CN217062032U

CN217062032U - Support plate for placing silicon wafers

Info

Publication number: CN217062032U
Application number: CN202220458898.7U
Authority: CN
Inventors: 刘翠翠; 余杰
Original assignee: Jiangxi Hankefan Semiconductor Technology Co ltd
Current assignee: Jiangxi Hankefan Semiconductor Technology Co ltd
Priority date: 2022-03-03
Filing date: 2022-03-03
Publication date: 2022-07-26
Anticipated expiration: 2032-03-03

Abstract

The utility model discloses a support plate of usefulness is placed to silicon chip, including the support plate main part, be provided with a plurality of step groove, a plurality of in the support plate main part and dodge groove and a plurality of mounting hole, the step groove is in with the distance setting at intervals each other in the support plate main part, dodge the groove with the step groove communicates with each other. The utility model discloses in, support plate single loading height, it is few with the silicon chip contact surface, and silicon chip bottom contactless, avoid too much contact to cause the silicon chip to pollute, be provided with magnet in the mounting hole simultaneously, compress tightly the silicon chip through magnet absorption, guaranteed can not rock in service and lead to dropping or scotch.

Description

Support plate for placing silicon wafers

Technical Field

The utility model belongs to the technical field of the silicon chip production technique and specifically relates to a support plate of usefulness is placed to silicon chip.

Background

With the continuous improvement of the solar cell requirements in recent two years, the unit capacity of the core equipment for preparing the solar cell film is required to be continuously improved

So as to meet the fundamental requirements of the whole production line, the requirements on the carrier plate for bearing the silicon wafer are higher and higher. However, the loading capacity of the existing carrier plate is low, and the film coating yield of the silicon wafer cannot meet the requirement; most of the carrier plates are thin, and the carrier plates can shake in the process of moving into a cavity for coating, so that the silicon wafers fall off, and the fragment rate is obviously improved. Most of silicon wafers in the market are picked and placed or vacuum chucks are used, and the shadows of the chucks are left on the silicon wafers, so that the coating is not uniform or the silicon wafers are polluted. In addition, the contact part of the carrier plate and the silicon wafer is also larger, which is easy to cause the defect and pollution of the part.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving the technical problem and providing a support plate for placing silicon wafers.

The technical scheme of the utility model: a carrier plate for placing silicon wafers comprises a carrier plate main body, wherein a plurality of step grooves, a plurality of avoiding grooves and a plurality of mounting holes are formed in the carrier plate main body, the step grooves are arranged on the carrier plate main body at intervals of the same distance, and the avoiding grooves are communicated with the step grooves.

Preferably, the distance between the bearing surface of the stepped groove and the carrier plate main body is 0.8-1.2 mm.

Preferably, the step groove is a square groove, and four corners of the step groove are subjected to chamfering treatment to form right angles.

The utility model has the advantages that: the utility model discloses in, support plate single loading height, it is few with the silicon chip contact surface, and silicon chip bottom contactless, avoid too much contact to cause the silicon chip to pollute, be provided with magnet in the mounting hole simultaneously, compress tightly the silicon chip through magnet absorption, guaranteed can not rock in service and lead to dropping or scotch.

Drawings

FIG. 1 is a top view of the overall structure of the preferred embodiment of the present invention;

FIG. 2 is a cross-sectional view along AA of FIG. 1;

FIG. 3 is an enlarged view of a portion of FIG. 2 at B;

fig. 4 is a partially enlarged view of fig. 1 at C.

Reference numerals: a carrier body 10, a step groove 101, an avoidance groove 102, and a mounting hole 103.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts all belong to the protection scope of the present invention.

Referring to fig. 1 to 4, a carrier for placing silicon wafers comprises a carrier main body 10, wherein the carrier main body 10 is provided with a plurality of step grooves 101, a plurality of avoidance grooves 102 and a plurality of mounting holes 103, the step grooves 101 are arranged on the carrier main body 10 at the same distance, and the avoidance grooves 102 are communicated with the step grooves 101. The utility model discloses in, the support plate uses with the cooperation of silicon chip production line, grabbing device on the production line once only snatchs 15 silicon chips and puts into the face of accepting in step groove 101, dodge the effect of groove 102 make on the grabbing device clamping jaw downstream after not contact with support plate main part 10, be provided with magnet in the mounting hole 103 simultaneously, the last clamping jaw of grabbing device has the silicon chip preforming, the preforming also is placed on support plate main part 10 after placing the silicon chip, compress tightly the silicon chip through strength magnets, guaranteed can not rock in service and lead to dropping or scotch.

As a preferred embodiment of the present invention, it may also have the following additional technical features:

in the embodiment, the distance between the bearing surface of the step groove 101 and the carrier plate main body 10 is 0.8-1.2mm, the contact part between the side edge of the step groove 101 and the silicon wafer is about 1.0mm, and the bottom of the step groove is not contacted, so that the problem of pollution caused by excessive contact is solved.

In this embodiment, the step groove 101 is a square groove, and four corners of the square groove are chamfered to form right angles.

It is to be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in the process, method, article, or apparatus that comprises the element.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A support plate for placing a silicon wafer is characterized in that: including support plate main part (10), be provided with a plurality of step groove (101), a plurality of on support plate main part (10) and dodge groove (102) and a plurality of mounting hole (103), step groove (101) separate the same distance setting each other on support plate main part (10), dodge groove (102) with step groove (101) communicate with each other.

2. The carrier board according to claim 1, wherein: the distance between the bearing surface of the step groove (101) and the carrier plate main body (10) is 0.8-1.2 mm.

3. The carrier plate according to claim 1, wherein: the step groove (101) is a square groove, and four corners of the step groove are processed to be right angles through chamfering.