CN217058482U - High-efficiency heat exchanger - Google Patents
High-efficiency heat exchanger Download PDFInfo
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- CN217058482U CN217058482U CN202123325096.3U CN202123325096U CN217058482U CN 217058482 U CN217058482 U CN 217058482U CN 202123325096 U CN202123325096 U CN 202123325096U CN 217058482 U CN217058482 U CN 217058482U
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Abstract
The utility model provides a high-efficiency heat exchanger, which mainly comprises a water inlet chamber, a water outlet chamber, a heat exchange belt, a semiconductor refrigerator and two air cooling chambers; the water inlet chamber and the water outlet chamber are both of cuboid hollow structures; the water inlet chamber and the water outlet chamber are parallel to each other and form an integrated structure with the heat exchange belt; the heat exchange belt is a plate surface structure consisting of a plurality of heat exchange tubes; the heat exchange tube is connected with the hollow parts of the water inlet chamber and the water outlet chamber; the two air cooling chambers are arranged on the two sides of the water inlet chamber and the water outlet chamber along the length direction; the semiconductor refrigerator is arranged on the plate surface formed by the heat exchange belt. The utility model relates to a high-efficiency heat exchanger, because of the clearance between the heat exchange tubes, the heat is carried by the air and contacts with the heat exchange tubes from different directions, thereby maximizing the heat exchange area and improving the heat exchange efficiency; the added semiconductor refrigerator and the air cooling chamber can further cool the water flow in the heat exchange tube on one hand; on the other hand, when the heat exchange belt can not meet the heat exchange requirement, an auxiliary effect can be provided.
Description
Technical Field
The utility model mainly relates to the technical field of heat exchangers, especially, relate to a high-efficient heat exchanger.
Background
The heat exchanger is an energy-saving device for transferring heat between two or more than two kinds of fluid at different temperatures, and is used for transferring heat from the fluid with higher temperature to the fluid with lower temperature to make the temperature of the fluid reach the index specified by the process so as to meet the requirements of process conditions, and is also one of the main devices for improving the energy utilization rate, so that the heat exchanger is widely applied to more than 30 technical fields of heating and ventilation, pressure vessels, reclaimed water treatment equipment, chemical engineering, petroleum and the like. Most of the heat exchangers in the existing market have small effective heat exchange area and poor heat exchange effect. Therefore, further improvements are needed.
SUMMERY OF THE UTILITY MODEL
In order to solve the technical problems of poor heat exchange effect, low efficiency and the like of the existing heat exchanger, the utility model provides a high-efficiency heat exchanger.
The utility model provides a technical scheme does:
the utility model provides a high-efficiency heat exchanger, which comprises a water inlet chamber, a water outlet chamber, a heat exchange belt, a semiconductor refrigerator and two air cooling chambers; the water inlet chamber and the water outlet chamber are both of rectangular hollow structures; the water inlet chamber and the water outlet chamber are parallel to each other and form an integrated structure with the heat exchange belt; the heat exchange belt is a plate surface structure formed by a plurality of heat exchange tubes; the heat exchange tube is connected with the hollow parts of the water inlet chamber and the water outlet chamber; the two air cooling chambers are arranged on two sides of the water inlet chamber and the water outlet chamber along the length direction; the semiconductor refrigerator is arranged on the plate surface formed by the heat exchange belts; the water inlet chamber and the water outlet chamber are respectively connected with a water inlet pipe and a water outlet pipe outwards; the air cooling chamber is hollow, and two ends of the air cooling chamber are respectively connected with an air inlet pipe and an air outlet pipe.
Preferably, a plurality of heat exchange plates are arranged among the heat exchange tubes; the surface of the heat exchange plate is perpendicular to the axis of the heat exchange tube.
Preferably, the semiconductor refrigerator comprises a serpentine cooling pipe and a plurality of aluminum refrigerating sheets; all the aluminum refrigerating plates are arranged in parallel; the cooling pipe is in a snake shape and penetrates through all the refrigeration sheets.
Preferably, the semiconductor refrigerator is arranged on the plate surface formed by the heat exchange belts through four groups of fixing assemblies; the four groups of fixing assemblies are respectively arranged at the bent positions of the snakelike cooling pipes; the fixing assembly comprises a first fixing ring and a second fixing ring which are arranged on two sides of the heat exchange belt; the first fixing ring and the second fixing ring are connected through a screw; the screw rod is arranged between the two adjacent heat exchange plates.
Preferably, a metal fixing plate is fixedly arranged between the water inlet chamber and the water outlet chamber; and two ends of the air cooling chamber are arranged on the metal fixing plate through connecting pieces.
The utility model has the advantages that:
the high-efficiency heat exchanger provided by the utility model has the advantages that because the gaps exist among the heat exchange tubes, heat is carried by air and is contacted with the heat exchange tubes from different directions, so that the heat exchange area is maximized, and the heat exchange efficiency is improved; the added semiconductor cooler and the air cooling chamber can further cool the water flow in the heat exchange tube; on the other hand, when the heat exchange belt can not meet the heat exchange requirement, the auxiliary cooling function can be provided.
Drawings
The invention and its features, aspects and advantages will become more apparent from a reading of the following detailed description of non-limiting embodiments with reference to the attached drawings. Like reference symbols in the various drawings indicate like elements. The drawings are not intended to be drawn to scale, emphasis instead being placed upon illustrating the principles of the invention.
FIG. 1 is a perspective view of the present invention;
FIG. 2 is a perspective view of another embodiment of the present invention;
FIG. 3 is a perspective view of the semiconductor cooler of the present invention;
Detailed Description
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application.
It will be understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof.
As the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. appear, their indicated orientation or positional relationship is based on that shown in the drawings, merely for convenience in describing the invention and simplifying the description, and does not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the invention.
The appearances of the terms first, second, and third, if any, are used for descriptive purposes only and are not intended to be limiting or imply relative importance.
Unless expressly stated or limited otherwise, the terms "mounted," "connected," and "coupled" are to be construed broadly and encompass, for example, both fixed and removable coupling as well as integral coupling; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The technical solutions in the embodiments of the present invention are described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, and not all embodiments. Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative efforts belong to the protection scope of the present invention.
Example 1
In order to solve the technical problems of poor heat exchange effect, low efficiency and the like of the existing heat exchanger, the embodiment of the utility model provides a high-efficiency heat exchanger, which comprises a water inlet chamber 1, a water outlet chamber 2, a heat exchange belt 3, a semiconductor refrigerator 4 and two air cooling chambers 5; the water inlet chamber 1 and the water outlet chamber 2 are both in cuboid hollow structures; the water inlet chamber 1 and the water outlet chamber 2 are parallel to each other and form an integrated structure with the heat exchange belt 3; the heat exchange belt 3 is a plate surface structure formed by a plurality of heat exchange tubes 301; the heat exchange tube 301 is communicated with the hollow parts of the water inlet chamber 1 and the water outlet chamber 2; the two air cooling chambers 5 are arranged at two sides of the water inlet chamber 1 and the water outlet chamber 2 along the length direction; the semiconductor refrigerator 4 is arranged on the plate surface formed by the heat exchange belt 3, and the semiconductor refrigerator 4 is used for refrigerating through electric power; the water inlet chamber 1 and the water outlet chamber 2 are respectively connected with a water inlet pipe 6 and a water outlet pipe 7 outwards; the air cooling chamber 5 is hollow and has two ends connected with an air inlet pipe 8 and an air outlet pipe 9 respectively.
When the high-efficiency heat exchanger related to the embodiment works, the water inlet pipe 6 sends water to the water inlet chamber 1, the water in the water inlet pipe 6 is divided into a plurality of heat exchange pipes 301, the low-temperature cooling water in the heat exchange pipes 301 exchanges heat and finally converges into the water outlet chamber 2 and is discharged from the water outlet pipe 7, and in the process, as gaps exist among the heat exchange pipes 301, the heat is carried by air and is contacted with the heat exchange pipes 301 from different directions, so that the heat exchange area is maximized, and the heat exchange efficiency is improved; the additionally arranged semiconductor refrigerator 4 and the air cooling chamber 5 can further cool water flow in the heat exchange pipe 301 on one hand, and can provide an auxiliary effect when the heat exchange belt 3 cannot meet the heat exchange requirement on the other hand; wherein, the air cooling chamber 5 is internally communicated with low-temperature air and the semiconductor refrigerator 4 is externally connected with a power supply;
the heat transfer efficiency of the metal is far better than that of the air, and in order to further improve the overall heat exchange efficiency of the heat exchanger, a plurality of copper heat exchange plates 10 are preferably arranged among the plurality of heat exchange tubes 301 in the implementation; the surface of the heat exchange plate 10 is vertical to the axis of the heat exchange tube 301; the semiconductor refrigerator 4 comprises a serpentine cooling pipe 401 and a plurality of aluminum refrigeration sheets 402; all the aluminum refrigeration plates 402 are arranged in parallel; the cooling pipe 401 is arranged to penetrate all the refrigeration sheets 402 in a serpentine shape; the heat is carried by the air, passes through the gap formed by the heat exchange tube 301 and the heat exchange plate 10 and is contacted with the tube surface of the heat exchange tube 301 and the plate surface of the heat exchange plate 10, and under the action of metal conduction, the heat can be contacted with cooling water more quickly and heat transfer is completed; the semiconductor refrigerator 4 has the characteristics of no noise, no vibration, no need of a refrigerant, small volume, light weight and the like, and is reliable in work, simple and convenient to operate, easy to adjust the cooling capacity and suitable for auxiliary refrigeration.
In the present embodiment, it is preferable that semiconductor cooler 4 is mounted on the plate surface constituted by heat exchanging belts 3 through four sets of fixing members 12; the serpentine cooling pipe 401 has a plurality of bent positions, and the four groups of fixing assemblies 12 are respectively arranged at the bent positions of the serpentine cooling pipe 401; the fixing unit 12 includes a first fixing ring 1201 and a second fixing ring 1202 provided at both sides of the heat exchanging tape 3; the first fixing ring 1201 and the second fixing ring 1202 are connected by a screw 1203, the first fixing ring 1201 and the second fixing ring 1202 are used for determining the horizontal position of the semiconductor cooler 4, and the screw 1203 is used for determining the vertical orientation of the semiconductor cooler 4; the screw 1203 is arranged between two adjacent heat exchange plates 10, and the stability of the screw 1203 in the vertical direction is ensured by the clamping action between the heat exchange plates 10.
In the embodiment, preferably, a metal fixing plate 13 is fixedly arranged between the water inlet chamber 1 and the water outlet chamber 2; the two ends of the air-cooling chamber 5 are mounted on the metal fixing plate 13 through the connecting members, which is similar to the heat exchange plate 10 and the aluminum cooling plate 402, on one hand, the metal fixing plate 13 can improve the heat transfer efficiency between the hot air and the air-cooling chamber 5; on the other hand, the metal fixing plate 13 can stabilize the relative positions of the water inlet chamber 1 and the water outlet chamber 2, and the overall stability of the device is improved.
The above-described embodiments are merely illustrative of the principles and utilities of the present patent application and are not intended to limit the present patent application. Those skilled in the art can modify and/or change the above-described embodiments without departing from the spirit and scope of the present application. Accordingly, it is intended that all equivalent modifications or changes which may be made by those skilled in the art without departing from the spirit and scope of the present disclosure shall be covered by the claims of this patent application.
Claims (5)
1. A high-efficiency heat exchanger is characterized by comprising a water inlet chamber, a water outlet chamber, a heat exchange band, a semiconductor refrigerator and two air cooling chambers; the water inlet chamber and the water outlet chamber are both of rectangular hollow structures; the water inlet chamber and the water outlet chamber are parallel to each other and form an integrated structure with the heat exchange belt; the heat exchange belt is a plate surface structure consisting of a plurality of heat exchange tubes; the heat exchange tube is communicated with the hollow parts of the water inlet chamber and the water outlet chamber;
the two air cooling chambers are arranged on two sides of the water inlet chamber and the water outlet chamber along the length direction;
the semiconductor refrigerator is arranged on the plate surface formed by the heat exchange belts;
the water inlet chamber and the water outlet chamber are respectively connected with a water inlet pipe and a water outlet pipe outwards;
the air cooling chamber is hollow, and two ends of the air cooling chamber are respectively connected with the air inlet pipe and the air outlet pipe.
2. A high efficiency heat exchanger as recited in claim 1 wherein: a plurality of heat exchange plates are arranged among the heat exchange tubes; the surface of the heat exchange plate is perpendicular to the axis of the heat exchange tube.
3. A high efficiency heat exchanger as claimed in claim 1 or 2, wherein: the semiconductor refrigerator comprises a snakelike cooling pipe and a plurality of aluminum refrigerating sheets; all the aluminum refrigerating plates are arranged in parallel; the cooling pipe is in a snake shape and penetrates through all the refrigeration sheets.
4. A high efficiency heat exchanger as recited in claim 3 wherein: the semiconductor refrigerator is arranged on the plate surface formed by the heat exchange belts through four groups of fixing assemblies; the four groups of fixing assemblies are respectively arranged at the bent positions of the snakelike cooling pipes; the fixing component comprises a first fixing ring and a second fixing ring which are arranged at two sides of the heat exchange belt; the first fixing ring and the second fixing ring are connected through a screw; the screw rod is arranged between the two adjacent heat exchange plates.
5. A high efficiency heat exchanger as recited in claim 1 wherein: a metal fixing plate is fixedly arranged between the water inlet chamber and the water outlet chamber; and two ends of the air cooling chamber are arranged on the metal fixing plate through connecting pieces.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123325096.3U CN217058482U (en) | 2021-12-27 | 2021-12-27 | High-efficiency heat exchanger |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123325096.3U CN217058482U (en) | 2021-12-27 | 2021-12-27 | High-efficiency heat exchanger |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217058482U true CN217058482U (en) | 2022-07-26 |
Family
ID=82479223
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123325096.3U Active CN217058482U (en) | 2021-12-27 | 2021-12-27 | High-efficiency heat exchanger |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217058482U (en) |
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2021
- 2021-12-27 CN CN202123325096.3U patent/CN217058482U/en active Active
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