CN217277934U

CN217277934U - Automatic detection device

Info

Publication number: CN217277934U
Application number: CN202123326578.0U
Authority: CN
Inventors: 洪艮超; 董坤玲; 孙世宏; 王启坤; 张鹏斌; 夏爱华; 汪辉; 陈鲁; 张嵩
Original assignee: Shenzhen Zhongke Feice Technology Co Ltd
Current assignee: Shenzhen Zhongke Feice Technology Co Ltd
Priority date: 2021-12-27
Filing date: 2021-12-27
Publication date: 2022-08-23
Anticipated expiration: 2031-12-27

Abstract

An automatic detection device comprises a transmission device, an edge detection device and a surface detection device; the transmission equipment comprises a loading device, a manipulator device and a calibration device, wherein the loading device is used for containing an object to be detected, the manipulator device is used for transmitting the object to be detected to the calibration device, and the calibration device is used for determining the center of the object to be detected and the direction of a preset mark; the edge detection equipment is used for detecting a first preset feature of the edge of the object to be detected on the calibration device; the manipulator device is also used for transmitting the object to be detected positioned on the calibration device to the surface detection equipment in a preset posture; the surface detection equipment is used for detecting a second preset characteristic on the surface of the object to be detected. Therefore, the automatic detection device can finish automatic detection of the preset characteristics of the front surface, the back surface and the edge of the object to be detected, for example, the automatic detection of the macroscopic defects of the wafer is finished, and the detection efficiency and the accuracy are improved.

Description

Automatic detection device

Technical Field

The application relates to the technical field of defect detection, in particular to an automatic detection device.

Background

The wafer can be processed into various circuit original structures to form an integrated circuit product with specific electrical functions. The processing and manufacturing process of a general wafer is complicated and complex, and if defects exist on the wafer, the manufactured integrated circuit product is invalid, so that the yield of the product is reduced, and the manufacturing cost is increased. The defects on the wafer are not only required to be detected in real time so as to remove the defects in time or stop the preparation process, but also the whole wafer is required to be macroscopically detected at the incoming end and the outgoing end. Macroscopic defects, generally those larger than 100 microns in size, can be observed directly by the human eye.

When the wafer is macroscopically detected, not only the defects on the surface of the front graph of the wafer need to be macroscopically detected, but also the defects on the back and the edge of the wafer need to be macroscopically detected, so that the purpose of overall macroscopically detecting the wafer is achieved.

According to the traditional macroscopic detection equipment, the wafer is manually controlled to rotate by people, the defects on the front surface, the back surface and the edge of the wafer are observed by naked eyes, the defects are manually marked and classified, and the defect detection efficiency is low.

SUMMERY OF THE UTILITY MODEL

The utility model discloses the main technical problem who solves is the lower technical problem of degree of automation that the macroscopic defect of current wafer detected.

According to an aspect of the present application, an embodiment provides an automatic detection apparatus, including a transport device, an edge detection device, and a surface detection device;

the transmission equipment comprises a loading device, a manipulator device and a calibration device, wherein the loading device is configured to contain an object to be measured, the manipulator device is configured to transmit the object to be measured to the calibration device, and the calibration device is configured to determine the position of the object to be measured;

the edge detection equipment is configured to detect the edge of an object to be detected on the calibration device according to a first preset characteristic;

the manipulator device is also configured to transmit the object to be detected on the calibration device to the surface detection equipment in a preset posture;

the surface detection device is configured to detect a second preset feature on the surface of the object to be detected.

In a possible implementation manner, the calibration device further includes a rotation system configured to drive the object to be measured to rotate along a preset axis; the rotating system is also configured to detect the rotating speed of the object to be detected and output a first control signal under the condition that the rotating speed of the object to be detected is constant;

the edge detection equipment comprises an edge detection system;

the edge detection system is configured to acquire an image of the edge of the object to be detected in a preset detection area under the trigger of a first control signal; and in the rotating process of the object to be detected, part or all of the edge of the object to be detected passes through a preset detection area of the edge detection equipment.

In one possible implementation manner, the edge detection system includes a first edge detector and/or a second edge detector, and an optical axis of the first edge detector and an optical axis of the second edge detector are located on the same straight line;

the first side inspection detector is provided with an internal illumination coaxial lens, and the second side inspection detector is provided with an internal illumination coaxial lens; the edge detection system also comprises a first illumination component arranged on the inner illumination coaxial lens of the first edge detection detector; the second illumination assembly is arranged on the inner illumination coaxial lens of the second edge detection detector;

the edge detection system is configured to control at least one of the first illumination assembly and the second illumination assembly to illuminate and acquire an image of the edge of the object to be detected in a preset detection area under the triggering of the first control signal.

In a possible implementation manner, the edge detection device further comprises an illumination system, the illumination system is arranged at the side of the edge detection system, and the illumination system is configured to provide illumination in at least one direction to the preset detection area under the triggering of the first control signal.

In one possible implementation, the lighting system includes a third lighting assembly and a fourth lighting assembly, the third lighting assembly is located at a side of the first edge detector, the fourth lighting assembly is located at a side of the second edge detector, the third lighting assembly is configured to provide side front lighting to the first edge detector, and the fourth lighting assembly is configured to provide side front lighting to the second edge detector;

the lighting system is configured to control at least one of the third lighting assembly and the fourth lighting assembly to provide illumination to the preset detection area upon triggering of the first control signal.

In one possible implementation manner, the object to be detected is a wafer, and the transmission equipment is an equipment front-section module;

the rotation system of the calibration device is also configured to drive the wafer to rotate along the central axis of the wafer; the calibration device is also configured to detect the rotation speed of the wafer and output a first control signal if the rotation speed of the wafer is a uniform speed.

In one possible implementation, the surface detection device includes an imaging background system, a surface detection system, and a motion mechanism;

the imaging background system is configured to provide a background image of a preset color, the preset color comprising at least one color;

the surface detection system is configured to acquire a detection image of the background image reflected by the surface;

the motion mechanism is configured to adjust the surface of the object to be measured to a preset angle, and the preset angle comprises at least one angle;

the manipulator device is also configured to transfer the object to be measured on the calibration device onto the movement mechanism in a preset posture.

In one possible implementation manner, the surface detection system comprises at least one surface detection detector, and each surface detection detector corresponds to a preset angle setting;

or, the area inspection detection system comprises an area inspection detector and a camera motion system, wherein the camera motion system is configured to move the area inspection detector to a plurality of preset shooting positions, and one preset shooting position corresponds to one preset angle.

In one possible implementation, the imaging background system includes a multispectral surface light source, or includes a multispectral surface light source and a black background component, wherein the multispectral surface light source is configured to provide a non-black background image;

the black background component is configured to provide a black background image and the multi-spectral area light source is further configured to provide an ambient light source.

In one possible implementation, the preset angle is-9 °, and/or the preset color includes at least one of black, white, green, blue, and yellow.

The automatic detection device according to the embodiment comprises a transmission device, an edge detection device and a surface detection device; the transmission equipment comprises a loading device, a manipulator device and a calibration device, wherein the loading device is configured to contain an object to be measured, the manipulator device is configured to transmit the object to be measured to the calibration device, and the calibration device is configured to determine the position of the object to be measured; the edge detection equipment is configured to detect the edge of an object to be detected on the calibration device according to a first preset characteristic; the manipulator device is also configured to transmit the object to be detected on the calibration device to the surface detection equipment in a preset posture; the surface detection device is configured to detect a second preset feature on the surface of the object to be detected. Therefore, the automatic detection device can finish the automatic detection of the macro defects of the front surface, the back surface and the edge of the object to be detected, for example, the automatic detection of the macro defects of the wafer is finished, and the detection efficiency and the accuracy are improved.

Drawings

FIG. 1 is a schematic structural diagram of an automatic detection apparatus according to an embodiment;

fig. 2 and fig. 3 are schematic structural diagrams of an edge detection apparatus according to an embodiment;

fig. 4 is a schematic structural diagram of a surface detection apparatus according to an embodiment.

Reference numerals: 1-a transmission device; 11-a loading device; 12-a robot device; 13-a calibration device; 2-an edge detection device; 21-a side detection system; 211-first side inspection detector; 212-a second edge detector; 213-a first lighting assembly; 214-a second lighting assembly; 22-a lighting system; 221-a third lighting assembly; 222-a fourth lighting assembly; 3-a surface detection device; 31-imaging background system; 32-area detection system; 321-a surface detection detector; 33-a movement mechanism; 10-the object to be measured.

Detailed Description

The present application will be described in further detail below with reference to the accompanying drawings by way of specific embodiments. Wherein like elements in different embodiments are numbered with like associated elements. In the following description, numerous details are set forth in order to provide a better understanding of the present application. However, those skilled in the art will readily recognize that some of the features may be omitted or replaced with other elements, materials, methods in different instances. In some instances, certain operations related to the present application have not been shown or described in detail in order to avoid obscuring the core of the present application from excessive description, and it is not necessary for those skilled in the art to describe these operations in detail, so that they may be fully understood from the description in the specification and the general knowledge in the art.

Furthermore, the features, operations, or characteristics described in the specification may be combined in any suitable manner to form various embodiments, and the operation steps involved in the embodiments may be interchanged or modified in order as will be apparent to those skilled in the art. Accordingly, the description and drawings are merely for clarity of description of certain embodiments and are not intended to necessarily refer to a required composition and/or order.

The numbering of the components as such, e.g., "first", "second", etc., is used herein only to distinguish the objects as described, and does not have any sequential or technical meaning. The term "connected" and "coupled" when used in this application, unless otherwise indicated, includes both direct and indirect connections (couplings).

During the production and transportation of the wafer in each process step, there is a possibility of generating macro defects, and the macro defects of the wafer generally include surface defects (the surface includes the front surface and the back surface) and edge defects. Common surface defects include color difference, watermarks, bubbles, scratches, process particles, and the like, and edge defects are usually edge breakages. Above-mentioned macroscopic defect, current detection mode are artifical naked eye detection and classification, and this appears easily, and it is low, the standard differs to detect the precision, leads to the detection quality to hang down, degree of automation low grade problem.

In the application, aiming at the automatic detection of wafer macroscopic defects, the device with the functions of automatic feeding, automatic edge detection and surface detection is provided. The existing neural network technology is mature in image recognition, for example, a template matching method is adopted, and the wafer image can be matched with a preset defect template image to obtain the types of defects in the wafer image and the number of corresponding categories. The present application therefore focuses primarily on improvements in the acquisition of defect images.

The first embodiment is as follows:

referring to fig. 1 to 4, the present embodiment provides an automatic detection apparatus, which includes a transmission device 1, an edge detection device 2, and a surface detection device 3.

Wherein the transport apparatus 1 may comprise a loading device 11, a robot device 12 and a calibration device 13, the loading device 11 being configured to hold the object 10 to be measured, the robot device 12 being configured to transport the object 10 to be measured to the calibration device 13, the calibration device 13 being configured to determine the position of the object 10 to be measured.

For example, when the object 10 to be measured is a wafer, the transport apparatus 1 may adopt any Existing Front End Module (EFEM) having a loading device 11, a robot device 12 and a calibration device 13. The calibration device 13 is configured to determine the center of the wafer and a predetermined mark (e.g., a V-groove).

The calibration device 13 may use any conventional calibration method to determine the center and V-groove of the wafer, so as to determine the posture (or position) of the wafer, so that the robot device 12 can load the wafer into the corresponding processing equipment. For example, in the conventional calibration method, the calibration device 13 is mainly used to drive the wafer to rotate, and the center and the V-groove of the wafer are determined by combining image recognition analysis and the like, so the calibration device 13 of the EFEM has a corresponding rotation system.

The robot device 12 is also configured to transfer the object 10 to be measured, which is positioned on the calibration device 13, to the surface detection apparatus 3 in a preset posture. The robot apparatus 12 of the existing EFEM is configured to load the wafer into the alignment apparatus 13 and to load the wafer, which has been aligned, into the process equipment. Therefore, after the calibration is completed, the wafer may be transferred to the surface inspection apparatus 3 in a predetermined posture.

The edge detection device 2 is configured to detect the edge of the object 10 to be measured on the calibration apparatus 13 with the first predetermined characteristic. For example, the first preset feature is a macro defect of the wafer edge, and any one of the existing visual inspection systems may be used to acquire an image of the edge of the object 10 to be detected, and then perform defect detection and classification through related algorithms such as a neural network, so as to achieve automatic detection and classification of the macro defect of the edge.

The automatic detection device that this embodiment provided sets up the limit on calibrating device 13 and examines the station (edge detection equipment 2 promptly), carries out edge detection to the wafer after accomplishing the calibration, need not additionally adopt independent edge detection equipment 2 for automatic detection device's whole volume and cost obtain control.

The surface inspection apparatus 3 described above is configured to perform inspection of a second preset feature on the surface of the object to be inspected 10. For example, the second preset feature is a macro defect on the surface of the wafer, and any one of the existing visual inspection systems may be used to acquire an image of the surface of the object 10 to be detected, and then perform defect detection and classification through related algorithms such as a neural network, so as to achieve automatic detection and classification of the macro defect on the surface.

Therefore, by adopting the automatic detection device, the macroscopic defect detection of the object to be detected 10 such as a wafer can be completed in an automatic detection mode, and the efficiency and the accuracy of the macroscopic defect detection are improved.

Example two:

the method for detecting the defects by utilizing image recognition is relatively mature in algorithm, and the main factors influencing the detection accuracy also comprise the provided image to be detected, so how to better acquire the image of the area to be detected directly influences the accuracy of automatic detection of the macroscopic defects.

In a practical application, the calibration device 13 may further include a rotation system configured to drive the object 10 to be measured to rotate along a preset axis; the rotating system is further configured to detect the rotating speed of the object to be measured 10, and output a first control signal if the rotating speed of the object to be measured 10 is a uniform speed. When the object 10 to be measured is a wafer, the transmission device 1 is a front-end module of the device. The rotation system of the calibration device 13 is further configured to drive the wafer to rotate along the central axis of the wafer; the control circuit is configured to detect the rotation speed of the wafer and output a first control signal under the condition that the rotation speed of the wafer is a uniform speed.

As shown in fig. 2 and 3, the edge detecting apparatus 2 may include an edge detecting system 21. The edge detection system 21 is configured to acquire an image of the edge of the object 10 to be detected in a preset detection area under the trigger of the first control signal; during the rotation of the object 10, part or all of the edge of the object 10 passes through the preset detection area of the edge detection device 2. The edge detection system 21 may complete an image of some or all of the edge of the wafer by acquiring multiple images at the same interval. The preset detection area of the edge detection device is determined by the shooting range of the camera, and therefore, in the present embodiment, the preset detection area refers to the shooting range of the edge detection system 21.

Wherein, the edge detection device 2 may further include a processing terminal configured to detect macro defects in the image according to the image acquired by the edge detection system 21. The processing terminal can adopt any existing detection algorithm for detection.

As described above, the image acquired by the edge inspection system 21 is a large factor affecting the defect detection accuracy, wherein the defects on the wafer are imaged differently in different lighting environments and the images captured by the cameras have different imaging effects. Based on the thickness of the wafer, which is generally less than 1mm, the defect at the edge can be obtained by polishing the front surface, the back surface or the side surface, and obtaining the image at the front surface or the back surface.

In one implementation, as shown in fig. 3, the edge detecting system 21 may include a first edge detector 211 and/or a second edge detector 212, and the optical axis of the first edge detector 211 and the optical axis of the second edge detector 212 are located on the same straight line. Wherein the first edge detection detector 211 is configured to acquire an image of an edge of the front side of the object 10 to be measured, and the second edge detection detector 212 is configured to acquire an image of an edge of the back side of the object 10 to be measured. In this embodiment, the edge of the object 10 to be measured may refer to a side surface of the object 10 to be measured, and may refer to edges of the front surface and the back surface close to the side surface.

Wherein, the first edge detection detector 211 has an inner-illumination coaxial lens, and the second edge detection detector 212 has an inner-illumination coaxial lens; the edge detection system 21 further comprises a first illumination assembly 213 disposed on the inner illumination coaxial lens of the first edge detector 211; and a second illumination assembly 214 disposed on the inner illumination coaxial lens of the second edge detector 212.

The edge detection system 21 is configured to control at least one of the first illumination assembly 213 and the second illumination assembly 214 to illuminate and acquire an image of the edge of the object 10 under test in a preset detection area, triggered by the first control signal.

As can be seen, taking the first side inspection detector 211 as an example, when only the first illumination assembly 213 illuminates, a reflected image of the preset inspection area is acquired, and when only the second illumination assembly 214 illuminates, a symmetrical image of the preset inspection area is acquired. When the first illumination assembly 213 and the second illumination assembly 214 are illuminated simultaneously, a reflection plus contrast composite field image of a preset detection area is acquired.

In order to provide more lighting conditions and obtain images of defects under more different lighting conditions, the edge detection apparatus 2 may further include an illumination system 22, the illumination system 22 is disposed at a side of the edge detection system 21, and the illumination system 22 is configured to provide illumination in at least one direction to the preset detection area under the triggering of the first control signal.

As shown in fig. 3, in one possible implementation, the lighting system 22 may include a third lighting assembly 221 and a fourth lighting assembly 222, the third lighting assembly 221 is located at a side of the first edge detector 211, the fourth lighting assembly 222 is located at a side of the second edge detector 212, the third lighting assembly 221 is configured to provide side front lighting to the first edge detector 211, and the fourth lighting assembly 222 is configured to provide side front lighting to the second edge detector 212. The lighting system 22 is configured to control at least one of the third lighting assembly 221 and the fourth lighting assembly 222 to provide illumination to the preset detection area upon triggering of the first control signal.

Or taking the first side inspection detector 211 as an example, when only the third illumination assembly 221 illuminates, a dark field image of a preset inspection area is acquired; when the second illumination assembly 214 and the third illumination assembly 221 are illuminated simultaneously, an opposite-radiation dark field composite field image of a preset detection area is acquired; when the first illumination assembly 213, the second illumination assembly 214 and the third illumination assembly 221 are illuminated simultaneously, a reflection and contrast dark field composite field image of a preset detection area is acquired.

Therefore, a plurality of illumination modes can be formed through combined illumination of the first illumination assembly, the second illumination assembly, the third illumination assembly and the fourth illumination assembly, the edge detection system is correspondingly provided with a plurality of acquisition modes, and a multi-camera multi-illumination-mode imaging system is formed, so that macroscopic defects of the edge of a wafer can form images corresponding to the plurality of acquisition modes (imaging modes), and more accurate defect detection can be performed.

Meanwhile, the edge detection equipment 2 can be built at the corresponding position of the calibration device 13 of the front section module of the equipment, and a station for edge detection does not need to be separately built, so that the cost and the volume of the automatic detection device are reduced.

Example three:

as described in the second embodiment, how to better acquire the image of the region to be detected directly affects the accuracy of the automatic detection. For the surface detection of the object 10 to be detected, the imaging quality or diversity can be improved to improve the detection accuracy.

As shown in fig. 1 and 4, the surface inspection apparatus 3 provided in this embodiment may include an imaging background system 31, an area inspection detection system 32, and a movement mechanism 33.

Wherein the imaging background system 31 is configured to provide a background image of a preset color, the preset color comprising at least one color.

The area detection system 32 is configured to acquire a detection image of the background image reflected off the surface. The background image needs to completely cover the surface of the object 10 to be measured, so that the whole detection image of the background image reflected by the surface presents one color.

The surface inspection device 3 may also include a processing terminal configured to detect macro-defects in the image based on the image acquired by the edge detection system 21. The processing terminal can adopt any existing detection algorithm for detection.

The movement mechanism 33 is configured to adjust the surface of the object 10 to be measured to a preset angle, which includes at least one angle.

The object 10 to be measured, which is calibrated by the calibration device 13, may have a determined angle and position on the calibration device 13, and the robot device 12 is further configured to transfer the object 10 to be measured, which is located on the calibration device 13, onto the movement mechanism 33 in a preset posture.

When the surface of the object 10 to be measured is a mirror surface or a mirror-like surface, and the camera is disposed above the surface, the camera may collect a reflection image of the camera itself to form interference, so that when the surface is detected, a certain included angle is formed between the camera and a normal line of the surface of the object 10 to be measured. Defect detection is performed by acquiring a detection image of the imaging background system 31 reflected by the surface.

In combination with practical applications, the macroscopic defects of different types on the surface of the object 10 to be detected form the most obvious images under different light rays and at different angles, and therefore, the detection image formed by only one background image and one background image cannot be adopted when the macroscopic defects of different types are collected, and the defects are not completely shot clearly or completely, so that the detection accuracy is not high.

In this embodiment, the area inspection system 32 may include at least one area inspection detector 321, and each area inspection detector 321 is disposed at a predetermined angle.

For example, as shown in fig. 4, the area inspection detecting system 32 may include four area inspection detectors 321, the corresponding background images include four colors, each area inspection detector 321 is correspondingly set at a fixed angle, the moving mechanism 33 rotates the surface of the object 10 to be measured to a preset angle, then the imaging background system 31 provides background images of the preset colors, and each area inspection detector 321 obtains an image that most highlights the corresponding defect. Therefore, multi-camera multi-spectrum and multi-angle macroscopic defect detection can be realized, and the detection accuracy of macroscopic defect detection is improved.

Or, the area detection system 32 may further include an area detection detector 321 and a camera motion system configured to move the area detection detector 321 to a plurality of preset shooting positions, where one preset shooting position corresponds to one preset angle.

For example, the camera motion system may drive the planar detector 321 to perform circular motion with the central point of the object 10 to be detected, may drive the planar detector 321 to any shooting position within a range of-90 ° to 90 °, and when a preset type of defect needs to be detected, drives the planar detector 321 to move to the corresponding preset shooting position.

The optical axis angle of the camera and the angle of the surface of the object 10 to be measured can be adjusted through experiments corresponding to different types of macroscopic defects of different objects 10 to be measured, and images acquired by the camera in real time can be displayed through a display so as to determine a background image with the most appropriate color corresponding to one type of defects and an optimal imaging angle. And acquiring the corresponding defect image at the corresponding preset angle during batch testing.

In practical applications, the imaging background system 31 includes a multispectral surface light source, or includes a multispectral surface light source and a black background component, wherein the multispectral surface light source is configured to provide a non-black background image; the black background component is configured to provide a black background image and the multi-spectral area light source is further configured to provide an ambient light source.

For example, the preset angle may be 0 ° to 90 °, and/or the preset color may include at least one of black, white, green, blue, and yellow.

Example four:

in practical applications, an operator places a wafer to be detected on the loading device 11 of the front end module of the apparatus, starts a relevant detection button, and the manipulator device 12 loads the wafer and transmits the wafer to the calibration device 13.

The alignment device 13 aligns the wafer, determines the center of the wafer and the direction of the V-groove, and determines the position or posture of the wafer. The detection of macroscopic defects of the edges is then carried out on the calibration device 13.

When the macro defect of the edge is detected, the rotation system of the calibration device 13 will rotate at a constant speed, and the edge detection system 21 starts to detect the edge of the wafer.

Specifically, the first edge inspection detector 211 and/or the second edge inspection detector 212 start to detect a preset detection area, and shoot all edges of the wafer under the rotation of the rotation system, so that the detection under one illumination mode is completed, the illumination modes of the four illumination assemblies are controlled, and edge images under multiple illumination modes are acquired. And then the processing terminal detects and identifies defects according to the images of the edges.

After the edge detection is completed, the robot device 12 transmits the wafer to the moving mechanism 33 of the surface detection device in a preset posture, the moving mechanism 33 clamps the wafer, and then sequentially rotates the wafer to a preset angle. The imaging background system 31 provides a background image with a corresponding preset color, and the area detection system 32 acquires a detection image corresponding to each preset angle. After the front surface of the wafer is inspected, the moving mechanism 33 turns the wafer and performs the back surface inspection by the same method as the front surface.

Therefore, the automatic detection device provided by the application can be used for comprehensively acquiring images of the front side, the back side and the edge of the wafer, detecting and classifying the macro defects, and improving the efficiency and the detectable rate of the wafer macro defect detection.

Although the above embodiments all use the object 10 as a wafer for illustration, the application of the automatic inspection apparatus provided in the present application to other objects 10 to be inspected is not limited, and the object to be inspected, such as glass, metal plate, etc., which needs to be inspected for macroscopic defects on the surface or edge, can be applied.

It is right to have used specific individual example above the utility model discloses expound, only be used for helping to understand the utility model discloses, not be used for the restriction the utility model discloses. To the technical field of the utility model technical personnel, the foundation the utility model discloses an idea can also be made a plurality of simple deductions, warp or replacement.

Claims

1. An automatic detection device is characterized by comprising a transmission device (1), an edge detection device (2) and a surface detection device (3);

the transfer device (1) comprises a loading device (11), a manipulator device (12) and a calibration device (13), the loading device (11) is configured to hold an object to be measured (10), the manipulator device (12) is configured to transfer the object to be measured (10) to the calibration device (13), the calibration device (13) is configured to determine the position of the object to be measured (10);

the edge detection device (2) is configured to detect a first preset feature of an edge of the object to be measured (10) located on the calibration apparatus (13);

the manipulator device (12) is also configured to transfer the object to be measured (10) located on the calibration device (13) to the surface detection apparatus (3) in a preset attitude;

the surface detection device (3) is configured to detect a second preset feature of the surface of the object to be measured (10).

2. The automatic detection device according to claim 1, characterized in that the calibration device (13) further comprises a rotation system configured to drive the object to be measured (10) in rotation along a preset axis; the rotating system is also configured to detect the rotating speed of the object to be detected (10), and output a first control signal under the condition that the rotating speed of the object to be detected (10) is uniform;

the edge detection device (2) comprises an edge detection system (21);

the edge detection system (21) is configured to acquire an image of the edge of the object to be detected (10) in a preset detection area under the trigger of the first control signal; in the rotating process of the object to be detected (10), part or all of the edge of the object to be detected (10) passes through the preset detection area of the edge detection equipment (2).

3. The automatic detection device according to claim 2, wherein the edge detection system (21) comprises a first edge detector (211) and/or a second edge detector (212), the optical axis of the first edge detector (211) and the optical axis of the second edge detector (212) being located on the same straight line;

the first edge inspection detector (211) is provided with an inner illumination coaxial lens, and the second edge inspection detector (212) is provided with an inner illumination coaxial lens; the side inspection detection system (21) further comprises a first illumination assembly (213) arranged on the inner illumination coaxial lens of the first side inspection detector (211); and a second illumination assembly (214) disposed on an inner illumination coaxial lens of the second edge detector (212);

the edge detection system (21) is configured to control at least one of the first illumination assembly (213) and the second illumination assembly (214) to illuminate and acquire an image of the edge of the object to be detected (10) in the preset detection area under the trigger of the first control signal.

4. The automatic detection apparatus according to claim 3, wherein the edge detection device (2) further comprises an illumination system (22), the illumination system (22) being arranged at a side of the edge detection system (21), the illumination system (22) being configured to provide illumination of at least one direction to the preset detection area upon triggering of the first control signal.

5. The automatic detection apparatus of claim 4, wherein the illumination system (22) comprises a third illumination assembly (221) and a fourth illumination assembly (222), the third illumination assembly (221) being located to the side of the first edge detector (211), the fourth illumination assembly (222) being located to the side of the second edge detector (212), the third illumination assembly (221) being configured to provide side front illumination to the first edge detector (211), the fourth illumination assembly (222) being configured to provide side front illumination to the second edge detector (212);

the lighting system (22) is configured to control at least one of the third lighting assembly (221) and a fourth lighting assembly (222) to provide lighting to the preset detection area upon triggering of the first control signal.

6. The automatic detection device according to claim 5, wherein the object (10) to be detected is a wafer, and the transmission equipment (1) is an equipment front-end module;

the rotation system of the calibration device (13) is further configured to drive the wafer to rotate along a central axis of the wafer; the calibration device (13) is further configured to detect a rotation speed of the wafer, and output the first control signal when the rotation speed of the wafer is a uniform speed.

7. The automatic detection apparatus according to any one of claims 1 to 6, characterized in that the surface detection device (3) comprises an imaging background system (31), a surface detection system (32) and a movement mechanism (33);

the imaging background system (31) is configured to provide a background image of a preset color, the preset color comprising at least one color;

the area detection system (32) is configured to acquire a detection image of the background image reflected by the surface;

the movement mechanism (33) is configured to adjust the surface of the object to be measured (10) to a preset angle, the preset angle comprising at least one angle;

the manipulator device (12) is also configured to transfer the object (10) to be measured on the calibration device (13) onto the movement mechanism (33) in a preset attitude.

8. The automatic detection device according to claim 7, characterized in that the area detection system (32) comprises at least one area detector (321), each of the area detectors (321) being arranged in correspondence with one of the preset angles;

or, the area detection system (32) comprises an area detection detector (321) and a camera motion system, wherein the camera motion system is configured to move the area detection detector (321) to a plurality of preset shooting positions, and one preset shooting position corresponds to one preset angle.

9. The automatic detection apparatus of claim 7, wherein the imaging context system (31) comprises a multispectral surface light source, or comprises a multispectral surface light source and a black context component, wherein the multispectral surface light source is configured to provide a non-black context image;

the black background component is configured to provide a black background image, and the multi-spectral area light source is further configured to provide an ambient light source.

10. The automatic detection device according to claim 7, wherein the preset angle is 0 ° to 90 ° and/or the preset color comprises at least one of black, white, green, blue and yellow.