CN217077841U - Wafer loading and unloading hanger equipment - Google Patents

Abstract

The utility model provides a wafer loading and unloading hanger device, which comprises a main support, a rear cover unloading unit, a hanger clamping unit, a wafer ejection unit, a sealing ring purging mechanism and a visual detection mechanism, wherein the sealing ring purging mechanism is used for generating purging airflow for a sealing ring on a hanger after a wafer on the hanger is ejected; the visual detection mechanism is used for collecting images of the upper sealing ring of the hanger and judging whether foreign matters are left on the sealing ring after the wafer on the hanger is ejected out. Adopt the technical scheme of the utility model, after the electroplating of last wafer was accomplished, before the installation of next wafer, can in time clear up hanger sealing washer foreign matter, ensure that wafer and sealing washer keep good sealing performance, prevent that the wafer piece from taking place and the seepage of plating solution, promote the homogeneity of wafer electroplating coating, improve hanger life.

Description

Wafer loading and unloading hanger equipment

Technical Field

The utility model relates to a wet processing procedure technical field of wafer encapsulation specifically is a wafer loading and unloading hanger equipment.

Background

In the wet process of wafer packaging, the wafer needs to be loaded onto the rack, then the rack is moved into the electroplating solution tank for electroplating, and after the electroplating is completed, the electroplated wafer needs to be unloaded, and then a new wafer needs to be loaded. The phenomenon of coating flaring can occur in the electroplating process, particularly after tin electroplating, tin can spread to the hanger sealing ring, and if cleaning is not found in time, the uniformity of wafer electroplating can be unqualified. The existing hanger cleaning mode is to finish centralized cleaning after a certain number of wafers, accumulation of an external expanded coating can be caused, the cleaning difficulty is increased, wafer fragments are easy to cause, the electroplating effect is poor, and the service life of a hanger is short.

SUMMERY OF THE UTILITY MODEL

In order to overcome the defects of the prior art, the utility model aims to provide a wafer loading and unloading hanger device.

In order to achieve the above object, the technical solution of the present invention is: a wafer handling hanger apparatus comprising:

a main support;

a rear cover dismounting unit for dismounting the locking piece of the rear cover of the hanger and moving the rear cover;

a hanger holding unit for placing and positioning a hanger;

the wafer ejection unit is used for supporting and ejecting the wafer on the hanger;

the sealing ring purging mechanism is used for generating purging airflow for the sealing ring on the hanger after the wafer on the hanger is ejected;

and the visual detection mechanism is used for detecting whether foreign matters are left on the sealing ring after the wafer is ejected out of the hanging tool.

Adopt the technical scheme of the utility model, after the electroplating of last wafer was accomplished, before the installation of next wafer, can in time clear up hanger sealing washer foreign matter, ensure that wafer and sealing washer keep good sealing performance, prevent that the wafer piece from taking place and the seepage of plating solution, promote the homogeneity of wafer electroplating coating, improve hanger life.

Further, the main support comprises a plurality of support columns, a cross beam positioned at the top, a table plate positioned at the middle position and a bottom plate positioned at the bottom; the rear cover dismounting unit is arranged on the top cross beam of the main bracket; the hanger clamping unit is arranged on the table plate; the wafer ejection unit is arranged on the bottom plate and comprises a jacking frame, a first lifting driving mechanism and a rotary driving mechanism, wherein the first lifting driving mechanism is used for driving the jacking frame to move up and down, and the rotary driving mechanism is used for driving the jacking frame to rotate; the sealing ring purging mechanism comprises a purging spray head, a vent pipeline and an airflow generating device, the purging spray head is connected to an air outlet of the airflow generating device through the vent pipeline, and the purging spray head is installed on the jacking frame; the visual detection mechanism comprises an image acquisition camera and an image analysis host, the image acquisition camera is installed on the jacking frame, and after the wafer is ejected out on the hanger, the image of the sealing ring on the hanger is acquired and whether foreign matters are left on the sealing ring is judged.

Before the wafer is installed, a rotary driving mechanism drives a sealing ring purging mechanism to rotate to perform full-circle purging on a sealing ring of a hanger to remove residual foreign matters or a coating, and then a visual detection mechanism collects an image of the sealing ring and judges whether foreign matters are left or not; after the sealing ring is confirmed to have no foreign matter residue, the wafer is conveyed to the top end of the jacking frame of the wafer ejection unit through the manipulator, the first lifting driving mechanism moves downwards, the wafer falls onto the sealing ring in the hanger, and the first lifting driving mechanism continues to drive the jacking frame to move downwards to be separated from the wafer; the rear cover dismounting unit moves downwards, the rear cover of the rack is loaded on the rack and locked, and wafer installation is completed; and finally, moving the hanger from the hanger clamping unit to an electroplating pool for electroplating. And after the wafer is electroplated, moving the wafer back to the hanger clamping unit, detaching the rear cover of the hanger through the rear cover dismounting unit, ejecting the electroplated wafer through the wafer ejection unit, removing the wafer through the manipulator, repeating the steps before the wafer is installed, and performing blowing and visual inspection on the hanger sealing ring.

Further, back lid uninstallation unit includes that backup pad, electricity criticize fixed plate, sucking disc, guiding mechanism, second lift actuating mechanism and a plurality of electricity are criticized, and is a plurality of electricity criticize the circumference and distribute and install on the electricity criticize on the fixed plate, the sucking disc install in electricity criticize fixed plate below, electricity criticize the fixed plate through guiding mechanism liftable install in go up the backup pad below, second lift actuating mechanism drives the electricity criticizes the fixed plate and makes lift travel along guiding mechanism.

By adopting the preferable scheme, the rear cover locking part of the hanger is quickly and synchronously loosened or locked through the multiple electric screwdriver, the rear cover is adsorbed by the sucking disc and lifted by the second lifting driving mechanism, and the automatic disassembly of the rear cover is completed.

And the rear cover unloading units are used for unloading the hanging tools of wafers with different sizes, a first translation driving mechanism is further arranged on the cross beam, and the first translation driving mechanism drives the rear cover unloading units to translate along the cross beam.

By adopting the preferable scheme, the corresponding position change of the rear cover dismounting unit is completed through the first translation driving mechanism according to the size of the wafer, so that the equipment can be simultaneously suitable for hangers of wafers with various sizes.

Furthermore, the visual inspection mechanism comprises a plurality of image acquisition cameras, and the orientation of each image acquisition camera is different from the included angle formed by the horizontal line.

By adopting the preferred scheme, the optimal image acquisition angles of the hanger sealing rings with different wafer sizes are matched through the plurality of image acquisition cameras, so that the universality of the equipment is improved; the multiple image acquisition cameras can be synchronously applied, image acquisition at different angles is carried out on the hanger sealing ring, and foreign matter inspection capability is improved.

Further, a hanger loading station and a wafer loading station are arranged on the table plate, the hanger clamping unit comprises a second translation driving mechanism, a sliding plate, a steering mechanism, a rotating plate, limiting blocks and supporting blocks, the limiting blocks are installed on two sides of the rotating plate, the supporting blocks are installed at one end of the rotating plate and matched with two sides of the hanger, the supporting blocks are matched with the lower end of the hanger, the rotating plate is installed on the sliding plate through the steering mechanism, and the second translation driving mechanism drives the sliding plate to translate between the hanger loading station and the wafer loading station.

By adopting the preferable scheme, the hanger is conveniently loaded in a vertical state at the hanger loading station, the hanger is rotated to a horizontal state through the steering mechanism, and then the hanger is moved to the wafer loading station through the second translation driving mechanism, so that the wafer is conveniently taken and placed. The structure is more compact, and the space configuration is saved.

Further, the device also comprises 3 infrared distance measuring sensors which are distributed in a circumferential array and are positioned at the same level.

By adopting the preferable scheme, whether the wafer is flat or not is judged by detecting the horizontal height of the position of the 3 point on the wafer, so that the wafer is prevented from being crushed when the rear cover is assembled.

Furthermore, the hanging tool comprises a main plate body and a rear cover, wherein an opening is formed in the main plate body, a first sealing ring surrounding the opening is arranged on the main plate body, the edge of the surface to be electroplated of the wafer is attached to the first sealing ring, and a second sealing ring is arranged between the rear cover and the main plate body; an air inlet channel is arranged in the main board body, an air inlet of the air inlet channel is located in a region, which is not contacted with electroplating liquid, of the upper portion of the hanger, and an air outlet of the air inlet channel is communicated to a closed space formed by the first sealing ring and the second sealing ring.

By adopting the preferable scheme, the air inlet channel communicated with the closed space formed by the first sealing ring and the second sealing ring is arranged on the hanger, and after the wafer is installed on the hanger, the tightness between the wafer and the first sealing ring can be detected by means of the air tightness detection equipment, so that the sealing reliability is ensured, the electroplating effect is ensured, and the use safety of the hanger is improved.

Further, still include the air cock of being made by elastic material, the air cock is installed intake channel's air inlet.

Adopt above-mentioned preferred scheme, the elasticity air cock butt joint of gas tightness check out test set and hanger is aerifyd and is tested, can prevent gas leakage, improves the test accuracy.

Further, including first air flue and the second air flue that is linked together in the air cock, first air flue and the internal inlet channel coaxial arrangement of mainboard, the second air flue sets up with mainboard surface vertical.

Adopt above-mentioned preferred scheme, make things convenient for gas tightness check out test set to dock with the hanger from the direction of positive hanger, improve the test convenience.

Furthermore, a conducting strip unit surrounding the opening is arranged on the main board body of the hanger, the conducting strip unit comprises at least 4 arc-shaped conducting strips, the arc-shaped conducting strips are isolated from one another, a plurality of contact pieces are arranged on each arc-shaped conducting strip, and the circumferential edge part of the wafer to be electroplated is in conductive contact with the contact pieces; conductive hooks with the number consistent with that of the arc-shaped conductive strips are arranged in an area, which is not contacted with electroplating solution, on the upper part of the main plate body, and each arc-shaped conductive strip is electrically connected with one conductive hook through a lead.

By adopting the preferable scheme, after the wafer is mounted on the hanger, the conductivity between the wafer and each conductive hook can be detected by means of the conductivity detector, whether the contact piece of each arc-shaped conductive piece is in full contact with the wafer is judged, the conductivity is measured before electroplating, whether the wafer is flatly placed is confirmed, the reliable electric conduction performance is ensured to be kept in the electroplating process, and the wafer electroplating effect is improved.

Further, still include clamp plate, third lift actuating mechanism, gas tightness check out test set and electric conductivity detector, the joint of giving vent to anger of gas tightness check out test set is installed on the clamp plate, the electric conductivity detector includes 4 independent electrically conductive detection return circuits at least, and every electrically conductive detection return circuit includes an anodal contact, and every electrically conductive detection return circuit's negative pole all is connected to the roof of the ejecting unit jacking frame of wafer, anodal contact is all installed on the clamp plate, third lift actuating mechanism drives the clamp plate lift removal for give vent to anger and connect and press in the second gas port mouth of hanger air cock, make every simultaneously anodal contact presses respectively on a conductive hook of hanger.

By adopting the preferable scheme, after the wafer is mounted on the hanger, the conductivity between the wafer and each conductive hook can be detected by means of the conductivity detector, whether the contact piece of each arc-shaped conductive piece is in full contact with the wafer is judged, the conductivity is measured before electroplating, whether the wafer is flatly placed is confirmed, the reliable electric conduction performance is ensured to be kept in the electroplating process, and the wafer electroplating effect is improved.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

FIG. 1 is a schematic structural diagram of an embodiment of the present invention;

FIG. 2 is a front view of an embodiment of the present invention;

FIG. 3 is a schematic structural view of a hanger clamping unit;

FIG. 4 is a schematic view of the hanger;

FIG. 5 is a schematic view of a surface of the hanger;

FIG. 6 is a schematic view of another surface of the hanger;

FIG. 7 is a layout view of a conductive sheet unit;

FIG. 8 is a cross-sectional view of the hanger;

FIG. 9 is an enlarged view of a portion of FIG. 8 at A;

FIG. 10 is a schematic view of a bottom plate top structure;

FIG. 11 is an enlarged view of a portion of FIG. 10 at B;

FIG. 12 is a schematic view of the structure of the air faucet.

Names of corresponding parts represented by numerals and letters in the drawings:

1-a hanging tool; 11-a main board body; 111-a backplane; 112-a top plate; 113-a circular counter bore; 114-bayonet; 115-a limiting groove; 116-a wire guide slot; 12-rear cover; 13-a first sealing ring; 14-a second sealing ring; 15-an intake passage; 16-air tap; 161-a first airway; 162-a second airway; 163-a cylindrical portion; 164-a square body portion; 165-ring body portion; 166-ear; 17-arc-shaped conducting strips; 171-a contact blade; 18-a conductive hook; 2-main support; 21-a support column; 22-a cross beam; 23-a table plate; 24-a base plate; 3-rear cover dismounting unit; 31-an upper support plate; 32-electric screwdriver fixing plate; 33-a suction cup; 34-a guide mechanism; 35-electric batch; 4-a hanger clamping unit; 41-a sliding plate; 42-a steering mechanism; 43-rotating plate; 44-a limiting block; 45-a holding block; 51-a jacking frame; 61-purge spray head; 71-image capturing camera.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

As shown in fig. 1 to 3, an embodiment of the present invention is: a wafer handling hanger apparatus comprising:

a main support 2 including a plurality of support columns 21, a cross beam 22 at the top, a table plate 23 at the middle, and a bottom plate 24 at the bottom;

a rear cover removing and mounting unit 3 provided on the top cross member 22 of the main stand 2, the rear cover removing and mounting unit 3 for removing and mounting a locking member of the rear cover of the hanger and moving the rear cover;

the hanging tool clamping unit 4 is arranged on the table plate 23, and the hanging tool clamping unit 4 is used for placing and positioning the hanging tool 1;

the wafer ejection unit is arranged on the bottom plate 24 and comprises a jacking frame 51, a first lifting driving mechanism and a rotary driving mechanism, wherein the first lifting driving mechanism is used for driving the jacking frame 51 to move up and down, and the rotary driving mechanism is used for driving the jacking frame 51 to rotate;

the sealing ring purging mechanism comprises a purging spray head 61, a ventilation pipeline and an airflow generating device, wherein the purging spray head 61 is connected to an air outlet of the airflow generating device through the ventilation pipeline, the purging spray head 61 is installed on the jacking frame 51, and the sealing ring purging mechanism is used for generating purging airflow for a sealing ring on the hanger after a wafer on the hanger is ejected;

visual inspection mechanism, it includes image acquisition camera 71 and image analysis host computer, and image acquisition camera 71 is installed on the jacking frame, visual inspection mechanism is used for on the hanger wafer ejecting back, gathers the hanger and goes up the sealing washer image and judge whether there is the foreign matter to remain on the sealing washer.

The beneficial effect of adopting above-mentioned technical scheme is: before the wafer is installed, a rotary driving mechanism drives a sealing ring purging mechanism to rotate to perform full-circle purging on a sealing ring of a hanger to remove residual foreign matters or a coating, and then a visual detection mechanism collects an image of the sealing ring and judges whether foreign matters are left or not; after the sealing ring is confirmed to have no foreign matter residue, the wafer is conveyed to the top end of the jacking frame of the wafer ejection unit through the manipulator, the first lifting driving mechanism moves downwards, the wafer falls onto the sealing ring in the hanger, and the first lifting driving mechanism continues to drive the jacking frame to move downwards to be separated from the wafer; the rear cover dismounting unit moves downwards, the rear cover of the rack is loaded on the rack and locked, and wafer installation is completed; and finally, moving the hanger from the hanger clamping unit to an electroplating pool for electroplating. And after the wafer is electroplated, moving the wafer back to the hanger clamping unit, detaching the rear cover of the hanger through the rear cover dismounting unit, ejecting the electroplated wafer through the wafer ejection unit, removing the wafer through the manipulator, repeating the steps before the wafer is installed, and performing blowing and visual inspection on the hanger sealing ring. Adopt the technical scheme of the utility model, after the electroplating of last wafer was accomplished, before the installation of next wafer, can in time clear up hanger sealing washer foreign matter, ensure that wafer and sealing washer keep good sealing performance, prevent that the wafer piece from taking place and the seepage of plating solution, promote the homogeneity of wafer electroplating coating, improve hanger life.

As shown in fig. 1 to 3, in other embodiments of the present invention, the rear cover removing unit 3 includes an upper supporting plate 31, an electric screwdriver fixing plate 32, a suction cup 33, a guiding mechanism 34, a second lifting driving mechanism and a plurality of electric screwdrivers 35, the plurality of electric screwdrivers 35 are circumferentially distributed and installed on the electric screwdriver fixing plate 32, the suction cup 33 is installed below the electric screwdriver fixing plate 32, the electric screwdriver fixing plate 32 is installed below the upper supporting plate 31 through the guiding mechanism 34 in a lifting manner, and the second lifting driving mechanism drives the electric screwdriver fixing plate 32 to move up and down along the guiding mechanism 34. The beneficial effect of adopting above-mentioned technical scheme is: the rear cover locking part of the hanger is quickly and synchronously loosened or locked through a plurality of electric screwdriver, and the rear cover is adsorbed by the sucking disc and lifted by the second lifting driving mechanism, so that the rear cover is automatically disassembled.

The utility model discloses an in other embodiments, cover unit 3 of removing stage makeup and costume after the multiunit, cover unit 3 is used for removing stage makeup and costume not the hanger of unidimensional wafer after each group, still is provided with first translation actuating mechanism on the crossbeam 22, cover unit 3 along the crossbeam 22 translation after first translation actuating mechanism drives the multiunit. The beneficial effect of adopting above-mentioned technical scheme is: according to the size of the wafer, the first translation driving mechanism completes the transposition of the corresponding rear cover dismounting unit, so that the equipment can be simultaneously suitable for hangers of wafers of various sizes.

In other embodiments of the present invention, the visual inspection mechanism includes a plurality of image capturing cameras 71, and the orientation of each image capturing camera 71 is different from the included angle formed by the horizontal line. The beneficial effect of adopting above-mentioned technical scheme is: the optimal image acquisition angles of the hanger sealing rings with different wafer sizes are matched through the plurality of image acquisition cameras, so that the universality of the equipment is improved; the multiple image acquisition cameras can be synchronously applied, image acquisition at different angles is carried out on the hanger sealing ring, and foreign matter inspection capability is improved.

As shown in fig. 3, in other embodiments of the utility model, be provided with hanger loading station and wafer loading station on the table 23, hanger clamping unit 4 includes second translation actuating mechanism, slide 41, steering mechanism 42, rotor plate 43, stopper 44 and support piece 45, stopper 44 is installed in the both sides of rotor plate 43, support piece 45 is installed in the one end of rotor plate 43, stopper 44 and the both sides phase-match of hanger 1, support piece 45 matches with the lower extreme of hanger 1, rotor plate 43 is installed on slide 41 through steering mechanism 42, second translation actuating mechanism drives slide 41 and translates between hanger loading station and wafer loading station. The beneficial effect of adopting above-mentioned technical scheme is: the rack is convenient to load in a vertical state at the rack loading station, the rack is rotated to a horizontal state through the steering mechanism, and then the rack is moved to the wafer loading station through the second translation driving mechanism, so that the wafer is convenient to take and place. The structure is more compact, and the space configuration is saved.

In other embodiments of the present invention, the infrared distance measuring device further comprises 3 infrared distance measuring sensors distributed in a circumferential array and at the same level. The beneficial effect of adopting above-mentioned technical scheme is: whether the wafer is flat or not is judged by detecting the horizontal height of the position of the 3 point on the wafer, so that the wafer is prevented from being crushed when the rear cover is assembled.

In the present invention, the specific form of the first translation driving mechanism, the second translation driving mechanism, the first elevation driving mechanism, the second elevation driving mechanism, the third elevation driving mechanism, the rotation driving mechanism, and the steering mechanism is not limited, and can be obtained from the prior art; the first translation driving mechanism and the second translation driving mechanism can adopt a structure form of horizontally arranged screw rod mechanism, air cylinder, electric cylinder or motor combined transmission belt; the first lifting driving mechanism, the second lifting driving mechanism and the third lifting driving mechanism can adopt a structure form that a vertically arranged screw rod mechanism, an air cylinder, an electric cylinder or a motor is combined with a transmission belt for conveying; the rotary driving mechanism and the steering mechanism can adopt a structural form that a motor is combined with a speed reducer.

As shown in fig. 4-7, in other embodiments of the present invention, the hanger 1 includes a main plate 11 and a rear cover 12, the main plate 11 is provided with an opening, the main plate 11 is provided with a conductive sheet unit surrounding the opening, the conductive sheet unit includes at least 4 arc-shaped conductive sheets 17, each arc-shaped conductive sheet 17 is isolated from each other, each arc-shaped conductive sheet 17 is provided with a plurality of contact sheets 171, and a circumferential edge portion of a wafer to be electroplated is in conductive contact with each contact sheet 171; the upper part of the main plate body 11 is provided with conductive hooks 18 with the number consistent with that of the arc-shaped conductive sheets in an area not contacted with the electroplating solution, each 1 arc-shaped conductive sheet 17 is electrically connected with one conductive hook through respective independent wires, and 1 arc-shaped conductive sheet 17 is connected with 1 conductive hook to form 1 independent conductive path. The beneficial effect of adopting above-mentioned technical scheme is: after the wafer is installed on the hanger, the conductivity between the wafer and each conductive hook can be detected by means of a conductivity detector, whether the contact pieces of each arc-shaped conductive piece are in full contact with the wafer or not is judged, the conductivity is measured before electroplating, whether the wafer is flatly placed or not is confirmed, reliable electric conduction performance is kept in the electroplating process, and the wafer electroplating effect is improved.

Right the utility model discloses the basic principle that the hanger carries out conductivity detection is: and respectively measuring the resistance between the surface of the wafer and each conductive hook through a conductivity detector, and comparing the resistance with a standard value to judge whether the conductivity of the hanger is qualified. The conductivity detector and the hanger are arranged in a split mode, and butt contact is carried out during testing. The utility model discloses do not limit to the conductivity detector, the conductivity detector can follow prior art and acquire, like adopting bell analytical instrument (big company) BEC-200A type online conductivity meter of limited company sales.

As shown in fig. 6, in other embodiments of the present invention, the main plate 11 is provided with wire grooves 116 whose number is equal to the number of the arc-shaped conductive sheets 17, and 1 wire is provided in each wire groove 116. The wire guide 116 is sealed or filled with sealant. The beneficial effect of adopting above-mentioned technical scheme is: ensure the reliable routing.

As shown in fig. 4-8, in another embodiment of the present invention, a first sealing ring 13 surrounding the opening is disposed on the main plate 11, an edge portion of the surface to be plated of the wafer is attached to the first sealing ring 12, and a second sealing ring 14 is disposed between the rear cover 12 and the main plate 11; an air inlet passage 15 is arranged in the main plate body 11, an air inlet of the air inlet passage 15 is located in an area, which is not contacted with electroplating solution, of the upper portion of the hanger, and an air outlet of the air inlet passage 15 is communicated to a closed space formed by the first sealing ring and the second sealing ring. The beneficial effect of adopting above-mentioned technical scheme is: the rack is provided with an air inlet channel communicated with a closed space formed by the first sealing ring and the second sealing ring, and after the wafer is installed on the rack, the tightness between the wafer and the first sealing ring can be detected by means of air tightness detection equipment, so that the sealing reliability is ensured, the electroplating effect is ensured, and the use safety of the rack is improved. Right the utility model discloses the basic principle that the gas tightness detected is carried out to the hanger is: compressed air with set pressure is filled into an air inlet channel of the hanger through air tightness detection equipment, and whether leakage exists or not is detected through measuring the internal pressure or flow change of a workpiece so as to judge air tightness. The air tightness detection equipment and the hanging tool are arranged in a split mode, and butt joint and inflation are carried out during testing. The utility model does not limit the air tightness detection device, the air tightness detection device can be obtained from the prior art, for example, a differential pressure type air tightness leak detector with model AL-T60 sold by Anhui Yingtai Automation technology Limited company is adopted,

as shown in fig. 4 to 8, in other embodiments of the present invention, the air faucet further includes an air faucet 16 made of an elastic material, and the air faucet 16 is installed at an air inlet of the air inlet passage 15. The beneficial effect of adopting above-mentioned technical scheme is: the air tightness detection equipment is in butt joint with the elastic air nozzle of the hanging tool for inflation and testing, air leakage can be prevented, and testing accuracy is improved.

As shown in fig. 9, in other embodiments of the present invention, the air faucet 16 includes a first air channel 161 and a second air channel 162 connected to each other, the first air channel 161 is coaxial with the main body internal air inlet channel 15, and the second air channel 162 is perpendicular to the surface of the main body. The beneficial effect of adopting above-mentioned technical scheme is: make things convenient for gas tightness check out test set and hanger butt joint from the direction of positive hanger, improve the test convenience.

As shown in fig. 5, 8 and 9, in other embodiments of the present invention, the main plate 11 includes a bottom plate 111 and a top plate 112, the top plate 112 is fixedly mounted on the top end surface of the bottom plate 111 through a locking member, and the air inlet passage 15 extends downward from the top end surface of the bottom plate 111. The beneficial effect of adopting above-mentioned technical scheme is: the air inlet channel is convenient to manufacture, and the manufacturing cost is reduced.

As shown in fig. 10-12, in other embodiments of the present invention, the air faucet 16 includes a cylindrical portion 163 and a square portion 164, the top end of the bottom plate 111 is provided with a circular counter bore 113 and a bayonet 114 located at the top end of the circular counter bore, the cylindrical portion 163 of the air faucet is installed in the circular counter bore 113 of the bottom plate, and the square portion 164 of the air faucet is installed in the bayonet 114.

In other embodiments of the present invention, as shown in fig. 12, a plurality of outwardly protruding ring portions 165 are provided around the cylindrical portion 163 of the air faucet. The beneficial effect of adopting above-mentioned technical scheme is: the air nozzle and the air inlet channel on the main board body are combined in a sealing mode.

As shown in fig. 11 and 12, in another embodiment of the present invention, the square body 164 of the air faucet has ears 166 protruding outward from both sides, and the fastening openings 114 of the bottom plate are provided with limiting grooves 115 matching with the ears. The beneficial effect of adopting above-mentioned technical scheme is: the position stability of the air nozzle is improved.

The above embodiments are only for illustrating the technical conception and the features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement the present invention, and the protection scope of the present invention can not be limited thereby, and all equivalent changes or modifications made according to the spirit of the present invention should be covered in the protection scope of the present invention.

Claims (10)

1. A wafer handling hanger apparatus, comprising:

a main support;

a rear cover dismounting unit for dismounting the locking piece of the rear cover of the hanger and moving the rear cover;

a hanger holding unit for placing and positioning a hanger;

the wafer ejection unit is used for supporting and ejecting the wafer on the hanger;

the sealing ring purging mechanism is used for generating purging airflow for the sealing ring on the hanger after the wafer on the hanger is ejected;

and the visual detection mechanism is used for detecting whether foreign matters are left on the sealing ring after the wafer is ejected out of the hanging tool.

2. The wafer handling hanger apparatus according to claim 1, wherein the rear cover removing unit comprises an upper support plate, a electric batch fixing plate, a suction cup, a guiding mechanism, a second lifting driving mechanism, and a plurality of electric batches, the electric batches are circumferentially distributed and mounted on the electric batch fixing plate, the suction cup is mounted below the electric batch fixing plate, the electric batch fixing plate is mounted below the upper support plate through the guiding mechanism in a lifting manner, and the second lifting driving mechanism drives the electric batch fixing plate to move up and down along the guiding mechanism.

3. The wafer handling hanger apparatus of claim 2, comprising a plurality of sets of the back cover removing units, each set of the back cover removing units being adapted to remove the hangers for wafers of different sizes, and further comprising a first translation driving mechanism, the first translation driving mechanism driving the plurality of sets of the back cover removing units to shift and translate.

4. The wafer handling hanger apparatus of claim 1, wherein the vision inspection mechanism comprises a plurality of image capturing cameras, each image capturing camera oriented at a different angle from horizontal.

5. The wafer handling hanger apparatus of claim 1, wherein the hanger clamping unit comprises a second translation driving mechanism, a sliding plate, a steering mechanism, a rotating plate, a limiting block and a holding block, the limiting block is mounted on two sides of the rotating plate, the holding block is mounted on one end of the rotating plate, the limiting block is matched with two sides of the hanger, the holding block is matched with the lower end of the hanger, the rotating plate is mounted on the sliding plate through the steering mechanism, and the second translation driving mechanism drives the sliding plate to translate between the hanger loading station and the wafer loading station.

6. The wafer handling rack apparatus of claim 1, further comprising 3 infrared ranging sensors in a circumferential array and at the same level.

7. The wafer handling hanger apparatus of claim 1, wherein the hanger comprises a main plate body and a rear cover, the main plate body is provided with an opening, the main plate body is provided with a first sealing ring surrounding the opening, an edge portion of a surface to be plated of a wafer abuts against the first sealing ring, and a second sealing ring is further provided between the rear cover and the main plate body; an air inlet channel is arranged in the main board body, an air inlet of the air inlet channel is located in a region, which is not contacted with electroplating liquid, of the upper portion of the hanger, and an air outlet of the air inlet channel is communicated to a closed space formed by the first sealing ring and the second sealing ring.

8. The wafer handling rack apparatus of claim 7, further comprising a hermeticity detection apparatus for hermeticity detection of the rack after wafer installation.

9. The wafer handling hanger apparatus of claim 8, wherein the main plate of the hanger is provided with a conductive sheet unit surrounding the opening, the conductive sheet unit comprises at least 4 arc-shaped conductive sheets, each arc-shaped conductive sheet is isolated from another arc-shaped conductive sheet, each arc-shaped conductive sheet is provided with a plurality of contact sheets, and the peripheral edge portion of the wafer to be electroplated is in conductive contact with each contact sheet; conductive hooks with the number consistent with that of the arc-shaped conductive strips are arranged in an area, which is not contacted with electroplating solution, on the upper part of the main plate body, and each arc-shaped conductive strip is electrically connected with one conductive hook through a lead.

10. The wafer handling rack apparatus of claim 9, further comprising a conductivity detector, the hermeticity detection apparatus being configured to detect rack conductivity after wafer mounting.

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