CN217143496U - Polishing device for silicon wafer - Google Patents

Abstract

The utility model discloses a burnishing device for silicon chip, include: a machine platform; the wax applying module drops wax on the surface of the polishing disc, so that a wax layer is formed on the surface of the polishing disc and is divided into a plurality of detection areas; the system comprises a plurality of image acquisition modules, a plurality of detection modules and a plurality of image processing modules, wherein the image acquisition modules acquire surface image information of a plurality of detection areas in a one-to-one correspondence manner; the image analysis module is electrically connected between the image acquisition modules and the image analysis module so as to transmit the acquired surface image information of the detection areas to the image analysis module, the image analysis module comprehensively analyzes and processes the surface image information of the detection areas, and if the flatness of the detection areas of the wax layer reaches the standard, the silicon wafer is attached to the wax layer for polishing. According to the utility model discloses a burnishing device for silicon chip is applicable to the roughness of the great wax layer of size and detects, is favorable to improving the yields of silicon chip polishing.

Description

Polishing device for silicon wafer

Technical Field

The utility model belongs to the technical field of burnishing device and specifically relates to a burnishing device for silicon chip is related to.

Background

Generally, in the process of applying wax, the surface appearance of the wax layer is only checked by manual visual inspection, however, the manual inspection result is unreliable, and the inspection is easy to miss, and the product yield is reduced. In the polishing device for silicon wafers in the related art, although the image acquisition module is provided to detect the wax layer, the wax layer with a large size is difficult to detect, the reliability is still poor, and the technical problem of easy omission is still existed, so how to improve the detection precision of the wax layer with a large size is a technical problem that needs to be solved urgently by the technical personnel in the field.

SUMMERY OF THE UTILITY MODEL

The utility model discloses aim at solving one of the technical problem that exists among the prior art at least. Therefore, the utility model provides a burnishing device for silicon chip lies in providing, is applicable to the roughness of the great wax layer of size and detects, and it is high to detect the precision, is favorable to improving the yields of silicon chip polishing.

According to the utility model discloses a burnishing device for silicon chip, include: a machine platform; the wax applying module and the polishing disc are arranged on the machine table, wax is dripped on the surface of the polishing disc through the wax applying module, so that a wax layer is formed on the surface of the polishing disc, and the wax layer is divided into a plurality of detection areas; the image acquisition modules are arranged at intervals in the circumferential direction of the wax layer and acquire surface image information of the detection areas in a one-to-one correspondence manner; the image analysis module is electrically connected with the image acquisition module to transmit acquired surface image information of a plurality of detection areas to the image analysis module, the image analysis module comprehensively analyzes and processes the surface image information of the detection areas and judges whether the flatness of the surface of the wax layer reaches the standard, and if the flatness of the detection areas of the wax layer reaches the standard, the silicon wafer is attached to the wax layer for polishing.

According to the utility model discloses a burnishing device for silicon chip, through making a plurality of image acquisition module one-to-ones gather a plurality of detection area's surface image information, be favorable to reducing every image acquisition module's angle of vision, guarantee every image acquisition module's resolution ratio, be applicable to the roughness of the great wax layer of size and detect, it is high to detect the precision, is favorable to improving the yields of silicon chip polishing.

In some embodiments of the present invention, the wax layer has two detection areas, and the image capturing module has two image capturing modules and two detection areas, one to one corresponding to each other.

In some embodiments of the present invention, each of the image capturing modules comprises: the mounting box comprises a box body and an opening and closing door, wherein an opening is formed in one end of the box body, and the opening and closing door is movably arranged at the opening position of the box body to open or close the opening; the camera is arranged in the box body and electrically connected with the image analysis module, converts the received optical signals into electric signals and transmits the electric signals to the image analysis module.

In some embodiments of the present invention, the switch door is rotatably connected to the box body.

In some embodiments of the present invention, the box body is provided with a pivot hole, and the switch door is provided with a pivot shaft adapted to be in running fit with the pivot hole.

In some embodiments of the present invention, each of the image capturing modules further comprises: the driving motor comprises a motor main body and a motor shaft, the motor main body is connected with the box body and is positioned outside the box body, and the motor shaft is connected with the pivot shaft to drive the switch door to rotate.

In some embodiments of the present invention, each of the image capturing modules further comprises: the light source is arranged in the box body, and when the opening is opened by the opening and closing door, light rays emitted by the light source are suitable for being incident to the surface of the wax layer.

In some embodiments of the present invention, the image analysis module comprises: an image receiving unit for receiving image information from a plurality of the image acquisition modules; an image processing unit for processing image information of a plurality of the detection areas; and an analysis determination unit configured to compare the processed image information of the plurality of detection regions with a set threshold value.

In some embodiments of the present invention, the polishing apparatus further comprises: the wax removing device is arranged on the machine table and electrically connected with the image analysis module, the wax removing device is used for removing the wax layer from the surface of the polishing disc, and when the image analysis module judges that the flatness of the surface of any one of the detection areas does not reach the standard, the wax removing device is started to remove the wax layer from the surface of the polishing disc.

In some embodiments of the present invention, the polishing apparatus further comprises: the protection casing, the protection casing cover is located the board, the protection casing with inject workspace between the board, apply wax the module, the polishing dish, the image acquisition module, the image analysis module and the dewaxing device all is located workspace.

Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

Drawings

FIG. 1 is a schematic view of a polishing apparatus for silicon wafers with a protective cover removed, according to some embodiments of the present invention;

fig. 2 is a schematic diagram of the operation of an image acquisition module and an image analysis module according to some embodiments of the present invention;

fig. 3 is a schematic structural diagram of an image acquisition module according to some embodiments of the present invention;

fig. 4 is a schematic structural view of a protective cover according to some embodiments of the present invention;

fig. 5 is an operational schematic diagram of a polishing apparatus for silicon wafers according to some embodiments of the present invention.

Reference numerals:

a polishing apparatus 100;

a machine table 10;

a waxing module 20;

a polishing disk 30; a wax layer 301; a detection area 302;

an image acquisition module 40;

a mounting box 41; a case 411; opening and closing the door 412; a pivot shaft 4121; an open opening 413;

a camera 42; a light source 43; a drive motor 44; an adjustment lever 45;

an image analysis module 50;

a dewaxing device 60;

a shield 70.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present invention, and should not be construed as limiting the present invention.

The following disclosure provides many different embodiments, or examples, for implementing different features of the invention. In order to simplify the disclosure of the present invention, the components and arrangements of specific examples are described below. Of course, they are merely examples and are not intended to limit the present invention. Furthermore, the present invention may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, the present disclosure provides examples of various specific processes and materials, but one of ordinary skill in the art may recognize the applicability of other processes and/or the use of other materials.

A polishing apparatus 100 for a silicon wafer according to an embodiment of the present invention is described below with reference to fig. 1 to 5.

Referring to fig. 1, a polishing apparatus 100 for a silicon wafer according to an embodiment of the present invention may include: a machine station 10, a wax application module 20, a polishing disc 30, a plurality of image acquisition modules 40, and an image analysis module 50.

Referring to fig. 1, a wax applying module 20 and a polishing disc 30 are both disposed on a machine station 10, and wax is dropped on the surface of the polishing disc 30 by the wax applying module 20, so that a wax layer 301 is formed on the surface of the polishing disc 30, specifically, during the wax applying process, the wax applying module 20 drops the wax on the surface of the polishing disc 30, and a driving module in the machine station 10 drives the polishing disc 30 to rotate, so that the wax layer 301 is formed on the surface of the polishing disc 30.

Referring to fig. 1 and 2, the wax layer 301 is divided into a plurality of detection regions 302, the plurality of image capturing modules 40 are arranged at intervals in the circumferential direction of the wax layer 301, and the plurality of image capturing modules 40 capture surface image information of the plurality of detection regions 302 in a one-to-one correspondence manner, it should be noted that the plurality of detection regions 302 on the wax layer 301 are artificially divided, and the number of the detection regions 302 is equal to that of the image capturing modules 40 and corresponds to that of the detection regions 302.

It can be understood that, by enabling the plurality of image acquisition modules 40 to acquire the surface image information of the plurality of detection areas 302 in a one-to-one correspondence manner, the field angle of each image acquisition module 40 is reduced, the resolution of each image acquisition module 40 is ensured, and the method is suitable for flatness detection of the wax layer 301 with a large size and has high detection precision.

Referring to fig. 1 and 2, the image acquisition modules 40 and the image analysis module 50 are electrically connected to transmit the acquired surface image information of the detection areas 302 to the image analysis module 50, wherein the image acquisition modules 40 and the image analysis module 50 are electrically connected in a wired or wireless manner, the image analysis module 50 performs comprehensive analysis on the surface image information of the detection areas 302 and determines whether the flatness of the surface of the wax layer 301 reaches the standard, and if the flatness of the detection areas 302 of the wax layer 301 reaches the standard, the silicon wafer is attached to the wax layer 301 for polishing.

Specifically, referring to fig. 5, before polishing a silicon wafer, a wax layer 301 may be formed by applying wax on the surface of a polishing pad 30 through a wax applying module 20, and then surface image information of a plurality of detection areas 302 is acquired in a one-to-one correspondence manner through a plurality of image acquisition modules 40, the plurality of image acquisition modules 40 transmit the acquired image information to an image analysis module 50, and the image analysis module 50 processes, analyzes and compares the surface image information of the plurality of detection areas 302. For example, when the acquired surface image information of the plurality of detection regions 302 is compared with a set threshold, where the threshold may be a specific set range of gray scale values, if the surface image information of any one detection region 302 exceeds the threshold range, it is determined that the flatness of the surface of the wax layer 301 does not meet the standard, and if the surface image information of all the detection regions 302 exceeds the threshold range, it is determined that the flatness of the surface of the wax layer 301 meets the standard.

Wherein, if it is up to standard to judge the surface roughness of wax layer 301, then can attach the silicon chip on the surface of wax layer 301, for example can snatch the silicon chip and place on the surface of wax layer 301 through the manipulator to carry out subsequent polishing operation, wherein can heat wax layer 301 for wax layer 301 has certain viscidity, thereby can be through wax layer 301 self with the silicon chip adhesion on wax layer 301. If the flatness of the surface of the wax layer 301 is determined not to be up to standard, the wax layer 301 needs to be removed, and the wax layer 301 needs to be coated again until the flatness of the surface of the wax layer 301 is up to standard.

In view of this, according to the utility model discloses a burnishing device 100 for silicon chip, through making a plurality of image acquisition modules 40 gather the surface image information of a plurality of detection area 302 one-to-one, be favorable to reducing the angle of view of every image acquisition module 40, guarantee the resolution ratio of every image acquisition module 40, be applicable to the roughness detection of the great wax layer 301 of size, detect the precision height, be favorable to improving the yields of silicon chip polishing.

In some embodiments of the present invention, referring to fig. 2, the wax layer 301 has two detection areas 302, the number of the image capturing modules 40 is two, and the two image capturing modules 40 are disposed in one-to-one correspondence with the two detection areas 302. It can be understood that the number of the image acquisition modules 40 is two, which is beneficial to improving the accuracy of image acquisition, and meanwhile, the number of the image acquisition modules 40 is not too much, which is convenient for the arrangement of the image acquisition modules 40 on the machine table 10, and is beneficial to reducing the cost.

In some embodiments of the present invention, as shown with reference to fig. 1 and 3, each image capture module 40 includes: the mounting box 41 and the camera 42 are installed, the mounting box 41 includes a box body 411 and a switch door 412, one end of the box body 411 is provided with an open opening 413, the switch door 412 is movably arranged at the open position of the box body 411 to open or close the open opening 413, the camera 42 is arranged in the box body 411, the camera 42 is used for collecting surface image information of the corresponding detection area 302, and the camera 42 is electrically connected with the image analysis module, converts a received optical signal into an electrical signal and transmits the electrical signal to the image analysis module 50.

It can be understood that, when the surface image information of the wax layer 301 needs to be acquired, the switch door 412 of each image acquisition module 40 is opened, and the camera 42 can acquire the surface image information of the corresponding detection area 302 through the open opening 413, without affecting the image acquisition work of the camera 42; when it is necessary to remove the wax layer 301 or recoat the wax layer 301, the opening and closing door 412 closes the opening 413 of the corresponding box 411, so that the camera 42 can be prevented from being contaminated and damaged by the splashed cleaning liquid.

In some embodiments of the present invention, referring to fig. 3, the switch door 412 is rotatably connected to the box 411. It can be understood that the opening and closing door 412 is convenient to open or close the box body 411 by rotatably connecting the opening and closing door 412 with the box body 411, and the operation is convenient.

Specifically, as shown in fig. 3, the box 411 is provided with a pivot hole (not shown), and the switch door 412 is provided with a pivot shaft 4121 adapted to be rotatably engaged with the pivot hole. It can be appreciated that the pivoting shaft 4121 is in cooperation with the pivoting hole to improve the reliability of opening and closing the door 412 or closing the case 411. For example, there are two pivot holes, there are also two pivot shafts 4121, and the two pivot shafts 4121 and the two pivot holes are fitted in one-to-one correspondence.

In some embodiments of the present invention, as shown in fig. 3, each image capture module 40 further includes: the driving motor 44, the driving motor 44 includes a motor body and a motor shaft, the motor body is connected with the box 411 and located outside the box 411, and the motor shaft is connected with the pivot shaft 4121 to drive the switch door 412 to rotate. It can be understood that the driving motor 44 drives the switch door 412 to rotate, which is beneficial to realizing the automatic opening and closing of the switch door 412, improving the automation degree of the polishing device 100 and ensuring the polishing efficiency.

In some embodiments of the present invention, each image capture module 40 further comprises: the light source 43, the light source 43 is arranged in the box body 411, when the opening door 412 is opened and the opening 413 is opened, light emitted by the light source 43 is suitable for being incident to the surface of the wax layer 301. It is understood that when the opening and closing door 412 opens the box 411, the light emitted from the light source 43 is emitted to the surface of the wax layer 301 and reflected by the surface of the wax layer 301, the light reflected by the surface of the wax layer 301 is suitable for being converged to the camera 42, and the camera 42 converts the received light signal into an electrical signal and transmits the electrical signal to the image analysis module 50. From this, through the light source 43 who sets up, can reduce the influence of surrounding environment light to when surrounding environment light is more weak, this light source 43 can also play the effect of light filling, makes the image of gathering more clear, accurate.

Optionally, in some examples, as shown in fig. 3, the image capturing module further includes an adjusting rod 45, the box 411 is connected to the machine platform 10 through the adjusting rod 45, and the adjusting rod 45 includes a plurality of rotatable rod segments, so that the position relationship of the box 411 with respect to the wax layer 301 can be adjusted by adjusting the rotation angle between adjacent rod segments, thereby facilitating the camera 42 to capture a clear image.

In some embodiments of the present invention, referring to fig. 2, image analysis module 50 includes: the image receiving unit is used for receiving the image information from the plurality of image acquisition modules 40, for example, the image receiving unit can have a storage function and can store the received images;

the image processing unit is configured to process image information of the plurality of detection regions 302, for example, the image processing module may remove background information from the image information, retain the enhanced wax layer 301 image information, and perform binarization processing on the wax layer 301 image information, so as to facilitate subsequent analysis, comparison, and determination;

the analysis determination unit is configured to compare the processed image information of the plurality of detection regions 302 with a set threshold value. For example, when the analysis and determination unit compares the collected surface image information with a set threshold, where the threshold may be a specific set range of gray scale values, if the surface image information of any one of the detection regions 302 exceeds the threshold range, it is determined that the flatness of the surface of the wax layer 301 does not meet the standard, and if the surface image information of all the detection regions 302 exceeds the threshold range, it is determined that the flatness of the surface of the wax layer 301 meets the standard.

In some embodiments of the present invention, referring to fig. 1, polishing apparatus 100 further comprises: the dewaxing device 60 is arranged on the machine table 10, the dewaxing device 60 is electrically connected with the image analysis module 50, the dewaxing device 60 is used for removing the wax layer 301 from the surface of the polishing disc 30, and when the image analysis module 50 judges that the flatness of the surface of any one of the detection areas 302 does not reach the standard, the dewaxing device 60 is started to remove the wax layer 301 from the surface of the polishing disc 30. It can be understood that by arranging the dewaxing device 60, when the flatness of the surface of the wax layer 301 is judged not to meet the standard, the unqualified wax layer 301 can be automatically removed. After the wax layer 301 is removed, wax may be applied again on the polishing disc 30 by the wax applying device to form the wax layer 301, and then the image collecting module 40 is used to collect the surface image information of the wax layer 301, and the image analyzing module 50 is used to analyze and determine whether the surface flatness of the wax layer 301 reaches the standard.

In some embodiments of the present invention, as shown in fig. 1 and 4, the polishing apparatus 100 further includes: the protective cover 70 covers the machine table 10, a working space is defined between the protective cover 70 and the machine table 10, and the wax applying module 20, the polishing disc 30, the image acquisition module 40, the image analysis module 50 and the wax removing device 60 are all located in the working space. For example, the shield 70 may be made of a transparent material such as glass. It can be understood that the waxing module 20, the polishing disk 30, the image collecting module 40, the image analyzing module 50 and the dewaxing device 60 are all arranged in the working space, so that the wax liquid and the cleaning liquid are prevented from splashing out of the machine table 10, and other components are prevented from being polluted and damaged.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like, indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; the connection can be mechanical connection, electrical connection or communication; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In the present application, unless expressly stated or limited otherwise, the first feature may be directly on or directly under the second feature or indirectly via intermediate members. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.

While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims (10)

1. A polishing apparatus for a silicon wafer, comprising:

a machine platform;

the wax applying module and the polishing disc are arranged on the machine table, wax is dripped on the surface of the polishing disc through the wax applying module, so that a wax layer is formed on the surface of the polishing disc, and the wax layer is divided into a plurality of detection areas;

the image acquisition modules are arranged at intervals in the circumferential direction of the wax layer and acquire surface image information of the detection areas in a one-to-one correspondence manner;

the image analysis module is electrically connected with the image acquisition module to transmit acquired surface image information of a plurality of detection areas to the image analysis module, the image analysis module comprehensively analyzes and processes the surface image information of the detection areas and judges whether the flatness of the surface of the wax layer reaches the standard, and if the flatness of the detection areas of the wax layer reaches the standard, the silicon wafer is attached to the wax layer for polishing.

2. The polishing apparatus for silicon wafers as set forth in claim 1, wherein the wax layer has two detection areas, and the number of the image capturing modules is two, and the two image capturing modules are disposed in one-to-one correspondence with the two detection areas.

3. The polishing apparatus for silicon wafers as set forth in claim 1, wherein each of the image pickup modules comprises:

the mounting box comprises a box body and an opening and closing door, wherein an opening is formed in one end of the box body, and the opening and closing door is movably arranged at the opening position of the box body to open or close the opening;

the camera is arranged in the box body and electrically connected with the image analysis module, converts the received optical signals into electric signals and transmits the electric signals to the image analysis module.

4. The silicon wafer polishing apparatus as set forth in claim 3, wherein the opening and closing door is rotatably connected to the case.

5. The silicon wafer polishing apparatus as set forth in claim 4 wherein the box body is provided with a pivot hole, and the switch door is provided with a pivot shaft adapted to be rotatably engaged with the pivot hole.

6. The polishing apparatus for silicon wafers as set forth in claim 5, wherein each of the image pickup modules further comprises:

the driving motor comprises a motor main body and a motor shaft, the motor main body is connected with the box body and is positioned outside the box body, and the motor shaft is connected with the pivot shaft to drive the switch door to rotate.

7. The polishing apparatus for silicon wafers as set forth in claim 3, wherein each of the image pickup modules further comprises:

the light source is arranged in the box body, and when the opening is opened by the opening and closing door, light rays emitted by the light source are suitable for being incident to the surface of the wax layer.

8. The polishing apparatus for silicon wafers as set forth in any one of claims 1 to 7, wherein the image analysis module comprises:

an image receiving unit for receiving image information from a plurality of the image acquisition modules;

an image processing unit for processing image information of a plurality of the detection areas;

and an analysis determination unit configured to compare the processed image information of the plurality of detection regions with a set threshold value.

9. The polishing apparatus for silicon wafers as set forth in any one of claims 1 to 7, further comprising:

the wax removing device is arranged on the machine table and electrically connected with the image analysis module, the wax removing device is used for removing the wax layer from the surface of the polishing disc, and when the image analysis module judges that the flatness of the surface of any one of the detection areas does not reach the standard, the wax removing device is started to remove the wax layer from the surface of the polishing disc.

10. The polishing apparatus for silicon wafers as set forth in claim 9, further comprising:

the protection casing, the protection casing cover is located the board, the protection casing with inject workspace between the board, apply wax the module, the polishing dish, the image acquisition module, the image analysis module and the dewaxing device all is located workspace.

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