CN217035576U - High-reliability surface-mounted fuse - Google Patents
High-reliability surface-mounted fuse Download PDFInfo
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- CN217035576U CN217035576U CN202220392095.6U CN202220392095U CN217035576U CN 217035576 U CN217035576 U CN 217035576U CN 202220392095 U CN202220392095 U CN 202220392095U CN 217035576 U CN217035576 U CN 217035576U
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Abstract
A high-reliability surface-mounted fuse belongs to the field of electronic components. The method comprises the following steps: the fuse comprises a substrate, a back electrode, a surface electrode, a lower heat insulation layer, a fuse body layer, a fuse isolation through hole, an upper heat insulation layer, an encapsulating layer, a terminal electrode, a fuse body and a fuse. The fuse isolation through hole penetrates through the fuse body, the upper heat insulation layer is located on the surface of the fuse body layer, the encapsulation layer is located on the surface of the upper heat insulation layer, the end electrodes cover the back electrode, the surface electrodes and the two ends of the substrate, and the plane pattern of the fuse body layer is in a grid type. The problem of contradiction between improving rated voltage and reducing electric arc in the prior art is solved. The method is widely applied to the field of miniaturized, high-working voltage, low-arc and high-reliability fuses.
Description
Technical Field
The utility model belongs to the field of electronic components, and further relates to the field of film fuses, in particular to a high-reliability surface-mounted fuse and a manufacturing method thereof.
Background
Among electronic components, a fuse is an element connected in series in an electronic circuit to protect against overcurrent. When the current of the circuit exceeds the specified value and lasts for a certain time, the fuse link body of the fuse generates heat exceeding the emitted heat and the temperature of the fuse link body reaches the melting point of the fuse link body, so that the fuse link body is fused, and the purpose of overcurrent protection is achieved.
For the surface-mounted thick film fuse, the product has small size, stable electrical property and high reliability, and is suitable for being directly welded and mounted on a PCB (printed Circuit Board), so that the surface-mounted thick film fuse is widely applied to the fields of spaceflight, aviation, electronics, ships and the like. The fuse link of the existing surface-mounted thick film fuse is in an I-shaped single fuse structure as shown in figure 1, the fuse link graph generally presents a structure with two wide ends and a narrow middle, and energy during fusing is mainly concentrated in a small area with the narrowest middle to generate a large electric arc, so that the rated voltage of the surface-mounted thick film fuse is generally low. As the circuit supply voltage continues to increase, the voltage rating of thick film fuses must correspondingly increase, further creating larger arcs.
In view of the above, the present invention is particularly proposed.
Disclosure of Invention
The technical problem to be solved by the utility model is as follows: the problem of contradiction between improving rated voltage and reducing electric arc in the prior art is solved.
The utility model has the following inventive concept: the single current path of the existing surface-mounted thick film fuse is improved into a plurality of series-parallel current paths, a grid-shaped thick film is adopted on a thick film plane structure for realization, and heat insulation layers are adopted on the upper surface and the lower surface of a fuse link for heat insulation, as shown in figures 2 and 3. For the fuse of the grid-type graphic fuse link, the energy during fusing is uniformly distributed and dispersed, so that the arc suppression performance of the fuse link can be improved, and the rated voltage of the fuse link is further improved.
Therefore, the utility model provides a high-reliability surface-mounted fuse, as shown in fig. 2 and 3. The method comprises the following steps: the fuse comprises a substrate 1, a back electrode 2, a surface electrode 3, a lower heat insulation layer 4, a fuse body layer 5, a fuse isolation through hole 6, an upper heat insulation layer 7, an encapsulating layer 8, a terminal electrode 9, a fuse body 10 and a fuse 11.
The substrate 1 is made of high temperature resistant insulating material, such as ceramic, glass, etc.
The back electrodes 2 are positioned at two ends of the back surface of the substrate 1.
The surface electrodes 3 are positioned at both ends of the surface of the substrate 1.
The lower heat insulation layer 4 is positioned on the surface of the substrate 1, one end of the lower heat insulation layer 4 is connected with the surface electrode 3 at one end of the surface of the substrate 1, and the other end of the lower heat insulation layer 4 is connected with the surface electrode 3 at the other end of the surface of the substrate 1.
The fuse body layer 5 is positioned on the surface of the lower heat insulation layer 4, two ends of the fuse body layer 5 are connected with the surface electrodes 3 at two ends of the surface of the substrate 1, and one end of the fuse body layer 5 is connected with the surface electrode 3 at the other end of the surface of the substrate 1.
The fuse isolation through holes 6 penetrate through the fuse link body 10, and the shape, number, size and arrangement mode of the isolation through holes 6 are set according to the specific performance of the fuse and can be round, groove-shaped or other shapes.
The fuse 11 is a fuse body portion between the isolation through holes 6, and is a film-shaped fuse.
The upper heat insulation layer 7 is positioned on the surface of the fuse body layer 5, one end of the upper heat insulation layer 7 is connected with the surface electrode 3 at the other end of the surface of the substrate 1, and the other end of the upper heat insulation layer 7 is connected with the surface electrode 3 at the other end of the surface of the substrate 1.
The encapsulating layer 8 is positioned on the surface of the upper heat-insulating layer 7, and two ends of the encapsulating layer 8 are lapped with the surface electrodes 3 at two ends of the surface of the substrate 1; the material of the encapsulating layer 8 is a glass material.
The terminal electrode 9 covers the back electrode 2, the surface electrode 3 and two ends of the substrate 1.
The fuse body layer 5 has a mesh pattern, and as shown in fig. 3, is formed by connecting a plurality of fuses in series and parallel.
The fuse layer 5 may be formed by thick-film screen printing, and the fired film thickness of the fuse layer is 1 to 50 μm.
The firing temperature of the fuse layer 5 is equal to or higher than the firing temperature or curing temperature of the upper heat insulating layer 7.
The sintering temperature of the upper heat insulation layer 7 is greater than or equal to the sintering temperature or the curing temperature of the encapsulating layer 8.
In particular, the back electrode 2, the surface electrode 3, the lower heat insulation layer 4, the fuse body layer 5, the upper heat insulation layer 7 and the encapsulating layer 8 can also be realized by adopting a thin film process.
Compared with the prior art, the utility model has the following beneficial effects:
(1) the rated voltage of the surface-mounted thick film fuse can be greatly improved.
(2) With the continuous rise of the power supply voltage of the circuit, the electric arc can be controlled to a very small degree, and the contradiction that the electric arc is reduced and rises along with the rise of the electric arc caused by the rise of the rated voltage is solved.
(3) Because the integration of the integrated process is adopted, the volume is small, and the reliability is high.
(4) The method is suitable for batch and large-scale production, and has the advantages of high quality consistency, high yield and low cost.
The utility model is widely applied to the field of miniaturized surface-mounted fuses with high working voltage and low electric arc and high reliability.
Drawings
Fig. 1 is a schematic plan view of a fuse link of a conventional fuse.
Fig. 2 is a schematic view of a longitudinal structure of the fuse of the present invention.
FIG. 3 is a schematic plan view of a fuse layer according to the present invention.
In the figure: the structure comprises a substrate 1, a back electrode 2, a surface electrode 3, a lower heat insulation layer 4, a fuse body layer 5, a fuse isolation through hole 6, an upper heat insulation layer 7, an encapsulating layer 8, a terminal electrode 9, a fuse body 10 and a fuse wire 11.
Detailed Description
With reference to fig. 2 and 3, the technical solution of the present invention is implemented as follows:
(1) preparing materials: a ceramic substrate is selected as a substrate, and a scribing machine is used for scribing a splitting line (namely a scribing groove for splitting a single fuse chip) on the ceramic substrate according to the arrangement layout size of the fuses.
(2) And screen printing a surface electrode and a back electrode on the surface of the scribed ceramic substrate, wherein the surface electrode and the back electrode mainly comprise silver palladium, and the palladium content is 1-35%.
(3) Preparing a lower thermal insulation layer on the surface of a ceramic substrate for preparing the electrode, wherein the main component of the lower thermal insulation layer is silicon dioxide, the firing temperature of the thermal insulation layer is 850 +/-30 ℃, and the firing film thickness of the thermal insulation layer is 10-100 mu m.
(4) And (2) screen-printing a fuse body layer on the surface of the prepared heat-insulating layer, wherein the main component of the fuse body is gold or silver, the plane structure of the fuse body layer is shown in figure 2 and is in a grid structure, 4 rows of fuses are connected in series, each row of fuses is formed by connecting 3 fuses in parallel, the sintering film thickness of the fuse body is 1-50 mu m, and the sintering temperature of the fuse body is 850 +/-30 ℃.
(5) And preparing an upper heat insulation layer on the surface of the prepared fuse body layer, wherein the main component of the upper heat insulation layer is silicon dioxide, the firing temperature of the heat insulation layer is 850 +/-30 ℃, and the firing film thickness of the heat insulation layer is 10-100 mu m.
(6) Printing a glass encapsulating layer on the surface of the prepared fuse link, wherein the main component of the encapsulating layer is glass, the firing film thickness of the encapsulating layer is 5-50 mu m, and the firing temperature of the encapsulating layer is 600 +/-30 ℃.
(7) Printing marks on the surface of the prepared encapsulating layer.
(8) And scribing the marked product along the middle of the adjacent electrode for the first strip-shaped splintering, and then coating silver on the end surface of the strip-shaped product, wherein the main component of the silver-coated slurry is silver palladium, the palladium solder is 1-30%, the silver coating depth is 0.1-2 mm, and the silver coating firing temperature is 600 +/-30 ℃.
(9) And carrying out secondary particle splintering on the silver-coated strip product.
(10) Electroplating the granular product of the secondary splinters, plating nickel, and then plating lead or tin-lead, wherein the thickness of the nickel layer is more than or equal to 3 mu m.
Finally, it should be noted that: the above examples are given for clarity of illustration only, and the present invention includes but is not limited to the above examples, which are neither exhaustive nor exhaustive of all embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. All embodiments that meet the requirements of the present invention are intended to be within the scope of the present invention.
Claims (8)
1. A highly reliable surface mount fuse, comprising: the fuse comprises a substrate, a back electrode, a surface electrode, a lower heat insulation layer, a fuse body layer, a fuse isolation through hole, an upper heat insulation layer, an encapsulating layer, a terminal electrode, a fuse body and a fuse wire;
the substrate is made of a high-temperature-resistant insulating material;
the back electrodes are positioned at two ends of the back surface of the substrate;
the surface electrodes are positioned at two ends of the surface of the substrate;
the lower heat insulation layer is positioned on the surface of the substrate, one end of the lower heat insulation layer is connected with the surface electrode at one end of the surface of the substrate, and the other end of the lower heat insulation layer is connected with the surface electrode at the other end of the surface of the substrate;
the fuse body layer is positioned on the surface of the lower heat-insulating layer, one end of the fuse body layer is connected with the surface electrode at one end of the surface of the substrate, and the other end of the fuse body layer is connected with the surface electrode at the other end of the surface of the substrate;
the fuse isolation through hole penetrates through the fuse link body;
the fuse wire is a fuse link body part between the isolation through holes;
the upper heat insulation layer is positioned on the surface of the fuse body layer, one end of the upper heat insulation layer is connected with the surface electrode at one end of the surface of the substrate, and the other end of the upper heat insulation layer is connected with the surface electrode at the other end of the surface of the substrate;
the encapsulating layer is positioned on the surface of the upper heat-insulating layer, and two ends of the encapsulating layer are in lap joint with the surface electrodes at two ends of the surface of the substrate;
the end electrodes cover the back electrode, the surface electrode and two ends of the substrate;
the plane figure of the fusing body layer is in a grid type and is formed by connecting a plurality of fuses in series and in parallel.
2. The high reliability surface mount fuse as recited in claim 1, wherein the substrate is made of ceramic or glass.
3. The high reliability surface mount fuse of claim 1, wherein the material of the encapsulation layer is a glass material.
4. A high reliability surface mount fuse as defined in claim 1 wherein said fuse isolation via is circular or slot shaped.
5. The highly reliable surface-mount fuse as recited in claim 1, wherein the grid-type structure is formed by connecting 4 rows of fuses in series, each row of fuses being formed by connecting 3 fuses in parallel.
6. The high reliability surface mount fuse of claim 1, wherein the fuse is a film fuse.
7. The high-reliability surface-mount fuse according to claim 1, wherein the back electrode, the front electrode, the lower insulating layer, the fuse layer, the upper insulating layer or the encapsulating layer is in a thin film shape or a thick film shape.
8. The highly reliable surface-mount fuse according to claim 1, wherein a fired thickness of the fuse body layer is 1 μm to 50 μm when the fuse body layer is formed in a thick film shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220392095.6U CN217035576U (en) | 2022-02-25 | 2022-02-25 | High-reliability surface-mounted fuse |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220392095.6U CN217035576U (en) | 2022-02-25 | 2022-02-25 | High-reliability surface-mounted fuse |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217035576U true CN217035576U (en) | 2022-07-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220392095.6U Active CN217035576U (en) | 2022-02-25 | 2022-02-25 | High-reliability surface-mounted fuse |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217035576U (en) |
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2022
- 2022-02-25 CN CN202220392095.6U patent/CN217035576U/en active Active
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