CN217122040U - Selective wave soldering tin bead prevention and floating height jig mechanism - Google Patents
Selective wave soldering tin bead prevention and floating height jig mechanism Download PDFInfo
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- CN217122040U CN217122040U CN202220407346.3U CN202220407346U CN217122040U CN 217122040 U CN217122040 U CN 217122040U CN 202220407346 U CN202220407346 U CN 202220407346U CN 217122040 U CN217122040 U CN 217122040U
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Abstract
The utility model discloses a selectivity wave-soldering prevents tin pearl and tool mechanism that rises for the location of component on the circuit board, including upper cover plate, clamp plate and download board, upper cover plate, clamp plate and download board top-down correspond the setting in proper order, the upper cover plate both sides correspond respectively and are provided with the trip, download board upper surface both sides are provided with the positioning seat respectively and correspond the joint with the trip, the clamp plate lower surface corresponds respectively and is provided with briquetting and barricade, the circuit board corresponds to set up in downloading the board upper surface and fixes the component on the circuit board through the briquetting, the bottom of barricade corresponds the setting with downloading the board upper surface. The utility model discloses both can effectively block that the tin pearl splashes and can avoid the part to float high, improve the product yield by a wide margin, visual inspection after the assembly, confirm to weld again after the position is correct, reduce and float high defective rate, reduced the anchor clamps spoilage, save daily tool maintenance cost, easy operation reduces the reliance to skilled operating personnel.
Description
Technical Field
The utility model relates to a selectivity wave-soldering prevents tin pearl and tool mechanism that rises.
Background
Because the product can produce tin pearl and float high problem when carrying out selectivity wave-soldering, and the product has the high reliable security requirement and does not allow the repairment, current selectivity wave-soldering tool can't solve, leads to higher tin pearl and floats high defective rate and customer complaint.
The existing conventional tool is provided with a plurality of movable parts such as stud nuts, springs and the like, is easy to damage in use and is difficult to maintain. In addition, the existing conventional jig has extremely high requirements on the proficiency and the care level of operators, and a new worker is generally difficult to be competent for the station.
SUMMERY OF THE UTILITY MODEL
The utility model provides a main technical problem who solves provides a selectivity wave-soldering prevents tin pearl and floats high tool mechanism, both can effectively block that the tin pearl splashes and can avoid the part to float high, improves the product yield by a wide margin, visual inspection after the assembly confirms to weld again after the position is correct, reduces and floats high defective rate, has reduced structural design, has reduced the anchor clamps spoilage, saves daily tool maintenance cost, and easy operation reduces the reliance to skilled operating personnel.
In order to solve the technical problem, the utility model discloses a technical scheme be: the utility model provides a selectivity wave-soldering prevents tin pearl and tool mechanism that rises for the location of component on the circuit board, including upper cover plate, clamp plate and download board, upper cover plate, clamp plate and download board top-down correspond the setting in proper order, the upper cover plate both sides correspond respectively and are provided with the trip, download board upper surface both sides are provided with the positioning seat respectively and correspond the joint with the trip, the clamp plate lower surface corresponds respectively and is provided with briquetting and barricade, the circuit board corresponds to set up in downloading the board upper surface and fixes the component on the circuit board through the briquetting, the bottom and the download board upper surface of barricade correspond the setting.
In a preferred embodiment of the present invention, the four corners of the lower surface of the upper cover plate are respectively provided with a positioning pin, and the four corners of the upper surface of the lower cover plate are respectively provided with a positioning groove column and a positioning pin in a one-to-one correspondence.
In a preferred embodiment of the present invention, the lower carrier plate is provided with 4 mounting stations, and the pressing plates are provided with 4 mounting stations and are respectively correspondingly disposed on the 4 mounting stations.
In a preferred embodiment of the present invention, the upper cover plate is provided with a plurality of spring posts corresponding to the upper surface of the pressing plate.
In a preferred embodiment of the present invention, a plurality of pressing plate positioning pins are correspondingly disposed on one side of the lower surface of the pressing plate.
In a preferred embodiment of the present invention, the lower carrier plate is correspondingly provided with a plurality of circuit board positioning pins at the mounting station.
In a preferred embodiment of the present invention, the upper cover plate and the pressing plate are further provided with a viewing hole penetrating vertically.
The utility model has the advantages that: the utility model provides a selectivity wave-soldering prevents tin pearl and floats high tool mechanism, both can effectively block that the tin pearl splashes and can avoid the part to float high, improves the product yield by a wide margin, visual inspection after the assembly, confirms to weld again after the position is correct, reduces and floats high defective rate, has reduced structural design, has reduced the anchor clamps spoilage, saves daily tool maintenance cost, and easy operation reduces the reliance to skilled operating personnel.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained without inventive work, wherein:
FIG. 1 is an exploded view of a preferred embodiment of a fixture mechanism for selective wave soldering to prevent solder balls and solder floating;
FIG. 2 is an enlarged partial view of the circuit board alignment pin portion of FIG. 1;
FIG. 3 is a front view of a preferred embodiment of a fixture mechanism for preventing solder balls and solder lifting in selective wave soldering according to the present invention;
fig. 4 is a bottom perspective view of a pressing plate of a preferred embodiment of a fixture mechanism for preventing solder balls and floating height in selective wave soldering.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely below, and it should be apparent that the described embodiments are only some embodiments of the present invention, but not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
Referring to fig. 1 in conjunction with fig. 2-4, an embodiment of the present invention includes:
the utility model provides a selectivity wave-soldering prevents tin pearl and tool mechanism that rises for the location of component on the circuit board, includes upper cover plate 1, clamp plate 2 and download board 3, upper cover plate 1, clamp plate 2 and download board 3 top-down correspond the setting in proper order.
The upper cover plate comprises an upper cover plate body and a lower support plate body, wherein clamping hooks 4 are correspondingly arranged on two sides of the upper cover plate body 1 respectively, and positioning seats 5 are arranged on two sides of the upper surface of the lower support plate body 3 respectively and are clamped with the clamping hooks 4 correspondingly so as to realize stable connection of the upper cover plate body 1 and the lower support plate body 3.
The lower surface of the pressing plate 2 is correspondingly provided with a pressing block 6 and a retaining wall 7 respectively, and the integrated pressing plate 2, the pressing block 6 and the retaining wall 7 can avoid the floating height of elements and can effectively prevent tin balls from splashing. The circuit board is correspondingly arranged on the upper surface of the lower carrier plate 3, and the element is fixed on the circuit board through the pressing block 6, so that the element and the circuit board are stably fixed, and the floating height of the element is avoided. The bottom of the retaining wall 7 is arranged corresponding to the upper surface of the lower loading plate 3 and is used for physically separating the components, and when tin balls are generated in the welding process, the tin balls can be blocked around the welded components and do not splash to other components, so that short circuit of other components is avoided.
Four corners of the lower surface of the upper cover plate 1 are correspondingly provided with positioning pins 8 respectively, and four corners of the upper surface of the lower carrier plate 3 are correspondingly provided with positioning groove columns 9 corresponding to the positioning pins 8 one to one respectively, so that the upper cover plate 1 and the lower carrier plate 3 can be conveniently positioned and installed.
The lower support plate 3 is provided with 4 installation stations, the press plates 2 are provided with 4 press plates and are respectively and correspondingly arranged on the 4 installation stations, 4 groups of operations are simultaneously carried out, and the processing efficiency is improved.
The upper cover plate 1 is provided with a plurality of spring columns 10 which are correspondingly pressed with the upper surface of the pressing plate 2, the pressing plate 2 is elastically pressed through the spring columns 10, and damage to a circuit board and elements is avoided.
And a plurality of press plate positioning pins 11 are correspondingly arranged on one side of the lower surface of the press plate 2, so that the upper part of the circuit board can be conveniently positioned and pressed.
The lower carrier plate 3 is correspondingly provided with a plurality of circuit board positioning pins 12 at the mounting station, so as to conveniently mount the circuit board on the lower carrier plate 3.
Meanwhile, the upper cover plate 1 and the pressing plate 2 are also provided with observation holes 13 which penetrate through from top to bottom, so that visual inspection can be conveniently carried out after assembly, welding can be carried out after the position is confirmed to be correct, and the floating height defective rate is reduced.
To sum up, the utility model provides a selectivity wave-soldering prevents tin pearl and superficial high tool mechanism both can effectively block that the tin pearl splashes and can avoid the part to float high, improves the product yield by a wide margin, visual inspection after the assembly confirms to weld again after the position is correct, reduces and floats high defective rate, has reduced structural design, has reduced the anchor clamps spoilage, saves daily tool maintenance cost, easy operation reduces the reliance to skilled operating personnel.
The above only is the embodiment of the present invention, not limiting the patent scope of the present invention, all of which utilize the equivalent structure or equivalent flow transformation made by the content of the specification of the present invention, or directly or indirectly applied to other related technical fields, all included in the same way in the patent protection scope of the present invention.
Claims (7)
1. The utility model provides a selectivity wave-soldering prevents tin pearl and tool mechanism that rises for the location of component on the circuit board, a serial communication port, including upper cover plate, clamp plate and download board, upper cover plate, clamp plate and download board top-down correspond the setting in proper order, the upper cover plate both sides correspond respectively and are provided with the trip, download board upper surface both sides are provided with the positioning seat respectively and correspond the joint with the trip, the clamp plate lower surface corresponds respectively and is provided with briquetting and barricade, the circuit board corresponds to set up in downloading the board upper surface and fixes the component on the circuit board through the briquetting, the bottom of barricade corresponds the setting with downloading the board upper surface.
2. The fixture mechanism for preventing solder balls and solder bumps in selective wave soldering according to claim 1, wherein positioning pins are correspondingly disposed at four corners of the lower surface of the upper cover plate, and positioning groove posts are correspondingly disposed at four corners of the upper surface of the lower cover plate, respectively, in a one-to-one correspondence with the positioning pins.
3. The fixture mechanism for preventing solder balls and solder bumps in selective wave soldering according to claim 1, wherein 4 mounting stations are disposed on the lower carrier plate, and 4 pressing plates are disposed on the lower carrier plate and respectively disposed on the 4 mounting stations.
4. The fixture mechanism for preventing solder balls and solder bumps of selective wave soldering of claim 3, wherein a plurality of spring posts are disposed on the upper cover plate and press-fit with the upper surface of the pressing plate.
5. The fixture mechanism for preventing tin bead and floating height in selective wave soldering according to claim 4, wherein a plurality of pressure plate positioning pins are correspondingly arranged on one side of the lower surface of the pressure plate.
6. The fixture mechanism for preventing solder balls and solder lifting in selective wave soldering according to claim 3, wherein the lower carrier plate is correspondingly provided with a plurality of circuit board positioning pins at an installation station.
7. The fixture mechanism for preventing solder balls and solder lifting in selective wave soldering of claim 1, wherein the upper cover plate and the pressing plate are further provided with vertically penetrating observation holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220407346.3U CN217122040U (en) | 2022-02-28 | 2022-02-28 | Selective wave soldering tin bead prevention and floating height jig mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220407346.3U CN217122040U (en) | 2022-02-28 | 2022-02-28 | Selective wave soldering tin bead prevention and floating height jig mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217122040U true CN217122040U (en) | 2022-08-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220407346.3U Active CN217122040U (en) | 2022-02-28 | 2022-02-28 | Selective wave soldering tin bead prevention and floating height jig mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217122040U (en) |
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2022
- 2022-02-28 CN CN202220407346.3U patent/CN217122040U/en active Active
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