CN217037543U - Via hole multilayer flexible circuit board - Google Patents
Via hole multilayer flexible circuit board Download PDFInfo
- Publication number
- CN217037543U CN217037543U CN202220627098.3U CN202220627098U CN217037543U CN 217037543 U CN217037543 U CN 217037543U CN 202220627098 U CN202220627098 U CN 202220627098U CN 217037543 U CN217037543 U CN 217037543U
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- copper base
- via hole
- base plate
- layer
- multilayer flexible
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- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The utility model discloses a via hole multilayer flexible circuit board which comprises a copper base body, wherein a via hole is formed in the copper base body, a conductive paste layer is coated on the top and the inner surface of the via hole, and insulating protective film coating layers are bonded on the two surfaces of the copper base body through adhesive layers. The structure of the utility model is reasonable, the copper substrate is provided with the via hole, and the insulating protective film coating layer on the surface can effectively solve the technical problem that the via hole is easy to crack on the copper substrate, thereby being beneficial to improving the integral use strength, ensuring the conductive effectiveness through the conductive slurry layer, having stable and reliable use, strong applicability and good practicability.
Description
Technical Field
The utility model belongs to the technical field of circuit boards, and particularly relates to a via hole multilayer flexible circuit board.
Background
The LED soft substrate is a relatively common structure in the LED lamp strip and the LED lamp, and the insulating paint forming of a copper substrate layer and spraying on the copper substrate layer is mainly adopted in the conventional LED soft substrate, so that the using requirement of general conditions can be met, the operation of via holes is not facilitated, the softness of the via holes is lower, the adhesive layer is easy to crack after the via holes, the using stability is influenced, and the applicability and the practicability are limited.
Disclosure of Invention
The utility model aims to provide a via hole multilayer flexible circuit board which is reasonable in structural arrangement and stable and reliable in use.
The technical scheme for achieving the purpose of the utility model is that the via hole multilayer flexible circuit board comprises a copper base body, wherein a via hole is formed in the copper base body, conductive paste layers are coated on the top and the inner surface of the via hole, and insulating protective film coating layers are adhered to the two surfaces of the copper base body through adhesive layers.
The copper base body comprises an upper copper base plate, a lower copper base plate and a middle insulating layer located between the upper copper base plate and the lower copper base plate, the upper copper base plate and the lower copper base plate are respectively bonded on the middle insulating layer through an upper adhesive layer and a lower adhesive layer, the via hole penetrates through the upper copper base plate, the middle insulating layer and the lower copper base plate, and the upper copper base plate and the lower copper base plate are electrically connected through the conductive slurry layer.
And at least one insulating protective film coating layer is provided with a position avoiding hole matched with the via hole.
The insulation protection film coating layer is a PI or PET material film layer.
The utility model has the positive effects that: the structure of the utility model is reasonable, the copper substrate is provided with the via hole, and the insulating protective film coating layer on the surface can effectively solve the technical problem that the via hole is easy to crack on the copper substrate, thereby being beneficial to improving the integral use strength, ensuring the conductive effectiveness through the conductive slurry layer, having stable and reliable use, strong applicability and good practicability.
Drawings
In order that the manner in which the present invention is more fully understood, a more particular description of the utility model will be rendered by reference to specific embodiments thereof which are illustrated in the appended drawings, wherein:
FIG. 1 is a schematic structural diagram of the present invention.
Reference numerals are as follows: the structure comprises a via hole 1, a copper base body 2, an upper copper base plate 21, a lower copper base plate 22, a middle insulating layer 23, an upper adhesive layer 24, a lower adhesive layer 25, a conductive paste layer 3, an adhesive layer 4, an insulating protection film coating layer 5 and a clearance hole 6.
Detailed Description
This is further illustrated in connection with the above-mentioned figures. In the present embodiment, directional words such as upper and lower are used for convenience of description, and are not intended to limit the scope thereof.
As shown in fig. 1, the via hole multilayer flexible circuit board comprises a copper base body 2, wherein the copper base body 2 comprises an upper copper base plate 21, a lower copper base plate 22 and a middle insulating layer 23 positioned between the upper copper base plate and the lower copper base plate, the upper copper base plate and the lower copper base plate are respectively adhered to the middle insulating layer through an upper adhesive layer 24 and a lower adhesive layer 25, a via hole 1 is formed in the copper base body, a conductive paste layer 3 is coated on the top and the inner surface of the via hole, and an insulating protective film coating layer 5 is adhered to the surface of the copper base body through an adhesive layer 4. In this embodiment, the insulating protective coating layer may be replaced with an insulating protective paint layer, the via hole penetrates through the upper copper substrate, the middle insulating layer, and the lower copper substrate, and the conductive paste layer electrically connects the upper copper substrate and the lower copper substrate. In the practical application process, owing to add insulating protection tectorial membrane layer, in the practical application process, can effectual reduction because of the via hole causes the fracture condition between the different layers to guarantee the stationarity of using, can make the pliability of the increase via hole department of via hole department through insulating protection tectorial membrane layer in addition, in order to increase its reliability of using, it is provided with the conductive paste layer in addition, can make and realize electrically conducting between last copper base plate and the lower copper base plate, forms double sided board circuit structure.
And a position avoiding hole 6 matched with the via hole is formed in at least one insulating protection film coating layer. The hole is provided with a position avoiding hole so as to be matched with the through hole, thereby ensuring the effectiveness of the hole position.
In this embodiment, the insulating protective film layer is a PI or PET material film layer.
The structure of the utility model is reasonable, the copper substrate is provided with the via hole, and the insulating protective film coating layer on the surface can effectively solve the technical problem that the via hole is easy to crack on the copper substrate, thereby being beneficial to improving the integral use strength, ensuring the conductive effectiveness through the conductive slurry layer, having stable and reliable use, strong applicability and good practicability.
The standard parts used in the present embodiment may be purchased directly from the market, and the non-standard structural parts described in the specification may be obtained by processing directly according to the general knowledge of the prior art without any doubt, and the connection manner of the respective parts adopts the conventional means matured in the prior art, and the machines, parts and equipment are all of the types conventional in the prior art, so that detailed description thereof is omitted here.
It should be understood that the above-described embodiments of the present invention are merely examples for clearly illustrating the present invention and are not intended to limit the embodiments of the present invention. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. This need not be, nor should it be exhaustive of all embodiments. And such obvious changes and modifications which fall within the spirit of the utility model are deemed to be covered by the present invention.
Claims (4)
1. The utility model provides a via hole multilayer flexible line way board, includes the copper base member, its characterized in that: the copper substrate is provided with a via hole, the top and the inner surface of the via hole are coated with conductive paste layers, and two surfaces of the copper substrate are bonded with insulating protective film coating layers through adhesive layers.
2. The via multilayer flexible circuit board of claim 1, wherein: the copper base body comprises an upper copper base plate, a lower copper base plate and a middle insulating layer located between the upper copper base plate and the lower copper base plate, the upper copper base plate and the lower copper base plate are respectively bonded on the middle insulating layer through an upper adhesive layer and a lower adhesive layer, the via hole penetrates through the upper copper base plate, the middle insulating layer and the lower copper base plate, and the upper copper base plate and the lower copper base plate are electrically connected through the conductive slurry layer.
3. The via multilayer flexible circuit board of claim 2, wherein: and at least one insulating protection film coating layer is provided with a position avoiding hole matched with the via hole.
4. The via multilayer flexible circuit board of claim 3, wherein: the insulation protection film coating layer is a PI or PET material film layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220627098.3U CN217037543U (en) | 2022-03-22 | 2022-03-22 | Via hole multilayer flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220627098.3U CN217037543U (en) | 2022-03-22 | 2022-03-22 | Via hole multilayer flexible circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217037543U true CN217037543U (en) | 2022-07-22 |
Family
ID=82455518
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220627098.3U Active CN217037543U (en) | 2022-03-22 | 2022-03-22 | Via hole multilayer flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217037543U (en) |
-
2022
- 2022-03-22 CN CN202220627098.3U patent/CN217037543U/en active Active
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