CN217088286U - High-speed chip mounter for mobile phone motherboard - Google Patents
High-speed chip mounter for mobile phone motherboard Download PDFInfo
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- CN217088286U CN217088286U CN202220586147.3U CN202220586147U CN217088286U CN 217088286 U CN217088286 U CN 217088286U CN 202220586147 U CN202220586147 U CN 202220586147U CN 217088286 U CN217088286 U CN 217088286U
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- mobile phone
- conveyer belt
- chip mounter
- speed chip
- mounting panel
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Abstract
The utility model discloses a high-speed chip mounter of mobile phone motherboard belongs to mobile phone motherboard processing equipment technical field, including the base to and install in the paster mechanism at base top, two telescopic machanisms are installed to the inboard symmetry of paster mechanism, all install the mounting panel on two telescopic machanisms, and mutual symmetry between two mounting panels, first conveyer belt and second conveyer belt are installed in the front of mounting panel, and the back mounted of mounting panel has the motor that is used for driving the second conveyer belt. The utility model discloses a setting of two telescopic machanisms and mounting panel can be conveniently according to the width adjustment of PCB board, distance between two mounting panels to conveniently cooperate the PCB board of the different width of conveyer belt conveying on the mounting panel, through the setting of mounting panel, first conveyer belt, second conveyer belt and motor, can carry out the centre gripping to the PCB board through first conveyer belt and second conveyer belt, thereby guarantee the stability of PCB board conveying, prevent the PCB board off tracking.
Description
Technical Field
The utility model relates to a chip mounter especially relates to a high-speed chip mounter of mobile phone motherboard, belongs to mobile phone motherboard processing equipment technical field.
Background
The chip mounter, also called a mounter or a surface mounting system, is configured behind a dispensing machine or a screen printer in a production line, and is equipment for accurately placing surface mounting components on a PCB (printed circuit board) pad by moving a mounting head, and the equipment is divided into manual operation and full-automatic operation.
The PCB board of different width can not be adapted to current chip mounter when using, is the condition that the off tracking appears easily at the conveying PCB board moreover, the utility model discloses a new solution is proposed to above problem.
SUMMERY OF THE UTILITY MODEL
The utility model discloses a main objective is in order to solve current chip mounter can not adapt to the PCB board of different width when using, is the condition that the off tracking appears easily at the conveying PCB board moreover, and the high-speed chip mounter of a mobile phone motherboard that provides.
The purpose of the utility model can be achieved by adopting the following technical scheme:
the utility model provides a high-speed chip mounter of mobile phone motherboard, includes the base, and install in the paster mechanism at base top, two telescopic machanism, two are installed to the inboard symmetry of paster mechanism all install the mounting panel on the telescopic machanism, two mutual symmetry between the mounting panel, first conveyer belt and second conveyer belt are installed in the front of mounting panel, the back mounted of mounting panel has and is used for the drive the motor of second conveyer belt.
Preferably, the telescopic mechanism comprises a supporting plate arranged at the top of the base, and a plurality of electric telescopic rods are arranged on the front surface of the supporting plate.
Preferably, the mounting plate comprises a body for attachment to the telescopic mechanism.
Preferably, the two ends of the main body are respectively provided with a first connecting block and a second connecting block, and the first connecting block and the second connecting block are provided with adjusting holes.
Preferably, the first conveyor belt is movably mounted on the front surface of the main body through a first connecting block, a second connecting block, an adjusting hole and a bolt.
Preferably, a protective box positioned outside the patch mechanism is mounted at the top of the base.
Preferably, the protective box is made of transparent materials, and two box doors are arranged on the front side of the protective box.
Preferably, both sides of the protective box are provided with openings, and the mounting plate penetrates through the protective box through the openings.
Preferably, the two box doors are rotatably connected with the protective box through hinges.
Preferably, the first conveyor belt and the second conveyor belt are rotatably mounted on the front surface of the mounting plate.
The utility model has the advantages of: according to the utility model discloses a high-speed chip mounter of mobile phone motherboard, through the setting of two telescopic machanisms and mounting panel, can conveniently be according to the width adjustment of PCB board, distance between two mounting panels to conveniently cooperate the PCB board of the different width of conveyer belt conveying on the mounting panel, through the setting of mounting panel, first conveyer belt, second conveyer belt and motor, can carry out the centre gripping to the PCB board through first conveyer belt and second conveyer belt, thereby guarantee the stability of PCB board conveying, prevent the PCB board off tracking.
Drawings
Fig. 1 is a schematic overall structure diagram of a preferred embodiment according to the present invention;
fig. 2 is a schematic diagram of the internal structure of a preferred embodiment according to the present invention;
fig. 3 is a schematic structural view of a telescopic mechanism according to a preferred embodiment of the present invention;
fig. 4 is a schematic view of a first conveyor belt according to a preferred embodiment of the present invention;
fig. 5 is a schematic view of a mounting plate structure according to a preferred embodiment of the present invention;
fig. 6 is a schematic structural diagram of a point a in fig. 1 according to a preferred embodiment of the present invention.
In the figure: 1. a base; 2. a protective box; 3. a box door; 4. mounting a plate; 5. a bolt; 6. a first conveyor belt; 7. a second conveyor belt; 8. a motor; 9. a patch mechanism; 10. a telescoping mechanism; 101. a support plate; 102. an electric telescopic rod; 401. a main body; 402. a first connection block; 403. a second connecting block; 404. and adjusting the hole.
Detailed Description
In order to make the technical solutions of the present invention clearer and clearer for those skilled in the art, the present invention will be described in further detail with reference to the following embodiments and the accompanying drawings, but the embodiments of the present invention are not limited thereto.
As shown in fig. 1-6, the high-speed chip mounter for a mobile phone motherboard provided in this embodiment includes a base 1 and a chip mounting mechanism 9 mounted on the top of the base 1, two telescopic mechanisms 10 are symmetrically mounted on the inner side of the chip mounting mechanism 9, and mounting plates 4 are mounted on the two telescopic mechanisms 10, so that the distance between the two mounting plates 4 can be conveniently adjusted according to the width of the PCB by setting the two telescopic mechanisms 10 and the mounting plates 4, and thus the PCB with different widths can be conveniently conveyed by matching with a conveyor belt on the mounting plate 4; mutual symmetry between two mounting panels 4, first conveyer belt 6 and second conveyer belt 7 are installed in the front of mounting panel 4, and the back mounted of mounting panel 4 has the motor 8 that is used for driving second conveyer belt 7, through the setting of mounting panel 4, first conveyer belt 6, second conveyer belt 7 and motor 8, can carry out the centre gripping to the PCB board through first conveyer belt 6 and second conveyer belt 7 to guarantee the stability of PCB board conveying, prevent the PCB board off tracking.
In the present embodiment, as shown in fig. 1, fig. 2, fig. 3 and fig. 4, the telescopic mechanism 10 includes a supporting plate 101 installed on the top of the base 1, a plurality of electric telescopic rods 102 are installed on the front surface of the supporting plate 101, the position of the mounting plate 4 can be conveniently adjusted through the arrangement of the electric telescopic rods 102, the protective box 2 located outside the patch mechanism 9 is installed on the top of the base 1, and dust can be effectively prevented through the arrangement of the protective box 2; the protective box 2 is made of transparent materials, the two box doors 3 are arranged on the front side of the protective box 2, openings are formed in the two sides of the protective box 2, the mounting plate 4 penetrates through the protective box 2 through the openings, mechanisms inside the protective box 2 can be conveniently checked and maintained through the arrangement of the box doors 3, and a conveyor belt on the mounting plate 4 can conveniently pass through the openings; two chamber doors 3 all rotate with protective housing 2 through the hinge and are connected, and first conveyer belt 6 and second conveyer belt 7 all rotate to be installed in the front of mounting panel 4, through the setting of hinge, can make things convenient for the installation of chamber door 3.
In this embodiment, as shown in fig. 1, fig. 2, fig. 5 and fig. 6, the mounting plate 4 includes a main body 401 for connecting the telescopic mechanism 10, a first connecting block 402 and a second connecting block 403 are respectively installed at two ends of the main body 401, adjusting holes 404 have been all opened on the first connecting block 402 and the second connecting block 403, the first conveyor belt 6 is movably installed on the front of the main body 401 through the first connecting block 402, the second connecting block 403, the adjusting holes 404 and the bolts 5, and through the setting of the adjusting holes 404 and the bolts 5, the height of the first conveyor belt 6 on the mounting plate 4 can be conveniently adjusted, so that PCB plates with different thicknesses can be conveniently conveyed.
In this embodiment, as shown in fig. 1 to fig. 6, a working process of the high-speed chip mounter for a mobile phone motherboard provided in this embodiment is as follows:
step 1: when the device is used, the distance between the two mounting plates 4 is adjusted through the telescopic mechanism 10 according to the width of the PCB, and then the position of the first conveyor belt 6 is adjusted through the bolt 5 and the adjusting hole 404;
step 2: make first conveyer belt 6 and second conveyer belt 7 can just grasp the PCB board, then starter motor 8 drives second conveyer belt 7 and rotates and to convey the PCB board, when the PCB board conveys under paster mechanism 9, stops the conveying and begins the paster operation.
The above description is only a further embodiment of the present invention, but the scope of protection of the present invention is not limited thereto, and any person skilled in the art can replace or change the technical solution and the concept of the present invention within the scope of the present invention.
Claims (10)
1. The utility model provides a high-speed chip mounter of mobile phone motherboard, its characterized in that, including base (1), and install in paster mechanism (9) at base (1) top, two telescopic machanism (10) are installed to the inboard symmetry of paster mechanism (9), two all install mounting panel (4), two on telescopic machanism (10) mutual symmetry between mounting panel (4), first conveyer belt (6) and second conveyer belt (7) are installed in the front of mounting panel (4), the back mounted of mounting panel (4) has and is used for the drive motor (8) of second conveyer belt (7).
2. The high-speed chip mounter for mobile phone motherboards according to claim 1, wherein the telescopic mechanism (10) comprises a support plate (101) mounted on the top of the base (1), and a plurality of electric telescopic rods (102) are mounted on the front surface of the support plate (101).
3. The high-speed chip mounter for mobile phone motherboards according to claim 1, wherein said mounting plate (4) comprises a main body (401) for connecting said telescoping mechanism (10).
4. The high-speed chip mounter for mobile phone motherboards according to claim 3, wherein a first connecting block (402) and a second connecting block (403) are respectively mounted at two ends of the main body (401), and the first connecting block (402) and the second connecting block (403) are both provided with adjusting holes (404).
5. The high-speed chip mounter for mobile phone motherboards according to claim 4, wherein the first conveyor belt (6) is movably mounted on the front surface of the main body (401) through a first connecting block (402), a second connecting block (403), an adjusting hole (404) and a bolt (5).
6. The high-speed chip mounter for mobile phone motherboards according to claim 1, wherein a protective box (2) located outside the chip mounting mechanism (9) is mounted on the top of the base (1).
7. The high-speed chip mounter for mobile phone motherboards according to claim 6, wherein the protective box (2) is a transparent protective box (2), and two box doors (3) are arranged on the front surface of the protective box (2).
8. The high-speed chip mounter for mobile phone motherboards according to claim 6, wherein openings are formed on both sides of the protective box (2), and the mounting plate (4) penetrates through the protective box (2) through the openings.
9. The high-speed chip mounter for mobile phone motherboards according to claim 7, wherein both of said doors (3) are rotatably connected to said protection box (2) by hinges.
10. The high-speed chip mounter for mobile phone motherboards according to claim 1, wherein the first conveyor belt (6) and the second conveyor belt (7) are rotatably mounted on the front surface of the mounting plate (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220586147.3U CN217088286U (en) | 2022-03-17 | 2022-03-17 | High-speed chip mounter for mobile phone motherboard |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220586147.3U CN217088286U (en) | 2022-03-17 | 2022-03-17 | High-speed chip mounter for mobile phone motherboard |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217088286U true CN217088286U (en) | 2022-07-29 |
Family
ID=82550385
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220586147.3U Active CN217088286U (en) | 2022-03-17 | 2022-03-17 | High-speed chip mounter for mobile phone motherboard |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217088286U (en) |
-
2022
- 2022-03-17 CN CN202220586147.3U patent/CN217088286U/en active Active
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