CN217052383U - Low-cost reciprocating type magnetron sputtering coating production line - Google Patents
Low-cost reciprocating type magnetron sputtering coating production line Download PDFInfo
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- CN217052383U CN217052383U CN202220624763.3U CN202220624763U CN217052383U CN 217052383 U CN217052383 U CN 217052383U CN 202220624763 U CN202220624763 U CN 202220624763U CN 217052383 U CN217052383 U CN 217052383U
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- 238000000576 coating method Methods 0.000 title claims abstract description 63
- 239000011248 coating agent Substances 0.000 title claims abstract description 36
- 238000001755 magnetron sputter deposition Methods 0.000 title claims abstract description 15
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 15
- 239000000758 substrate Substances 0.000 claims abstract description 50
- 238000000034 method Methods 0.000 claims abstract description 27
- 230000008569 process Effects 0.000 claims abstract description 27
- 230000005540 biological transmission Effects 0.000 claims abstract description 9
- 238000010438 heat treatment Methods 0.000 claims description 29
- 239000000463 material Substances 0.000 claims description 28
- 238000004544 sputter deposition Methods 0.000 claims description 18
- 238000007599 discharging Methods 0.000 claims description 12
- 238000005516 engineering process Methods 0.000 claims description 9
- 230000008859 change Effects 0.000 abstract description 4
- 238000011031 large-scale manufacturing process Methods 0.000 abstract description 2
- 230000033001 locomotion Effects 0.000 description 8
- 239000013077 target material Substances 0.000 description 8
- 239000007789 gas Substances 0.000 description 7
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 6
- 229910052786 argon Inorganic materials 0.000 description 4
- 230000005684 electric field Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000007888 film coating Substances 0.000 description 3
- 238000009501 film coating Methods 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- -1 argon ions Chemical class 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 238000005477 sputtering target Methods 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
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Abstract
The utility model discloses a reciprocating type magnetron sputtering coating film production line of low cost, including the belt transfer chain that can the reciprocating transmission substrate, be equipped with the cavity of a plurality of mutual intercommunications of ability on the belt transfer chain, all be equipped with the slide valve between each cavity, the cavity includes coating film process chamber at least, the interior fixed target that is provided with of coating film process chamber, the target is followed the horizontal setting of belt transfer chain forms the magnet edge in negative pole magnetic field the target transverse arrangement, the magnetic line of force top direction in negative pole magnetic field is parallel with substrate transmission direction. The utility model discloses use back plasma at the radial sculpture of target runway evenly distributed in the radial direction of substrate, eliminated the influence of runway degree of depth gradient change to the film homogeneity, and this scheme has still reduced large-scale production's equipment input cost.
Description
Technical Field
The utility model belongs to the technical field of magnetron sputtering, a reciprocating type magnetron sputtering coating film production line of low cost is related to.
Background
The magnetron sputtering technology belongs to one of physical vapor deposition technologies in the film coating technology, and electrons spirally run near the surface of a target by utilizing the interaction of a magnetic field and an electric field, so that the probability of generating ions by the impact of the electrons on argon is increased. The generated ions are accelerated to collide the surface of the target under the action of an electric field so as to generate sputtering; in the sputtering particles, target atoms or molecules are deposited on a base material to form a film, generated secondary electrons are bound in a plasma area near the target under the action of an electric field and a magnetic field, and impact with argon gas molecules in the area to ionize a large number of argon ions, and the argon ions impact the target, so that the deposition preparation of the film is repeatedly completed.
In the magnetron sputtering coating, the distance between the target and the coating substrate is called as a target base distance, the target base distance is usually less than 100mm and can be adjusted, and the thickness of the target is usually 10-20 mm. . After long-time film coating, an obvious bombardment runway is left on the surface of the target material, the runway is the worst in the radial direction of the target material and the uniformity of the distribution of the two ends, and obvious gradient exists. The etching rate and the shape of the sputtering target material etching runway are related to the parameters of the target material cathode, the parameters of the coating process and the service time of the target material. In an industrial process, the length of the target is usually 10-30% longer than the length direction of the substrate, so as to reduce the deterioration degree of the uniformity of the film caused by the difference of the depths of the runways at the two ends of the target. One key technology for large-area coating is the uniformity control of the film, including the uniformity control of thickness, composition uniformity and physicochemical properties. The target base distance of the runway depth relative to 100mm is a large variable, and an important factor for the stability and repeatability of the process technology is provided.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a low-cost reciprocating magnetron sputtering coating production line, which is used for optimizing the radial depth gradient difference of a target sputtering runway to lead to the uniformity of a film; meanwhile, the investment of expensive equipment primary hardware is reduced, and the influence of target difference is reduced.
The low-cost reciprocating magnetron sputtering coating production line comprises a belt conveyor line capable of conveying substrates in a reciprocating mode, wherein a plurality of chambers which can be communicated with one another are arranged on the belt conveyor line, gate valves are arranged among the chambers, the chambers at least comprise coating process chambers, targets are fixedly arranged in the coating process chambers, the targets are arranged along the transverse direction of the belt conveyor line, magnets forming a cathode magnetic field are arranged along the transverse direction of the targets, and the top direction of magnetic lines of force of the cathode magnetic field is parallel to the conveying direction of the substrates.
Preferably, the chamber sequentially comprises a feeding buffer chamber, a first heating chamber, one or more process chambers, a second heating chamber and a discharging buffer chamber along the length direction of the belt conveyor line, the process chambers at least comprise the coating process chambers, and gate valves are arranged at the inlet of the feeding buffer chamber and the outlet of the discharging buffer chamber.
Preferably, the transverse length of the target is 1.1-1.3 times of that of the substrate, and the transverse length is perpendicular to the conveying direction of the belt conveyor line.
Preferably, the process chamber only comprises a coating process chamber, the number of the gate valves is six, and a first gate valve, a second gate valve, a third gate valve, a fourth gate valve, a fifth gate valve and a sixth gate valve are sequentially arranged from the feeding buffer chamber to the discharging buffer chamber.
Preferably, each chamber is provided with three position sensors for detecting the position of the base material, the three position sensors in each chamber comprise a first sensor and a third sensor which are positioned at openings on two sides of the chamber, and a second sensor which is positioned at the working position of the chamber, the first sensor is close to the base material inlet end of the belt conveyor line, and the third sensor is close to the base material outlet end of the belt conveyor line.
The utility model has the advantages of it is following: the target radial direction is parallel to the flow sheet direction, namely the depth gradient change direction of the target track is parallel to the flow sheet direction, and through the reciprocating motion of the substrate, plasma is uniformly distributed in the radial direction of the substrate in the radial etching of the target track, so that the influence of the track depth gradient change on the uniformity of the film is eliminated.
Secondly, the coating line realizes transmission and production line access through a roll shaft motor instead of adopting a high-cost six-axis mechanical arm; for the preparation of films with the thickness of hundreds of nanometers, the scheme can reduce the equipment investment cost of large-scale production by coating the film back and forth through multiple movements of the substrate.
Drawings
FIG. 1 is a schematic structural view of a low-cost reciprocating magnetron sputtering coating production line of the present invention.
Fig. 2 is a schematic view of the internal structure of the structure shown in fig. 1 during operation.
Fig. 3 is a schematic view of a tape-out mode during operation of the structure shown in fig. 1.
The symbols in the drawings are: 1. the device comprises a belt conveyor line, 2, a feeding buffer chamber, 3, first heating chambers, 4, a coating process chamber, 5, second heating chambers, 6, a discharging buffer chamber, 7, a gate valve, 71, first gate valves, 72, second gate valves, 73, third gate valves, 74, fourth gate valves, 75, fifth gate valves, 76, sixth gate valves, 8, a target, 9, a position sensor, 10, a heater, 11, a magnet, 12 and a base material.
Detailed Description
The following detailed description of the present invention is provided to enable those skilled in the art to make and use the present invention without departing from the spirit and scope of the present invention.
As shown in fig. 1-3, the utility model provides a reciprocating type magnetron sputtering coating production line of low cost, including the belt conveyor line 1 that can reciprocating transmission substrate 12, be equipped with a plurality of cavities on the belt conveyor line 1, the cavity is followed belt conveyor line 1's length direction is including feeding buffer cavity 2, heating cavity one 3, one or more process chamber, heating cavity two 5 and ejection of compact buffer cavity 6 in proper order, process cavity has at least one and including coating film process cavity 4, feeding buffer cavity 2 the import department all be equipped with slide valve 7 between ejection of compact buffer cavity 6's the exit and each cavity, coating film process cavity 4 internal fixation is provided with target 8.
The transverse length of the target 8 is 1.1 to 1.3 times of the transverse length of the base material 12, and the transverse length is the length perpendicular to the conveying direction of the belt conveyor line 1. The target 8 is arranged along the transverse direction of the belt conveyor line 1, the magnets 11 forming a cathode magnetic field are arranged along the transverse direction of the target 8, and the top end direction of the magnetic force lines of the cathode magnetic field is parallel to the conveying direction of the base material 12; the structure is used for reducing the influence of different track depths at the tail end of the target 8 on the coating uniformity.
The installation direction of the cathode of the target 8 is a key point of the implementation of the patent, the gradient change direction of the runway depth of the target 8 (the radial direction of the target 8) needs to be parallel to the flow sheet direction, the magnets 11 of the cathode magnetic field of the target 8 are transversely arranged along the target 8, and the top end direction of the magnetic force line is parallel to the transmission direction of the base material 12. The number of targets 8 to be mounted is set in an effective region of the base material 12 depending on the target pitch and the plasma glow, and is usually 1 to 3 targets 8. The temperature of the base material 12 is different in the coating process of different processes, two heating chambers (a first heating chamber 3 and a second heating chamber 5) are arranged on two sides of the process chamber, corresponding heaters 10 are arranged in the heating chambers, the heaters 10 can be electrothermal heaters 10 arranged on the tops of the chambers, and other heating structures suitable for heating the base material 12 in the prior art can also be adopted. The heating mode of the heating chamber, the layout of the heater 10 and the setting of the heating process parameters are selected according to the characteristics of the coating material, and it should be noted that the temperature control needs to ensure that the influence of the fluctuation of the temperature of the base material 12 on the growth of the film is in a controllable range in the reciprocating process. The vacuum system, the gas system, the cooling system and other plant power systems of the coating line are out of the scope of the patent, and the corresponding technologies suitable in the existing magnetron sputtering coating technology can be adopted according to the requirements.
In the embodiment, the process chamber only comprises a coating process chamber 4, the number of the gate valves 7 is six, and from the feeding buffer chamber 2 to the discharging buffer chamber 6, the gate valves are a first gate valve 71, a second gate valve 72, a third gate valve 73, a fourth gate valve 74, a fifth gate valve 75 and a sixth gate valve 76 in sequence. Each chamber is provided with three position sensors 9 for detecting the position of the base material 12, and each position sensor 9 in each chamber comprises a first sensor positioned at the opening of the chamber close to the first gate valve 71, a third sensor positioned at the opening of the chamber close to the sixth gate valve 76 and a second sensor positioned at the working position of the chamber. The first and second sensors are used to detect whether the substrate 12 enters or leaves the respective chamber, and the second sensor is used to detect whether the substrate 12 reaches the operative position of the chamber, typically using an optical position sensor 9.
The motor of belt conveyor line 1 drives the roller and rotates, the transmission of substrate 12 through the transmission band that the roller drove realizes the transmission, the reciprocating motion of substrate 12 is realized to motor reversible rotation, and the speed that substrate 12 moved is adjustable. The roller shafts driven by the motor are connected through a belt; a support rod (not shown in figure 2) is arranged between the roll shafts and used for adjusting the tension degree of the belt. The coating production line is connected with the production line through the feeding chamber and the discharging chamber, the substrate 12 enters from the feeding buffer chamber from the upstream of the coating line, and enters from the discharging buffer chamber to the downstream of the coating line, so that the on-line coating of the substrate 12 is realized.
The working process of the scheme is as follows: as shown in fig. 2 and 3, three substrates 12 in the drawing represent the substrate 12 before, during, and after the plating, respectively. The pre-coated substrate 12 enters the feed buffer chamber and upon sensing the presence of the substrate 12 by a sensor in the chamber, a feedback signal indicates that the substrate 12 has entered and the belt conveyor line 1 is conveying the substrate 12 in a forward direction. When the third sensor in the chamber detects the substrate 12, the feedback signal informs the second gate valve 72 to open, and the belt conveyor line 1 continues to forward convey the substrate 12 at the set speed. After a first sensor in the first heating chamber 3 detects the substrate 12, closing a second gate valve 72, opening a third gate valve 73 and a fourth gate valve 74, simultaneously conveying sputtering gas to the first coating process chamber 4, keeping the air pressure balance of the first heating chamber 3, the second coating process chamber 4 and the second heating chamber 5, simultaneously continuing forward conveying by the belt conveyor line 1, when the first sensor in the first coating process chamber 4 senses the existence of the substrate 12, starting the cathode of the sputtering instrument to work, starting the target 8, and measuring, controlling, sputtering and coating the substrate 12 in the coating process chamber 4 and keeping a certain speed for forward movement; when the third sensor in the chamber senses the presence of the substrate 12, the belt conveyor positively outputs the substrate 12 to the second heating chamber 5. After the sensor III in the coating process chamber 4 senses that the base material 12 leaves, the cathode of the sputtering instrument stops working, the glow of the target material 8 is closed, but the sputtering gas is continuously conveyed. After the second sensor in the second heating chamber 5 senses the existence of the substrate 12, the belt conveyor line 1 starts to decelerate, the belt conveyor line 1 stops when the substrate 12 moves to the third sensor in the chamber, and the moving path of the first conveying process is completed.
Since the gate valve five 75 is still in the closed state during the next conveyance. The second conveying process is started, and the base material 12 in the second heating chamber 5 is reversely conveyed along the belt type conveying line 1; when the first sensor of the second heating chamber 5 detects the existence of the substrate 12, it indicates that the substrate 12 will be output to the coating process chamber 4. When the sensor III of the coating process chamber 4 senses the existence of the base material 12, the cathode of the sputtering instrument works, the target material 8 glows, and the base material 12 carries out sputtering coating measurement and control in the coating process chamber 4. When a sensor I of the coating process chamber 4 senses that the base material 12 exists, the belt type conveying line 1 continues to convey reversely; when the sensor of the coating process chamber 4 detects that the substrate 12 leaves, the cathode of the sputtering instrument stops working, the glow of the target 8 is closed, and the sputtering gas continues to be conveyed. When the second sensor 3 in the first heating chamber senses the existence of the substrate 12, the belt conveyor line 1 starts to decelerate, the third sensor which conveys the substrate 12 to the chamber stops, and the moving path of the second conveying process is completed.
When the third conveying process starts, the motor of the belt conveyor line 1 forwards conveys the base material 12, and if the three sensors of the heating chamber, i.e. the 3 sensors, sense the existence of the base material 12, the belt conveyor line 1 continues to forwards convey the base material 12 to the coating process chamber 4. And when a sensor of the coating process chamber 4 senses the existence of the base material 12, the cathode of the sputtering instrument works, the target material 8 glows, and the base material 12 is subjected to sputtering coating measurement and control in the coating process chamber 4. When the sensor III of the coating process chamber 4 senses that the base material 12 exists, the belt conveyor line 1 continues to convey forwards to convey the base material 12 to the heating chamber II 5; when the sensor III of the coating process chamber 4 senses that the substrate 12 leaves, the cathode of the sputtering instrument stops working, the target 8 glows and is closed, the conveying paths of the three conveying processes in the coating process chamber 4 are all completed, and when the coating work is finished, the sputtering gas is closed, the gas conveying is stopped, and the gate valve III 73 is closed. And when the first sensor sensing substrate 12 in the second heating chamber 5 leaves the position, the fourth gate valve 74 is closed, the third sensor sensing substrate 12 in the second heating chamber 5 exists, the fifth gate valve 75 is opened, the belt conveyor line 1 conveys the coated substrate 12 to the discharging buffer chamber 6, when the first sensor sensing substrate 12 in the discharging buffer chamber 6 leaves, the fifth gate valve 75 is closed, the substrate 12 is conveyed to the third sensor of the chamber by the belt conveyor line 1 to stop, and the movement path of the third conveying process is completed. And when the reciprocating motion formed by the first conveying process, the second conveying process and the third conveying process is finished, finishing the film coating.
The above contents are only used for demonstrating the working mode of the coating line, the cycle number of the reciprocating motion can be determined according to the target thickness of the film and the deposition rate of the film, the structure of the scheme can realize the reciprocating motion of the base material 12 by driving the belt by the roll shaft through the positive and negative rotation of the motor in the belt conveyor line 1, and the motor and the belt are not directly connected with the hollow cavity in the coating process chamber 4. Therefore, the service life of the vacuum cavity is prolonged, and the operation and maintenance cost of the equipment is reduced. The case shown in the patent is only used for demonstrating the working mode of the coating line.
The above description is made for the exemplary purposes with reference to the accompanying drawings, and it is obvious that the present invention is not limited by the above embodiments, and various insubstantial improvements can be made without modification to the present invention.
Claims (5)
1. A low-cost reciprocating magnetron sputtering coating production line is characterized in that: including belt conveyor line (1) that can reciprocating transmission substrate (12), be equipped with the cavity of a plurality of ability intercommunications on belt conveyor line (1), all be equipped with gate valve (7) between each cavity, the cavity includes coating film technology chamber (4) at least, coating film technology chamber (4) internal fixation is provided with target (8), target (8) are followed the horizontal setting of belt conveyor line (1), and magnet (11) that form the magnetic field of negative pole are followed target (8) transverse arrangement, and the magnetic line of force top direction in magnetic field of negative pole is parallel with substrate (12) direction of transfer.
2. The low-cost reciprocating magnetron sputtering coating production line of claim 1, characterized in that: the chamber sequentially comprises a feeding buffer chamber (2), a heating chamber I (3), one or more process chambers, a heating chamber II (5) and a discharging buffer chamber (6) along the length direction of the belt conveyor line (1), the process chambers at least comprise a coating process chamber (4), and gate valves (7) are arranged at the inlet of the feeding buffer chamber (2) and the outlet of the discharging buffer chamber (6).
3. The low-cost reciprocating magnetron sputtering coating production line according to claim 2, characterized in that: the transverse length of the target (8) is 1.1-1.3 times of that of the base material (12), and the transverse length is perpendicular to the conveying direction of the belt conveyor line (1).
4. A low cost reciprocating magnetron sputter coating line according to any one of claims 2 to 3, characterized in that: the process chamber only comprises a coating process chamber (4), six gate valves (7) are arranged, and a first gate valve (71), a second gate valve (72), a third gate valve (73), a fourth gate valve (74), a fifth gate valve (75) and a sixth gate valve (76) are sequentially arranged from the feeding buffer chamber (2) to the discharging buffer chamber (6).
5. A low cost reciprocating magnetron sputter coating line according to any one of claims 1 to 3, characterized in that: every cavity all is equipped with position sensor (9) that detect substrate (12) position, and position sensor (9) in every cavity are three, including the sensor one and the sensor three that are located cavity both sides opening part to and the sensor two that is located the operating position of cavity, sensor one is close to substrate (12) the entering end of belt conveyor line (1), sensor three is close to substrate (12) the output of belt conveyor line (1).
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220624763.3U CN217052383U (en) | 2022-03-21 | 2022-03-21 | Low-cost reciprocating type magnetron sputtering coating production line |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202220624763.3U CN217052383U (en) | 2022-03-21 | 2022-03-21 | Low-cost reciprocating type magnetron sputtering coating production line |
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| CN217052383U true CN217052383U (en) | 2022-07-26 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115287609A (en) * | 2022-08-30 | 2022-11-04 | 新倍司特系统科技(苏州)有限公司 | Equipment and method for uniformly coating large-area thick coating |
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2022
- 2022-03-21 CN CN202220624763.3U patent/CN217052383U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115287609A (en) * | 2022-08-30 | 2022-11-04 | 新倍司特系统科技(苏州)有限公司 | Equipment and method for uniformly coating large-area thick coating |
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