CN209741058U - Conductive adhesive tape - Google Patents
Conductive adhesive tape Download PDFInfo
- Publication number
- CN209741058U CN209741058U CN201920385773.4U CN201920385773U CN209741058U CN 209741058 U CN209741058 U CN 209741058U CN 201920385773 U CN201920385773 U CN 201920385773U CN 209741058 U CN209741058 U CN 209741058U
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- Prior art keywords
- conductive
- conductive adhesive
- layer
- adhesive tape
- adhesive layer
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- Expired - Fee Related
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- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Laminated Bodies (AREA)
Abstract
The utility model provides a conductive adhesive tape, from the top down includes conductive substrate, first printing ink cementing layer, first conductive adhesive layer, first from the type layer in proper order, conductive adhesive in the first conductive adhesive layer is latticed distribution, still can keep away from the another side from the bottom up of first printing ink cementing layer at conductive substrate and still set gradually second printing ink cementing layer, second conductive adhesive layer and second from the type layer, forms double-sided tape, and the net is rectangle net, honeycomb net or rhombus net, and conductive substrate can be metal fiber substrate or conductive cloth. The printing ink cementing layer and the conductive adhesive layer are arranged on the conductive base material, and the conductive adhesive layer contains conductive polymers, so that the conductive performance and the shielding performance of the adhesive tape are further improved; the metal fiber or the conductive cloth with certain flexibility is selected as the wire base material, so that the flexibility and the strength of the adhesive tape are ensured; the latticed distribution of the conductive adhesive further reduces the thickness of the adhesive tape and saves raw materials; and can be made into single-sided adhesive tape or double-sided adhesive tape according to the requirement.
Description
Technical Field
The utility model relates to an sticky tape technical field especially relates to a conductive adhesive tape.
Background
The conductive adhesive tape is a good shielding material, is suitable for various electronic and electrical products such as computers, mobile phones, wires, cables and the like, and can shield or isolate electromagnetic waves or infinite interference of the electromagnetic waves during high-frequency transmission. The conductive adhesive tape generally adopts conductive metal foil or conductive cloth as a base material, but the metal foil is hard and cannot be used in occasions with high softness; the conductive cloth is soft, but has poor strength and relatively poor conductive shielding performance. The conventional conductive adhesive tape is often thick in adhesive layer, poor in die cutting performance, easy to generate burrs, poor in conductive shielding performance, poor in strength and easy to damage when the conductive adhesive tape is pursuing thinness.
SUMMERY OF THE UTILITY MODEL
The utility model aims at overcoming the shortcoming of above-mentioned prior art, provide a conductive adhesive tape that electric conductive property is good, shielding property is good, compliance and intensity are moderate.
The utility model discloses a realize through following technical scheme:
The utility model provides a conductive adhesive tape, from the top down includes electrically conductive substrate, first printing ink cementing layer, first conductive adhesive layer, first from the type layer in proper order, conductive adhesive in the first conductive adhesive layer is latticed distribution. The lattice structure may be obtained by printing coating.
Further, electrically conductive substrate keeps away from the another side from the bottom up of first printing ink cementing layer still sets gradually second printing ink cementing layer, second conductive adhesive layer and second from the type layer, forms double-sided sticky tape, the conducting resin in the second conductive adhesive layer is latticed distribution.
Preferably, the mesh is one of a rectangular mesh, a honeycomb mesh or a diamond mesh.
Preferably, the conductive substrate can be a metal fiber substrate or a conductive cloth, and the metal fiber can be made into a metal fiber cloth.
Preferably, the thickness of the first conductive adhesive layer or/and the second conductive adhesive layer is 10-100 μm.
Preferably, the thickness of the first ink cementing layer or/and the second ink cementing layer is 0.5-2 μm. The ink cementing layer contains conductive components.
Preferably, the thickness of the conductive substrate is 50-150 μm.
Preferably, the first conductive adhesive layer or/and the second conductive adhesive layer contains a conductive polymer, and the conductive polymer is one of polyaniline and polyphenylacetylene. The conductive adhesive layer also contains conductive particles, such as conductive particles, conductive fibers and the like, wherein the conductive particles are carbon black, graphite or conductive metal components.
The first release layer or/and the second release layer may be glassine paper.
the beneficial effects of the utility model reside in that: the conductive base material is provided with the ink cementing layer and the conductive adhesive layer, the conductive adhesive layer can conduct the conductive ink arranged in the ink cementing layer, so that the surface resistivity is reduced, and the conductive adhesive layer contains conductive polymers, so that the conductive performance and the shielding performance of the adhesive tape are further improved; the metal fiber or the conductive cloth with certain flexibility is selected as the wire base material, so that the flexibility and the strength of the adhesive tape are ensured; the latticed distribution of the conductive adhesive further reduces the thickness of the adhesive tape and saves raw materials; and can be made into single-sided adhesive tape or double-sided adhesive tape according to the requirement.
Drawings
Fig. 1 is a schematic cross-sectional structure diagram of the conductive tape in embodiment 1.
Fig. 2 is a schematic cross-sectional structure of the conductive tape in embodiment 2.
Fig. 3 is a schematic top view of the first conductive adhesive layer in the conductive tape of embodiment 1.
Fig. 4 is a schematic top view of the first conductive adhesive layer and the second conductive adhesive layer in the conductive tape of embodiment 2.
Reference numerals: 1-a first release layer; 2-a first conductive adhesive layer; 3-a first ink glue layer; 4-a conductive substrate; 5-a second ink glue layer; 6-a second conductive adhesive layer; 7-a second release layer; 8-honeycomb grids; 9-diamond grid.
Detailed Description
Example 1
As shown in fig. 1 and fig. 3, a conductive adhesive tape is a single-sided pressure-sensitive adhesive tape, and sequentially includes a conductive substrate 4, a first ink glue layer 3, a first conductive adhesive layer 2, and a first release layer 1 from top to bottom, wherein the conductive adhesive in the first conductive adhesive layer 2 is distributed in a honeycomb grid 8 shape. The lattice structure may be obtained by printing coating. The conductive base material 4 is a metal fiber base material, and the metal fiber is made into metal fiber cloth to improve the strength. The thickness of the conductive substrate 4 was 100 μm.
The thickness of the first conductive adhesive layer 2 is 30 μm.
The thickness of the first ink cementing layer 3 is 2 μm. The first ink glue layer 3 contains a conductive component.
The first conductive adhesive layer 2 contains conductive polymers, and the conductive polymers are polyaniline. The conductive adhesive layer also contains conductive carbon black. The first release layer 1 is glassine.
Example 2
As shown in fig. 2 and fig. 4, a conductive adhesive tape is a double-sided pressure-sensitive adhesive tape, and sequentially includes a second release layer 7, a second conductive adhesive layer 6, a second ink bonding layer 5, a conductive substrate 4, a first ink bonding layer 3, a first conductive adhesive layer 2, and a first release layer 1 from top to bottom, wherein the conductive adhesives in the first conductive adhesive layer 2 and the second conductive adhesive layer 6 are distributed in a rhombic grid 9 shape. The lattice structure may be obtained by printing coating. The conductive base material 4 is a conductive cloth having a thickness of 150 μm.
The thickness of the first conductive adhesive layer 2 and the second conductive adhesive layer 6 are both 50 μm.
The thickness of the first ink glue layer 3 and the second ink glue layer 5 is 1 μm. The first ink glue layer 3 and the second ink glue layer 5 contain a conductive component.
The first conductive adhesive layer 2 and the second conductive adhesive layer 6 contain conductive polymers, and the conductive polymers are polyphenylacetylene. The first conductive adhesive layer 2 and the second conductive adhesive layer 6 also contain silver conductive particles and carbon fibers.
The first release layer 1 and the second release layer 7 are glassine paper.
The above detailed description is specific to possible embodiments of the present invention, and the embodiments are not intended to limit the scope of the present invention, and all equivalent implementations or modifications that do not depart from the scope of the present invention should be included within the scope of the present invention.
Claims (8)
1. The utility model provides a conductive adhesive tape, its characterized in that includes electrically conductive substrate, first printing ink cementing layer, first conductive adhesive layer, first from the type layer from the top down in proper order, conductive adhesive in the first conductive adhesive layer is latticed and distributes.
2. The conductive adhesive tape according to claim 1, wherein a second ink bonding layer, a second conductive adhesive layer and a second release layer are sequentially disposed on the other side of the conductive substrate away from the first ink bonding layer from bottom to top to form a double-sided adhesive tape, and the conductive adhesive in the second conductive adhesive layer is in a grid distribution.
3. An electrically conductive adhesive tape according to claim 1 or 2, wherein said grid is one of a rectangular grid, a honeycomb grid or a diamond grid.
4. The conductive adhesive tape according to claim 1 or 2, wherein the conductive substrate is a metal fiber substrate or a conductive cloth.
5. The conductive adhesive tape according to claim 1 or 2, wherein the thickness of the first conductive adhesive layer or/and the second conductive adhesive layer is 10 to 100 μm.
6. The conductive adhesive tape according to claim 1 or 2, wherein the thickness of the first ink adhesive layer or/and the second ink adhesive layer is 0.5 to 2 μm.
7. The conductive tape according to claim 1 or 2, wherein the conductive substrate has a thickness of 50 to 150 μm.
8. The conductive adhesive tape according to claim 1 or 2, wherein the first conductive adhesive layer or/and the second conductive adhesive layer contains a conductive polymer, and the conductive polymer is one of polyaniline and polyphenylacetylene.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201920385773.4U CN209741058U (en) | 2019-03-25 | 2019-03-25 | Conductive adhesive tape |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201920385773.4U CN209741058U (en) | 2019-03-25 | 2019-03-25 | Conductive adhesive tape |
Publications (1)
Publication Number | Publication Date |
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CN209741058U true CN209741058U (en) | 2019-12-06 |
Family
ID=68718454
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201920385773.4U Expired - Fee Related CN209741058U (en) | 2019-03-25 | 2019-03-25 | Conductive adhesive tape |
Country Status (1)
Country | Link |
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CN (1) | CN209741058U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114702914A (en) * | 2021-08-09 | 2022-07-05 | 常州威斯双联科技有限公司 | All-dimensional conductive adhesive film with XYZ axes and preparation method thereof |
CN115103581A (en) * | 2022-04-29 | 2022-09-23 | 捷邦精密科技股份有限公司 | Panel shielding assembly for notebook computer and production process thereof |
-
2019
- 2019-03-25 CN CN201920385773.4U patent/CN209741058U/en not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114702914A (en) * | 2021-08-09 | 2022-07-05 | 常州威斯双联科技有限公司 | All-dimensional conductive adhesive film with XYZ axes and preparation method thereof |
CN115103581A (en) * | 2022-04-29 | 2022-09-23 | 捷邦精密科技股份有限公司 | Panel shielding assembly for notebook computer and production process thereof |
CN115103581B (en) * | 2022-04-29 | 2024-04-26 | 捷邦精密科技股份有限公司 | Panel shielding assembly for notebook computer and production process thereof |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20191206 |