, wherein a wafer is adhered and fixed in the ring inner area by the adhesive film, and the wafer frame can be arranged on the ring liner and leads the wafer to face downwards;

the power device is used for driving the adsorption seat and the pressing frame to rotate synchronously, when the cover body is operated to descend and is connected with the cavity, the wafer frame is pressed by the pressing frame, the wafer is adsorbed by the adsorption seat, the wafer frame rotates synchronously when the power unit drives the pressing frame, and in the process, the liquid spraying swing arm swings and sprays a solvent to the surface of the wafer by the spray head so as to remove a glue layer on the surface of the wafer.

2. The wafer down spin cleaning apparatus of claim 1 wherein the ring inner liner has an inner circular wall with an inner diameter larger than the outer diameter of the wafer.

3. The wafer down spin cleaning apparatus of claim 2 wherein the ring inner liner forms an upper tapered surface on the top surface where the inner circular wall meets, the upper tapered surface sloping downward toward the center.

4. The bottom-mounted rotary cleaning apparatus as claimed in claim 2, wherein the ring liner forms a lower conical surface on the bottom surface of the inner wall, and the chamber has a conical seat with a water outlet at the bottom center.

5. The bottom-mounted wafer rotary cleaning apparatus as claimed in claim 4, wherein the ring liner has at least one positioning recess, the cover further has a transmission frame disposed therein and located at the periphery of the pressing frame, the transmission frame has at least one positioning protrusion facing downward, the transmission frame is also driven by the power device, when the cover is lowered to engage with the chamber, the transmission frame presses on the ring liner, and the positioning protrusion is located in the positioning recess, and the transmission frame drives the ring liner to rotate synchronously when the power device is operated.

6. The wafer down-set spin rinse apparatus of claim 1 wherein the chuck is a porous ceramic chuck and the power device is a motor.

7. The bottom-mounted rotary cleaning apparatus for wafers as claimed in claim 1, wherein the spray arm has two nozzles, a first nozzle and a second nozzle, the first nozzle providing a low pressure solvent and the second nozzle providing a high pressure solvent.

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