CN217062047U

CN217062047U - Wafer extracting mechanism for semiconductor die bonder

Info

Publication number: CN217062047U
Application number: CN202220495871.5U
Authority: CN
Inventors: 李建龙; 郭军; 黄平
Original assignee: Shenzhen Zhenhao Semiconductor Testing Equipment Co ltd
Current assignee: Shenzhen Zhenhao Semiconductor Testing Equipment Co ltd
Priority date: 2022-03-07
Filing date: 2022-03-07
Publication date: 2022-07-26
Anticipated expiration: 2032-03-07

Abstract

The application discloses a wafer extracting mechanism for a semiconductor die bonder, which comprises a rotating mechanism, a lifting mechanism and a sucker assembly, wherein the rotating mechanism and the lifting mechanism are respectively connected with the sucker assembly; the rotating mechanism comprises a rotating driving piece and a rotating shaft, the rotating shaft is connected with the rotating driving piece, and the rotating shaft is connected with the sucker component; the lifting mechanism comprises a lifting driving piece, an eccentric shaft and a linkage mechanism, the lifting driving piece is connected with one end of the eccentric shaft, the other end of the eccentric shaft is connected with the linkage mechanism, a shifting fork is arranged on the linkage mechanism, and the lifting driving piece can drive the shifting fork to move up and down; the rotating shaft is provided with an elastic reset piece, the sucker bracket is provided with a roller, the elastic reset piece is connected with the sucker bracket, and the roller is abutted to the lower surface of the shifting fork. The method avoids laying a line or a pipeline in the rotating mechanism, and can effectively reduce the failure rate of equipment, thereby improving the processing efficiency of the die bonder; the overall structure is more compact, and the equipment and after-sale maintenance difficulty of the equipment are reduced.

Description

Wafer extracting mechanism for semiconductor die bonder

Technical Field

The application belongs to the field of automation equipment, and particularly relates to a wafer extracting mechanism for a semiconductor die bonder.

Background

A die bonder belongs to chip mounting equipment and is also called a die bonder. The size range of the semiconductor wafer is 0.2-2 mm, so that the manual extraction method is obviously inconvenient in the process of extracting and loading the wafer, and the existing mode is to install a wafer extracting mechanism on a wafer fixing machine.

Because the semiconductor chips are generally adhered to the blue film of the wafer ring and the thin film of the wafer ring in a centralized manner by a supplier, in the process of extracting the wafer, a wafer sucker in a wafer extracting mechanism needs to firstly descend to suck the wafer, then ascend, and finally rotate and feed; this necessitates that the wafer extraction mechanism include at least two sets of motion structures for elevation and rotation.

The rotary mechanism on the existing wafer extracting mechanism generally adopts a motor to drive a wafer sucker to rotate so as to complete the rotary feeding of the wafer; the lifting driving structure mainly comprises two driving types of air cylinders or servo motors, but no matter the air cylinders or the servo motors are adopted, lines or air pipes are inevitably required to be laid on the rotating mechanism.

The wafer extracting mechanism on the existing die bonder has the following technical problems:

1. the wafer extraction mechanism has a complex overall structure, which increases the difficulty of equipment assembly and after-sale maintenance.

2. After the die bonder works for a long time, the rotating mechanism in the wafer extracting mechanism rotates ceaselessly, and the wafer extracting mechanism inevitably contacts and rubs with a cable of a motor in the lifting mechanism or an air pipe of an air cylinder, so that the cable or the air pipe is abraded, and equipment is broken down.

SUMMERY OF THE UTILITY MODEL

In order to solve the technical problems in the prior art, the present application provides a wafer extracting mechanism for a semiconductor die bonder, wherein the die bonder comprises a supporting member and a controller, the wafer extracting mechanism comprises a conveying mechanism, the conveying mechanism is connected with the controller, and the conveying mechanism is mounted on the supporting member; the conveying mechanism comprises a rotating mechanism, a lifting mechanism and a sucker assembly which are respectively connected with a controller, and the rotating mechanism and the lifting mechanism are respectively connected with the sucker assembly; the rotating mechanism comprises a rotating driving piece and a rotating shaft, the rotating driving piece is connected with the supporting piece, the rotating shaft is connected with the rotating driving piece, and the rotating shaft is connected with the sucker component; the sucking disc assembly comprises a sucking disc support and a negative pressure sucking disc, the negative pressure sucking disc is installed on the sucking disc support, and the sucking disc support is connected with the rotating shaft; the lifting mechanism comprises a lifting driving piece, an eccentric shaft and a linkage mechanism, the lifting driving piece is connected with the supporting piece, the lifting driving piece is connected with one end of the eccentric shaft, the other end of the eccentric shaft is connected with the linkage mechanism, a shifting fork is arranged on the linkage mechanism, and the lifting driving piece can drive the shifting fork to move up and down; the elastic reset piece is arranged on the rotating shaft, the idler wheel is arranged on the sucker support, the elastic reset piece is connected with the sucker support, the idler wheel is abutted to the lower surface of the shifting fork, and the idler wheel can slide on the lower surface of the shifting fork.

As a further improvement of the application, the number of the lifting mechanisms and the number of the sucker assemblies are respectively two, and the left side and the right side of the rotating mechanism are respectively and symmetrically provided with the lifting mechanism and the sucker assembly; the two shifting forks on the lifting mechanism are distributed in a staggered mode in the horizontal direction, and the distance between the two shifting forks is larger than the distance for driving the shifting forks to move by the lifting mechanism.

As a further improvement of this application, follow on the rotation axis there is sucking disc lift guide respectively in the direction of motion of sucking disc support, on the sucking disc support with the relevant position punishment of sucking disc lift guide do not is equipped with sucking disc lift slider, sucking disc lift slider with sucking disc lift guide sliding connection.

As a further improvement of the application, the lifting driving member is a first motor, a rotating shaft of the first motor is provided with a coupling, and the coupling is connected with one end of the eccentric shaft; the linkage mechanism comprises a connecting piece, a transmission shaft and a linkage piece, one end of the connecting piece is rotatably connected with one end, away from the coupling, of the eccentric shaft, the other end of the connecting piece is rotatably connected with the transmission shaft, the transmission shaft is installed on the linkage piece, and the linkage piece is connected with the shifting fork.

As a further improvement of the application, two mounting holes are formed in the connecting piece, a first bearing and a second bearing are respectively arranged in the mounting holes, the first bearing is connected with one end, away from the eccentric shaft, of the coupler, the second bearing is connected with the transmission shaft, and the first bearing and the second bearing are respectively connected with the connecting piece through bearing seats.

As a further improvement of this application, first motor through first motor fixing base with support piece connects, be equipped with shift fork lift guide on the first motor fixing base, be equipped with shift fork lift slider on the linkage, shift fork lift slider with shift fork lift guide sliding connection.

As a further improvement of this application, be equipped with the sensor on the first motor fixing base, the sensor with the controller links to each other, be equipped with the shifting block on the linkage piece, the shifting block is followed linkage piece elevating movement, the shifting block can with the sensor meets.

As a further improvement of this application, the rotary driving piece is the second motor, the second motor pass through the second motor fixing base with support piece connects, the rotation axis is connected with the pivot of second motor, the second motor with the controller links to each other.

As a further improvement of this application, be equipped with vision positioning mechanism on the support piece, vision positioning mechanism with the controller links to each other, vision positioning mechanism be used for transport mechanism provides the vision location.

As a further improvement of this application, vision positioning mechanism is including getting material camera and blowing camera, get the material camera with the blowing camera respectively with the controller links to each other, get the material camera with the blowing camera respectively through the camera fixed block with support piece connects.

The beneficial effect of this application does:

the method avoids laying lines or pipelines in the rotating mechanism, and can effectively reduce the failure rate of equipment, thereby improving the processing efficiency of the die bonder; and the lifting mechanism and the rotating mechanism are independent in structure, can be independently assembled during assembly, and are respectively fixedly mounted on the supporting piece, so that the whole equipment structure is more compact, and the difficulty in assembly and after-sale maintenance of the equipment is reduced.

Specifically, when the wafer extracting mechanism works, the rotary driving piece drives the rotary shaft and the sucker assembly to rotate, so that the sucker assembly is driven to reach a preset feeding and discharging position; when the sucker component needs to descend for sucking or discharging materials, the lifting driving piece drives the eccentric wheel to rotate, the eccentric wheel drives the linkage mechanism and the shifting fork to descend, the shifting fork presses the roller to descend synchronously, the roller drives the sucker component to descend so as to complete sucking or discharging materials, and meanwhile, the sucker component stretches the elastic resetting piece; when sucking material or blowing completion back sucking disc subassembly need rise, the eccentric wheel of lift driving piece drive is rotatory, and eccentric wheel drive link gear and shift fork rise, and the shift fork breaks away from the oppression to the gyro wheel this moment, and under the effect of elasticity reset piece elasticity, pulling sucking disc subassembly rises until gyro wheel and shift fork butt to accomplish the material or the blowing of inhaling of wafer.

Drawings

In order to more clearly illustrate the present application or prior art solutions, a brief description of the drawings needed for the embodiments or prior art descriptions is provided below, and it is obvious that the drawings in the following description are some embodiments of the present application, and that other drawings can be obtained by those skilled in the art without inventive effort.

FIG. 1 is a schematic diagram of the overall structure of an embodiment of the present application;

FIG. 2 is a schematic view of the overall structure of the carrying mechanism in the embodiment of the present application;

FIG. 3 is a schematic view of the overall structure of the rotating mechanism and the chuck assembly in the embodiment of the present application;

FIG. 4 is a schematic view of the overall structure of the lifting mechanism in the embodiment of the present application;

FIG. 5 is an exploded view of the lift mechanism of the embodiment of the present application;

fig. 6 is a schematic view of the eccentric shaft structure in the embodiment of the present application.

Detailed Description

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application; the terms "including" and "having," and any variations thereof in the description and claims of this application and the description of the figures above, are intended to cover non-exclusive inclusions. The terms "first," "second," and the like in the description and claims of this application or in the above-described drawings are used for distinguishing between different objects and not for describing a particular order.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein may be combined with other embodiments.

In order to make the technical solutions better understood by those skilled in the art, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings.

As shown in fig. 1-6, a wafer picking mechanism for a semiconductor die bonder comprises a support 1 and a controller, wherein the support 1 is used for mounting the wafer picking mechanism, and the controller can control the operation of the wafer picking mechanism. The wafer extracting mechanism comprises a conveying mechanism and a visual positioning mechanism 2, the conveying mechanism and the visual positioning mechanism 2 are respectively connected with the controller, and the visual positioning mechanism 2 is used for providing visual positioning for the conveying mechanism; the visual positioning mechanism 2 comprises a material taking camera 21 and a material placing camera 22, the material taking camera 21 and the material placing camera 22 are respectively installed on the support piece 1 through camera fixing blocks 23, the material taking camera 21 is arranged right above the position where the wafer is sucked by the wafer extracting mechanism, and the material placing camera 22 is arranged right above the position where the wafer is placed by the wafer extracting mechanism.

When the wafer picking device works, whether the conveying mechanism reaches a wafer feeding position is judged through the material taking camera 21, when the conveying mechanism reaches the feeding position, the material taking camera 21 sends a signal to the controller, and the controller controls the conveying mechanism to suck the wafer; on the other hand, whether the conveying mechanism reaches the wafer placing position is judged by the placing camera 22, and after the conveying mechanism reaches the placing position, the placing camera 22 sends a signal to the controller, and the controller controls the conveying mechanism to release the wafer.

The conveying mechanism comprises a rotating mechanism 3, a lifting mechanism 4 and a sucker assembly 5 which are respectively connected with the controller, and the rotating mechanism 3 and the lifting mechanism 4 are respectively connected with the sucker assembly 5; the sucker assembly 5 is used for sucking and releasing a wafer, the rotating mechanism 3 is used for driving the sucker assembly 5 to rotate, and the lifting mechanism 4 is used for driving the sucker assembly 5 to lift.

The rotating mechanism 3 comprises a rotating driving part and a rotating shaft 31, wherein the rotating driving part is a second motor 32, the second motor 32 is connected with the controller, the second motor 32 is fixedly connected with the supporting part 1 through a second motor fixing seat 33, a rotating shaft of the second motor 32 is fixedly connected with the rotating shaft 31, and the rotating shaft 31 is in sliding limit connection with the sucker component 5. When the wafer sucking and releasing device works, the controller controls the second motor 32 to rotate, the second motor 32 drives the rotating shaft 31 to synchronously rotate, and the rotating shaft 31 drives the sucker assembly 5 to synchronously rotate to suck or release a wafer.

The quantity of sucking disc subassembly 5 has two, and two sucking disc subassemblies 5 are installed in the left and right sides of rotation axis 31 in the symmetry dorsad, and sucking disc subassembly 5 includes sucking disc support 51 and negative pressure sucking disc 52, and negative pressure sucking disc 52 installs on sucking disc support 51, and negative pressure sucking disc 52 is used for external negative pressure device, is convenient for hold the wafer, sucking disc support 51 and rotation axis 31 sliding connection.

The number of the lifting mechanisms 4 is two, the two lifting mechanisms 4 are arranged in one-to-one correspondence with the positions of the two sucker assemblies 5, each lifting mechanism 4 comprises a lifting driving piece, an eccentric shaft 41 and a linkage mechanism 42, the lifting driving piece is a first motor 43, and the central axis of one end of the eccentric shaft 41 is parallel to the central axis of the other end but does not coincide with the central axis of the other end of the eccentric shaft; the first motor 43 is fixedly connected with the support member 1 through the first motor fixing seat 44, a shaft coupling 45 is connected to a rotating shaft of the first motor 43, the shaft coupling 45 is fixedly connected with one end of the eccentric shaft 41, the other end of the eccentric shaft 41 is connected with the linkage mechanism 42, a shifting fork 46 is arranged on the linkage mechanism 42, and the first motor 43 can drive the shifting fork 46 to move up and down.

An elastic reset piece is arranged on the rotating shaft 31, the elastic reset piece is a strong spring 6, a roller 7 is fixedly arranged on the sucker bracket 51, the other end of the strong spring 6 is fixedly connected with the sucker bracket 51, and the roller 7 is abutted against the lower surface of the shifting fork 46; when the rotation mechanism 3 drives the sucker assembly 5 to rotate, the roller 7 can roll or slide on the lower surface of the shifting fork 46.

When the wafer extracting mechanism works, the second motor 32 drives the rotating shaft 31 and the sucker assembly 5 to rotate, so that the sucker assembly 5 is driven to reach a preset feeding position and a preset discharging position; when the sucker component 5 needs to descend for sucking or discharging materials, the first motor 43 drives the eccentric wheel 41 to rotate, the eccentric wheel 41 drives the linkage mechanism 42 and the shifting fork 46 to descend, the shifting fork 46 presses the roller 7 to descend synchronously, the roller 7 drives the sucker component 5 to descend so as to finish sucking or discharging materials, and meanwhile, the sucker bracket 51 stretches the strong spring 6; when the sucker assembly 5 needs to ascend after the material sucking or discharging is completed, the first motor 43 drives the eccentric wheel 41 to rotate, the eccentric wheel 41 drives the linkage mechanism 42 and the shifting fork 46 to ascend, the shifting fork 46 breaks away from the pressing on the roller 7 at the moment, and the sucker assembly 5 moves upwards under the action of the elastic force of the strong spring 6 until the roller 7 is abutted against the shifting fork 46, so that the sucker assembly 5 is reset upwards.

In this embodiment, the shifting forks 46 on the two lifting mechanisms 4 are distributed in a staggered manner in the horizontal direction, and the distance between the two shifting forks 46 is greater than the distance for driving the shifting forks 46 to move by the first motor 43, so that the two shifting forks 46 are ensured not to collide when lifting; through two shift forks 46 dislocation set, can guarantee that one of them sucking disc subassembly 5 is when absorbing the wafer, another sucking disc subassembly 5 is at the release wafer, ensures that every sucking disc subassembly 5 all controls at 180 at the rotation angle on the horizontal direction, when getting the material or after the blowing is accomplished, second motor 32 antiport 180, can make two sucking disc subassembly 5's position exchange, so repeated work has improved this wafer extraction mechanism's work efficiency.

In order to limit and guide the lifting motion of the suction cup bracket 51, suction cup lifting guide parts 311 are respectively arranged on the rotating shaft 31 along the motion direction of the suction cup assembly 5, suction cup lifting slide parts 511 are respectively arranged at the positions, corresponding to the suction cup lifting guide parts 311, on the suction cup bracket 51, and the suction cup lifting slide parts 511 are slidably connected with the suction cup lifting guide parts 311. The cooperation between the suction cup lifting guide 311 and the suction cup lifting slider 511 can guide the movement direction of the suction cup holder 51 in a limited manner, thereby improving the processing accuracy of the wafer picking mechanism.

The linkage mechanism 42 comprises a connecting piece 421, a transmission shaft 422 and a linkage piece 423, wherein one end of the connecting piece 421 is rotatably connected with one end of the eccentric shaft 41 far away from the coupling 45, the other end of the connecting piece 421 is rotatably connected with the transmission shaft 422, the transmission shaft 422 is fixedly arranged on the linkage piece 423, and the linkage piece 423 is fixedly connected with the shifting fork 46. Two mounting holes 424 are formed in the connecting piece 421, a first bearing 425 and a second bearing 426 are respectively mounted on the two mounting holes 424, the first bearing 425 is connected with one end, away from the coupler 45, of the eccentric shaft 41, the transmission shaft 422 is inserted into the corresponding mounting hole 424 and fixedly connected with the second bearing 426, and the first bearing 425 and the second bearing 426 are respectively and fixedly connected with the connecting piece 421 through the bearing seat 8; when the first motor 43 is operated, the eccentric shaft 41 rotates to drive the connecting member 421 to move in an arc, and at this time, the first bearing 425 and the second bearing 426 rotate in the mounting hole 424, and the second bearing 426 pulls the transmission shaft 422 to move up and down, thereby driving the connecting member 423 and the shift fork 46 to move up and down.

In order to limit and guide the movement direction of the shifting fork 46, a shifting fork lifting guide 47 is mounted on the first motor fixing seat 44, the direction of the shifting fork lifting guide 47 is vertical to the horizontal direction, a shifting fork lifting sliding part 48 is mounted on the linkage 423, and the shifting fork lifting sliding part 48 is in sliding connection with the shifting fork lifting guide 47; the connection between the fork lifting slide 48 and the fork lifting guide 47 ensures that the fork 46 can only move in the lifting direction, thereby improving the processing precision of the wafer extracting mechanism.

In order to control the movement stroke of the shifting fork 46, the two first motor fixing seats 44 are respectively provided with a sensor 9, the sensors 9 are respectively connected with a controller, the linkage member 423 is provided with a shifting block 10, the shifting block 10 can move up and down along with the linkage member 423, when the linkage member 423 is driven by the first motor 43 to fall to a certain extent, the shifting block 10 can be connected with the sensors 9, the sensors 9 feed back signals, and the controller controls the first motor 43 to stop rotating. The descending distance of the link 423 and the shifting fork 46 can be controlled by arranging the sensor 9, so that the descending distance of the sucker assembly 5 is consistent every time, and the processing precision of the wafer extracting mechanism is improved.

The process of the wafer picking mechanism for sucking the wafer is as follows:

firstly, the first motor 43 works to drive the eccentric shaft 41 to rotate, the eccentric shaft 41 drives the connecting piece 421 to move, the connecting piece 421 drives the connecting piece 423 and the shifting fork 46 to slide downwards on the shifting fork lifting guide piece 47, the shifting fork 46 presses the roller 7 to descend, meanwhile, the sucker support 51 can pull up the strong spring 6, the roller 7 drives the sucker support 51 and the negative pressure sucker 52 to slide downwards on the sucker lifting guide piece 311, when the negative pressure sucker 52 descends to a position capable of sucking a wafer, the shifting block 10 is connected with the sensor 9, the sensor 9 sends a signal to the controller, and the controller controls the first motor 43 to stop working, so that the shifting fork 46 and the negative pressure sucker 52 stop descending; at this time, the negative pressure suction cup 52 starts to work, and sucks up the wafer on the loading position; after the negative pressure sucker 52 sucks the wafer, the first motor 43 rotates reversely to drive the shifting fork 46 to move upwards, the shifting fork 46 is separated from pressing the roller 7, and the sucker bracket 51 and the negative pressure sucker 52 are pulled to slide upwards on the sucker guide part 311 under the action of the elastic force of the strong spring 6; next, the second motor 32 starts to work, the rotating shaft 31 is driven to rotate, the rotating shaft 31 drives the suction cup support 51 and the negative pressure suction cup 52 to rotate, the roller 7 rolls or slides on the lower surface of the shifting fork 46, after the placing camera 22 detects the negative pressure suction cup 52, the placing camera 22 feeds back a signal to the controller, and the controller controls the second motor 32 to stop rotating, so that the negative pressure suction cup 52 is stopped at the wafer placing position.

The process of releasing the wafer by the wafer picking mechanism is as follows:

firstly, the first motor 43 works to drive the eccentric shaft 41 to rotate, the eccentric shaft 41 drives the connecting piece 421 to move, the connecting piece 421 drives the connecting piece 423 and the shifting fork 46 to slide downwards on the shifting fork lifting guide piece 47, the shifting fork 46 presses the roller 7 to descend, meanwhile, the sucker support 51 can pull up the strong spring 6, the roller 7 drives the sucker support 51 and the negative pressure sucker 52 to slide downwards on the sucker lifting guide piece 311, when the negative pressure sucker 52 descends to a position for releasing a wafer, the shifting block 10 is connected with the sensor 9, the sensor 9 sends a signal to the controller, and the controller controls the first motor 43 to stop working, so that the shifting fork 46 and the negative pressure sucker 52 stop descending; at this time, the vacuum chuck 52 starts to work, releasing the wafer to a predetermined position; after the negative pressure sucker 52 sucks the wafer, the first motor 43 rotates reversely to drive the shifting fork 46 to move upwards, the shifting fork 46 is separated from pressing the roller 7, and the sucker bracket 51 and the negative pressure sucker 52 are pulled to slide upwards on the sucker guide part 311 under the action of the elastic force of the strong spring 6; next, the second motor 32 starts to work, the rotating shaft 31 is driven to rotate, the rotating shaft 31 drives the suction cup support 51 and the negative pressure suction cup 52 to rotate, the roller 7 rolls or slides on the lower surface of the shifting fork 46, when the material taking camera 21 detects the negative pressure suction cup 52, the material taking camera 21 feeds back a signal to the controller, the controller controls the second motor 32 to stop rotating, and the negative pressure suction cup 52 is stopped at the wafer loading position.

It should be noted that the processes of sucking the wafer and releasing the wafer by the wafer picking mechanism can be performed synchronously, that is, one of the chuck assemblies 5 sucks the wafer while the other chuck assembly 5 just releases the wafer, and it is only necessary to ensure that the rotation angle of each chuck support 51 is controlled at 180 °, so that the processing efficiency of the wafer picking mechanism can be doubled.

It should be understood that the above-described embodiments are merely exemplary of some, and not all, embodiments of the present application, and that the drawings illustrate preferred embodiments of the present application without limiting the scope of the claims appended hereto. This application is capable of embodiments in many different forms and is provided for the purpose of enabling a thorough understanding of the disclosure of the application. Although the present application has been described in detail with reference to the foregoing embodiments, it will be apparent to one skilled in the art that the present application may be practiced without modification or with equivalents of some of the features described in the foregoing embodiments. All equivalent structures made by using the contents of the specification and the drawings of the present application are directly or indirectly applied to other related technical fields and are within the protection scope of the present application.

Claims

1. A wafer extraction mechanism for a semiconductor die bonder, the die bonder comprising a support and a controller, characterized in that: the wafer extracting mechanism comprises a conveying mechanism, the conveying mechanism is connected with the controller, and the conveying mechanism is installed on the supporting piece;

the conveying mechanism comprises a rotating mechanism, a lifting mechanism and a sucker assembly which are respectively connected with a controller, and the rotating mechanism and the lifting mechanism are respectively connected with the sucker assembly;

the rotating mechanism comprises a rotating driving piece and a rotating shaft, the rotating driving piece is connected with the supporting piece, the rotating shaft is connected with the rotating driving piece, and the rotating shaft is connected with the sucker assembly;

the sucking disc assembly comprises a sucking disc bracket and a negative pressure sucking disc, the negative pressure sucking disc is arranged on the sucking disc bracket, and the sucking disc bracket is connected with the rotating shaft;

the lifting mechanism comprises a lifting driving piece, an eccentric shaft and a linkage mechanism, the lifting driving piece is connected with the supporting piece, the lifting driving piece is connected with one end of the eccentric shaft, the other end of the eccentric shaft is connected with the linkage mechanism, a shifting fork is arranged on the linkage mechanism, and the lifting driving piece can drive the shifting fork to move up and down;

the elastic reset piece is arranged on the rotating shaft, the idler wheel is arranged on the sucker support, the elastic reset piece is connected with the sucker support, the idler wheel is abutted to the lower surface of the shifting fork, and the idler wheel can slide on the lower surface of the shifting fork.

2. The wafer extraction mechanism for a semiconductor die bonder as claimed in claim 1, wherein: the number of the lifting mechanisms and the number of the sucker assemblies are two, and the left side and the right side of the rotating mechanism are symmetrically provided with one lifting mechanism and one sucker assembly respectively;

the two shifting forks on the lifting mechanism are distributed in a staggered mode in the horizontal direction, and the distance between the two shifting forks is larger than the distance for driving the shifting forks to move by the lifting mechanism.

3. The wafer extraction mechanism for a semiconductor die bonder as claimed in claim 2, wherein: the sucking disc lifting guide piece is arranged on the rotating shaft along the moving direction of the sucking disc support respectively, sucking disc lifting sliding pieces are arranged on the sucking disc support and at the corresponding positions of the sucking disc lifting guide piece respectively, and the sucking disc lifting sliding pieces are connected with the sucking disc lifting guide piece in a sliding mode.

4. The wafer extraction mechanism for a semiconductor die bonder as claimed in claim 2, wherein: the lifting driving piece is a first motor, a rotating shaft of the first motor is provided with a coupler, and the coupler is connected with one end of the eccentric shaft;

the linkage mechanism comprises a connecting piece, a transmission shaft and a linkage piece, one end of the connecting piece is rotatably connected with one end, away from the coupling, of the eccentric shaft, the other end of the connecting piece is rotatably connected with the transmission shaft, the transmission shaft is installed on the linkage piece, and the linkage piece is connected with the shifting fork.

5. The wafer extraction mechanism for a semiconductor die bonder as claimed in claim 4, wherein: the connecting piece is provided with two mounting holes, a first bearing and a second bearing are respectively arranged in the mounting holes, the first bearing is connected with one end, away from the coupler, of the eccentric shaft, the second bearing is connected with the transmission shaft, and the first bearing and the second bearing are respectively connected with the connecting piece through bearing seats.

6. The wafer extraction mechanism for a semiconductor die bonder as claimed in claim 4, wherein: the first motor is connected with the supporting piece through a first motor fixing seat, a shifting fork lifting guide piece is arranged on the first motor fixing seat, a shifting fork lifting sliding piece is arranged on the linkage piece, and the shifting fork lifting sliding piece is connected with the shifting fork lifting guide piece in a sliding mode.

7. The wafer extraction mechanism for a semiconductor die bonder as claimed in claim 6, wherein: the sensor is arranged on the first motor fixing seat and connected with the controller, the shifting block is arranged on the linkage piece and moves up and down along with the linkage piece, and the shifting block can be connected with the sensor.

8. The wafer extraction mechanism for a semiconductor die bonder as claimed in any one of claims 1 to 7, wherein: the rotary driving part is a second motor, the second motor is connected with the supporting part through a second motor fixing seat, the rotating shaft is connected with a rotating shaft of the second motor, and the second motor is connected with the controller.

9. The wafer extraction mechanism for a semiconductor die bonder as claimed in any one of claims 1 to 7, wherein: the supporting piece is provided with a visual positioning mechanism, the visual positioning mechanism is connected with the controller, and the visual positioning mechanism is used for providing visual positioning for the conveying mechanism.

10. The wafer extraction mechanism for a semiconductor die bonder as claimed in claim 9, wherein: the vision positioning mechanism comprises a material taking camera and a material placing camera, the material taking camera and the material placing camera are respectively connected with the controller, and the material taking camera and the material placing camera are respectively connected with the supporting piece through camera fixing blocks.