CN217089443U

CN217089443U - Semiconductor refrigeration ice cream machine with air duct for heat dissipation

Info

Publication number: CN217089443U
Application number: CN202221094527.1U
Authority: CN
Inventors: 刘康; 高俊岭; 张荣杰
Original assignee: Guangdong Fuxin Electronic Technology Co ltd
Current assignee: Guangdong Fuxin Electronic Technology Co ltd
Priority date: 2022-05-09
Filing date: 2022-05-09
Publication date: 2022-08-02
Anticipated expiration: 2032-05-09

Abstract

The utility model relates to an ice cream machine technical field especially relates to a radiating semiconductor refrigeration ice cream machine in wind channel. A semiconductor refrigeration ice cream machine with an air duct for heat dissipation comprises an inner container, an air blowing pipeline, a heat dissipation fan and two refrigeration heat dissipation assemblies symmetrically arranged on two sides of the inner container; the refrigeration heat dissipation assembly comprises a semiconductor refrigeration device and a radiator, wherein the cold end surface of the semiconductor refrigeration device is attached to the outer wall of the inner container, and the hot end surface of the semiconductor refrigeration device is attached to the radiator. Radiating semiconductor refrigeration ice-cream machine in wind channel has effectively reduced radiating windage, and the radiating efficiency of promotion realizes high-efficient quick heat dissipation, and the radiating effect is good, effectively increases the power of product, promotes the refrigerating output, has solved current ice-cream machine's heat dissipation windage big, the radiating effect is poor, can't realize high-efficient quick heat dissipation to and the refrigerating output is low, cold volume transmission efficiency hangs down and leads to ice cream preparation time long, influences the problem that user experience feels.

Description

Semiconductor refrigeration ice cream machine with air duct for heat dissipation

Technical Field

The utility model relates to an ice cream machine technical field especially relates to a radiating semiconductor refrigeration ice cream machine in wind channel.

Background

With the rapid development of semiconductor refrigeration technology, the semiconductor refrigeration technology has entered into household electrical appliances in the field of daily life, wherein the semiconductor ice cream machine realizes the application of the semiconductor refrigeration technology. In the prior semiconductor ice cream machine, a semiconductor refrigerating device is attached to one side of a refrigerating inner container, and because the semiconductor refrigerating technology belongs to temperature difference refrigeration, the power of the semiconductor refrigerating device can be further increased only when the temperature of a hot end surface is within a reasonable range, and larger refrigerating capacity is realized. But semiconductor ice-cream machine's unilateral refrigeration structure at present, the refrigerating output is low, though use heat radiation module and refrigeration module to match, but present heat radiation structure makes a radiator fan correspond a radiator usually, set up radiator fan in one side of radiator, make the fan directly blow the radiator, there is great windage in this kind of structure of forcing the heat dissipation, and the drive division at radiator fan middle part not only does not have the wind to blow off, and can play the effect of sheltering from to the heat dissipation, the radiating effect is poor, can't realize high-efficient quick heat dissipation, and because semiconductor refrigeration technology receives ambient temperature's influence greatly, simple increase power has been through unable refrigeration promotion volume, lead to the ice cream to make into the finished time of ice cream from the stoste longer, user's experience has been influenced.

SUMMERY OF THE UTILITY MODEL

Problem to the background art provides, the utility model aims to provide a radiating semiconductor refrigeration ice-cream machine in wind channel has effectively reduced radiating windage, the radiating efficiency of promotion, realize high-efficient quick heat dissipation, the radiating effect is good, effectively increase the power of product, promote the refrigerating output, it is big to have solved current ice-cream machine's heat dissipation windage, the radiating effect is poor, can't realize high-efficient quick heat dissipation, and the refrigerating output is low, cold volume transmission efficiency is low and lead to ice cream preparation time long, influence the problem that user experience felt.

To achieve the purpose, the utility model adopts the following technical proposal:

a semiconductor refrigeration ice cream machine with an air duct for heat dissipation comprises an inner container, an air blowing pipeline, a heat dissipation fan and two refrigeration heat dissipation assemblies symmetrically arranged on two sides of the inner container;

the refrigerating and radiating assembly comprises a semiconductor refrigerating device and a radiator, wherein the cold end surface of the semiconductor refrigerating device is attached to the outer wall of the inner container, and the hot end surface of the semiconductor refrigerating device is attached to the radiator;

the blowing pipeline comprises an air inlet channel, a first air outlet channel and a second air outlet channel, wherein the first air outlet channel and the second air outlet channel are arranged on two sides of the air inlet channel, an air inlet end of the air inlet channel is provided with the cooling fan, two air outlet ends of the air inlet channel are respectively communicated with an air inlet end of the first air outlet channel and an air inlet end of the second air outlet channel, an air outlet end of the first air outlet channel is communicated with one ventilation channel of the radiator, and an air outlet end of the second air outlet channel is communicated with the other ventilation channel of the radiator.

Further, the radiator comprises radiating fins and an air guide cover, the air guide cover is arranged on one side, far away from the inner container, of the radiating fins, and the ventilation channel is formed between the air guide cover and the radiating fins.

Further, the first air outlet channel and the second air outlet channel are symmetrically arranged on two sides of the air inlet channel;

the air inlet duct is provided with a first air inlet, the first air outlet duct is provided with a first air outlet, the second air outlet duct is provided with a second air outlet, the cooling fan is arranged on the outer side wall of the air blowing duct and is arranged corresponding to the first air inlet, the first air outlet is connected with the air inlet end of the ventilation channel of one radiator, and the second air outlet is connected with the air inlet end of the ventilation channel of the other radiator;

the air outlet direction of the first air outlet channel and the air outlet direction of the second air outlet channel are respectively the same as the ventilation direction of the ventilation channel of the radiator.

Further, the blowing duct is U-shaped.

Further, the air conditioner further comprises a shell, the inner container, the air blowing pipeline, the cooling fan and the refrigeration cooling assembly are arranged in the shell, a second air inlet is formed in the position, corresponding to the cooling fan, of the side wall of the shell, and a third air outlet is formed in the position, corresponding to the air outlet end of the ventilation channel, of the side wall of the shell.

Further, the cooling device also comprises cooling devices, wherein the cooling devices are symmetrically arranged on two sides of the inner container, the inner sides of the cooling devices are provided with a bonding curved surface, and the outer sides of the cooling devices are provided with bonding planes;

the laminating curved surface of the cold ware that looses with the outer wall of inner bag is laminated mutually, the laminating plane of cold ware that looses with the cold junction face of semiconductor refrigeration device is laminated mutually.

Further, the heat-insulation cooling device further comprises a heat-insulation gasket, the heat-insulation gasket is arranged between the radiating fins and the air cooler, the heat-insulation gasket is provided with a first installation opening, and the semiconductor refrigeration device is clamped at the first installation opening.

Further, the cooling device comprises an inner barrel, the inner barrel and the air cooler are arranged inside the inner barrel, the refrigeration heat dissipation assembly, the blowing pipeline and the heat dissipation fan are arranged outside the inner barrel, and the inner barrel is arranged inside the shell.

Furthermore, a second mounting through hole is formed in the side wall of the inner barrel corresponding to the refrigeration heat dissipation assembly, mounting concave parts are respectively formed in the two sides of the attaching plane of the cold dissipation device, and the mounting concave parts are arranged towards one side of the attaching curved surface in a concave mode;

the attaching plane penetrates through the second mounting through hole, and the inner barrel is clamped between the mounting concave part and the heat-insulating gasket.

The stirring device further comprises a cover body and a stirring device, wherein the cover body covers the top of the shell;

the lid corresponds inner bag department has seted up the stirring opening, agitating unit covers fits the top of lid, just agitating unit passes insert behind the stirring opening in the inner chamber of inner bag.

Compared with the prior art, the embodiment of the utility model has following beneficial effect:

1. the refrigeration heat dissipation assemblies are arranged and symmetrically arranged on the two sides of the inner container, and the two refrigeration heat dissipation assemblies can transmit the cooling capacity to the inner container from two points, so that the cooling capacity is transmitted to the inner container more quickly, and the refrigeration efficiency is improved; in addition, through further arranging an air blowing pipeline and a heat dissipation fan, combining an air channel structure, two refrigeration heat dissipation assemblies on two sides of the inner container share one heat dissipation fan, and utilizing the characteristics of horn mouth blowing of the axial flow fan, namely, an air passing area of the fan mainly surrounds an annular area around a driving part of the fan, the heat dissipation fan is arranged at an air inlet end of the air inlet channel through air channel design, air blown out by the axial flow fan can quickly enter a first air outlet channel and a second air outlet channel on two sides of the air inlet channel and is blown out to a ventilation channel of a corresponding heat sink from the first air outlet channel and the second air outlet channel, so that heat of the heat sink is taken away, the air resistance of heat dissipation is effectively reduced, the heat dissipation efficiency is improved, efficient and quick heat dissipation is realized, the heat dissipation effect is good, the power of a product is effectively increased, the refrigeration capacity is improved, and the problems of large heat dissipation air resistance, poor heat dissipation effect and the like of the existing ice cream machine are solved, The problems that efficient and rapid heat dissipation cannot be realized, the ice cream making time is long and the user experience is influenced due to low refrigerating capacity and low cold quantity transmission efficiency are solved;

2. by arranging the heat radiating fins and the air guide cover, the air guide cover is enclosed on one side, away from the inner container, of the heat radiating fins, and a ventilation channel is formed between the air guide cover and the heat radiating fins, so that the heat of the corresponding heat radiating fins can be taken away after the air blown out from the first air outlet channel and the second air outlet channel enters the corresponding ventilation channels, the dissipation of cold air can be avoided, and the heat radiating efficiency is effectively improved;

3. through setting up first air-out duct and second air-out duct symmetry in the both sides of air-inlet duct, first air-out duct and second air-out duct respectively with two radiator one-to-one, the ventilation passageway of a radiator is blown in from first air outlet to the wind that first air-out duct blew out, the ventilation passageway of another radiator is blown in from the second air outlet to the wind that the second air-out duct blew out, because the air-out direction of first air-out duct and the air-out direction of second air-out duct are the same with the ventilation passageway's of radiator ventilation direction respectively, can further reduce the windage, make wind can blow out along the ventilation passageway, effectively improve the radiating effect.

Drawings

Fig. 1 is a schematic view of an explosion structure of a semiconductor refrigeration ice cream machine with an air duct for heat dissipation according to an embodiment of the present invention;

fig. 2 is a schematic view of an explosion structure of a semiconductor refrigeration ice cream machine with heat dissipation in an air duct according to an embodiment of the present invention (with the housing, the cover and the stirring device removed);

fig. 3 is a schematic perspective view of a semiconductor refrigeration ice cream maker with heat dissipation in an air duct according to an embodiment of the present invention;

fig. 4 is an exploded schematic view of an inner container, a cooling heat dissipation assembly, an air blowing pipeline and a heat dissipation fan of the semiconductor cooling ice cream machine with heat dissipation in an air duct according to an embodiment of the present invention;

fig. 5 is an exploded schematic view of an inner container, a cooling and heat dissipating assembly, an air blowing duct and a heat dissipating fan of the semiconductor cooling ice cream machine according to an embodiment of the present invention;

fig. 6 is a schematic view of an installation structure of a refrigeration heat dissipation assembly, a cold dissipator and an inner container of the semiconductor refrigeration ice cream machine with heat dissipation in an air duct according to an embodiment of the present invention;

fig. 7 is an exploded view of a cooling heat dissipation assembly, a heat preservation gasket, and a cooling device of the semiconductor cooling ice cream machine according to an embodiment of the present invention;

in the drawings: the inner container 1, the air blowing pipeline 2, the air inlet duct 21, the first air inlet 211, the first air outlet duct 22, the first air outlet 221, the second air outlet duct 23, the second air outlet 231, the cooling fan 3, the cooling and heat dissipating component 4, the semiconductor cooling device 41, the radiator 42, the ventilation channel 421, the cooling fins 422, the air guide cover 423, the shell 5, the second air inlet 51, the third air outlet 52, the cold dissipating device 6, the attaching curved surface 61, the attaching plane 62, the mounting concave 63, the first mounting hole 631, the heat insulating gasket 7, the first mounting hole 71, the third mounting hole 72, the inner barrel 8, the second mounting hole 81, the second mounting hole 82, the cover 9, the stirring hole 91 and the stirring device 10.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.

In the description of the present invention, it is to be understood that the terms "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships illustrated in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, features defined as "first" and "second" may explicitly or implicitly include one or more of the features for distinguishing between descriptive features, non-sequential, non-trivial and non-trivial.

As shown in fig. 1 to 7, the semiconductor refrigeration ice cream machine with air duct for heat dissipation comprises an inner container 1, an air blowing pipeline 2, a heat dissipation fan 3 and two refrigeration heat dissipation assemblies 4 symmetrically arranged at two sides of the inner container 1;

the refrigeration heat dissipation assembly 4 comprises a semiconductor refrigeration device 41 and a radiator 42, wherein the cold end surface of the semiconductor refrigeration device 41 is attached to the outer wall of the inner container 1, and the hot end surface of the semiconductor refrigeration device 41 is attached to the radiator 42;

the pipeline 2 that blows includes the air inlet duct 21 and set up in the first air-out duct 22 and the second air-out duct 23 of air inlet duct 21 both sides, the air inlet end of air inlet duct 21 is provided with radiator fan 3, two air-out ends of air inlet duct 21 respectively with the air inlet end of first air-out duct 22 with the air inlet end of second air-out duct 23 communicates mutually, the air-out end of first air-out duct 22 with one the ventilation passageway 421 of radiator 42 is linked together, the air-out end of second air-out duct 23 and another the ventilation passageway 421 of radiator 42 is linked together.

The refrigeration heat dissipation assemblies 4 are arranged, the two refrigeration heat dissipation assemblies 4 are symmetrically arranged on two sides of the inner container 1, and the two refrigeration heat dissipation assemblies 4 can transmit the refrigeration capacity to the inner container 1 from two points, so that the transmission of the refrigeration capacity to the inner container 1 is accelerated, and the refrigeration efficiency is improved; in addition, by further arranging the air blowing pipeline 2 and the heat dissipation fan 3 and combining an air channel structure, the two refrigeration heat dissipation assemblies 4 at two sides of the inner container 1 share one heat dissipation fan 3, and by utilizing the characteristics of horn mouth blowing of the axial flow fan, that is, the air passing area of the fan mainly surrounds the annular area at the periphery of the driving part of the fan, the heat dissipation fan 3 is arranged at the air inlet end of the air inlet channel 21 through the air channel design, the air blown out by the heat dissipation fan 3 can quickly enter the first air outlet channel 22 and the second air outlet channel 23 at two sides of the air inlet channel 21 and is blown out to the corresponding ventilation channel 421 of the heat dissipation device 42 from the first air outlet channel 22 and the second air outlet channel 23, so as to take away the heat of the heat dissipation device 42, effectively reduce the air resistance of heat dissipation, improve the heat dissipation efficiency and realize high-efficiency and quick heat dissipation, the heat dissipation effect is good, effectively increases the power of product, promotes the refrigeration capacity, has solved current ice-cream machine's heat dissipation windage big, the radiating effect is poor, can't realize high-efficient quick heat dissipation to and the refrigeration capacity is low, cold volume transmission efficiency is low and lead to ice cream preparation time long, influence the problem that user experience felt.

More specifically, the heat sink 42 includes a heat dissipating fin 422 and an air guiding cover 423, the air guiding cover 423 covers a side of the heat dissipating fin 422 away from the inner container 1, and the ventilation channel 421 is formed between the air guiding cover 423 and the heat dissipating fin 422.

By arranging the heat dissipation fins 422 and the air guide cover 423, the air guide cover 423 covers one side of the heat dissipation fins 422, which is far away from the inner container 1, and the ventilation channel 421 is formed between the air guide cover 423 and the heat dissipation fins 422, so that after air blown out from the first air outlet channel 22 and the second air outlet channel 23 enters the corresponding ventilation channel 421, the heat of the corresponding heat dissipation fins 422 can be taken away, the loss of cold air can be avoided, and the heat dissipation efficiency is effectively improved.

It should be further noted that, when the air guiding cover 423 is covered on the side of the heat dissipating fin 422 far from the inner container 1, a space may be reserved without covering the heat dissipating fin 422, and when the heat sink 42 is installed on the air blowing pipeline 2, a section of the heat dissipating fin 422 without covering the air guiding cover 423 may be inserted into the corresponding first air outlet channel 22 and the second air outlet channel 23, so that the air guiding cover 423 abuts against the corresponding edges of the first air outlet channel 22 and the second air outlet channel 23, thereby ensuring the air tightness of the air channels, avoiding air leakage, and further ensuring the heat dissipating effect.

To be further explained, the first air outlet channel 22 and the second air outlet channel 23 are symmetrically arranged on two sides of the air inlet channel 21;

the air inlet duct 21 is provided with a first air inlet 211, the first air outlet duct 22 is provided with a first air outlet 221, the second air outlet duct 23 is provided with a second air outlet 231, the heat dissipation fan 3 is arranged on the outer side wall of the air blowing duct 2, the heat dissipation fan 3 is arranged corresponding to the first air inlet 211, the first air outlet 221 is connected with an air inlet end of a ventilation channel 421 of one of the heat sinks 42, and the second air outlet 231 is connected with an air inlet end of a ventilation channel 421 of the other heat sink 42;

the air outlet direction of the first air outlet duct 22 and the air outlet direction of the second air outlet duct 23 are respectively the same as the ventilation direction of the ventilation channel 421 of the heat sink 42.

Through with first air-out duct 22 with second air-out duct 23 symmetry set up in the both sides of intake stack 21, first air-out duct 22 with second air-out duct 23 respectively with two radiator 42 one-to-one, the wind that first air-out duct 22 blew out blows in one from first air outlet 221 radiator 42's ventilation passageway 421, the wind that second air-out duct 23 blew out blows in another from second air outlet 231 radiator 42's ventilation passageway 421, because the air-out direction of first air-out duct 22 with the air-out direction of second air-out duct 23 respectively with radiator 42's ventilation direction is the same, can further reduce the windage, make wind energy enough to blow out along ventilation passageway 421, effectively improve the radiating effect.

Preferably, the blowing duct 2 is U-shaped.

Through inciting somebody to action the shape setting of blowing pipeline 2 is the U type, makes the air inlet duct 21 first air-out duct 22 with the junction of air inlet duct 21 second air-out duct 23 with the junction of air inlet duct 21 has certain arc shape to make the wind energy of blowing in get into more smoothly first air-out duct 22 with second air-out duct 23 further reduces the windage.

Further, the refrigerator further comprises a housing 5, the inner container 1, the blowing pipeline 2, the cooling fan 3 and the refrigeration heat dissipation assembly 4 are all disposed in the housing 5, a second air inlet 51 is disposed at a position, corresponding to the cooling fan 3, of a side wall of the housing 5, and a third air outlet 52 is disposed at a position, corresponding to an air outlet end of the ventilation channel 421, of the side wall of the housing 5.

Through setting up shell 5, just shell 5 sets up second air intake 51 with third air outlet 52, radiator fan 3 passes through second air intake 51 blows in external cold wind in the shell 5, the cold wind that blows in passes through first air intake 211 gets into in the air inlet duct 21, cold wind along air inlet duct 21 blows in first air outlet duct 22 with second air outlet duct 23, finally blows in the correspondence in the ventilation channel 421, will fin 422's heat is taken away, and from corresponding third air outlet 52 blows out, and the radiating effect is good, and the radiating efficiency is high.

Further, the cooling device further comprises a cooling diffuser 6, wherein the cooling diffuser 6 is symmetrically arranged on two sides of the inner container 1, the inner side of the cooling diffuser 6 is provided with a bonding curved surface 61, and the outer side of the cooling diffuser 6 is provided with a bonding plane 62;

the laminating curved surface 61 of cold ware 6 with the outer wall of inner bag 1 laminates mutually, the laminating plane 62 of cold ware 6 with the laminating of semiconductor refrigeration device 41 mutually.

Through setting up the cold ware 6 looses, semiconductor refrigeration device 41 can pass through the laminating of cold ware 6 that looses set up in the outer wall of inner bag 1, the cold ware 6 that looses can with the cold volume of semiconductor refrigeration device 41 is passed to fast the inner bag 1, and because the laminating curved surface 61 of cold ware 6 that looses with the outer wall of inner bag 1 laminates mutually, can effectively increase scattered cold ware 6 with the laminating area of inner bag 1 improves cold volume transmission efficiency to further promote refrigeration effect, guarantee that ice-cream machine can realize the rapid prototyping of ice cream preparation.

Further, the refrigerator further comprises a heat insulation gasket 7, the heat insulation gasket 7 is arranged between the radiating fins 422 and the cold radiator 6, the heat insulation gasket 7 is provided with a first installation opening 71, and the semiconductor refrigeration device 41 is clamped in the first installation opening 71.

Specifically, the heat-insulating gasket 7 is made of sponge, and by arranging the heat-insulating gasket 7, the semiconductor refrigeration device 41 is installed and fixed, and can play a role in heat insulation, so that the loss of cold energy of the semiconductor refrigeration device 41 is avoided, the heat emitted by the radiator 42 is prevented from influencing the semiconductor refrigeration device 41, the refrigeration effect of the semiconductor refrigeration device 41 is ensured, and the forming efficiency of the ice cream machine for making ice cream is further ensured.

Further, the refrigerator further comprises an inner barrel 8, the inner barrel 1 and the air cooler 6 are arranged inside the inner barrel 8, the refrigeration heat dissipation assembly 4, the blowing pipeline 2 and the heat dissipation fan 3 are arranged outside the inner barrel 8, and the inner barrel 8 is arranged inside the shell 5.

By arranging the inner barrel 8, because the inner barrel 1 and the cold radiator 6 are arranged inside the inner barrel 8, the refrigeration heat dissipation assembly 4, the blowing pipeline 2 and the heat dissipation fan 3 are all arranged outside the inner barrel 8, the inner barrel 8 can separate the inner barrel 1 from the refrigeration heat dissipation assembly 4, the blowing pipeline 2 and the heat dissipation fan 3, and the heat dissipated by the radiator 42 or the heat generated by other components such as the heat dissipation fan 3 during operation is prevented from influencing the cold conduction of the cold radiator 6, thereby ensuring the refrigeration effect.

Specifically, a second mounting through hole 81 is formed in the side wall of the inner barrel 8 corresponding to the refrigeration heat dissipation assembly 4, mounting concave portions 63 are respectively formed in the two sides of the attachment plane 62 of the cold diffuser 6, and the mounting concave portions 63 are recessed toward one side of the attachment curved surface 61;

the attaching plane 62 is inserted into the second mounting through hole 81, and the inner barrel 8 is interposed between the mounting concave portion 63 and the heat insulating spacer 7.

Specifically, the attachment plane 62 of the cold diffuser 6 penetrates into the second mounting hole 81, the attachment plane 62 of the cold diffuser 6 is flush with the outer wall of the inner barrel 8, the outer wall of the inner barrel 8 is attached to the heat insulating gasket 7, the inner wall of the inner barrel 8 is attached to the mounting recess 63, specifically, a first mounting hole 631 may be disposed in the mounting recess 63, second mounting holes 82 may be disposed on both sides of the second mounting hole 81 of the inner barrel 8, third mounting holes 72 may be disposed on both sides of the first mounting hole 71 of the heat insulating gasket 7, and fasteners such as screws sequentially pass through the first mounting hole 631, the second mounting hole 82, and the third mounting holes 72, so that the inner barrel 8, the heat insulating gasket 7, and the cold diffuser 6 are mounted.

Furthermore, a thermal insulation material such as foam can be filled between the inner container 1 and the inner barrel 8, so that the thermal insulation effect on the inner container 1 can be further improved, and the forming efficiency of the ice cream machine for making ice cream can be further ensured.

Further, the stirring device comprises a cover body 9 and a stirring device 10, wherein the cover body 9 covers the top of the shell 5;

the lid 9 corresponds the inner bag 1 department has seted up stirring through hole 91, agitating unit 10 lid fits the top of lid 9, just agitating unit 10 passes insert behind the stirring through hole 91 in the inner chamber of inner bag 1.

By arranging the cover body 9, the cover body 9 covers the housing 5, so that the components such as the inner container 1, the blowing pipeline 2, the cooling fan 3, the refrigerating and cooling assembly 4 and the like are contained and hidden in the housing 5, thereby preventing water vapor, dust and the like in the external environment from entering the interior of the ice cream machine, ensuring the using effect of the ice cream machine, leading the appearance of the ice cream machine to be more beautiful, and in addition, by arranging the stirring device 10, the stirring device 10 passes through the stirring through hole 91 and then is inserted into the inner cavity of the inner container 1, thereby realizing stirring of the materials in the inner cavity of the inner container 1 to realize the production of the ice cream, the stirring device 10 covers the top of the cover body 9, so that the materials in the inner cavity of the inner container 1 can be prevented from splashing in the process of making and stirring the ice cream, and the making effect of the ice cream is ensured.

The technical principle of the present invention is described above with reference to specific embodiments. The description is made for the purpose of illustrating the principles of the invention and should not be construed in any way as limiting the scope of the invention. Based on the explanations herein, those skilled in the art will be able to conceive of other embodiments of the present invention without any inventive effort, which would fall within the scope of the present invention.

Claims

1. A semiconductor refrigeration ice cream machine with an air duct for heat dissipation is characterized by comprising an inner container, an air blowing pipeline, a heat dissipation fan and two refrigeration heat dissipation assemblies, wherein the two refrigeration heat dissipation assemblies are symmetrically arranged on two sides of the inner container;

2. The semiconductor refrigeration ice cream machine with the air duct for heat dissipation according to claim 1, wherein the heat sink comprises heat dissipation fins and an air guide cover, the air guide cover is arranged on one side of the heat dissipation fins, which is far away from the inner container, and the ventilation channel is formed between the air guide cover and the heat dissipation fins.

3. The semiconductor refrigeration ice cream machine with the function of dissipating heat through the air duct according to claim 2, wherein the first air outlet duct and the second air outlet duct are symmetrically arranged on two sides of the air inlet duct;

4. The semiconductor refrigeration ice cream machine with air duct heat dissipation according to claim 3, wherein said air blowing duct is U-shaped.

5. The semiconductor refrigeration ice cream machine with the function of dissipating heat through the air duct according to claim 3, further comprising a housing, wherein the inner container, the blowing duct, the cooling fan and the refrigeration heat dissipation assembly are all disposed in the housing, a second air inlet is disposed at a position, corresponding to the cooling fan, of a side wall of the housing, and a third air outlet is disposed at a position, corresponding to an air outlet end of the ventilation channel, of the side wall of the housing.

6. The semiconductor refrigeration ice cream machine with the air duct for heat dissipation according to claim 5, further comprising air coolers, wherein the air coolers are symmetrically arranged on two sides of the inner container, the inner sides of the air coolers are provided with the attaching curved surfaces, and the outer sides of the air coolers are provided with the attaching planes;

7. The semiconductor refrigeration ice cream machine with air duct heat dissipation according to claim 6, further comprising a heat preservation gasket, wherein the heat preservation gasket is arranged between the heat dissipation fins and the air cooler, the heat preservation gasket is provided with a first installation opening, and the semiconductor refrigeration device is clamped in the first installation opening.

8. The semiconductor refrigeration ice cream machine with air duct heat dissipation according to claim 7, further comprising an inner barrel, wherein the inner container and the air diffuser are both disposed inside the inner barrel, the refrigeration heat dissipation assembly, the blowing duct and the heat dissipation fan are all disposed outside the inner barrel, and the inner barrel is disposed inside the housing.

9. The semiconductor refrigeration ice cream machine with air duct heat dissipation according to claim 8, wherein a second mounting port is provided on a side wall of the inner barrel corresponding to the refrigeration heat dissipation assembly, mounting concave portions are respectively provided on two sides of the attachment plane of the air diffuser, and the mounting concave portions are recessed toward one side of the attachment curved surface;

10. The semiconductor refrigeration ice cream machine with the function of dissipating heat through the air duct according to claim 8, further comprising a cover body and a stirring device, wherein the cover body covers the top of the shell;