CN217156336U - Edge detection equipment and equipment front end module - Google Patents
Edge detection equipment and equipment front end module Download PDFInfo
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- CN217156336U CN217156336U CN202123457242.8U CN202123457242U CN217156336U CN 217156336 U CN217156336 U CN 217156336U CN 202123457242 U CN202123457242 U CN 202123457242U CN 217156336 U CN217156336 U CN 217156336U
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Abstract
An edge detection apparatus and an apparatus front-end module, the edge detection apparatus comprising: the rotating system is configured to drive the object to be measured to rotate along a preset axis; the rotating system is also configured to detect the rotating speed of the object to be detected and output a first control signal under the condition that the rotating speed of the object to be detected is constant; the side inspection detection system is arranged at an interval with the rotating system and comprises a first illumination assembly and a second illumination assembly which are coaxially and oppositely arranged, and the side inspection detection system is configured to control at least one of the first illumination assembly and the second illumination assembly to illuminate under the trigger of a first control signal to acquire an image in a preset detection area. Therefore, the defect detection of the image is carried out by matching the rotating system and the edge detection system, and the automation degree of the defect detection of the edge is improved. Meanwhile, three illumination modes can be realized by the two illumination assemblies which are coaxially arranged, and the edge detection system acquires three images so as to detect defects.
Description
Technical Field
The application relates to the technical field of defect detection, in particular to edge detection equipment and an equipment front-end module.
Background
The wafer can be processed into various circuit original structures to form an integrated circuit product with specific electrical functions. The processing and manufacturing process of a common wafer is complicated, and if defects exist on the wafer, the manufactured integrated circuit product is invalid, so that the yield of the product is reduced, and the manufacturing cost is increased. The defects on the wafer are not only detected in real time so as to remove the defects or stop the preparation process in time, but also the whole wafer is required to be macroscopically detected at the incoming end and the outgoing end. Macroscopic defects, generally those larger than 100 microns in size, can be observed directly by the human eye.
When the wafer is macroscopically detected, the defects of the edge of the wafer need to be macroscopically detected, so that the purpose of overall macroscopically detecting the wafer is achieved.
According to the traditional edge macroscopic detection equipment, the wafer is manually controlled to rotate by people, the defects on the edge of the wafer are observed by naked eyes, the defects are manually marked and classified, and the defect detection efficiency is low.
SUMMERY OF THE UTILITY MODEL
The utility model discloses the main technical problem who solves is the lower technical problem of degree of automation that the macroscopic defect at the edge of current wafer detected.
According to a first aspect of the present application, there is provided in one embodiment an edge detection apparatus, comprising:
the rotating system is configured to drive the object to be measured to rotate along a preset axis; the rotating system is also configured to detect the rotating speed of the object to be detected and output a first control signal under the condition that the rotating speed of the object to be detected is constant; during the rotation process, part or all of the edge of the object to be detected passes through a preset detection area of the edge detection equipment;
the edge detection system is arranged at an interval with the rotating system and comprises a first illuminating assembly and a second illuminating assembly which are coaxially and oppositely arranged, the edge detection system is configured to control at least one of the first illuminating assembly and the second illuminating assembly to illuminate a preset detection area under the triggering of a first control signal, and an image of the edge of an object to be detected in the preset detection area is obtained.
In a possible implementation manner, the edge detection system comprises a first edge detector and/or a second edge detector, and optical axes of the first edge detector and the second edge detector are parallel to a preset axis;
the first edge detection detector is configured to acquire an image of the edge of the front surface of the object to be detected in a preset detection area;
the second edge detection detector is configured to acquire an image of the edge of the back of the object to be detected in a preset detection area; the front surface and the back surface of the object to be detected are two opposite surfaces.
In one possible implementation manner, the edge detection system includes a first edge detector and a second edge detector, and an optical axis of the first edge detector and an optical axis of the second edge detector are located on the same straight line;
the first edge inspection detector is provided with an inner illumination coaxial lens, and the second edge inspection detector is provided with an inner illumination coaxial lens; the first lighting assembly is arranged on the inner lighting coaxial lens of the first edge detection detector, and the second lighting assembly is arranged on the inner lighting coaxial lens of the second edge detection detector.
In a possible implementation manner, the edge detection device further comprises an illumination system, the illumination system is arranged at the side of the edge detection system, and the illumination system is configured to provide illumination in at least one direction to the preset detection area under the triggering of the first control signal.
In one possible implementation, the lighting system includes a third lighting assembly and a fourth lighting assembly, the third lighting assembly is located at a side of the first edge detector, the fourth lighting assembly is located at a side of the second edge detector, the third lighting assembly is configured to provide side front lighting to the first edge detector, and the fourth lighting assembly is configured to provide side front lighting to the second edge detector;
the lighting system is configured to control at least one of the third lighting assembly and the fourth lighting assembly to provide illumination to the preset detection area upon triggering of the first control signal.
In a possible implementation manner, the third illumination assembly and the fourth illumination assembly are point light sources, a light source direction of the third illumination assembly and an optical axis of the first edge detection detector form a first preset included angle, and a light source direction of the fourth illumination assembly and an optical axis of the second edge detection detector form a second preset included angle.
In a possible implementation manner, the illumination system comprises a fifth illumination assembly and a sixth illumination assembly, the fifth illumination assembly and the sixth illumination assembly are both annular light sources, the fifth illumination assembly is coaxially arranged with the first edge detection detector, and the sixth illumination assembly is coaxially arranged with the second edge detection detector;
the lighting system is configured to control at least one of the fifth lighting assembly and the sixth lighting assembly to provide illumination to the preset detection area upon triggering of the first control signal.
In one possible implementation, the illumination angle of the fifth illumination assembly is 30 ° to 60 °, and the illumination angle of the sixth illumination assembly is 30 ° to 60 °.
In one possible implementation manner, the object to be measured is a wafer, and the rotating system is arranged in a calibration device of the wafer;
the rotating system is configured to drive the wafer to rotate around a preset axis of the wafer; the rotation system is configured to detect the rotation speed of the wafer and output a first control signal if the rotation speed of the wafer is a uniform speed.
According to a second aspect of the present application, an embodiment provides an apparatus front-end module, including a calibration device and the edge detection apparatus described in any one of the possible implementations of the first aspect and the first aspect, wherein the calibration device is configured to adjust a position of a wafer, and a rotation system of the edge detection apparatus is disposed in the calibration device.
According to the edge detection device and the device front-end module of the above embodiment, the edge detection device includes: the rotating system is configured to drive the object to be measured to rotate along a preset axis; the rotating system is also configured to detect the rotating speed of the object to be detected and output a first control signal under the condition that the rotating speed of the object to be detected is constant; during the rotation process, part or all of the edge of the object to be detected passes through a preset detection area of the edge detection equipment; the edge detection system is arranged at an interval with the rotating system and comprises a first illumination assembly and a second illumination assembly which are coaxially and oppositely arranged, the edge detection system is configured to control at least one of the first illumination assembly and the second illumination assembly to illuminate a preset detection area under the triggering of a first control signal, and an image of the edge of an object to be detected in the preset detection area is obtained. Therefore, the preset detection area corresponding to the edge of the object to be detected is subjected to image acquisition through the cooperation of the rotating system and the edge detection system, so that the defect detection of the image is performed, and the automation degree of the defect detection of the edge is improved. Meanwhile, three illumination modes can be realized by the two illumination assemblies coaxially arranged, and the edge detection system can acquire three corresponding images, so that defect detection is performed.
Drawings
Fig. 1 is a schematic structural diagram of an edge detection apparatus according to an embodiment;
FIG. 2 is a front view of an edge detection apparatus according to an embodiment;
FIGS. 3 and 6 are side views of an edge detection apparatus according to an embodiment;
fig. 4 and 5 are schematic views of a preset detection area according to an embodiment.
Reference numerals: 1-a rotation system; 2-a side inspection detection system; 21-a first side-detecting detector; 211-a first lighting assembly; 22-a second edge detector; 221-a second lighting assembly; 3-a lighting system; 31-a third lighting assembly; 32-a fourth lighting assembly; 33-a fifth lighting assembly; 34-a sixth lighting assembly; 4-the object to be measured.
Detailed Description
The present application will be described in further detail below with reference to the accompanying drawings by way of specific embodiments. Wherein like elements in different embodiments are numbered with like associated elements. In the following description, numerous details are set forth in order to provide a better understanding of the present application. However, those skilled in the art will readily recognize that some of the features may be omitted or replaced with other elements, materials, methods in different instances. In some instances, certain operations related to the present application have not been shown or described in detail in order to avoid obscuring the core of the present application from excessive description, and it is not necessary for those skilled in the art to describe these operations in detail, so that they may be fully understood from the description in the specification and the general knowledge in the art.
Furthermore, the features, operations, or characteristics described in the specification may be combined in any suitable manner to form various embodiments, and the operation steps involved in the embodiments may be interchanged or modified in order as will be apparent to those skilled in the art. Accordingly, the description and drawings are merely for clarity of description of certain embodiments and are not intended to necessarily refer to a required composition and/or order.
The numbering of the components as such, e.g., "first", "second", etc., is used herein only to distinguish the objects as described, and does not have any sequential or technical meaning. The term "connected" and "coupled" when used in this application, unless otherwise indicated, includes both direct and indirect connections (couplings).
During the production and transportation of the wafer in each process step, there is a possibility of generating macro defects, which generally include surface defects (including front and back surfaces) and edge defects. The edge of the wafer generally includes the side surface of the wafer, and the annular region of the front surface and the surface near the side surface. Common surface defects include color difference, watermarks, bubbles, scratches, process particles, and the like, and edge defects are usually edge breakages. Above-mentioned macroscopic defect, current detection mode are artifical naked eye detection and classification, and this appears easily, and it is low, the standard differs to detect the precision, leads to the detection quality to hang down, degree of automation low grade problem.
In the application, an edge detection device and a device front-end module are provided for automatic detection of edge defects of wafer macro defects. The existing neural network technology is mature in image recognition, for example, a template matching method is adopted, and the wafer image can be matched with a preset defect template image to obtain the types of defects in the wafer image and the number of corresponding categories. The present application therefore focuses primarily on improvements in the acquisition of defect images.
The first embodiment is as follows:
referring to fig. 1 to fig. 3, the present embodiment provides an edge detection apparatus, which includes a rotation system 1 and an edge detection system 2.
Wherein, the rotating system 1 is configured to drive the object 4 to be measured to rotate along a preset axis; the device is also configured to detect the rotating speed of the object 4 to be detected, and output a first control signal under the condition that the rotating speed of the object 4 to be detected is a constant speed; wherein, in the rotating process, part or all of the edge of the object 4 to be detected passes through the preset detection area of the edge detection device. It can be understood that the rotating system 1 simulates the action of a human hand rotating the object 4 to be measured. In this embodiment, the object 4 to be measured is an object with a circular shape, such as a wafer, and the predetermined axis is a central line of the circular shape.
The edge detection system 2 is arranged at a distance from the rotating system 1, the edge detection system 2 comprises a first illumination assembly 211 and a second illumination assembly 221 which are coaxially and oppositely arranged, and the edge detection system 2 is configured to control at least one of the first illumination assembly 211 and the second illumination assembly 221 to illuminate a preset detection area under the triggering of a first control signal, and acquire an image of the edge of the object 4 to be detected in the preset detection area. The edge detection system 2 is arranged at a distance from the rotating system 1. The edge detection system 2 may complete an image of part or all of the edge of the object 4 to be detected by acquiring multiple images at the same interval time. It can be understood that the edge-detecting system 2 simulates the action of human eyes observing the object 4 to be measured. The edge detection system 2 may include one or more detectors for image acquisition, and the detectors may be cameras, and the embodiment is described by taking the detectors as the cameras, and is not limited to other available types of detectors provided in the present application.
As shown in fig. 4 and 5, the preset detection area of the edge detection device is determined by the detection range of the detector, and when the detector is a camera, the preset detection area is determined by the shooting range of the camera, so that in the present embodiment, the preset detection area refers to the shooting range of the edge detection system 2, such as the preset detection area a shown in fig. 5. It can be seen that the image captured by the edge inspection system 2 can only capture a portion of the edge of the object 4 to be detected each time.
The edge detection device may further include a processing terminal configured to detect macro defects in the image according to the image acquired by the edge detection system 2. The processing terminal can adopt any existing detection algorithm for detection. It can be understood that the side-detection system 2 simulates the action of human brain to determine defects.
As described above, the image acquired by the edge inspection system 2 is a large factor affecting the accuracy of defect detection, wherein the defects on the wafer are imaged differently in different lighting environments and the images captured by the cameras have different imaging effects. Based on the thickness of the wafer, which is generally less than 1mm, the defect at the edge can be obtained by polishing the front surface or the back surface or the side surface and obtaining the image at the front surface or the back surface. In this embodiment, the edge of the object 4 may refer to a side surface of the object 4, and may refer to edges of the front surface and the back surface close to the side surface.
In practical application, according to the range of the edge of the object 4 to be detected, or the characteristics of the specific object 4 to be detected, image acquisition can be performed in the front and/or back direction, and therefore, the edge detection system 2 can include the first edge detector 21 and/or the second edge detector 22, the optical axes of the first edge detector 21 and the second edge detector 22 are both parallel to the preset axis, that is, the first edge detector 21 and the second edge detector 22 are directly opposite to the surface of the object 4 to be detected.
Wherein, the first edge detection detector 21 is configured to acquire an image of the edge of the front surface of the object 4 to be detected in a preset detection area; the second edge detection detector 22 is configured to acquire an image of the edge of the back surface of the object 4 to be detected in a preset detection area; the front surface and the back surface of the object 4 to be measured are opposite.
In a possible implementation manner, the edge detection system 2 may include a first edge detector 21 and a second edge detector 22, where an optical axis of the first edge detector 21 and an optical axis of the second edge detector 22 are located on the same straight line; furthermore, the optical axis of the first edge inspection detector 21 and the optical axis of the second edge inspection detector 22 are tangent to the edge of the object 4 to be measured.
The first side inspection detector 21 has an internal illumination coaxial lens, and the second side inspection detector 22 has an internal illumination coaxial lens; the first illumination assembly 211 is disposed on the inner illumination coaxial lens of the first edge inspection probe 21, and the second illumination assembly 221 is disposed on the inner illumination coaxial lens of the second edge inspection probe 22. The first illumination assembly 211 provides illumination to the predetermined inspection area through the inner illumination coaxial lens of the first edge finder 21, and the second illumination assembly 221 provides illumination to the predetermined inspection area through the inner illumination coaxial lens of the second edge finder 22.
As can be seen, the first side inspection detector 21 is taken as an example, and when only the first illumination module 211 is illuminated, the reflected image of the preset inspection area is acquired, and when only the second illumination module 221 is illuminated, the correlation image of the preset inspection area is acquired. When the first illumination assembly 211 and the second illumination assembly 221 are simultaneously illuminated, a reflection and contrast composite field image of a preset detection area is acquired. That is to say, three kinds of illumination modes can be realized to two illumination components of coaxial setting, and the limit is examined the detection system and can be acquireed corresponding three images to carry out defect detection.
In order to provide more lighting conditions and acquire images of defects under more different lighting conditions, the edge detection device may further include a lighting system 3, the lighting system 3 is disposed at a side of the edge detection system 2, and the lighting system 3 is configured to provide at least one direction of lighting to the preset detection area under the triggering of the first control signal.
For example, the illumination system 3 may include a third illumination assembly 31 and a fourth illumination assembly 32, the third illumination assembly 31 being located at a side of the first edge detector 21, the fourth illumination assembly 32 being located at a side of the second edge detector 22, the third illumination assembly 31 being configured to provide side front illumination to the first edge detector 21, the fourth illumination assembly 32 being configured to provide side front illumination to the second edge detector 22; the lighting system 3 is configured to control at least one of the third lighting assembly 31 and the fourth lighting assembly 32 to provide illumination to the preset detection area upon triggering of the first control signal. The lateral direct light illumination means that the light source direction of the third illumination assembly 31 and the optical axis of the first edge detector 31 form an acute included angle, which is not necessarily 45 °, and other angles are also possible.
Or, taking the first side inspection detector 21 as an example for explanation, when only the third illumination assembly 31 illuminates, a dark field image of a preset inspection area is acquired; when the second illumination assembly 221 and the third illumination assembly 31 are illuminated simultaneously, a pair-shot dark field composite field image of a preset detection area is acquired; when the first illumination assembly 211, the second illumination assembly 221 and the third illumination assembly 31 are illuminated simultaneously, a reflection-plus-contrast dark field composite field image of a preset detection area is acquired.
It can be seen that a plurality of illumination modes can be formed by combined illumination of the first illumination assembly 211, the second illumination assembly 221, the third illumination assembly 31 and the fourth illumination assembly 32, the edge inspection detection system 2 corresponds to a mode with a plurality of acquisitions, and a multi-camera multi-illumination-mode imaging system is formed, so that macroscopic defects of the edge of the wafer can form images corresponding to the plurality of acquisition modes (imaging modes) to perform more accurate defect detection.
In one implementation, as shown in fig. 6, the illumination system may also be in the form of a ring light source, provided that the first illumination assembly 211 and the second illumination assembly 221 are used. The lighting system 3 may include a fifth lighting assembly 33 and a sixth lighting assembly 34, both the fifth lighting assembly 33 and the sixth lighting assembly 34 are annular light sources, the fifth lighting assembly 33 is coaxially disposed with the first edge detector 21, and the sixth lighting assembly 34 is coaxially disposed with the second edge detector 22; the lighting system 3 is configured to control at least one of the fifth lighting assembly 33 and the sixth lighting assembly 34 to provide illumination to the preset detection area upon triggering of the first control signal.
The annular light source is equivalent to an annular point light source, wherein the first side inspection detector 21 is taken as an example for explanation, and when only the fifth illumination assembly 33 illuminates, a dark field image of a preset detection area is acquired; when the second illumination assembly 221 and the fifth illumination assembly 33 are illuminated simultaneously, an opposite-radiation and dark-field composite field image of a preset detection area is acquired; when the first illumination assembly 211, the second illumination assembly 221 and the fifth illumination assembly 33 are illuminated simultaneously, a reflection-plus-contrast dark field composite field image of a preset detection area is acquired.
The irradiation angle of the fifth illumination module 33 may be 30 to 60 °, and the irradiation angle of the sixth illumination module 34 may be 30 to 60 °.
It can be seen that a plurality of illumination modes can be formed by combined illumination of the first illumination assembly 211, the second illumination assembly 221, the fifth illumination assembly 33 and the sixth illumination assembly 34, the edge inspection detection system 2 has a plurality of collection modes correspondingly, and a multi-camera multi-illumination-mode imaging system is formed, so that macroscopic defects of the edge of the wafer can form images corresponding to the plurality of collection modes (imaging modes) to perform more accurate defect detection.
Example two:
as described in the first embodiment, the function of the rotating system 1 is not limited to a specific device, the edge detection device may be an independent device, and when the object 4 to be detected is a wafer, the rotating system 1 of the edge detection device may utilize a rotating system of a front end module of the device, that is, the edge detection device may be set up at a position corresponding to the calibration device of the front end module of the device, and a station for edge detection does not need to be set up separately, which is beneficial to reducing the cost and size of the automatic detection device.
An Existing Front End Module (EFEM) generally includes a wafer loading device, a robot device, and a calibration device, wherein the loading device is configured to hold an object 4 to be measured, the robot device is configured to transfer the object 4 to be measured to the calibration device, and the calibration device is configured to determine a center of the object 4 to be measured and an orientation of a preset mark.
The calibration device can determine and calibrate the center and the V groove of the wafer by adopting any conventional calibration mode so as to determine the posture of the wafer, so that the robot device can conveniently load the wafer into the corresponding processing equipment. For example, in the conventional calibration method, the wafer is mainly driven to rotate by the calibration device, and the center and the V-groove of the wafer are determined by combining image recognition analysis and the like, so the calibration device of the EFEM has the corresponding rotation system 1.
The robot device is also configured to transfer the object 4 to be measured positioned on the calibration device to the surface detection apparatus in a preset posture. The robot apparatus of the existing EFEM is configured to load the wafer into the alignment apparatus and to load the wafer, which has been aligned, into the process equipment.
In this embodiment, an apparatus front-end module is provided, which includes a calibration device configured to adjust a position of a wafer and the edge detecting apparatus described in the first embodiment, wherein the rotation system 1 of the edge detecting apparatus is disposed in the calibration device.
The rotating system 1 is configured to drive the wafer to rotate around the center line of the wafer; the wafer rotation speed detection device is also configured to detect the rotation speed of the wafer and output a first control signal when the rotation speed of the wafer is a uniform speed.
The edge inspection detection system 2 may include a first edge inspection detector 21 and/or a second edge inspection detector 22, optical axes of the first edge inspection detector 21 and the second edge inspection detector 22 are both parallel to a predetermined axis, the optical axes of the first edge inspection detector 21 and the second edge inspection detector 22 are located on the same straight line, and the optical axis of the first edge inspection detector 21 is tangent to the edge of the wafer.
The first edge detection detector 21 is configured to acquire an image of an edge of the front surface of the wafer in a preset detection area; the second edge detector 22 is configured to acquire an image of the edge of the back side of the wafer in a preset detection area; the first side inspection detector 21 has an internal illumination coaxial lens, and the second side inspection detector 22 has an internal illumination coaxial lens; the edge detection system 2 further includes a first illumination assembly 211 disposed on the inner illumination coaxial lens of the first edge detector 21 and a second illumination assembly 221 disposed on the inner illumination coaxial lens of the second edge detector 22. The first illumination assembly 211 provides illumination to the predetermined inspection area through the inner illumination coaxial lens of the first edge finder 21, and the second illumination assembly 221 provides illumination to the predetermined inspection area through the inner illumination coaxial lens of the second edge finder 22.
The edge detection system 2 is configured to control at least one of the first illumination assembly 211 and the second illumination assembly 221 to illuminate and acquire an image of the edge of the wafer in a predetermined detection area under the trigger of the first control signal.
The edge detection device may further include an illumination system 3, the illumination system 3 may include a third illumination assembly 31 and a fourth illumination assembly 32, the third illumination assembly 31 is located at a side of the first edge detector 21, the fourth illumination assembly 32 is located at a side of the second edge detector 22, the third illumination assembly 31 is configured to provide side front illumination to the first edge detector 21, and the fourth illumination assembly 32 is configured to provide side back illumination to the first edge detector 21; the lighting system 3 is configured to control at least one of the third lighting assembly 31 and the fourth lighting assembly 32 to provide illumination to the preset detection area upon triggering of the first control signal.
The specific technical effects of the edge detection system 2 and the illumination system 3 have been described in the first embodiment, and will not be described again.
Taking the first side inspection detector 21 as an example, when only the first illumination assembly 211 illuminates, a reflection image of a preset inspection area is acquired. When only the second illumination assembly 221 is illuminated, a correlation image of the preset detection area is acquired. When the first illumination assembly 211 and the second illumination assembly 221 are simultaneously illuminated, a reflection and contrast composite field image of a preset detection area is acquired. When only the third illumination assembly 31 is illuminated, a dark field image of a preset detection area is acquired. When the second illumination assembly 221 and the third illumination assembly 31 are illuminated simultaneously, an image of the opposite-radiation dark field composite field of the preset detection area is acquired. When the first illumination assembly 211, the second illumination assembly 221 and the third illumination assembly 31 are illuminated simultaneously, a reflection-plus-contrast dark field composite field image of a preset detection area is acquired.
It can be seen that a plurality of illumination modes can be formed by combined illumination of the first illumination assembly 211, the second illumination assembly 221, the third illumination assembly 31 and the fourth illumination assembly 32, the edge inspection system 2 has a plurality of collection modes correspondingly, and a multi-camera multi-illumination-mode imaging system is formed, so that macroscopic defects of the edge of the wafer can form images corresponding to the plurality of collection modes (or imaging modes) to perform more accurate defect detection. In the present embodiment, the first side edge detector 21 may have six imaging modes in a combined illumination mode of four illumination assemblies.
The edge detection equipment can be built at the corresponding position of the calibration device of the front section module of the equipment, and a station for edge detection is not required to be built independently, so that the cost and the volume of the automatic detection device are reduced.
In a possible implementation manner, the third illumination assembly 31 and the fourth illumination assembly 32 are both point light sources, a light source direction of the third illumination assembly 31 and an optical axis of the first edge inspection detector 21 form a first preset included angle, and a light source direction of the fourth illumination assembly 32 and an optical axis of the second edge inspection detector 22 form a second preset included angle; the first preset included angle is 20-70 degrees, and the second preset included angle is 20-70 degrees. The adjustable point light source can realize the adjustment of the illumination angle of the dark field image. And the light source directions of the third illumination assembly 31 and the fourth illumination assembly 32 are both towards the detection ranges of the first edge detector 21 and the second edge detector 22, i.e. provide illumination for the preset detection area.
It is right to have used specific individual example above the utility model discloses expound, only be used for helping to understand the utility model discloses, not be used for the restriction the utility model discloses. To the technical field of the utility model technical personnel, the foundation the utility model discloses an idea can also be made a plurality of simple deductions, warp or replacement.
Claims (10)
1. An edge detection apparatus, comprising:
the rotating system (1) is configured to drive the object (4) to be measured to rotate along a preset axis; the rotating system (1) is also configured to detect the rotating speed of the object to be detected (4), and output a first control signal under the condition that the rotating speed of the object to be detected (4) is constant; during the rotation process, part or all of the edge of the object (4) to be detected passes through a preset detection area of the edge detection equipment;
the edge detection system (2) is arranged at an interval with the rotating system (1), the edge detection system (2) comprises a first illumination assembly (211) and a second illumination assembly (221) which are coaxially and oppositely arranged, the edge detection system (2) is configured to control at least one of the first illumination assembly (211) and the second illumination assembly (221) to illuminate a preset detection area under the triggering of a first control signal, and the edge of the object to be detected (4) is acquired and is in the image of the preset detection area.
2. The edge detection apparatus of claim 1, wherein the edge detection system (2) comprises a first edge detector (21) and/or a second edge detector (22), the optical axes of the first edge detector (21) and the second edge detector (22) being parallel to the predetermined axis;
the first edge detection detector (21) is configured to acquire an image of the edge of the front surface of the object to be detected (4) in the preset detection area;
the second edge detection detector (22) is configured to acquire an image of the edge of the back surface of the object to be detected (4) in the preset detection area; the front surface and the back surface of the object to be detected (4) are opposite.
3. The edge detection apparatus of claim 2, wherein the edge detection system (2) comprises the first edge detector (21) and the second edge detector (22), and the optical axes of the first edge detector (21) and the second edge detector (22) are located on a same straight line;
the first edge inspection detector (21) is provided with an internal illumination coaxial lens, and the second edge inspection detector (22) is provided with an internal illumination coaxial lens; the first lighting assembly (211) is arranged on the inner lighting coaxial lens of the first side inspection detector (21), and the second lighting assembly (221) is arranged on the inner lighting coaxial lens of the second side inspection detector (22).
4. The edge detection apparatus according to claim 3, further comprising an illumination system (3), the illumination system (3) being arranged at a side of the edge detection system (2), the illumination system (3) being configured to provide at least one direction of illumination to the preset detection area upon triggering of the first control signal.
5. The edge detection apparatus of claim 4, wherein the illumination system (3) comprises a third illumination assembly (31) and a fourth illumination assembly (32), the third illumination assembly (31) being located to the side of the first edge detector (21), the fourth illumination assembly (32) being located to the side of the second edge detector (22), the third illumination assembly (31) being configured to provide side front lighting to the first edge detector (21), the fourth illumination assembly (32) being configured to provide side front lighting to the second edge detector (22);
the lighting system (3) is configured to control at least one of the third lighting assembly (31) and the fourth lighting assembly (32) to provide illumination to the preset detection area upon triggering of the first control signal.
6. The edge inspection apparatus of claim 5, wherein the third illumination assembly (31) and the fourth illumination assembly (32) are point light sources, the light source direction of the third illumination assembly (31) and the optical axis of the first edge inspection detector (21) form a first predetermined angle, and the light source direction of the fourth illumination assembly (32) and the optical axis of the second edge inspection detector (22) form a second predetermined angle.
7. The edge inspection apparatus of claim 4, wherein the illumination system (3) comprises a fifth illumination assembly (33) and a sixth illumination assembly (34), the fifth illumination assembly (33) and the sixth illumination assembly (34) each being an annular light source, the fifth illumination assembly (33) being disposed coaxially with the first edge inspection detector (21), the sixth illumination assembly (34) being disposed coaxially with the second edge inspection detector (22);
the lighting system (3) is configured to control at least one of the fifth lighting assembly (33) and a sixth lighting assembly (34) to provide illumination to the preset detection area upon triggering of the first control signal.
8. The edge inspection apparatus of claim 7, wherein the illumination angle of the fifth illumination assembly (33) is 30 ° to 60 °, and the illumination angle of the sixth illumination assembly (34) is 30 ° to 60 °.
9. The edge inspection apparatus according to any of claims 1 to 8, wherein the object (4) to be inspected is a wafer, and the rotation system (1) is disposed in a calibration device of the wafer;
the rotating system (1) is configured to drive the wafer to rotate around a preset axis of the wafer; the rotating system (1) is configured to detect the rotating speed of the wafer, and output a first control signal under the condition that the rotating speed of the wafer is uniform.
10. An equipment front end module, characterized in that it comprises a calibration device configured to adjust the position of a wafer and an edge detection apparatus according to claim 9, the edge detection apparatus rotation system (1) being arranged within the calibration device.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115791807A (en) * | 2023-01-09 | 2023-03-14 | 苏州高视半导体技术有限公司 | Device for detecting wafer defects |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115791807A (en) * | 2023-01-09 | 2023-03-14 | 苏州高视半导体技术有限公司 | Device for detecting wafer defects |
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