CN217062834U

CN217062834U - Light emission component and optical module

Info

Publication number: CN217062834U
Application number: CN202220877868.XU
Authority: CN
Inventors: 姜瑜斐; 王永乐; 仲兆良; 王家宁; 王目喜
Original assignee: Qingdao Xinghang Photoelectric Technology Co ltd
Current assignee: Qingdao Xinghang Photoelectric Technology Co ltd
Priority date: 2022-04-15
Filing date: 2022-04-15
Publication date: 2022-07-26
Anticipated expiration: 2032-04-15

Abstract

The utility model discloses a light emission subassembly and optical module, light emission subassembly includes: a PCB board; a substrate; a chip assembly including three chips; the three chips are arranged on two sides of the substrate; a laser comprising three laser arrays; a detector comprising three detector arrays; the three laser arrays are distributed in a staggered mode; the three detector arrays are distributed in a staggered mode; the three laser arrays and the three detector arrays are arranged in a crossed manner; the three laser arrays are connected with the three chips in a one-to-one opposite mode; and the positions, close to the three detector arrays, on the PCB are respectively provided with a bonding pad, and the three detector arrays are correspondingly connected with the bonding pads. The utility model discloses a light emission subassembly and optical module has improved compact structure nature, has reduced spatial layout.

Description

Light emission component and optical module

Technical Field

The utility model relates to the field of communication technology, especially, relate to a light emission subassembly and optical module.

Background

With the popularization and deep application of optical communication products in 4G, 5G and cloud services, the demand and daily increase of parallel photoelectric conversion modules, and the market demand also develops towards continuous miniaturization, high speed, high density and low power consumption.

Generally, the electrical leads around the chip need to be connected to the PCB pads around the chip by gold wire bonding, which requires a certain space between the chips when several chips are arranged, such as a distance d1 between chip 1 and chip 2 and a distance d2 between chip 2 and chip 3 in fig. 1, in order to arrange the pads and the bonding wires. Therefore, the chips cannot be densely arranged side by side, and the layout density is influenced. Meanwhile, the laser 300 is arranged on one side of the chip 1, the chip 2 and the chip 3, and the detector 400 is arranged on one side of the laser 300, so that due to the limited size of the laser 300, the chips are too scattered, and the bonding line is too inclined when the bonding pad close to the laser side is connected with the laser 300. Such as bonding wire 100 between chip 1 and laser 300, and bonding wire 200 between chip 3 and laser 300, are too inclined, which affects the manufacturability, reliability and signal quality of the line connection. How to realize the compact mounting and lead wire leading-out of 3 4-path chips becomes a technical problem which is urgently solved.

In various optical module products, closed-loop monitoring of the optical power of a chip becomes an important ring of the products, and meanwhile, a way is provided for customers to know the product performance in time.

The performance of the optical chip, which is an important component of the parallel photoelectric conversion module, directly determines whether the product is working normally, and the optical power, which is the most effective method for determining whether the chip is working normally, is used by most manufacturers to monitor the performance of the photoelectric conversion module. The monitoring of the optical power of the parallel photoelectric module in the current market is basically realized by adopting a plastic part with a die opened, but the monitoring of the optical power of a multi-channel product is difficult to realize due to the influence of a light receiving chip and an electric chip, and the monitoring is difficult to realize in actual production.

Disclosure of Invention

The utility model provides a light emission component has improved compact structure nature.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

the utility model provides a light emission component, include:

a PCB board;

a substrate disposed on the PCB;

a chip assembly comprising three chips; the three chips are arranged on two sides of the substrate;

the laser is arranged on the substrate and comprises three laser arrays;

the detector is arranged on the substrate and comprises three detector arrays;

wherein the three laser arrays are arranged in a staggered manner; the three detector arrays are arranged in a staggered manner; the three laser arrays and the three detector arrays are arranged in a crossed manner;

the three laser arrays are connected with the three chips in a one-to-one opposite mode;

and welding pads are respectively arranged on the positions, close to the three detector arrays, of the PCB, and the three detector arrays are correspondingly connected with the welding pads.

In some embodiments of the present application, the three laser arrays are a first laser array, a second laser array, and a third laser array; the three detector arrays are a first detector array, a second detector array and a third detector array; the three chips are a first chip, a second chip and a third chip;

the first laser array and the first detector array are oppositely arranged, the second laser array and the second detector array are oppositely arranged, and the third laser array and the third detector array are oppositely arranged;

the first laser array, the second detector array and the third laser array are arranged in a row; the first detector array, the second laser array and the third detector array are arranged in a row;

the first chip is connected with the first laser array; the second chip is connected with the second laser array; the third chip is connected with a third laser array.

In some embodiments of the present application, the light emitting assembly further comprises a lens array;

the lens array comprises two first light path structures and one second light path structure, or one first light path structure and two second light path structures;

the first light path structure and the second light path structure are arranged in a crossed manner;

the first light path structure comprises a first lens, a first reflecting surface, a second lens and a first fiber coupling lens; the first lens transmits the received optical signal to a first reflecting surface, and the optical signal is reflected to a second reflecting surface and a first optical fiber coupling lens through the first reflecting surface; the second reflecting surface reflects the received optical signal to a second lens, and the optical signal is converged and emitted through the second lens; the first fiber coupling lens couples the received optical signal to an optical fiber;

the second light path structure comprises a third lens, a third reflecting surface, a fourth reflecting surface, a fifth reflecting surface, a fourth lens and a second fiber coupling lens; the third lens transmits the received optical signal to a third reflecting surface and a fourth reflecting surface, and the third reflecting surface reflects the received optical signal to the second optical fiber coupling lens; the second fiber coupling lens couples the received optical signal to an optical fiber; the fourth reflecting surface reflects the received optical signal to a fifth reflecting surface; the fifth reflecting surface reflects the received optical signal to the fourth lens, and the optical signal is converged and emitted through the fourth lens.

In some embodiments of the present application, the lens array includes two first optical path structures and one second optical path structure;

the first lens of one first light path structure is positioned above the light emitting port of the first laser array, and the second lens of one first light path structure is positioned above the light receiving port of the first detector array;

a first lens of another first light path structure is positioned above the transmitting light port of the third laser array, and a second lens of another first light path structure is positioned above the receiving light port of the third detector array;

the third lens of the second optical path structure is located above the light emitting port of the second laser array, and the fourth lens of the second optical path structure is located above the light receiving port of the second detector array.

In some embodiments of the present application, the lens array includes one first light path structure and two second light path structures;

the third lens of one of the second light path structures is positioned above the light emitting port of the first laser array, and the fourth lens of one of the second light path structures is positioned above the light receiving port of the first detector array;

a third lens of another second light path structure is positioned above a light emitting port of the third laser array, and a fourth lens of another second light path structure is positioned above a light receiving port of the third detector array;

the first lens of the first light path structure is positioned above the light emitting port of the second laser array, and the second lens of the first light path structure is positioned above the light receiving port of the second detector array.

In some embodiments of the present application, the laser array is connected to the corresponding chip by bonding wires; the detector array is connected with the corresponding bonding pad through a bonding lead.

In some embodiments of the present application, the substrate is made of ceramic or metal.

In some embodiments of the present application, the laser and the probe are attached to the substrate, the substrate is attached to the PCB, and the chip assembly is attached to the PCB.

In some embodiments of the present application, the chips are four-channel electrical chips, the laser arrays are four-channel laser arrays, and the detector arrays are four-channel detector arrays.

An optical module, characterized in that: comprises a plurality of the light emitting components.

The technical scheme of the utility model relative prior art have following technological effect: the utility model discloses a light emission component and optical module lays in the both sides of base plate through designing three chip, and three laser array is crisscross to be laid, and three detector array is crisscross to be laid, and three laser array alternately lays with three detector array, and three laser array is connected with three chip one-to-one, and three detector array corresponds with the pad and is connected, need not the redesign pad between the chip, has improved compact structure nature, has reduced spatial layout.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the description below are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is a layout diagram of a prior art chip;

fig. 2 is a chip layout diagram of an embodiment of a light emitting module according to the present invention;

fig. 3 is a top view of an embodiment of a light emitting assembly with a lens array in accordance with the present invention;

FIG. 4 is a side view of one embodiment of a light emitting assembly with a lens array as set forth in the present disclosure;

FIG. 5 is a cross-sectional view taken along line C-C of FIG. 3;

FIG. 6 is an enlarged view of E in FIG. 5;

FIG. 7 is a cross-sectional view taken along line D-D of FIG. 3;

fig. 8 is an enlarged view of F in fig. 7.

Reference numerals are as follows:

100. bonding a lead; 200. bonding a lead; 300. a laser; 400. a detector;

1-1, a first chip; 1-2, a second chip; 1-3, a third chip;

2-1, a first laser array; 2-2, a second laser array; 2-3, a third laser array;

3-1, a first detector array; 3-2, a second detector array; 3-3, a third detector array;

4. a substrate; 5. a PCB board; 6. a lead wire; 7. a bonding pad;

8. a lens array;

8-1, a first lens; 8-2, a first reflecting surface; 8-3, a second reflecting surface;

8-4, a first fiber coupling lens; 8-5, a second lens;

8-6, a third lens; 8-7, a third reflecting surface; 8-8, a second fiber coupling lens;

8-9 and a fourth reflecting surface; 8-10, a fifth reflecting surface; 8-11 and a fourth lens.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person having ordinary skill in the art without making creative efforts belong to the protection scope of the present application.

In the description of the present application, it is to be understood that the terms "central," "upper," "lower," "front," "back," "top," "bottom," "inner," "outer," and the like are used in the orientations and positional relationships indicated in the figures, which are based on the orientations and positional relationships shown in the figures, and are used for convenience in describing the present application and for simplicity in description, and do not indicate or imply that the device or element so referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and therefore should not be considered limiting.

In the description of the present application, it is to be understood that the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or as implying that the number of indicated technical features is indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless otherwise specified.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in this application will be understood to be a specific case for those of ordinary skill in the art.

To the problem that the chip was arranged too dispersedly among the prior art, the utility model provides a light emission subassembly and optical module need not the design pad between the chip, has reduced the interval between the chip, has improved compact structure nature. The light emitting module and the optical module according to the present invention will be described in detail with reference to the accompanying drawings.

The first embodiment,

The light emitting module of the present embodiment includes a PCB 5, a substrate 4, a chip module, a laser, a probe, etc., as shown in fig. 2 to 8.

The PCB board 5 has a plurality of pads thereon.

And a substrate 4 disposed on the PCB board 5. The substrate 4 is used for carrying the laser and the detector.

A chip assembly comprising three chips: a first chip 1-1, a second chip 1-2 and a third chip 1-3. Three chips are arranged on both sides of the substrate 4. The chip is a driving chip and is used for driving the laser to operate.

The laser, it lays on base plate 4, and it includes three laser array: a first laser array 2-1, a second laser array 2-2, and a third laser array 2-3.

The detector, it lays on base plate 4, and it includes three detector arrays: a first detector array 3-1, a second detector array 3-2, and a third detector array 3-3.

Wherein, the three laser arrays are arranged in a staggered way; the three detector arrays are distributed in a staggered mode; the three laser arrays and the three detector arrays are arranged in a crossed mode.

The three laser arrays are connected with the three chips in a one-to-one opposite mode. And the positions, close to the three detector arrays, on the PCB 5 are respectively provided with a bonding pad 7, and the three detector arrays are correspondingly connected with the bonding pads 7.

The light emitting component of this embodiment, through designing three chip and laying in the both sides of base plate, three laser array is crisscross lays, and three detector array is crisscross lays, and three laser array and three detector array are alternately laid, and three laser array is connected with three chip one-to-one, and three detector array corresponds with the pad and is connected, need not redesign pad between the chip, has improved compact structure nature, has reduced spatial layout.

Because the three chips are arranged on two sides of the substrate 4, and the three laser arrays are connected with the three chips in a one-to-one opposite mode, the deflection condition of bonding wires for connecting the laser arrays and the chips is reduced.

Because the positions, close to the three detector arrays, on the PCB are respectively provided with the bonding pads 7, and the three detector arrays are correspondingly connected with the bonding pads 7, the deflection condition of the bonding lead 6 for connecting the detector arrays and the bonding pads is reduced; therefore, the difficulty of the line connection process is reduced, and the stability and reliability of line connection are improved.

The light emitting module of the embodiment is used for reducing the layout space of the whole module and simultaneously shortening the bonding lead, and the positions of the three laser arrays and the positions of the three detector arrays are rearranged, so that the optimal design of the whole product is met.

In some embodiments of the present application, in order to further improve the layout rationality of the light emitting modules and reduce the space occupation, the first laser array 2-1 is arranged opposite to the first detector array 3-1, the second laser array 2-2 is arranged opposite to the second detector array 3-2, and the third laser array 2-3 is arranged opposite to the third detector array 3-3; the first laser array 2-1, the second detector array 3-2 and the third laser array 2-3 are arranged in a row; the first detector array 3-1, the second laser array 2-2 and the third detector array 3-3 are arranged in a row. Namely, three laser arrays and three detector arrays are arranged in two rows on the substrate 4.

The first chip 1-1 and the third chip 1-3 are arranged on one side of the substrate 4, the first chip 1-1 is close to the first laser array 2-1, and the third chip 1-3 is close to the third laser array 2-3; the second chip 1-2 is arranged on the other side of the substrate 4, and the second chip 1-2 is close to the second detector array 3-2; the first chip 1-1 is connected with the first laser array 2-1; the second chip 1-2 is connected with the second laser array 2-2; the third chip 1-3 is connected to a third laser array 2-3.

And a welding pad is arranged on one side of the PCB and the substrate 4, close to the second detector array 3-2, and is used for being connected with the second detector array 3-2.

Pads are respectively arranged on the other side of the PCB and the substrate 4, close to the first detector array 3-1 and the third detector array 3-3, and are used for being correspondingly connected with the first detector array 3-1 and the third detector array 3-3.

In some embodiments of the present application, the optical transmission assembly further includes a lens array 8, configured to transmit an optical signal emitted by the laser to the optical fiber and the detector, so as to implement transmission of the signal and optical power monitoring of the laser. The lens array 8 is coupled and aligned with the optical port of the laser and the optical port of the detector to realize the transmission of the beam shaping.

Because the three laser arrays and the three detector arrays are arranged in a crossed manner, the optical path of the lens array 8 needs to be designed in a targeted manner, and the optical power monitoring function of the laser arrays is realized.

Different light paths are designed for the positions of different laser arrays by the lens array 8, the light path designed for the second laser array 2-2 is different from the light path designed for the first laser array 2-1 and the third laser array 2-3, and the two light paths are compatible to the same lens array by the lens array 8.

The lens array 8 includes two first optical path structures and one second optical path structure, or one first optical path structure and two second optical path structures. The first light path structure and the second light path structure are arranged in a crossed mode.

The first optical path structure comprises a first lens 8-1, a first reflecting surface 8-2, a second reflecting surface 8-3, a second lens 8-5 and a first fiber coupling lens 8-4, and is shown in fig. 6; an optical signal is emitted into a first lens 8-1, the first lens 8-1 transmits the received optical signal to a first reflecting surface 8-2, and the received optical signal is reflected to a second reflecting surface 8-3 and a first optical fiber coupling lens 8-4 through the first reflecting surface 8-2; the second reflecting surface 8-3 reflects the received optical signal to a second lens 8-5, and the optical signal is converged and emitted through the second lens 8-5; the first fiber coupling lens 8-4 couples the received optical signal to the optical fiber. In some embodiments of the present application, the first reflective surface 8-2 is disposed perpendicular to the second reflective surface 8-3.

The second light path structure comprises a third lens 8-6, a third reflecting surface 8-7, a fourth reflecting surface 8-9, a fifth reflecting surface 8-10, a fourth lens 8-11 and a second fiber coupling lens 8-8, and is shown in FIG. 8; the optical signal is emitted into a third lens 8-6, the third lens 8-6 transmits the received optical signal to a third reflecting surface 8-7 and a fourth reflecting surface 8-9, and the third reflecting surface 8-7 reflects the received optical signal to a second optical fiber coupling lens 8-8; a second fibre-coupling lens 8-8 couples the received optical signal to an optical fibre. The fourth reflecting surface 8-9 reflects the received optical signal to the fifth reflecting surface 8-10; the fifth reflecting surface 8-10 reflects the received optical signal to the fourth lens 8-11, and the received optical signal is converged and emitted through the fourth lens 8-11. In some embodiments of the present application, the third reflective surface 8-7 is disposed perpendicular to the fourth reflective surface 8-9, the fourth reflective surface 8-9 is disposed perpendicular to the fifth reflective surface 8-10, and the third reflective surface 8-7 is disposed parallel to the fifth reflective surface 8-10.

By designing the two optical path structures on the lens array, the optical fiber array is suitable for arrangement of the laser array and the detector array on the substrate 4, optical signals emitted by the laser array can be transmitted to the optical fibers and the corresponding detector array, and signal transmission and optical power monitoring of the laser array are achieved.

In some embodiments of the present application, the lens array includes two first optical path structures and one second optical path structure; one of the first light path structures, the second light path structure and the other first light path structure are sequentially arranged. That is, the first laser array 2-1 and the third laser array 2-3 adopt the first optical path structure to perform signal transmission and optical power monitoring, and the second laser array 2-2 adopts the second optical path structure to perform signal transmission and optical power monitoring.

The first lens of one of the first optical path structures is located above the emission light port of the first laser array 2-1, and the second lens of one of the first optical path structures is located above the receiving light port of the first detector array 3-1, as shown in fig. 5 and 6.

The first lens of the other first optical path structure is positioned above the light emitting port of the third laser array 2-3, and the second lens of the other first optical path structure is positioned above the light receiving port of the third detector array 3-3.

The third lens of the second optical path structure is located above the light emitting port of the second laser array 2-2, and the fourth lens of the second optical path structure is located above the light receiving port of the second detector array 3-2, as shown in fig. 7 and 8.

An optical signal emitted by a light emitting port of a first laser array 2-1 is emitted into a first lens 8-1 of a first optical path structure above, divergent light is shaped into parallel light through shaping of the first lens 8-1 and is emitted to a first reflection surface 8-2, the parallel light beam is reflected on the first reflection surface 8-2, a part of light is reflected to a second reflection surface 8-3, the light is continuously reflected through the second reflection surface 8-3 and reaches a second lens 8-5, the light is converged to a light receiving port of the first detector array 3-1 through shaping of the second lens 8-5, the first detector array 3-1 performs photoelectric conversion, and the light emitting power of the first laser array 2-1 is monitored. And the other part of light is directly transmitted to the first optical fiber coupling lens 8-4, and parallel light is shaped into convergent light through the shaping of the first optical fiber coupling lens 8-4, and enters the optical fiber to carry out signal transmission.

Similarly, an optical signal emitted by the emitting light port of the third laser array 2-3 enters the first lens of the first optical path structure above, the diverging light is shaped into parallel light by the shaping of the first lens and is emitted to the first reflecting surface, the parallel light beam is reflected by the first reflecting surface, a part of light is reflected to the second reflecting surface, continues to be reflected by the second reflecting surface and reaches the second lens, and is converged to the receiving light port of the third detector array 3-3 by the shaping of the second lens, the third detector array 3-3 performs photoelectric conversion, and the emitting light power of the third laser array 2-3 is monitored. And the other part of light is directly transmitted to the first optical fiber coupling lens, and the parallel light is shaped into convergent light through the shaping of the first optical fiber coupling lens, and enters the optical fiber for signal transmission.

An optical signal emitted by a light emitting port of the second laser array 2-2 is emitted into a third lens 8-6 of an upper second light path structure, the divergent light is shaped into parallel light through shaping of the third lens 8-6, a part of parallel light rays of optical power monitoring reaches a fourth reflecting surface 8-9, total reflection of the fourth reflecting surface 8-9 is carried out, the fourth reflecting surface reaches a fifth reflecting surface 8-10, the fourth reflecting surface reaches a fourth lens 8-11 through total reflection of the fifth reflecting surface 8-10, the fourth reflecting surface enters a light receiving port of the second detector array 3-2 through shaping of the fourth lens 8-11, and photoelectric conversion is carried out on the second detector array 3-2, so that monitoring of the optical power of the second laser array 2-2 is achieved. In addition, part of parallel light transmitted by the signal reaches the second optical fiber coupling lens 8-8 through total reflection on the third reflecting surface 8-7, is shaped by the second optical fiber coupling lens 8-8 and is converged into the optical fiber, and the signal transmission is realized.

Through designing two first light path structures and one second light path structure, the optical signal that is used for sending corresponding laser array transmits to optic fibre and corresponding detector array, realizes the transmission of signal and the optical power control of laser array, moreover, spatial layout is reasonable.

In yet other embodiments of the present application, the lens array includes one first optical path structure and two second optical path structures; one second light path structure, the first light path structure and the other second light path structure are sequentially arranged. That is, the first laser array 2-1 and the third laser array 2-3 adopt the second optical path structure to perform signal transmission and optical power monitoring, and the second laser array 2-2 adopts the first optical path structure to perform signal transmission and optical power monitoring.

Wherein the third lens of one of the second optical path structures is located above the emission light port of the first laser array 2-1, and wherein the fourth lens of one of the second optical path structures is located above the reception light port of the first detector array 3-1. An optical signal emitted by an emitting light port of the first laser array 2-1 is emitted into a third lens of a second optical path structure above the emitting light port, the third lens emits the received optical signal to a third reflecting surface and a fourth reflecting surface, and the third reflecting surface reflects the received optical signal to a second optical fiber coupling lens; the second fiber coupling lens couples the received optical signal to the optical fiber. The fourth reflecting surface reflects the received optical signal to the fifth reflecting surface; the fifth reflecting surface reflects the received optical signals to the fourth lens, and the optical signals are converged and emitted to the first detector array 3-1 through the fourth lens; the transmission of signals and the monitoring of the optical power of the first laser array 2-1 are achieved.

The third lens of another second optical path structure is located above the emission light port of the third laser array 2-3, and the fourth lens of another second optical path structure is located above the receiving light port of the third detector array 3-3. An optical signal emitted by an emitting light port of the third laser array 2-3 is emitted into a third lens of a second optical path structure above the third laser array, the third lens emits the received optical signal to a third reflecting surface and a fourth reflecting surface, and the third reflecting surface reflects the received optical signal to a second optical fiber coupling lens; the second fiber coupling lens couples the received optical signal to the optical fiber. The fourth reflecting surface reflects the received optical signal to the fifth reflecting surface; the fifth reflecting surface reflects the received optical signals to the fourth lens, and the optical signals are converged and emitted to the third detector array 3-3 through the fourth lens; the transmission of signals and the monitoring of the optical power of the third laser array 2-3 is achieved.

The first lens of the first optical path structure is located above the light emitting port of the second laser array 2-2, and the second lens of the first optical path structure is located above the light receiving port of the second detector array 3-2. An optical signal emitted by an emitting light port of the second laser array 2-2 is emitted into a first lens of a first optical path structure above the first lens, the first lens emits the received optical signal to a first reflecting surface, and the received optical signal is reflected to a second reflecting surface and a first optical fiber coupling lens through the first reflecting surface; the second reflecting surface reflects the received optical signals to the second lens, and the optical signals are converged and emitted to the second detector array 3-2 through the second lens; the first fiber coupling lens couples the received optical signal to an optical fiber. Monitoring of the optical power of the second detector array 3-2 and transmission of signals is achieved.

The first light path structure and the two second light path structures are designed and used for transmitting optical signals sent by the corresponding laser arrays to the optical fibers and the corresponding detector arrays, signal transmission and optical power monitoring of the laser arrays are achieved, and the spatial layout is reasonable.

Because the position of laser array is different, lens array 8 designs the light path simultaneously, and compatible two kinds of light path structures realize the optical power control to all laser array passageways, and this design provides the thinking to the high integration of product to the function promotion of high integration product has been realized.

In some embodiments of the present application, each laser array is connected to a corresponding chip through a bonding wire, so as to electrically connect the laser array to the corresponding chip; the connection stability of the laser array and the corresponding chip is improved, and stable signal transmission is guaranteed.

Each detector array is connected with a corresponding bonding pad 7 through a bonding lead 6, so that the detector arrays are electrically connected with the corresponding bonding pads; the connection stability of the detector array and the corresponding bonding pad is improved, and stable signal transmission is guaranteed.

In some embodiments of the present application, the substrate 4 is made of ceramic. The ceramic has good thermal conductivity and is insulating, thereby preventing the short circuit of the surfaces of the laser and the detector and ensuring the normal operation of the laser and the detector.

In some embodiments of the present application, the substrate 4 is made of metal, which has good thermal conductivity.

In some embodiments of the present application, the laser and the detector are attached to the substrate 4, the substrate 4 is attached to the PCB 5, and the chip assembly is attached to the PCB 5, so that the connection stability is ensured, the connection is convenient, and the cost is low.

In some embodiments of the present application, the first chip 1-1, the second chip 1-2, and the third chip 1-3 are four-channel electrical chips, each laser array is a four-channel laser array, and each detector array is a four-channel detector array, so that the chip assembly is a 12-channel chip assembly, the laser is a 12-channel laser, and the detector is a 12-channel detector, and therefore, the light emitting module of this embodiment can implement 12-channel signal transmission, and the application range of the four-channel electrical chips is improved.

The light emitting module of the present embodiment realizes a 12-channel chip packaging unit by using 4-channel chips; by applying the unit, the internal core of the original optical module based on 12-channel chip packaging can be replaced, the packaging size of the original product is not changed, and 12-channel and above 12-channel optical module products are realized. The multi-channel serial optical module aims to solve the market demand problem of a multi-channel serial optical module product based on a future 4-channel chip.

The light emitting module of the embodiment realizes the optical power monitoring of all laser arrays through the optical path design of the lens array. Through the light path design of the lens array, the lens array is compatible with two light path design schemes, so that the optical power of all channels is monitored on the basis of 4 chips. On the basis of adopting 4-channel chips to realize 12-channel packaging units, a special lens array is designed to realize the monitoring of the optical power of the 12-channel chips.

In the light emitting module of the present embodiment, 3 driving chips are arranged on two sides; the optical chips of the middle 4 channels also need to be distributed again according to the position of the driving chip; and designing a lens array to realize monitoring of the optical power of the laser according to the distribution of the optical chips.

The light emitting component of this embodiment provides a chip special layout and corresponding lens array that realize optical power monitoring, can realize the performance of 12 passageway optical modules with conventional four-channel chip on the market through the concatenation, keeps under the unchangeable state of product outward appearance, encapsulation and function, and lens array designs corresponding optical design according to the overall arrangement of optical chip simultaneously, satisfies the product and realizes the control of optical power.

Example II,

Based on the design of the light emitting module of the first embodiment, the second embodiment provides an optical module, which includes a plurality of light emitting modules.

If the optical module comprises 1 optical transmitting module, 12-channel signal transmission can be realized;

if the optical module comprises 2 optical emitting modules, 24-channel signal transmission can be realized;

if the optical module includes 3 optical transmission modules, 36-channel signal transmission can be implemented.

A plurality of light emitting assemblies are designed in the optical module, so that series of optical module products of 12 channels and above 12 channels are realized. Moreover, the structure compactness is improved, and the volume of the whole optical module is further reduced.

In the foregoing description of embodiments, the particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples. The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims

1. A light emitting assembly, comprising:

a PCB board;

a substrate disposed on the PCB;

the laser is arranged on the substrate and comprises three laser arrays;

the detector is arranged on the substrate and comprises three detector arrays;

2. The light emitting assembly of claim 1, wherein:

the three laser arrays are a first laser array, a second laser array and a third laser array; the three detector arrays are a first detector array, a second detector array and a third detector array; the three chips are a first chip, a second chip and a third chip;

3. The light emitting assembly of claim 2, wherein: the light emitting assembly further comprises a lens array;

the first light path structure comprises a first lens, a first reflecting surface, a second lens and a first fiber coupling lens; the first lens transmits the received optical signal to a first reflecting surface, and the optical signal is reflected to a second reflecting surface and a first optical fiber coupling lens through the first reflecting surface; the second reflecting surface reflects the received optical signal to a second lens, and the optical signal is converged and emitted through the second lens; the first optical fiber coupling lens couples the received optical signal to an optical fiber;

the second light path structure comprises a third lens, a third reflecting surface, a fourth reflecting surface, a fifth reflecting surface, a fourth lens and a second fiber coupling lens; the third lens transmits the received optical signal to a third reflecting surface and a fourth reflecting surface, and the third reflecting surface reflects the received optical signal to the second optical fiber coupling lens; the second optical fiber coupling lens couples the received optical signal to an optical fiber; the fourth reflecting surface reflects the received optical signal to a fifth reflecting surface; the fifth reflecting surface reflects the received optical signal to the fourth lens, and the optical signal is converged and emitted through the fourth lens.

4. The light emitting assembly of claim 3, wherein: the lens array comprises two first light path structures and one second light path structure;

5. The light emitting assembly of claim 3, wherein: the lens array comprises a first light path structure and two second light path structures;

6. The light emitting assembly of claim 1, wherein:

the laser array is connected with the corresponding chip through a bonding lead;

the detector array is connected with the corresponding bonding pad through a bonding lead.

7. The light emitting assembly of claim 1, wherein: the substrate is made of ceramic or metal.

8. The light emitting assembly of claim 1, wherein: the laser and the detector are attached to the substrate, the substrate is attached to the PCB, and the chip assembly is attached to the PCB.

9. The light emitting assembly of any one of claims 1 to 8, wherein: the chip is a four-channel electric chip, the laser arrays are four-channel laser arrays, and the detector arrays are four-channel detector arrays.

10. An optical module, characterized in that: comprising a number of light emitting assemblies as claimed in any one of claims 1 to 9.