CN217025839U - High-performance wave-absorbing shielding adhesive tape - Google Patents
High-performance wave-absorbing shielding adhesive tape Download PDFInfo
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- CN217025839U CN217025839U CN202123158194.2U CN202123158194U CN217025839U CN 217025839 U CN217025839 U CN 217025839U CN 202123158194 U CN202123158194 U CN 202123158194U CN 217025839 U CN217025839 U CN 217025839U
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Abstract
The utility model relates to the field of adhesive tapes and discloses a high-performance wave-absorbing shielding adhesive tape. The method comprises the following steps: the reinforced layer comprises a plurality of first supporting strips distributed on the substrate layer in an interval arrangement manner, and second supporting strips are obliquely arranged among the first supporting strips, one ends of the second supporting strips are connected with the upper end parts of the first supporting strips, and the other ends of the second supporting strips are connected with the lower end parts of the first supporting strips. The device comprises a reinforcing layer, a conductive layer, a wave-absorbing layer, a protective layer, an acrylate adhesive layer and a release film, wherein the conductive layer is arranged on the upper surface of the reinforcing layer, the upper surface and the lower surface of the reinforcing layer are coated with conductive adhesive layers, the wave-absorbing layer is arranged on the upper surface of the conductive layer, the protective layer is arranged on the upper surface of the wave-absorbing layer, the acrylate adhesive layer is arranged on the lower surface of a base body layer, and the release film is attached to the acrylate adhesive layer. The adhesive tape has good electromagnetic shielding and wave absorbing properties, can realize reliable bonding and stable conductive performance, and can maintain the overall performance of the adhesive tape in a high-temperature environment.
Description
Technical Field
The utility model relates to the field of adhesive tapes, in particular to a high-performance wave-absorbing shielding adhesive tape.
Background
Various electronic, communication and electrical devices have been widely used, and these devices need to not only shield external electromagnetic waves, but also reduce electromagnetic leakage from the devices themselves to the environment, and prevent electromagnetic interference between various components inside the housing, and the electromagnetic shielding tape is used to shield and protect key parts of electronic products. The existing adhesive tape not only has a better shielding effect, but also needs good wave-absorbing performance to further reduce electromagnetic leakage and mutual electromagnetic interference among elements, and meanwhile, the adhesive tape is easy to age and the overall performance is reduced due to the influence of a high-temperature environment.
SUMMERY OF THE UTILITY MODEL
In order to solve the technical problems, the utility model provides the high-performance wave-absorbing shielding adhesive tape which has good electromagnetic shielding and wave-absorbing performance, can realize reliable bonding and stable conductive performance, and can keep the overall performance of the adhesive tape in a high-temperature environment.
In order to achieve the purpose, the technical scheme of the utility model is as follows:
a high-performance wave-absorbing shielding adhesive tape comprises:
a substrate layer;
the reinforcing layer is arranged on the upper surface of the substrate layer and comprises a plurality of first supporting strips which are arranged and distributed on the substrate layer at intervals, and second supporting strips which are obliquely arranged among the first supporting strips, one ends of the second supporting strips are connected with the upper end parts of the first supporting strips, and the other ends of the second supporting strips are connected with the lower end parts of the first supporting strips;
the conductive layer is arranged on the upper surface of the reinforcing layer, and the upper surface and the lower surface of the reinforcing layer are coated with conductive adhesive layers;
the wave absorbing layer is arranged on the upper surface of the conductive layer, the protective layer is arranged on the upper surface of the wave absorbing layer, the acrylate adhesive layer is arranged on the lower surface of the substrate layer, and the release film is attached to the acrylate adhesive layer.
In a preferred embodiment of the present invention, the conductive adhesive layer has conductive particles uniformly distributed therein.
As a preferred scheme of the utility model, the wave absorbing layer is made of polyurethane foam materials.
As a preferable scheme of the utility model, the protective layer comprises a fiber layer arranged on the upper surface of the wave absorbing layer and a polyimide film layer arranged on the upper surface of the fiber layer.
In a preferred embodiment of the present invention, the substrate layer is made of a copper foil material.
In conclusion, the utility model has the following beneficial effects: the adhesive tape has good electromagnetic shielding and wave absorbing properties, can realize reliable bonding and stable conductivity, and can maintain the overall performance of the adhesive tape in a high-temperature environment.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic view of the overall structure of the present invention.
The corresponding part names indicated by the numbers and letters in the drawings:
1. a substrate layer; 2. an acrylate adhesive layer; 3. a release film; 4. a second support bar; 5. a first support bar; 6. a reinforcing layer; 7. a conductive adhesive layer; 8. a conductive layer; 9. a protective layer; 10. a wave-absorbing layer; 11. a fibrous layer; 12. a polyimide film layer.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Examples
As shown in fig. 1, the utility model is a high-performance wave-absorbing shielding adhesive tape, comprising: the base layer 1, base layer 1 adopt the copper foil material to make. Locate the enhancement layer 6 of base member layer 1 upper surface, the enhancement layer 6 includes and is a plurality of first supporting strips 5 that interval arrangement distributes on base member layer 1, and the slope is located between a plurality of first supporting strips 5 and one end and the upper end of first supporting strip 5 is connected the second support strip 4 that the other end is connected with the lower tip of first supporting strip 5, through the aforesaid setting, reduces the influence that the sticky tape received external environment, makes the wholeness ability of sticky tape reduce. Locate enhancement layer 6 upper surface and upper and lower both surfaces and all coat the conducting layer 8 that has conductive adhesive layer 7, the equipartition has conductive particle in this conductive adhesive layer 7, has stabilized the electric conductive property of sticky tape, and simultaneously, conductive particle connects enhancement layer 6 and is tied the layer by the tie to realize the ascending electric conduction of omnidirectional.
Furthermore, the wave absorbing layer 10 is arranged on the upper surface of the conducting layer 8, and the wave absorbing layer 10 is made of polyurethane foam. And the protective layer 9 is arranged on the upper surface of the wave absorbing layer 10, and the protective layer 9 comprises a fiber layer 11 arranged on the upper surface of the wave absorbing layer 10 and a polyimide film layer 12 arranged on the upper surface of the fiber layer 11. The acrylic ester adhesive layer 2 is arranged on the lower surface of the base layer 1, and the release film 3 is attached to the acrylic ester adhesive layer 2.
In the embodiment, the adhesive tape has good electromagnetic shielding and wave absorbing properties, can realize reliable bonding and stable conductive performance, and can maintain the overall performance of the adhesive tape in a high-temperature environment.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the utility model. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (5)
1. A high-performance wave-absorbing shielding adhesive tape is characterized by comprising:
a substrate layer;
the reinforcing layer is arranged on the upper surface of the substrate layer and comprises a plurality of first supporting strips which are arranged and distributed on the substrate layer at intervals, and second supporting strips which are obliquely arranged among the plurality of first supporting strips, wherein one ends of the second supporting strips are connected with the upper end parts of the first supporting strips, and the other ends of the second supporting strips are connected with the lower end parts of the first supporting strips;
the conductive layer is arranged on the upper surface of the reinforcing layer, and the upper surface and the lower surface of the reinforcing layer are coated with conductive adhesive layers;
the wave-absorbing layer is arranged on the upper surface of the conducting layer, the protective layer is arranged on the upper surface of the wave-absorbing layer, the acrylate adhesive layer is arranged on the lower surface of the substrate layer, and the release film is attached to the acrylate adhesive layer.
2. The high-performance wave-absorbing shielding adhesive tape according to claim 1, wherein conductive particles are uniformly distributed in the conductive adhesive layer.
3. The high-performance wave-absorbing shielding adhesive tape according to claim 1, wherein the wave-absorbing layer is made of polyurethane foam.
4. The high-performance wave-absorbing shielding adhesive tape according to claim 1, wherein the protective layer comprises a fiber layer disposed on the upper surface of the wave-absorbing layer and a polyimide film layer disposed on the upper surface of the fiber layer.
5. The high-performance wave-absorbing shielding adhesive tape according to claim 1, wherein the base layer is made of copper foil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123158194.2U CN217025839U (en) | 2021-12-15 | 2021-12-15 | High-performance wave-absorbing shielding adhesive tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123158194.2U CN217025839U (en) | 2021-12-15 | 2021-12-15 | High-performance wave-absorbing shielding adhesive tape |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217025839U true CN217025839U (en) | 2022-07-22 |
Family
ID=82441939
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123158194.2U Active CN217025839U (en) | 2021-12-15 | 2021-12-15 | High-performance wave-absorbing shielding adhesive tape |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217025839U (en) |
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2021
- 2021-12-15 CN CN202123158194.2U patent/CN217025839U/en active Active
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